JP6310194B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6310194B2 JP6310194B2 JP2013139547A JP2013139547A JP6310194B2 JP 6310194 B2 JP6310194 B2 JP 6310194B2 JP 2013139547 A JP2013139547 A JP 2013139547A JP 2013139547 A JP2013139547 A JP 2013139547A JP 6310194 B2 JP6310194 B2 JP 6310194B2
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- oxide semiconductor
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- transistor
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L29/42312—Gate electrodes for field effect devices
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
- H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
Description
本実施の形態では、半導体装置の一形態を、図1を用いて説明する。本実施の形態では、酸化物半導体膜を有するトランジスタの構造の一例を示す。
本実施の形態では、半導体装置及び半導体装置の作製方法の一形態を、図2及び図3を用いて説明する。本実施の形態では、酸化物半導体膜を有するトランジスタの作製方法の一例を示す。
本実施の形態では、図1(A)の構造と一部異なる図4(A)の構造例およびその作製方法を以下に示す。
本実施の形態では、実施の形態2に示すトランジスタを使用した半導体装置の例を図5を用いて説明する。
実施の形態2に示すトランジスタを使用した半導体装置の他の例として、論理回路であるNOR型回路の断面図の一例を図6(A)に示す。図6(B)は図6(A)に対応するNOR型回路の回路図であり、図6(C)はNAND型回路の回路図である。
本実施の形態では、半導体装置の一例として、実施の形態2または実施の形態3で示すトランジスタ415、416のいずれか一を少なくとも一部に用いたCPU(Central Processing Unit)について説明する。
本実施の形態ではボトムゲート型のトランジスタを用いて表示装置を作製する例を示す。ボトムゲート型のトランジスタは、実施の形態2のトランジスタの作製工程の一部を変更すれば形成することができ、例えば電極層を形成した後、酸化物絶縁膜を形成し、CMP処理をせずに酸化物半導体層の積層を形成し、その上にソース電極層及びドレイン電極層を形成することで作製することができる。また、ソース電極層及びドレイン電極層を形成した後、希釈フッ酸でウェットエッチングして酸化物半導体層の積層の一部を薄膜化させることで図10(B)に示すチャネルエッチ型のトランジスタ310を作製することができる。
実施の形態1または実施の形態7に示したトランジスタを用いて表示機能を有する半導体装置(表示装置ともいう)を作製することができる。また、トランジスタを含む駆動回路の一部又は全体を、画素部と同じ基板上に一体形成し、システムオンパネルを形成することができる。
本明細書に開示する半導体装置は、さまざまな電子機器(遊技機も含む)に適用することができる。電子機器としては、テレビ、モニタ等の表示装置、照明装置、デスクトップ型或いはノート型のパーソナルコンピュータ、ワードプロセッサ、DVD(Digital Versatile Disc)などの記録媒体に記憶された静止画又は動画を再生する画像再生装置、ポータブルCDプレーヤ、ラジオ、テープレコーダ、ヘッドホンステレオ、ステレオ、コードレス電話子機、トランシーバ、携帯無線機、携帯電話、自動車電話、携帯型ゲーム機、電卓、携帯情報端末、電子手帳、電子書籍、電子翻訳機、音声入力機器、ビデオカメラ、デジタルスチルカメラ、電気シェーバ、電子レンジ等の高周波加熱装置、電気炊飯器、電気洗濯機、電気掃除機、エアコンディショナーなどの空調設備、食器洗い器、食器乾燥器、衣類乾燥器、布団乾燥器、電気冷蔵庫、電気冷凍庫、電気冷凍冷蔵庫、DNA保存用冷凍庫、煙感知器、放射線測定器、透析装置等の医療機器、などが挙げられる。さらに、誘導灯、信号機、ベルトコンベア、エレベータ、エスカレータ、産業用ロボット、電力貯蔵システム等の産業機器も挙げられる。また、石油を用いたエンジンや、非水系二次電池からの電力を用いて電動機により推進する移動体なども、電気機器の範疇に含まれるものとする。上記移動体として、例えば、電気自動車(EV)、内燃機関と電動機を併せ持ったハイブリッド車(HEV)、プラグインハイブリッド車(PHEV)、これらのタイヤ車輪を無限軌道に変えた装軌車両、電動アシスト自転車を含む原動機付自転車、自動二輪車、電動車椅子、ゴルフ用カート、小型又は大型船舶、潜水艦、ヘリコプター、航空機、ロケット、人工衛星、宇宙探査機や惑星探査機、宇宙船が挙げられる。これらの電子機器の具体例を図14、及び図15に示す。
162 トランジスタ
164 容量素子
310 トランジスタ
400 基板
401 ゲート電極層
402 ゲート絶縁層
402a 第1のゲート絶縁層
402b 第2のゲート絶縁層
403 酸化物半導体積層
403a 第1の酸化物半導体層
403b 第2の酸化物半導体層
403c 第3の酸化物半導体層
415 トランジスタ
416 トランジスタ
418 トランジスタ
Claims (5)
- 絶縁表面上の第1のゲート電極層と、
前記第1のゲート電極層上の第1の絶縁層と、
前記第1の絶縁層上の第1の酸化物半導体層と、
前記第1の酸化物半導体層上の第2の酸化物半導体層と、
前記第2の酸化物半導体層上の第3の酸化物半導体層と、
前記第3の酸化物半導体層上の第2の絶縁層と、
前記第2の絶縁層上の第2のゲート電極層と、を有し、
前記第1の酸化物半導体層の膜厚は、前記第2の酸化物半導体層より小さく、
前記第2の酸化物半導体層と前記第1の酸化物半導体層との界面近傍では、それぞれの伝導帯下端のエネルギーが連続的に変化することを特徴とする半導体装置。 - 絶縁表面上の第1のゲート電極層と、
前記第1のゲート電極層上の第1の絶縁層と、
前記第1の絶縁層上の第1の酸化物半導体層と、
前記第1の酸化物半導体層上の第2の酸化物半導体層と、
前記第2の酸化物半導体層上の第3の酸化物半導体層と、
前記第3の酸化物半導体層上の第2の絶縁層と、
前記第2の絶縁層上の第2のゲート電極層と、を有し、
前記第1の酸化物半導体層の膜厚は、前記第2の酸化物半導体層より小さく、
前記第2の酸化物半導体層と前記第1の酸化物半導体層との界面近傍では、それぞれの伝導帯下端のエネルギーが連続的に変化し、
前記第2の酸化物半導体層と前記第3の酸化物半導体層との界面近傍では、それぞれの伝導帯下端のエネルギーが連続的に変化することを特徴とする半導体装置。 - 絶縁表面上の第1のゲート電極層と、
前記第1のゲート電極層上の第1の絶縁層と、
前記第1の絶縁層上の第1の酸化物半導体層と、
前記第1の酸化物半導体層上の第2の酸化物半導体層と、
前記第2の酸化物半導体層上の第3の酸化物半導体層と、
前記第3の酸化物半導体層上の第2の絶縁層と、
前記第2の絶縁層上の第2のゲート電極層と、を有し、
前記第1の酸化物半導体層の膜厚は、前記第2の酸化物半導体層より小さく、
前記第2の酸化物半導体層と前記第3の酸化物半導体層との界面近傍では、それぞれの伝導帯下端のエネルギーが連続的に変化することを特徴とする半導体装置。 - 請求項1乃至3のいずれか一において、
前記第1の酸化物半導体層、前記第2の酸化物半導体層及び前記第3の酸化物半導体層の少なくとも一は、結晶部を有することを特徴とする半導体装置。 - 請求項1乃至4のいずれか一において、
前記第2の絶縁層上に第3の絶縁層を有し、
前記第3の絶縁層は窒化物絶縁膜であり、前記第2の絶縁層は、酸化物絶縁膜であることを特徴とする半導体装置。
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KR102113160B1 (ko) * | 2012-06-15 | 2020-05-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
JP6134598B2 (ja) | 2012-08-02 | 2017-05-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
SG10201700805WA (en) | 2012-08-03 | 2017-02-27 | Semiconductor Energy Lab Co Ltd | Oxide semiconductor stacked film and semiconductor device |
US9245958B2 (en) | 2012-08-10 | 2016-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
WO2014024808A1 (en) | 2012-08-10 | 2014-02-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP6220597B2 (ja) | 2012-08-10 | 2017-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
CN108305895B (zh) | 2012-08-10 | 2021-08-03 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
US9929276B2 (en) | 2012-08-10 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
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