KR100878939B1 - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR100878939B1 KR100878939B1 KR1020077030414A KR20077030414A KR100878939B1 KR 100878939 B1 KR100878939 B1 KR 100878939B1 KR 1020077030414 A KR1020077030414 A KR 1020077030414A KR 20077030414 A KR20077030414 A KR 20077030414A KR 100878939 B1 KR100878939 B1 KR 100878939B1
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- Prior art keywords
- die pad
- lead
- semiconductor device
- leads
- sealing
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Abstract
Description
Claims (8)
- 삭제
- 복수의 패드가 형성된 주면을 갖는 반도체 칩과,상기 반도체 칩을 지지하는 다이패드와,상기 다이패드와 각각 일체로 형성된 복수의 서스펜션 리드와,상기 복수의 서스펜션 리드의 사이에 배치된 복수의 리드와,상기 반도체 칩의 복수의 패드와 상기 복수의 리드를 각각 전기적으로 접속하는 복수의 와이어와,상기 반도체 칩, 상기 다이패드, 상기 복수의 서스펜션 리드의 각각의 일부, 상기 복수의 리드의 각각의 일부 및 상기 복수의 와이어를 밀봉하는 밀봉부를 포함하고,상기 복수의 서스펜션 리드의 각각은, 상기 다이패드와 연결되는 일단부와, 상기 일단부와는 반대측에 위치하고 상기 밀봉부로부터 노출되는 타단부를 갖고,상기 복수의 서스펜션 리드의 각각에 있어서, 상기 일단부와 상기 타단부의 사이는 상기 밀봉부로부터 노출되어 있지 않은 것을 특징으로 하는 반도체 장치.
- 제2항에 있어서,상기 밀봉부는, 상기 반도체 칩의 상기 주면 측에 위치하는 표면과, 상기 다이패드 측에 위치하는 이면을 갖고,상기 서스펜션 리드의 타단부는, 상기 밀봉부의 상기 이면으로부터 노출되어 있는 것을 특징으로 하는 반도체 장치.
- 제2항 또는 제3항에 있어서,상기 서스펜션 리드의 상기 일단부와 상기 서스펜션 리드의 상기 타단부의 사이의 상기 서스펜션 리드의 두께는, 상기 서스펜션 리드의 상기 타단부의 두께보다도 얇은 것을 특징으로 하는 반도체 장치.
- 제2항 또는 제3항에 있어서,상기 다이패드의 두께는, 상기 서스펜션 리드의 상기 일단부와 상기 서스펜션 리드의 상기 타단부의 사이의 상기 서스펜션 리드의 두께와 같은 두께인 것을 특징으로 하는 반도체 장치.
- 제2항 또는 제3항에 있어서,상기 다이패드의 두께는, 상기 서스펜션 리드의 상기 타단부의 두께보다도 얇은 것을 특징으로 하는 반도체 장치.
- 제2항 또는 제3항에 있어서,상기 복수의 리드의 각각은, 상기 다이패드 측에 위치하는 내측 리드부와, 상기 내측 리드부와는 반대측에 위치하고 상기 밀봉부로부터 노출되는 외측 리드부를 갖는 것을 특징으로 하는 반도체 장치.
- 제2항 또는 제3항에 있어서,상기 다이패드는, 상기 반도체 칩을 지지하는 칩 지지면을 갖고,상기 서스펜션 리드는, 상기 다이패드의 상기 칩 지지면과 나란한 상면을 갖고,상기 복수의 리드의 각각은, 상기 와이어가 접속되는 상면을 갖고,상기 다이패드의 상기 칩 지지면과 상기 서스펜션 리드의 상기 상면과 상기 복수의 리드의 각각의 상기 상면은, 같은 높이에 위치하고 있는 것을 특징으로 하는 반도체 장치.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-1999-00184739 | 1999-06-30 | ||
JP18473999 | 1999-06-30 | ||
JPJP-P-2000-00105251 | 2000-04-06 | ||
JP2000105251 | 2000-04-06 |
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KR1020077021569A Division KR100864781B1 (ko) | 1999-06-30 | 2000-06-30 | 반도체 장치 |
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KR1020087007985A Division KR100885606B1 (ko) | 1999-06-30 | 2000-06-30 | 반도체 장치 |
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KR20080005312A KR20080005312A (ko) | 2008-01-10 |
KR100878939B1 true KR100878939B1 (ko) | 2009-01-19 |
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KR1020077021569A KR100864781B1 (ko) | 1999-06-30 | 2000-06-30 | 반도체 장치 |
KR1020077011557A KR100743335B1 (ko) | 1999-06-30 | 2000-06-30 | 반도체 장치 |
KR1020087007985A KR100885606B1 (ko) | 1999-06-30 | 2000-06-30 | 반도체 장치 |
KR1020077030414A KR100878939B1 (ko) | 1999-06-30 | 2000-06-30 | 반도체 장치 |
KR1020017016929A KR100809821B1 (ko) | 1999-06-30 | 2000-06-30 | 반도체 장치의 제조 방법 |
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KR1020077021569A KR100864781B1 (ko) | 1999-06-30 | 2000-06-30 | 반도체 장치 |
KR1020077011557A KR100743335B1 (ko) | 1999-06-30 | 2000-06-30 | 반도체 장치 |
KR1020087007985A KR100885606B1 (ko) | 1999-06-30 | 2000-06-30 | 반도체 장치 |
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KR1020017016929A KR100809821B1 (ko) | 1999-06-30 | 2000-06-30 | 반도체 장치의 제조 방법 |
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US (9) | US20030001249A1 (ko) |
JP (9) | JP3839321B2 (ko) |
KR (5) | KR100864781B1 (ko) |
CN (1) | CN1248308C (ko) |
AU (1) | AU5706900A (ko) |
MY (1) | MY133357A (ko) |
WO (1) | WO2001003186A1 (ko) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY133357A (en) | 1999-06-30 | 2007-11-30 | Hitachi Ltd | A semiconductor device and a method of manufacturing the same |
JP4764608B2 (ja) * | 1999-06-30 | 2011-09-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7324635B2 (en) | 2000-05-04 | 2008-01-29 | Telemaze Llc | Branch calling and caller ID based call routing telephone features |
JP4523138B2 (ja) | 2000-10-06 | 2010-08-11 | ローム株式会社 | 半導体装置およびそれに用いるリードフレーム |
JP3895570B2 (ja) * | 2000-12-28 | 2007-03-22 | 株式会社ルネサステクノロジ | 半導体装置 |
JP2002231873A (ja) * | 2001-02-05 | 2002-08-16 | Sony Corp | 半導体装置およびその製造方法 |
JP2002299540A (ja) | 2001-04-04 | 2002-10-11 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2003007953A (ja) * | 2001-06-27 | 2003-01-10 | Matsushita Electric Ind Co Ltd | 樹脂封止型半導体装置およびその製造方法 |
JP3696820B2 (ja) * | 2001-10-10 | 2005-09-21 | 新光電気工業株式会社 | リードフレーム及びその製造方法 |
JP3540793B2 (ja) * | 2001-12-05 | 2004-07-07 | 松下電器産業株式会社 | 樹脂封止型半導体装置及びその製造方法 |
JP2003258183A (ja) * | 2002-03-04 | 2003-09-12 | Shinko Electric Ind Co Ltd | リードフレームの製造方法 |
US6841854B2 (en) | 2002-04-01 | 2005-01-11 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device |
JP2003338587A (ja) * | 2002-05-21 | 2003-11-28 | Hitachi Ltd | 半導体装置及びその製造方法 |
CN100533722C (zh) * | 2002-07-01 | 2009-08-26 | 株式会社瑞萨科技 | 半导体器件 |
JP4522049B2 (ja) * | 2003-02-14 | 2010-08-11 | 三洋電機株式会社 | 半導体装置 |
JP2004253706A (ja) * | 2003-02-21 | 2004-09-09 | Seiko Epson Corp | リードフレーム、半導体チップのパッケージング部材、半導体装置の製造方法、及び、半導体装置 |
US7195953B2 (en) * | 2003-04-02 | 2007-03-27 | Yamaha Corporation | Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein |
JP4467903B2 (ja) * | 2003-04-17 | 2010-05-26 | 大日本印刷株式会社 | 樹脂封止型半導体装置 |
EP1658643B1 (de) * | 2003-08-29 | 2018-11-14 | OSRAM Opto Semiconductors GmbH | Strahlungemittierendes halbleiterbauelement |
JP2005159103A (ja) * | 2003-11-27 | 2005-06-16 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP4417150B2 (ja) * | 2004-03-23 | 2010-02-17 | 株式会社ルネサステクノロジ | 半導体装置 |
JP2006108306A (ja) * | 2004-10-04 | 2006-04-20 | Yamaha Corp | リードフレームおよびそれを用いた半導体パッケージ |
JP4624170B2 (ja) * | 2005-04-25 | 2011-02-02 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US20060289966A1 (en) * | 2005-06-22 | 2006-12-28 | Dani Ashay A | Silicon wafer with non-soluble protective coating |
JP4881620B2 (ja) | 2006-01-06 | 2012-02-22 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
DE102006057747B4 (de) * | 2006-09-27 | 2015-10-15 | Osram Opto Semiconductors Gmbh | Halbleiterkörper und Halbleiterchip mit einem Halbleiterkörper |
JP5122835B2 (ja) * | 2007-02-27 | 2013-01-16 | ローム株式会社 | 半導体装置、リードフレームおよび半導体装置の製造方法 |
US20080284038A1 (en) * | 2007-05-16 | 2008-11-20 | Dimaano Jr Antonio B | Integrated circuit package system with perimeter paddle |
JP2009026884A (ja) * | 2007-07-18 | 2009-02-05 | Elpida Memory Inc | 回路モジュール及び電気部品 |
US8159052B2 (en) * | 2008-04-10 | 2012-04-17 | Semtech Corporation | Apparatus and method for a chip assembly including a frequency extending device |
JP5334239B2 (ja) * | 2008-06-24 | 2013-11-06 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP5549066B2 (ja) * | 2008-09-30 | 2014-07-16 | 凸版印刷株式会社 | リードフレーム型基板とその製造方法、及び半導体装置 |
CN104392968B (zh) * | 2008-11-21 | 2018-05-18 | 先进封装技术私人有限公司 | 半导体基板 |
JP5255009B2 (ja) * | 2010-02-26 | 2013-08-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
TWI557933B (zh) | 2010-03-30 | 2016-11-11 | Dainippon Printing Co Ltd | A manufacturing method of a wire frame or a substrate for a light emitting diode, a semiconductor device, and a wire frame or a substrate for a light emitting diode |
JP2010166100A (ja) * | 2010-05-06 | 2010-07-29 | Panasonic Corp | 樹脂封止型半導体装置 |
US8581382B2 (en) * | 2010-06-18 | 2013-11-12 | Stats Chippac Ltd. | Integrated circuit packaging system with leadframe and method of manufacture thereof |
JP2012028699A (ja) * | 2010-07-27 | 2012-02-09 | Panasonic Corp | 半導体装置、リードフレーム集合体及びその製造方法 |
KR101778832B1 (ko) | 2010-11-02 | 2017-09-14 | 다이니폰 인사츠 가부시키가이샤 | Led 소자 탑재용 리드 프레임, 수지 부착 리드 프레임, 반도체 장치의 제조 방법 및 반도체 소자 탑재용 리드 프레임 |
JP5873998B2 (ja) * | 2011-02-15 | 2016-03-01 | パナソニックIpマネジメント株式会社 | 半導体装置及びその製造方法 |
JP5919087B2 (ja) * | 2012-05-10 | 2016-05-18 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
JP2013239658A (ja) * | 2012-05-17 | 2013-11-28 | Sumitomo Electric Ind Ltd | 半導体デバイス |
US8956920B2 (en) * | 2012-06-01 | 2015-02-17 | Nxp B.V. | Leadframe for integrated circuit die packaging in a molded package and a method for preparing such a leadframe |
CN103579161B (zh) * | 2012-08-07 | 2016-02-03 | 扬智科技股份有限公司 | 芯片封装结构 |
KR101388892B1 (ko) * | 2012-08-20 | 2014-04-29 | 삼성전기주식회사 | 패키지 기판, 패키지 기판의 제조 방법 및 패키지 기판의 성형 금형 |
US10229870B2 (en) * | 2012-11-30 | 2019-03-12 | Infineon Technologies Ag | Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress |
US9093437B2 (en) | 2012-12-04 | 2015-07-28 | Infineon Technologies Ag | Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device |
JP6092645B2 (ja) * | 2013-02-07 | 2017-03-08 | エスアイアイ・セミコンダクタ株式会社 | 半導体装置 |
CN104167344B (zh) * | 2013-05-17 | 2017-02-08 | 中微半导体设备(上海)有限公司 | 一种等离子体处理腔室及其基台 |
US9496214B2 (en) * | 2013-05-22 | 2016-11-15 | Toyota Motor Engineering & Manufacturing North American, Inc. | Power electronics devices having thermal stress reduction elements |
JP5908874B2 (ja) | 2013-08-27 | 2016-04-26 | 大日本印刷株式会社 | 樹脂付リードフレーム、リードフレーム、半導体装置および樹脂付リードフレームの製造方法 |
JP5758459B2 (ja) | 2013-08-27 | 2015-08-05 | 大日本印刷株式会社 | 樹脂付リードフレーム、リードフレーム、半導体装置および樹脂付リードフレームの製造方法 |
CN103606539A (zh) * | 2013-10-31 | 2014-02-26 | 华天科技(西安)有限公司 | 一种基于框架采用开孔优化技术的扁平封装件及其制作工艺 |
JP6026397B2 (ja) * | 2013-12-10 | 2016-11-16 | 大日本印刷株式会社 | 樹脂付リードフレームの製造方法 |
US10032699B1 (en) * | 2014-04-28 | 2018-07-24 | Amkor Technology, Inc. | Flip chip self-alignment features for substrate and leadframe applications |
CN104016296B (zh) * | 2014-06-14 | 2016-04-06 | 山东华芯半导体有限公司 | 一种封装结构和该封装结构的封装方法 |
JP6253531B2 (ja) * | 2014-06-30 | 2017-12-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9643200B2 (en) | 2014-12-19 | 2017-05-09 | Richard A. Belanger | Squeeze container liquid extrusion tool |
CN106548949A (zh) * | 2016-11-03 | 2017-03-29 | 东莞市国正精密电子科技有限公司 | 基于led生产工艺的ic封装方法 |
JP6652117B2 (ja) * | 2017-11-29 | 2020-02-19 | 日亜化学工業株式会社 | 樹脂パッケージおよび発光装置 |
CN108039342A (zh) * | 2017-12-01 | 2018-05-15 | 泰州友润电子科技股份有限公司 | 一种改进的to-220d7l引线框架 |
KR102066721B1 (ko) * | 2018-03-23 | 2020-01-16 | 주식회사 웨이브피아 | 큐에프엔 알에프 칩 패키지 |
CN108520872A (zh) * | 2018-05-02 | 2018-09-11 | 泰州友润电子科技股份有限公司 | 一种具有绝缘保护性能的多装载型引线框架 |
US11545418B2 (en) * | 2018-10-24 | 2023-01-03 | Texas Instruments Incorporated | Thermal capacity control for relative temperature-based thermal shutdown |
WO2024070615A1 (ja) * | 2022-09-29 | 2024-04-04 | ローム株式会社 | 半導体装置 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR920010862A (ko) * | 1990-11-30 | 1992-06-27 | 이노우에 사다오 | 반도체 장치 및 이것에 사용되는 리드프레임 |
KR920013647A (ko) * | 1990-12-31 | 1992-07-29 | 김광호 | 반도체 장치의 패키지 몰딩 방법 |
KR960005972A (ko) * | 1994-07-13 | 1996-02-23 | 야스까와 히데아끼 | 수지 밀폐형 반도체 장치 및 그 제조 방법 |
US5594274A (en) * | 1993-07-01 | 1997-01-14 | Nec Corporation | Lead frame for use in a semiconductor device and method of manufacturing the semiconductor device using the same |
KR970023917A (ko) * | 1995-10-30 | 1997-05-30 | 김광호 | 와이어의 단락을 방지하기 위한 반도체 패키지 |
KR970053627A (ko) * | 1995-12-11 | 1997-07-31 | 니시무로 타이조 | 수지 밀봉형 반도체 장치 |
WO1998029903A1 (en) * | 1996-12-26 | 1998-07-09 | Hitachi, Ltd. | Resin-encapsulated semiconductor device and method for manufacturing the same |
KR19980025552A (ko) * | 1996-10-02 | 1998-07-15 | 김광호 | 저응력 반도체 칩 패키지 |
KR19980032022A (ko) * | 1996-10-09 | 1998-07-25 | 사와무라시꼬 | 반도체 장치및 그의 제조방법 |
JPH11111749A (ja) * | 1997-10-03 | 1999-04-23 | Dainippon Printing Co Ltd | 半導体装置とそれに用いられる回路部材およびそれらの製造方法 |
KR19990044365A (ko) * | 1996-07-03 | 1999-06-25 | 야스카와 히데아키 | 수지 밀봉형 반도체 장치 및 그 제조 방법 |
JP2000012758A (ja) * | 1998-06-26 | 2000-01-14 | Matsushita Electron Corp | リードフレームおよびそれを用いた樹脂封止型半導体装置およびその製造方法 |
US6229200B1 (en) * | 1998-06-10 | 2001-05-08 | Asat Limited | Saw-singulated leadless plastic chip carrier |
Family Cites Families (75)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3038639A (en) * | 1957-10-31 | 1962-06-12 | American Radiator & Standard | Pressure actuated dispenser for washing machines |
US3022656A (en) * | 1959-08-28 | 1962-02-27 | Maytag Co | Dispenser for laundry machines |
JPS57155760A (en) * | 1981-03-23 | 1982-09-25 | Hitachi Ltd | Lead frame used for semiconductor and assembly and manufacture thereof |
JPS60161643A (ja) | 1984-02-01 | 1985-08-23 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
JPS61139052A (ja) * | 1984-12-11 | 1986-06-26 | Matsushita Electric Ind Co Ltd | 半導体集積回路部品 |
JPS62169457A (ja) * | 1986-01-22 | 1987-07-25 | Hitachi Micro Comput Eng Ltd | 半導体装置用リ−ドフレ−ム |
JPS6315453A (ja) | 1986-07-08 | 1988-01-22 | Fujitsu Ltd | 表面実装型半導体装置及びその製造方法 |
US5150193A (en) * | 1987-05-27 | 1992-09-22 | Hitachi, Ltd. | Resin-encapsulated semiconductor device having a particular mounting structure |
JP2532041B2 (ja) * | 1987-10-05 | 1996-09-11 | 新光電気工業株式会社 | 半導体装置用リ―ドフレ―ム |
US5287000A (en) | 1987-10-20 | 1994-02-15 | Hitachi, Ltd. | Resin-encapsulated semiconductor memory device useful for single in-line packages |
JPH01147848A (ja) * | 1987-12-04 | 1989-06-09 | Sumitomo Metal Mining Co Ltd | Ic用リードフレームの製造方法 |
DE68927295T2 (de) * | 1988-07-08 | 1997-05-07 | Oki Electric Ind Co Ltd | Kunstharzversiegeltes halbleiterbauelement |
US5264730A (en) * | 1990-01-06 | 1993-11-23 | Fujitsu Limited | Resin mold package structure of integrated circuit |
JPH03232264A (ja) * | 1990-02-08 | 1991-10-16 | Hitachi Ltd | リードフレームおよびそれを用いた半導体集積回路装置 |
US5147815A (en) * | 1990-05-14 | 1992-09-15 | Motorola, Inc. | Method for fabricating a multichip semiconductor device having two interdigitated leadframes |
US5122858A (en) * | 1990-09-10 | 1992-06-16 | Olin Corporation | Lead frame having polymer coated surface portions |
US5105259A (en) * | 1990-09-28 | 1992-04-14 | Motorola, Inc. | Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation |
JP2781070B2 (ja) | 1991-01-08 | 1998-07-30 | 松下電子工業株式会社 | リードフレームの製造方法 |
JPH04239753A (ja) * | 1991-01-23 | 1992-08-27 | Matsushita Electron Corp | 半導体装置用リードフレームおよびその製造方法 |
JPH05129473A (ja) | 1991-11-06 | 1993-05-25 | Sony Corp | 樹脂封止表面実装型半導体装置 |
EP0987758A3 (en) * | 1991-12-27 | 2000-05-24 | Fujitsu Limited | Semiconducter device and method of producing the same |
KR100552353B1 (ko) * | 1992-03-27 | 2006-06-20 | 가부시키가이샤 히타치초엘에스아이시스템즈 | 리이드프레임및그것을사용한반도체집적회로장치와그제조방법 |
JPH05326788A (ja) * | 1992-05-25 | 1993-12-10 | Nippon Steel Corp | リードフレーム素材及びこれを用いた半導体装置 |
JP3322429B2 (ja) * | 1992-06-04 | 2002-09-09 | 新光電気工業株式会社 | 半導体装置 |
JPH06295962A (ja) * | 1992-10-20 | 1994-10-21 | Ibiden Co Ltd | 電子部品搭載用基板およびその製造方法並びに電子部品搭載装置 |
US5859471A (en) * | 1992-11-17 | 1999-01-12 | Shinko Electric Industries Co., Ltd. | Semiconductor device having tab tape lead frame with reinforced outer leads |
US5327008A (en) * | 1993-03-22 | 1994-07-05 | Motorola Inc. | Semiconductor device having universal low-stress die support and method for making the same |
JP2960283B2 (ja) * | 1993-06-14 | 1999-10-06 | 株式会社東芝 | 樹脂封止型半導体装置の製造方法と、この製造方法に用いられる複数の半導体素子を載置するためのリードフレームと、この製造方法によって製造される樹脂封止型半導体装置 |
JPH0730036A (ja) * | 1993-07-13 | 1995-01-31 | Seiko Epson Corp | 半導体装置用リードフレームおよび、それを用いた半導体装置 |
US5521429A (en) * | 1993-11-25 | 1996-05-28 | Sanyo Electric Co., Ltd. | Surface-mount flat package semiconductor device |
US6111306A (en) * | 1993-12-06 | 2000-08-29 | Fujitsu Limited | Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same |
JP3151346B2 (ja) * | 1993-12-10 | 2001-04-03 | 株式会社日立製作所 | 半導体集積回路装置およびその製造方法ならびにその製造に用いるモールド金型 |
JPH07211852A (ja) * | 1994-01-21 | 1995-08-11 | Sony Corp | リードフレーム、それを用いた半導体装置及びその製造装置 |
JPH07288263A (ja) * | 1994-04-19 | 1995-10-31 | Nitto Denko Corp | 半導体装置の製造方法および金属箔材料 |
US5834831A (en) * | 1994-08-16 | 1998-11-10 | Fujitsu Limited | Semiconductor device with improved heat dissipation efficiency |
JPH0878605A (ja) * | 1994-09-01 | 1996-03-22 | Hitachi Ltd | リードフレームおよびそれを用いた半導体集積回路装置 |
US5583372A (en) * | 1994-09-14 | 1996-12-10 | Micron Technology, Inc. | Adhesion enhanced semiconductor die for mold compound packaging |
JPH098205A (ja) * | 1995-06-14 | 1997-01-10 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置 |
JPH09115951A (ja) * | 1995-10-23 | 1997-05-02 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JPH1093004A (ja) * | 1996-09-11 | 1998-04-10 | Matsushita Electron Corp | 電子部品およびその製造方法 |
US5943558A (en) * | 1996-09-23 | 1999-08-24 | Communications Technology, Inc. | Method of making an assembly package having an air tight cavity and a product made by the method |
JP3012816B2 (ja) * | 1996-10-22 | 2000-02-28 | 松下電子工業株式会社 | 樹脂封止型半導体装置およびその製造方法 |
US5977615A (en) * | 1996-12-24 | 1999-11-02 | Matsushita Electronics Corporation | Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device |
US6133637A (en) * | 1997-01-24 | 2000-10-17 | Rohm Co., Ltd. | Semiconductor device having a plurality of semiconductor chips |
JPH1140720A (ja) | 1997-07-16 | 1999-02-12 | Dainippon Printing Co Ltd | 回路部材および該回路部材を用いた樹脂封止型半導体装置 |
JPH10335566A (ja) | 1997-04-02 | 1998-12-18 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置とそれに用いられる回路部材、および樹脂封止型半導体装置の製造方法 |
US6201292B1 (en) * | 1997-04-02 | 2001-03-13 | Dai Nippon Insatsu Kabushiki Kaisha | Resin-sealed semiconductor device, circuit member used therefor |
JPH117440A (ja) | 1997-06-17 | 1999-01-12 | Matsushita Electric Ind Co Ltd | プロセッサ、コンパイラ、積和演算方法及び記録媒体 |
US6861735B2 (en) | 1997-06-27 | 2005-03-01 | Matsushita Electric Industrial Co., Ltd. | Resin molded type semiconductor device and a method of manufacturing the same |
JP2915892B2 (ja) | 1997-06-27 | 1999-07-05 | 松下電子工業株式会社 | 樹脂封止型半導体装置およびその製造方法 |
US6025640A (en) * | 1997-07-16 | 2000-02-15 | Dai Nippon Insatsu Kabushiki Kaisha | Resin-sealed semiconductor device, circuit member for use therein and method of manufacturing resin-sealed semiconductor device |
JPH1140520A (ja) * | 1997-07-23 | 1999-02-12 | Toshiba Corp | ウェーハの分割方法及び半導体装置の製造方法 |
US5936837A (en) * | 1997-08-11 | 1999-08-10 | Motorola, Inc. | Semiconductor component having leadframe with offset ground plane |
WO1999011612A2 (en) * | 1997-09-05 | 1999-03-11 | Isis Pharmaceuticals, Inc. | Substituted cyclic compounds and mixtures comprising same |
JP3344552B2 (ja) * | 1997-09-17 | 2002-11-11 | 株式会社東芝 | 圧接型半導体装置 |
JP3622462B2 (ja) | 1997-12-16 | 2005-02-23 | 株式会社日立製作所 | 半導体装置 |
JP3285815B2 (ja) * | 1998-03-12 | 2002-05-27 | 松下電器産業株式会社 | リードフレーム,樹脂封止型半導体装置及びその製造方法 |
JP2951308B1 (ja) * | 1998-03-13 | 1999-09-20 | 松下電子工業株式会社 | リードフレームの製造方法 |
ES2247788T3 (es) * | 1998-04-01 | 2006-03-01 | Ricoh Company, Ltd. | Dispositivo semiconductor y su fabricacion. |
JPH11297917A (ja) * | 1998-04-13 | 1999-10-29 | Sony Corp | 半導体装置及びその製造方法 |
JP3562311B2 (ja) * | 1998-05-27 | 2004-09-08 | 松下電器産業株式会社 | リードフレームおよび樹脂封止型半導体装置の製造方法 |
JPH11354705A (ja) * | 1998-06-04 | 1999-12-24 | Toshiba Corp | 半導体装置及び半導体装置の製造方法 |
KR100298692B1 (ko) * | 1998-09-15 | 2001-10-27 | 마이클 디. 오브라이언 | 반도체패키지제조용리드프레임구조 |
US6281568B1 (en) * | 1998-10-21 | 2001-08-28 | Amkor Technology, Inc. | Plastic integrated circuit device package and leadframe having partially undercut leads and die pad |
FR2786957B1 (fr) * | 1998-12-07 | 2001-02-23 | Sfim Ind | Actionneur piezo-electrique ou electrostrictif |
TW428295B (en) * | 1999-02-24 | 2001-04-01 | Matsushita Electronics Corp | Resin-sealing semiconductor device, the manufacturing method and the lead frame thereof |
MY133357A (en) | 1999-06-30 | 2007-11-30 | Hitachi Ltd | A semiconductor device and a method of manufacturing the same |
JP4273592B2 (ja) * | 1999-10-08 | 2009-06-03 | 株式会社デンソー | 樹脂封止型半導体装置の製造方法 |
US6355502B1 (en) * | 2000-04-25 | 2002-03-12 | National Science Council | Semiconductor package and method for making the same |
JP4523138B2 (ja) * | 2000-10-06 | 2010-08-11 | ローム株式会社 | 半導体装置およびそれに用いるリードフレーム |
JP3895570B2 (ja) * | 2000-12-28 | 2007-03-22 | 株式会社ルネサステクノロジ | 半導体装置 |
WO2002061835A1 (fr) * | 2001-01-31 | 2002-08-08 | Hitachi, Ltd | Dispositif a semi-conducteur et procede de fabrication |
JP2003204027A (ja) * | 2002-01-09 | 2003-07-18 | Matsushita Electric Ind Co Ltd | リードフレーム及びその製造方法、樹脂封止型半導体装置及びその製造方法 |
CN100380651C (zh) * | 2002-04-30 | 2008-04-09 | 株式会社瑞萨科技 | 半导体器件和电子设备 |
TWI338358B (en) * | 2003-11-19 | 2011-03-01 | Rohm Co Ltd | Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same |
-
2000
- 2000-06-08 MY MYPI20002571 patent/MY133357A/en unknown
- 2000-06-30 KR KR1020077021569A patent/KR100864781B1/ko active IP Right Grant
- 2000-06-30 KR KR1020077011557A patent/KR100743335B1/ko active IP Right Grant
- 2000-06-30 AU AU57069/00A patent/AU5706900A/en not_active Abandoned
- 2000-06-30 WO PCT/JP2000/004340 patent/WO2001003186A1/ja active Application Filing
- 2000-06-30 KR KR1020087007985A patent/KR100885606B1/ko active IP Right Grant
- 2000-06-30 JP JP2001508498A patent/JP3839321B2/ja not_active Expired - Lifetime
- 2000-06-30 KR KR1020077030414A patent/KR100878939B1/ko active IP Right Grant
- 2000-06-30 CN CNB008096791A patent/CN1248308C/zh not_active Expired - Lifetime
- 2000-06-30 KR KR1020017016929A patent/KR100809821B1/ko active IP Right Grant
-
2002
- 2002-08-27 US US10/227,817 patent/US20030001249A1/en not_active Abandoned
-
2004
- 2004-06-30 US US10/879,010 patent/US7804159B2/en not_active Expired - Fee Related
-
2008
- 2008-08-01 US US12/222,099 patent/US7777312B2/en not_active Expired - Fee Related
- 2008-10-09 JP JP2008262404A patent/JP4388586B2/ja not_active Expired - Lifetime
-
2009
- 2009-01-26 JP JP2009013905A patent/JP4917112B2/ja not_active Expired - Lifetime
- 2009-11-02 US US12/610,900 patent/US7821119B2/en not_active Expired - Fee Related
-
2010
- 2010-10-04 US US12/897,221 patent/US8115298B2/en not_active Expired - Fee Related
- 2010-10-05 JP JP2010225542A patent/JP5564392B2/ja not_active Expired - Lifetime
-
2012
- 2012-01-24 US US13/357,076 patent/US8637965B2/en not_active Expired - Fee Related
-
2013
- 2013-03-11 JP JP2013047511A patent/JP2013141009A/ja active Pending
- 2013-12-17 US US14/108,507 patent/US8969138B2/en not_active Expired - Fee Related
-
2014
- 2014-03-31 JP JP2014073052A patent/JP2014143434A/ja active Pending
-
2015
- 2015-02-16 US US14/623,032 patent/US9484288B2/en not_active Expired - Lifetime
- 2015-10-05 JP JP2015197447A patent/JP2016001763A/ja active Pending
-
2016
- 2016-02-05 JP JP2016020533A patent/JP2016105503A/ja active Pending
- 2016-05-27 US US15/166,603 patent/US20160276253A1/en not_active Abandoned
- 2016-11-11 JP JP2016220525A patent/JP2017028333A/ja active Pending
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR920010862A (ko) * | 1990-11-30 | 1992-06-27 | 이노우에 사다오 | 반도체 장치 및 이것에 사용되는 리드프레임 |
KR920013647A (ko) * | 1990-12-31 | 1992-07-29 | 김광호 | 반도체 장치의 패키지 몰딩 방법 |
US5594274A (en) * | 1993-07-01 | 1997-01-14 | Nec Corporation | Lead frame for use in a semiconductor device and method of manufacturing the semiconductor device using the same |
KR960005972A (ko) * | 1994-07-13 | 1996-02-23 | 야스까와 히데아끼 | 수지 밀폐형 반도체 장치 및 그 제조 방법 |
JPH0883876A (ja) * | 1994-07-13 | 1996-03-26 | Seiko Epson Corp | 樹脂封止型半導体装置およびその製造方法 |
KR970023917A (ko) * | 1995-10-30 | 1997-05-30 | 김광호 | 와이어의 단락을 방지하기 위한 반도체 패키지 |
KR970053627A (ko) * | 1995-12-11 | 1997-07-31 | 니시무로 타이조 | 수지 밀봉형 반도체 장치 |
KR19990044365A (ko) * | 1996-07-03 | 1999-06-25 | 야스카와 히데아키 | 수지 밀봉형 반도체 장치 및 그 제조 방법 |
KR19980025552A (ko) * | 1996-10-02 | 1998-07-15 | 김광호 | 저응력 반도체 칩 패키지 |
KR19980032022A (ko) * | 1996-10-09 | 1998-07-25 | 사와무라시꼬 | 반도체 장치및 그의 제조방법 |
WO1998029903A1 (en) * | 1996-12-26 | 1998-07-09 | Hitachi, Ltd. | Resin-encapsulated semiconductor device and method for manufacturing the same |
JPH11111749A (ja) * | 1997-10-03 | 1999-04-23 | Dainippon Printing Co Ltd | 半導体装置とそれに用いられる回路部材およびそれらの製造方法 |
US6229200B1 (en) * | 1998-06-10 | 2001-05-08 | Asat Limited | Saw-singulated leadless plastic chip carrier |
JP2000012758A (ja) * | 1998-06-26 | 2000-01-14 | Matsushita Electron Corp | リードフレームおよびそれを用いた樹脂封止型半導体装置およびその製造方法 |
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