RU2008141166A - Полевой транзистор, использующий оксидную пленку для передачи информации, и способ его изготовления - Google Patents
Полевой транзистор, использующий оксидную пленку для передачи информации, и способ его изготовления Download PDFInfo
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- RU2008141166A RU2008141166A RU2008141166/28A RU2008141166A RU2008141166A RU 2008141166 A RU2008141166 A RU 2008141166A RU 2008141166/28 A RU2008141166/28 A RU 2008141166/28A RU 2008141166 A RU2008141166 A RU 2008141166A RU 2008141166 A RU2008141166 A RU 2008141166A
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- oxide film
- effect transistor
- field effect
- deuterium
- hydrogen
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- 238000004519 manufacturing process Methods 0.000 title claims 3
- 230000005540 biological transmission Effects 0.000 title 1
- 230000005669 field effect Effects 0.000 claims abstract 12
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 claims abstract 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract 9
- 229910052805 deuterium Inorganic materials 0.000 claims abstract 9
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract 9
- 239000001257 hydrogen Substances 0.000 claims abstract 9
- 239000004065 semiconductor Substances 0.000 claims abstract 7
- 239000000758 substrate Substances 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
- H01L29/78693—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate the semiconducting oxide being amorphous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66969—Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Dram (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
1. Полевой транзистор, включающий в себя оксидную пленку в качестве полупроводникового слоя, в котором оксидная пленка включает одну из истоковой и стоковой частей, к которой добавлен либо водород, либо дейтерий. ! 2. Полевой транзистор, включающий в себя оксидную пленку в качестве полупроводникового слоя, в котором оксидная пленка включает канальную часть, истоковую часть и стоковую часть, и в котором концентрация одного из водорода или дейтерия в истоковой части и в стоковой части больше, чем концентрация одного из водорода или дейтерия в канальной части. ! 3. Полевой транзистор по п.1, в котором истоковая часть и стоковая часть выполнены с электродом затвора и имеют копланарную структуру. ! 4. Полевой транзистор по п.1, в котором сопротивление одной из истоковой части и стоковой части составляет 1/10 или менее от сопротивления канальной части. ! 5. Полевой транзистор по п.1, в котором оксидная пленка выполнена из аморфного оксида, представленного в следующем виде: ! [(Sn 1-x M4 x )O 2 ]a·[(In 1-y M3 y ) 2 O 3 ]b·[(Zn 1-z M2 z O)]c ! где 0≤x≤1; 0≤y≤1; 0≤z≤1; 0≤a≤1, 0≤b≤1, 0≤c≤1, и a+b+c=1; ! M4 - элемент VI группы, выбранный из группы состоящей из Si, Ge и Zr с порядковым номером элемента меньшим, чем у Sn; ! M3 это Lu или элемент III группы выбранный из группы, состоящей из B, Al, Ga и Y с порядковым номером элемента меньшим, чем у In; ! M2 это элемент II группы, выбранный из группы, состоящей из Mg и Ca с порядковым номером элемента меньшим, чем у Zn. ! 6. Устройство отображения, содержащее: ! элемент отображения, включающий в себя электрод; и ! полевой транзистор в соответствии с п.1, в котором одна из истоковой и стоковой частей полевого транзистора электрически соединена с электродом
Claims (10)
1. Полевой транзистор, включающий в себя оксидную пленку в качестве полупроводникового слоя, в котором оксидная пленка включает одну из истоковой и стоковой частей, к которой добавлен либо водород, либо дейтерий.
2. Полевой транзистор, включающий в себя оксидную пленку в качестве полупроводникового слоя, в котором оксидная пленка включает канальную часть, истоковую часть и стоковую часть, и в котором концентрация одного из водорода или дейтерия в истоковой части и в стоковой части больше, чем концентрация одного из водорода или дейтерия в канальной части.
3. Полевой транзистор по п.1, в котором истоковая часть и стоковая часть выполнены с электродом затвора и имеют копланарную структуру.
4. Полевой транзистор по п.1, в котором сопротивление одной из истоковой части и стоковой части составляет 1/10 или менее от сопротивления канальной части.
5. Полевой транзистор по п.1, в котором оксидная пленка выполнена из аморфного оксида, представленного в следующем виде:
[(Sn
1-x
M4
x
)O
2
]a·[(In
1-y
M3
y
)
2
O
3
]b·[(Zn
1-z
M2
z
O)]c
где 0≤x≤1; 0≤y≤1; 0≤z≤1; 0≤a≤1, 0≤b≤1, 0≤c≤1, и a+b+c=1;
M4 - элемент VI группы, выбранный из группы состоящей из Si, Ge и Zr с порядковым номером элемента меньшим, чем у Sn;
M3 это Lu или элемент III группы выбранный из группы, состоящей из B, Al, Ga и Y с порядковым номером элемента меньшим, чем у In;
M2 это элемент II группы, выбранный из группы, состоящей из Mg и Ca с порядковым номером элемента меньшим, чем у Zn.
6. Устройство отображения, содержащее:
элемент отображения, включающий в себя электрод; и
полевой транзистор в соответствии с п.1, в котором одна из истоковой и стоковой частей полевого транзистора электрически соединена с электродом устройства отображения.
7. Устройство по п.6, в котором множество элементов отображения и множество полевых транзисторов двумерно размещены на подложке.
8. Способ изготовления полевого транзистора, содержащего оксидную пленку в качестве полупроводникового слоя, содержащий операции:
формирование оксидной пленки на подложке; и
добавку одного из водорода или дейтерия к части оксидной пленки для формирования истоковой части и стоковой части.
9. Способ изготовления полевого транзистора, включающего оксидную пленку в качестве полупроводникового слоя, содержащий операции:
формирование оксидной пленки на подложке; и
формирование изолирующей пленки затвора на оксидной пленке;
формирование электрода затвора на изолирующей пленке затвора; и
добавку одного из водорода или дейтерия к оксидной пленке с использованием образца электрода затвора в качестве шаблона для получения истоковой части и стоковой части в оксидной пленке в/при самосовмещении с образцом электрода затвора.
10. Полевой транзистор, содержащий: оксидный полупроводниковый слой, включающий область проводящего канала;
электрод затвора;
изолятор затвора;
электрод стока; и
электрод истока,
в котором оксидный полупроводниковый слой дополнительно включает пару легированных зон, прилегающих к истоковому и стоковому электродам, при этом каждая из легированных зон имеет не менее одного из водорода или дейтерия, и в которой концентрация одного из водорода или дейтерия в легированной зоне больше, чем концентрация одного из водорода или дейтерия в области канала.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006074630A JP5110803B2 (ja) | 2006-03-17 | 2006-03-17 | 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法 |
JP2006-074630 | 2006-03-17 |
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Publication Number | Publication Date |
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RU2008141166A true RU2008141166A (ru) | 2010-04-27 |
RU2400865C2 RU2400865C2 (ru) | 2010-09-27 |
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Application Number | Title | Priority Date | Filing Date |
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RU2008141166/28A RU2400865C2 (ru) | 2006-03-17 | 2007-03-08 | Полевой транзистор, использующий оксидную пленку для передачи информации, и способ его изготовления |
Country Status (9)
Country | Link |
---|---|
US (2) | US8003981B2 (ru) |
EP (1) | EP1984954B1 (ru) |
JP (1) | JP5110803B2 (ru) |
KR (1) | KR101142327B1 (ru) |
CN (1) | CN101401213B (ru) |
AT (1) | ATE527693T1 (ru) |
BR (1) | BRPI0709583B8 (ru) |
RU (1) | RU2400865C2 (ru) |
WO (1) | WO2007119386A1 (ru) |
Families Citing this family (300)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7371605B2 (en) * | 2005-03-25 | 2008-05-13 | Lucent Technologies Inc. | Active organic semiconductor devices and methods for making the same |
KR100785038B1 (ko) | 2006-04-17 | 2007-12-12 | 삼성전자주식회사 | 비정질 ZnO계 TFT |
US7692223B2 (en) * | 2006-04-28 | 2010-04-06 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and method for manufacturing the same |
JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
JP5116290B2 (ja) * | 2006-11-21 | 2013-01-09 | キヤノン株式会社 | 薄膜トランジスタの製造方法 |
CN101663762B (zh) * | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
JP5408842B2 (ja) * | 2007-04-27 | 2014-02-05 | キヤノン株式会社 | 発光装置およびその製造方法 |
JP5294651B2 (ja) * | 2007-05-18 | 2013-09-18 | キヤノン株式会社 | インバータの作製方法及びインバータ |
KR100873081B1 (ko) * | 2007-05-29 | 2008-12-09 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
EP2158608A4 (en) | 2007-06-19 | 2010-07-14 | Samsung Electronics Co Ltd | OXIDE SEMICONDUCTORS AND THIN FILM TRANSISTORS THEREWITH |
JP5393058B2 (ja) * | 2007-09-05 | 2014-01-22 | キヤノン株式会社 | 電界効果型トランジスタ |
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JP2009099887A (ja) * | 2007-10-19 | 2009-05-07 | Hitachi Displays Ltd | 表示装置 |
JP5268132B2 (ja) * | 2007-10-30 | 2013-08-21 | 富士フイルム株式会社 | 酸化物半導体素子とその製造方法、薄膜センサおよび電気光学装置 |
US8319214B2 (en) * | 2007-11-15 | 2012-11-27 | Fujifilm Corporation | Thin film field effect transistor with amorphous oxide active layer and display using the same |
JP5489445B2 (ja) * | 2007-11-15 | 2014-05-14 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
JP2009130209A (ja) * | 2007-11-26 | 2009-06-11 | Fujifilm Corp | 放射線撮像素子 |
JP5213429B2 (ja) * | 2007-12-13 | 2013-06-19 | キヤノン株式会社 | 電界効果型トランジスタ |
JP2009146100A (ja) * | 2007-12-13 | 2009-07-02 | Sony Corp | 表示装置および光センサ素子 |
JP5213458B2 (ja) | 2008-01-08 | 2013-06-19 | キヤノン株式会社 | アモルファス酸化物及び電界効果型トランジスタ |
US8704217B2 (en) | 2008-01-17 | 2014-04-22 | Idemitsu Kosan Co., Ltd. | Field effect transistor, semiconductor device and semiconductor device manufacturing method |
US20100295042A1 (en) * | 2008-01-23 | 2010-11-25 | Idemitsu Kosan Co., Ltd. | Field-effect transistor, method for manufacturing field-effect transistor, display device using field-effect transistor, and semiconductor device |
JP5219529B2 (ja) * | 2008-01-23 | 2013-06-26 | キヤノン株式会社 | 電界効果型トランジスタ及び、該電界効果型トランジスタを備えた表示装置 |
JP2009206508A (ja) * | 2008-01-31 | 2009-09-10 | Canon Inc | 薄膜トランジスタ及び表示装置 |
JP5305696B2 (ja) * | 2008-03-06 | 2013-10-02 | キヤノン株式会社 | 半導体素子の処理方法 |
JP5343853B2 (ja) * | 2008-03-13 | 2013-11-13 | 株式会社村田製作所 | ガラスセラミック組成物、ガラスセラミック焼結体および積層型セラミック電子部品 |
JP5181164B2 (ja) * | 2008-03-17 | 2013-04-10 | ユー・ディー・シー アイルランド リミテッド | 有機電界発光表示装置 |
JP5325446B2 (ja) | 2008-04-16 | 2013-10-23 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
JP5704790B2 (ja) | 2008-05-07 | 2015-04-22 | キヤノン株式会社 | 薄膜トランジスタ、および、表示装置 |
KR101496148B1 (ko) | 2008-05-15 | 2015-02-27 | 삼성전자주식회사 | 반도체소자 및 그 제조방법 |
US7812346B2 (en) * | 2008-07-16 | 2010-10-12 | Cbrite, Inc. | Metal oxide TFT with improved carrier mobility |
TWI495108B (zh) | 2008-07-31 | 2015-08-01 | Semiconductor Energy Lab | 半導體裝置的製造方法 |
US8945981B2 (en) | 2008-07-31 | 2015-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
TWI476921B (zh) | 2008-07-31 | 2015-03-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
JP5616038B2 (ja) | 2008-07-31 | 2014-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
TWI500159B (zh) | 2008-07-31 | 2015-09-11 | Semiconductor Energy Lab | 半導體裝置和其製造方法 |
JP5322530B2 (ja) * | 2008-08-01 | 2013-10-23 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタの製造方法及び該製造方法によって製造された薄膜電界効果型トランジスタ |
JP5480554B2 (ja) | 2008-08-08 | 2014-04-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI500160B (zh) | 2008-08-08 | 2015-09-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
TWI424506B (zh) | 2008-08-08 | 2014-01-21 | Semiconductor Energy Lab | 半導體裝置的製造方法 |
JP5525778B2 (ja) | 2008-08-08 | 2014-06-18 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2010045263A (ja) * | 2008-08-15 | 2010-02-25 | Idemitsu Kosan Co Ltd | 酸化物半導体、スパッタリングターゲット、及び薄膜トランジスタ |
US8129718B2 (en) * | 2008-08-28 | 2012-03-06 | Canon Kabushiki Kaisha | Amorphous oxide semiconductor and thin film transistor using the same |
JP5627071B2 (ja) * | 2008-09-01 | 2014-11-19 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
TWI606592B (zh) | 2008-09-01 | 2017-11-21 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
US9082857B2 (en) | 2008-09-01 | 2015-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising an oxide semiconductor layer |
JP5339825B2 (ja) * | 2008-09-09 | 2013-11-13 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
JP5258467B2 (ja) * | 2008-09-11 | 2013-08-07 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
WO2010029885A1 (en) | 2008-09-12 | 2010-03-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
KR20110056542A (ko) | 2008-09-12 | 2011-05-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
WO2010029865A1 (en) | 2008-09-12 | 2010-03-18 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
KR101722409B1 (ko) | 2008-09-19 | 2017-04-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
EP2421030B1 (en) | 2008-09-19 | 2020-10-21 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
KR101874327B1 (ko) | 2008-09-19 | 2018-07-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 |
KR101827333B1 (ko) * | 2008-09-19 | 2018-02-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 |
KR101273913B1 (ko) * | 2008-09-19 | 2013-06-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
EP2172977A1 (en) | 2008-10-03 | 2010-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
WO2010038819A1 (en) | 2008-10-03 | 2010-04-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
KR101961632B1 (ko) | 2008-10-03 | 2019-03-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 |
EP2172804B1 (en) | 2008-10-03 | 2016-05-11 | Semiconductor Energy Laboratory Co, Ltd. | Display device |
CN101714546B (zh) | 2008-10-03 | 2014-05-14 | 株式会社半导体能源研究所 | 显示装置及其制造方法 |
JP5430113B2 (ja) | 2008-10-08 | 2014-02-26 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
CN101719493B (zh) | 2008-10-08 | 2014-05-14 | 株式会社半导体能源研究所 | 显示装置 |
JP5484853B2 (ja) | 2008-10-10 | 2014-05-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR101799601B1 (ko) | 2008-10-16 | 2017-11-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 표시 장치 |
JP5361651B2 (ja) | 2008-10-22 | 2013-12-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US8106400B2 (en) | 2008-10-24 | 2012-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
EP2180518B1 (en) | 2008-10-24 | 2018-04-25 | Semiconductor Energy Laboratory Co, Ltd. | Method for manufacturing semiconductor device |
US8741702B2 (en) | 2008-10-24 | 2014-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
KR102095625B1 (ko) | 2008-10-24 | 2020-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
JP5616012B2 (ja) | 2008-10-24 | 2014-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP5442234B2 (ja) | 2008-10-24 | 2014-03-12 | 株式会社半導体エネルギー研究所 | 半導体装置及び表示装置 |
KR101667909B1 (ko) | 2008-10-24 | 2016-10-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
WO2010047288A1 (en) | 2008-10-24 | 2010-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductordevice |
KR101634411B1 (ko) | 2008-10-31 | 2016-06-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 구동 회로, 표시 장치 및 전자 장치 |
TWI633605B (zh) | 2008-10-31 | 2018-08-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
KR101631454B1 (ko) | 2008-10-31 | 2016-06-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 논리회로 |
TWI535037B (zh) | 2008-11-07 | 2016-05-21 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
JP2010135771A (ja) | 2008-11-07 | 2010-06-17 | Semiconductor Energy Lab Co Ltd | 半導体装置及び当該半導体装置の作製方法 |
TWI606595B (zh) | 2008-11-07 | 2017-11-21 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
CN101740631B (zh) | 2008-11-07 | 2014-07-16 | 株式会社半导体能源研究所 | 半导体装置及该半导体装置的制造方法 |
EP2184783B1 (en) | 2008-11-07 | 2012-10-03 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device and method for manufacturing the same |
TWI536577B (zh) | 2008-11-13 | 2016-06-01 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
KR101432764B1 (ko) | 2008-11-13 | 2014-08-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
JP2010153802A (ja) | 2008-11-20 | 2010-07-08 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の作製方法 |
KR102359831B1 (ko) | 2008-11-21 | 2022-02-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
TWI585955B (zh) | 2008-11-28 | 2017-06-01 | 半導體能源研究所股份有限公司 | 光感測器及顯示裝置 |
TWI529949B (zh) | 2008-11-28 | 2016-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
KR101643204B1 (ko) | 2008-12-01 | 2016-07-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
TWI613489B (zh) | 2008-12-03 | 2018-02-01 | 半導體能源研究所股份有限公司 | 液晶顯示裝置 |
JP5491833B2 (ja) * | 2008-12-05 | 2014-05-14 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2010140919A (ja) | 2008-12-09 | 2010-06-24 | Hitachi Ltd | 酸化物半導体装置及びその製造方法並びにアクティブマトリクス基板 |
JP5781720B2 (ja) | 2008-12-15 | 2015-09-24 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
JP5615540B2 (ja) | 2008-12-19 | 2014-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
CN102257621B (zh) * | 2008-12-19 | 2013-08-21 | 株式会社半导体能源研究所 | 晶体管的制造方法 |
EP2515337B1 (en) | 2008-12-24 | 2016-02-24 | Semiconductor Energy Laboratory Co., Ltd. | Driver circuit and semiconductor device |
JP4844627B2 (ja) * | 2008-12-24 | 2011-12-28 | ソニー株式会社 | 薄膜トランジスタの製造方法および表示装置の製造方法 |
US8441007B2 (en) | 2008-12-25 | 2013-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
TWI476915B (zh) | 2008-12-25 | 2015-03-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
US8114720B2 (en) | 2008-12-25 | 2012-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
TWI654689B (zh) | 2008-12-26 | 2019-03-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
KR101648927B1 (ko) | 2009-01-16 | 2016-08-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
US8492756B2 (en) | 2009-01-23 | 2013-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US8247812B2 (en) * | 2009-02-13 | 2012-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device |
CN101840936B (zh) | 2009-02-13 | 2014-10-08 | 株式会社半导体能源研究所 | 包括晶体管的半导体装置及其制造方法 |
US8278657B2 (en) * | 2009-02-13 | 2012-10-02 | Semiconductor Energy Laboratory Co., Ltd. | Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device |
US8247276B2 (en) | 2009-02-20 | 2012-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, method for manufacturing the same, and semiconductor device |
US8841661B2 (en) | 2009-02-25 | 2014-09-23 | Semiconductor Energy Laboratory Co., Ltd. | Staggered oxide semiconductor TFT semiconductor device and manufacturing method thereof |
JP5617174B2 (ja) * | 2009-02-27 | 2014-11-05 | 大日本印刷株式会社 | トランジスタ素子の製造方法 |
US8461582B2 (en) | 2009-03-05 | 2013-06-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US20100224880A1 (en) * | 2009-03-05 | 2010-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US20100224878A1 (en) | 2009-03-05 | 2010-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP5504008B2 (ja) | 2009-03-06 | 2014-05-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
CN102349158B (zh) * | 2009-03-12 | 2015-05-06 | 株式会社半导体能源研究所 | 制造半导体器件的方法 |
TWI485781B (zh) | 2009-03-13 | 2015-05-21 | Semiconductor Energy Lab | 半導體裝置及該半導體裝置的製造方法 |
US8450144B2 (en) | 2009-03-26 | 2013-05-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
KR101681884B1 (ko) | 2009-03-27 | 2016-12-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치, 표시장치 및 전자기기 |
US8927981B2 (en) | 2009-03-30 | 2015-01-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US8338226B2 (en) | 2009-04-02 | 2012-12-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
TWI489628B (zh) * | 2009-04-02 | 2015-06-21 | Semiconductor Energy Lab | 半導體裝置和其製造方法 |
JP5564331B2 (ja) * | 2009-05-29 | 2014-07-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
EP2256795B1 (en) | 2009-05-29 | 2014-11-19 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method for oxide semiconductor device |
JP5322787B2 (ja) | 2009-06-11 | 2013-10-23 | 富士フイルム株式会社 | 薄膜トランジスタ及びその製造方法、電気光学装置、並びにセンサー |
EP3573108A1 (en) * | 2009-06-30 | 2019-11-27 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
TW201103090A (en) * | 2009-07-01 | 2011-01-16 | Univ Nat Chiao Tung | Method for manufacturing a self-aligned thin film transistor and a structure of the same |
KR101476817B1 (ko) | 2009-07-03 | 2014-12-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 트랜지스터를 갖는 표시 장치 및 그 제작 방법 |
JP5640478B2 (ja) * | 2009-07-09 | 2014-12-17 | 株式会社リコー | 電界効果型トランジスタの製造方法及び電界効果型トランジスタ |
WO2011007682A1 (en) | 2009-07-17 | 2011-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
CN102751295B (zh) | 2009-07-18 | 2015-07-15 | 株式会社半导体能源研究所 | 半导体装置与用于制造半导体装置的方法 |
KR101782176B1 (ko) | 2009-07-18 | 2017-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
KR101768786B1 (ko) | 2009-07-18 | 2017-08-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
KR101638978B1 (ko) * | 2009-07-24 | 2016-07-13 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조방법 |
TWI529914B (zh) | 2009-08-07 | 2016-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
JP4970622B2 (ja) * | 2009-08-26 | 2012-07-11 | 株式会社アルバック | 半導体装置、半導体装置を有する液晶表示装置、半導体装置の製造方法 |
WO2011027723A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
KR102113148B1 (ko) | 2009-09-04 | 2020-05-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 제작하기 위한 방법 |
WO2011027701A1 (en) | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
WO2011027702A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
WO2011034012A1 (en) | 2009-09-16 | 2011-03-24 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit, light emitting device, semiconductor device, and electronic device |
KR102057221B1 (ko) * | 2009-09-16 | 2019-12-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
KR101470811B1 (ko) * | 2009-09-16 | 2014-12-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
CN102576677B (zh) * | 2009-09-24 | 2015-07-22 | 株式会社半导体能源研究所 | 半导体元件及其制造方法 |
KR101827687B1 (ko) | 2009-09-24 | 2018-02-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 구동 회로, 상기 구동 회로를 포함하는 표시 장치, 및 상기 표시 장치를 포함하는 전자 기기 |
KR101721285B1 (ko) | 2009-10-09 | 2017-03-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 시프트 레지스터 및 표시 장치 |
WO2011043206A1 (en) | 2009-10-09 | 2011-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR101772639B1 (ko) | 2009-10-16 | 2017-08-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
CN110824800B (zh) | 2009-10-16 | 2022-07-26 | 株式会社半导体能源研究所 | 显示设备 |
CN110061144A (zh) | 2009-10-16 | 2019-07-26 | 株式会社半导体能源研究所 | 逻辑电路和半导体器件 |
WO2011048945A1 (en) * | 2009-10-21 | 2011-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device including the same |
CN104733033B (zh) | 2009-10-29 | 2018-03-02 | 株式会社半导体能源研究所 | 半导体器件 |
KR102142450B1 (ko) | 2009-10-30 | 2020-08-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작방법 |
CN102576172B (zh) | 2009-10-30 | 2016-01-27 | 株式会社半导体能源研究所 | 液晶显示设备、其驱动方法以及包括该液晶显示设备的电子电器 |
SG188112A1 (en) | 2009-10-30 | 2013-03-28 | Semiconductor Energy Lab | Logic circuit and semiconductor device |
KR101952065B1 (ko) | 2009-11-06 | 2019-02-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 동작 방법 |
CN102612741B (zh) * | 2009-11-06 | 2014-11-12 | 株式会社半导体能源研究所 | 半导体装置 |
KR101488521B1 (ko) * | 2009-11-06 | 2015-02-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
CN102668097B (zh) * | 2009-11-13 | 2015-08-12 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
KR102329497B1 (ko) | 2009-11-13 | 2021-11-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 이 표시 장치를 구비한 전자 기기 |
KR101800852B1 (ko) * | 2009-11-20 | 2017-12-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
WO2011062041A1 (en) * | 2009-11-20 | 2011-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Transistor |
WO2011068106A1 (en) * | 2009-12-04 | 2011-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device including the same |
KR101523358B1 (ko) | 2009-12-04 | 2015-05-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
WO2011068021A1 (en) * | 2009-12-04 | 2011-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
WO2011070928A1 (en) | 2009-12-11 | 2011-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP5727204B2 (ja) | 2009-12-11 | 2015-06-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR101729933B1 (ko) * | 2009-12-18 | 2017-04-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 불휘발성 래치 회로와 논리 회로, 및 이를 사용한 반도체 장치 |
WO2011074407A1 (en) | 2009-12-18 | 2011-06-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
JP2011149933A (ja) * | 2009-12-25 | 2011-08-04 | Semiconductor Energy Lab Co Ltd | 固体試料の分析方法 |
KR20170142998A (ko) | 2009-12-25 | 2017-12-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 제작 방법 |
KR101842413B1 (ko) | 2009-12-28 | 2018-03-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
US8879010B2 (en) * | 2010-01-24 | 2014-11-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
KR101810261B1 (ko) * | 2010-02-10 | 2017-12-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 전계 효과 트랜지스터 |
US8617920B2 (en) * | 2010-02-12 | 2013-12-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
CN102763202B (zh) * | 2010-02-19 | 2016-08-03 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
WO2011104938A1 (ja) * | 2010-02-23 | 2011-09-01 | シャープ株式会社 | 回路基板の製造方法、回路基板及び表示装置 |
CN113540253A (zh) | 2010-02-26 | 2021-10-22 | 株式会社半导体能源研究所 | 制造半导体装置的方法 |
JP2011187506A (ja) * | 2010-03-04 | 2011-09-22 | Sony Corp | 薄膜トランジスタおよびその製造方法、並びに表示装置 |
KR101867272B1 (ko) * | 2010-03-05 | 2018-06-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치와 그의 제작 방법 |
WO2011118741A1 (en) | 2010-03-26 | 2011-09-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
CN105789321B (zh) | 2010-03-26 | 2019-08-20 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
KR101351219B1 (ko) | 2010-04-06 | 2014-01-13 | 가부시키가이샤 히타치세이사쿠쇼 | 박막 트랜지스터 및 그 제조 방법 |
KR101877377B1 (ko) | 2010-04-23 | 2018-07-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
WO2011145484A1 (en) * | 2010-05-21 | 2011-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR101872927B1 (ko) * | 2010-05-21 | 2018-06-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
KR20180105252A (ko) * | 2010-09-03 | 2018-09-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 전계 효과 트랜지스터 및 반도체 장치의 제조 방법 |
KR101824125B1 (ko) * | 2010-09-10 | 2018-02-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
KR101952235B1 (ko) * | 2010-09-13 | 2019-02-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
KR101856722B1 (ko) * | 2010-09-22 | 2018-05-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 파워 절연 게이트형 전계 효과 트랜지스터 |
US8530273B2 (en) * | 2010-09-29 | 2013-09-10 | Guardian Industries Corp. | Method of making oxide thin film transistor array |
EP2447999A1 (en) * | 2010-10-29 | 2012-05-02 | Applied Materials, Inc. | Method for depositing a thin film electrode and thin film stack |
TWI555205B (zh) | 2010-11-05 | 2016-10-21 | 半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
TWI593115B (zh) | 2010-11-11 | 2017-07-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
TWI541981B (zh) * | 2010-11-12 | 2016-07-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
TWI423449B (zh) * | 2010-12-09 | 2014-01-11 | Au Optronics Corp | 氧化物半導體薄膜電晶體及其製作方法 |
WO2012090799A1 (en) | 2010-12-28 | 2012-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
WO2012090973A1 (en) | 2010-12-28 | 2012-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
KR101981808B1 (ko) | 2010-12-28 | 2019-08-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
US8941112B2 (en) * | 2010-12-28 | 2015-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US9443984B2 (en) | 2010-12-28 | 2016-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP5975635B2 (ja) * | 2010-12-28 | 2016-08-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI570809B (zh) | 2011-01-12 | 2017-02-11 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
US8912080B2 (en) * | 2011-01-12 | 2014-12-16 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of the semiconductor device |
JP5527225B2 (ja) * | 2011-01-14 | 2014-06-18 | ソニー株式会社 | 薄膜トランジスタおよび表示装置 |
TWI539597B (zh) * | 2011-01-26 | 2016-06-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
TWI570920B (zh) * | 2011-01-26 | 2017-02-11 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
US8643007B2 (en) * | 2011-02-23 | 2014-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO2012128030A1 (en) * | 2011-03-18 | 2012-09-27 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film, semiconductor device, and manufacturing method of semiconductor device |
JP6023453B2 (ja) * | 2011-04-15 | 2016-11-09 | 株式会社半導体エネルギー研究所 | 記憶装置 |
US9331206B2 (en) | 2011-04-22 | 2016-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Oxide material and semiconductor device |
US8445969B2 (en) * | 2011-04-27 | 2013-05-21 | Freescale Semiconductor, Inc. | High pressure deuterium treatment for semiconductor/high-K insulator interface |
CN102760697B (zh) * | 2011-04-27 | 2016-08-03 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
KR102124557B1 (ko) | 2011-06-08 | 2020-06-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 스퍼터링 타겟, 스퍼터링 타겟의 제조 방법 및 박막의 형성 방법 |
JP6005401B2 (ja) | 2011-06-10 | 2016-10-12 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US9112036B2 (en) | 2011-06-10 | 2015-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
US8673426B2 (en) * | 2011-06-29 | 2014-03-18 | Semiconductor Energy Laboratory Co., Ltd. | Driver circuit, method of manufacturing the driver circuit, and display device including the driver circuit |
JP6013685B2 (ja) * | 2011-07-22 | 2016-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9012993B2 (en) * | 2011-07-22 | 2015-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8994019B2 (en) * | 2011-08-05 | 2015-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US20130037793A1 (en) * | 2011-08-11 | 2013-02-14 | Qualcomm Mems Technologies, Inc. | Amorphous oxide semiconductor thin film transistor fabrication method |
US9660092B2 (en) | 2011-08-31 | 2017-05-23 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor thin film transistor including oxygen release layer |
TW201312757A (zh) * | 2011-09-14 | 2013-03-16 | Hon Hai Prec Ind Co Ltd | 薄膜電晶體結構及其製造方法 |
US9082663B2 (en) | 2011-09-16 | 2015-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
WO2013039126A1 (en) | 2011-09-16 | 2013-03-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8952379B2 (en) | 2011-09-16 | 2015-02-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US9431545B2 (en) | 2011-09-23 | 2016-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
JP2013084333A (ja) | 2011-09-28 | 2013-05-09 | Semiconductor Energy Lab Co Ltd | シフトレジスタ回路 |
US20130087784A1 (en) * | 2011-10-05 | 2013-04-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP5912394B2 (ja) | 2011-10-13 | 2016-04-27 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US8637864B2 (en) | 2011-10-13 | 2014-01-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
JP6053490B2 (ja) | 2011-12-23 | 2016-12-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US8969867B2 (en) | 2012-01-18 | 2015-03-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US9653614B2 (en) | 2012-01-23 | 2017-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US9419146B2 (en) | 2012-01-26 | 2016-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
TWI581431B (zh) | 2012-01-26 | 2017-05-01 | 半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
CN102629590B (zh) * | 2012-02-23 | 2014-10-22 | 京东方科技集团股份有限公司 | 一种薄膜晶体管阵列基板及其制作方法 |
JP6207178B2 (ja) * | 2012-03-05 | 2017-10-04 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US20130240875A1 (en) * | 2012-03-14 | 2013-09-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US8901556B2 (en) | 2012-04-06 | 2014-12-02 | Semiconductor Energy Laboratory Co., Ltd. | Insulating film, method for manufacturing semiconductor device, and semiconductor device |
US8860023B2 (en) | 2012-05-01 | 2014-10-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US20130320335A1 (en) * | 2012-06-01 | 2013-12-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
KR20130136063A (ko) | 2012-06-04 | 2013-12-12 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 이를 포함하는 박막 트랜지스터 표시판 및 그 제조 방법 |
WO2013183495A1 (ja) * | 2012-06-08 | 2013-12-12 | シャープ株式会社 | 半導体装置およびその製造方法 |
US20140014948A1 (en) * | 2012-07-12 | 2014-01-16 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
KR102002858B1 (ko) * | 2012-08-10 | 2019-10-02 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 그 제조 방법 |
US20140062849A1 (en) * | 2012-09-05 | 2014-03-06 | Tagnetics, Inc. | Cmos-compatible display system and method |
KR102001057B1 (ko) | 2012-10-31 | 2019-07-18 | 엘지디스플레이 주식회사 | 어레이 기판의 제조방법 |
KR20230121931A (ko) | 2012-12-25 | 2023-08-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
KR102241249B1 (ko) | 2012-12-25 | 2021-04-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 저항 소자, 표시 장치, 및 전자기기 |
CN103915508B (zh) * | 2013-01-17 | 2017-05-17 | 上海天马微电子有限公司 | 一种底栅结构的氧化物薄膜晶体管及其制作方法 |
US8981374B2 (en) | 2013-01-30 | 2015-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
CN103984170A (zh) * | 2013-02-19 | 2014-08-13 | 上海天马微电子有限公司 | 阵列基板及其制造方法、液晶显示器 |
US9915848B2 (en) | 2013-04-19 | 2018-03-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
CN104124277B (zh) * | 2013-04-24 | 2018-02-09 | 北京京东方光电科技有限公司 | 一种薄膜晶体管及其制作方法和阵列基板 |
KR102222344B1 (ko) * | 2013-05-02 | 2021-03-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
TWI687748B (zh) | 2013-06-05 | 2020-03-11 | 日商半導體能源研究所股份有限公司 | 顯示裝置及電子裝置 |
JP6475424B2 (ja) | 2013-06-05 | 2019-02-27 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR102294507B1 (ko) * | 2013-09-06 | 2021-08-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
JP2016001712A (ja) * | 2013-11-29 | 2016-01-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
TWI518430B (zh) * | 2013-12-02 | 2016-01-21 | 群創光電股份有限公司 | 顯示面板及應用其之顯示裝置 |
JP2016027597A (ja) * | 2013-12-06 | 2016-02-18 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9929279B2 (en) | 2014-02-05 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP2015188062A (ja) | 2014-02-07 | 2015-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI658597B (zh) | 2014-02-07 | 2019-05-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
JP6585354B2 (ja) | 2014-03-07 | 2019-10-02 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI660490B (zh) | 2014-03-13 | 2019-05-21 | 日商半導體能源研究所股份有限公司 | 攝像裝置 |
JP6559444B2 (ja) | 2014-03-14 | 2019-08-14 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
CN103928400A (zh) * | 2014-03-31 | 2014-07-16 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
KR102380829B1 (ko) | 2014-04-23 | 2022-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치 |
JP5856227B2 (ja) * | 2014-05-26 | 2016-02-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US10002971B2 (en) * | 2014-07-03 | 2018-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
CN104112779A (zh) * | 2014-07-29 | 2014-10-22 | 叶志 | 基于氘化金属氧化物薄膜的薄膜晶体管 |
CN104201111A (zh) * | 2014-09-18 | 2014-12-10 | 六安市华海电子器材科技有限公司 | 一种氧化物半导体薄膜晶体管的制备方法 |
KR102281848B1 (ko) * | 2015-01-26 | 2021-07-26 | 삼성디스플레이 주식회사 | 박막 트랜지스터 제조 방법과 박막 트랜지스터 |
US10147823B2 (en) | 2015-03-19 | 2018-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
CN107683531B (zh) * | 2015-05-22 | 2022-04-29 | 株式会社半导体能源研究所 | 半导体装置以及包括该半导体装置的显示装置 |
WO2017029576A1 (en) * | 2015-08-19 | 2017-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
JP6851166B2 (ja) | 2015-10-12 | 2021-03-31 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR102617041B1 (ko) | 2015-12-28 | 2023-12-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 장치, 텔레비전 시스템, 및 전자 기기 |
RU167501U1 (ru) * | 2016-06-14 | 2017-01-10 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Воронежский государственный технический университет" (ВГТУ) | Тонкопленочный прозрачный полевой транзистор |
CN105977306A (zh) * | 2016-06-21 | 2016-09-28 | 北京大学深圳研究生院 | 一种自对准薄膜晶体管及其制备方法 |
KR102643111B1 (ko) * | 2016-07-05 | 2024-03-04 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 이를 포함하는 박막 트랜지스터 표시판 및 그 제조 방법 |
JP6581057B2 (ja) * | 2016-09-14 | 2019-09-25 | 株式会社東芝 | 半導体装置、半導体記憶装置及び固体撮像装置 |
WO2018076268A1 (zh) * | 2016-10-28 | 2018-05-03 | 华为技术有限公司 | 场效应晶体管结构及其制作方法 |
KR102490188B1 (ko) | 2016-11-09 | 2023-01-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치, 표시 모듈, 전자 기기, 및 표시 장치의 제작 방법 |
KR102627305B1 (ko) * | 2016-12-30 | 2024-01-18 | 한양대학교 산학협력단 | 박막 트랜지스터 기판 및 표시 장치 |
US11038001B2 (en) * | 2017-03-27 | 2021-06-15 | Sharp Kabushiki Kaisha | Active matrix substrate and method for producing same |
CN107195583B (zh) * | 2017-05-02 | 2019-08-02 | 深圳市华星光电技术有限公司 | 一种oled显示面板及其制备方法 |
CN107170762B (zh) * | 2017-06-16 | 2019-04-30 | 武汉华星光电半导体显示技术有限公司 | Oled显示面板及其制作方法 |
JP7108386B2 (ja) * | 2017-08-24 | 2022-07-28 | 住友化学株式会社 | 電荷トラップ評価方法 |
KR20190063230A (ko) * | 2017-11-29 | 2019-06-07 | 엘지디스플레이 주식회사 | 박막트랜지스터 어레이 기판 및 그를 포함하는 유기발광표시장치 |
US10854612B2 (en) | 2018-03-21 | 2020-12-01 | Samsung Electronics Co., Ltd. | Semiconductor device including active region with variable atomic concentration of oxide semiconductor material and method of forming the same |
US10396061B1 (en) * | 2018-03-22 | 2019-08-27 | International Business Machines Corporation | Transparent electronics for invisible smart dust applications |
CN109148598B (zh) * | 2018-08-20 | 2022-04-26 | Tcl华星光电技术有限公司 | 薄膜晶体管及其制备方法 |
KR20210028318A (ko) | 2019-09-03 | 2021-03-12 | 삼성디스플레이 주식회사 | 표시 장치 및 제조 방법 |
CN110707042A (zh) * | 2019-09-23 | 2020-01-17 | 深圳市华星光电半导体显示技术有限公司 | 反相器的制作方法及反相器 |
KR102111067B1 (ko) * | 2019-12-26 | 2020-05-18 | 삼성디스플레이 주식회사 | 스위칭 소자, 이를 포함하는 표시 기판 및 이의 제조 방법 |
JP2021141196A (ja) | 2020-03-05 | 2021-09-16 | 株式会社ジャパンディスプレイ | 半導体装置、および表示装置 |
JP2021141193A (ja) | 2020-03-05 | 2021-09-16 | 株式会社ジャパンディスプレイ | 半導体装置、及び表示装置 |
KR102237898B1 (ko) * | 2020-04-21 | 2021-04-09 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 그 제조 방법 |
CN113138487B (zh) * | 2021-04-13 | 2022-08-05 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06338631A (ja) * | 1993-03-29 | 1994-12-06 | Canon Inc | 発光素子及びその製造方法 |
JP3205167B2 (ja) * | 1993-04-05 | 2001-09-04 | キヤノン株式会社 | 電子源の製造方法及び画像形成装置の製造方法 |
JP3141979B2 (ja) | 1993-10-01 | 2001-03-07 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
RU2069417C1 (ru) | 1994-06-08 | 1996-11-20 | Акционерное общество открытого типа "Научно-исследовательский институт молекулярной электроники и завод "Микрон" | Способ изготовления тонкопленочных транзисторов матриц жидкокристаллических экранов |
JP2946189B2 (ja) * | 1994-10-17 | 1999-09-06 | キヤノン株式会社 | 電子源及び画像形成装置、並びにこれらの活性化方法 |
JP3479375B2 (ja) * | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
JP4986347B2 (ja) * | 2000-08-25 | 2012-07-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US6936854B2 (en) * | 2001-05-10 | 2005-08-30 | Canon Kabushiki Kaisha | Optoelectronic substrate |
JP2003179233A (ja) * | 2001-12-13 | 2003-06-27 | Fuji Xerox Co Ltd | 薄膜トランジスタ、及びそれを備えた表示素子 |
JP4108633B2 (ja) * | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
US7242039B2 (en) * | 2004-03-12 | 2007-07-10 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
KR101019337B1 (ko) * | 2004-03-12 | 2011-03-07 | 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 | 아몰퍼스 산화물 및 박막 트랜지스터 |
JP4544518B2 (ja) * | 2004-09-01 | 2010-09-15 | キヤノン株式会社 | 電界励起型発光素子及び画像表示装置 |
US7791072B2 (en) * | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
JP4560502B2 (ja) * | 2005-09-06 | 2010-10-13 | キヤノン株式会社 | 電界効果型トランジスタ |
JP5006598B2 (ja) * | 2005-09-16 | 2012-08-22 | キヤノン株式会社 | 電界効果型トランジスタ |
JP5015470B2 (ja) * | 2006-02-15 | 2012-08-29 | 財団法人高知県産業振興センター | 薄膜トランジスタ及びその製法 |
US20070215945A1 (en) * | 2006-03-20 | 2007-09-20 | Canon Kabushiki Kaisha | Light control device and display |
WO2007142167A1 (en) * | 2006-06-02 | 2007-12-13 | Kochi Industrial Promotion Center | Semiconductor device including an oxide semiconductor thin film layer of zinc oxide and manufacturing method thereof |
JP4332545B2 (ja) * | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
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CN101401213B (zh) | 2011-03-23 |
CN101401213A (zh) | 2009-04-01 |
EP1984954B1 (en) | 2011-10-05 |
KR101142327B1 (ko) | 2012-05-17 |
RU2400865C2 (ru) | 2010-09-27 |
ATE527693T1 (de) | 2011-10-15 |
US20090065771A1 (en) | 2009-03-12 |
BRPI0709583B1 (pt) | 2018-05-29 |
EP1984954A1 (en) | 2008-10-29 |
JP5110803B2 (ja) | 2012-12-26 |
BRPI0709583A2 (pt) | 2011-07-19 |
JP2007250983A (ja) | 2007-09-27 |
US20110256684A1 (en) | 2011-10-20 |
US8003981B2 (en) | 2011-08-23 |
WO2007119386A1 (en) | 2007-10-25 |
BRPI0709583B8 (pt) | 2018-08-07 |
KR20080114802A (ko) | 2008-12-31 |
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