JP2009026884A - 回路モジュール及び電気部品 - Google Patents
回路モジュール及び電気部品 Download PDFInfo
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Abstract
【解決手段】固体回路部と基板接続部分とを備えた電気部品において、固体回路部は、基板接続部分を支持する支持面と、当該支持部の外側に、他の固体回路部と対向する対向面とを備え、対向面において他の固体回路部の対向面と対向するように配置できる。高さの異なる基板接続部分を有する電気部品を用意することにより、回路基板上に千鳥状に配置することができる。
【選択図】 図1
Description
11、11a〜11e 基板接続部分
12 半田ボール
13 モールド部
Claims (11)
- 半導体を基材とした固体回路部と、当該固体回路部を電気的に外部基板に搭載する基板接続部分とを備え、前記固体回路部は、前記外部基板に搭載する側に、前記基板接続部分の前記外部基板に搭載する搭載面に対向し、前記基板接続部分を支持する支持面と、該支持面の外側に設けられ、他の固体回路部と対向する対向面とを含んでいることを特徴とする電気部品。
- 請求項1において、前記基板接続部分は、前記固体回路部の前記支持面に接続された第1の接続部品と、前記外部基板に搭載され、前記支持面と同一サイズの前記搭載面を有する第2の接続部品を備えたことを特徴とする電気部品。
- 請求項1において、前記基板接続部分は、前記外部基板に搭載される前記支持面と同一サイズの前記外部基板搭載面と、前記固体回路部の前記支持面と前記対向面の和よりも小さくない面積を有する前記固体回路部との接続面とを有することを特徴とる電気部品。
- 請求項1において、前記基板接続部分は、前記外部基板に搭載され、前記支持面と同一サイズを備えた基板搭載面を有する第1の接続部品と、当該第1の部品と前記固体回路部との間に設けられ、前記固体回路部の前記支持面と前記対向面の和よりも小さくない面積を備えた第2の接続部品を有していることを特徴とする電気部品。
- 請求項1〜4のいずれかにおいて、前記固体回路部は、少なくとも一部が樹脂モールドされていることを特徴とする電気部品。
- 請求項1〜5のいずれかにおいて、前記固体回路部は、複数の固体回路素子を積層した構造を有していることを特徴とする電気部品。
- 請求項1〜6のいずれかにおいて、前記基板接続部分は、前記固体回路部の中央部に接続されていることを特徴とする電気部品。
- 請求項1〜6のいずれかにおいて、前記基板接続部分は、前記固体回路の中央部とは異なる位置に接続されていることを特徴とする電気部品。
- 回路基板と、当該回路基板に搭載される複数の電気部品とを備え、前記複数の電気部品は、高さ方向に、隣接する前記電気部品が部分的に重なるように、千鳥状に配置されていることを特徴とする回路モジュール。
- 請求項9において、前記電気部品は、半導体を基材とした固体回路部と、当該固体回路部を電気的に前記回路基板に搭載する基板接続部分とを備え、前記固体回路部は、前記回路基板に搭載する側に、前記基板接続部分の前記外部基板と搭載する面に対向し、前記基板接続部分を支持する支持面と、該支持面の外側に設けられ、他の固体回路部と対向する対向面とを含んでいることを特徴とする回路モジュール。
- 請求項10において、前記固体回路部はDRAMを有していることを特徴とする回路モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2007187258A JP2009026884A (ja) | 2007-07-18 | 2007-07-18 | 回路モジュール及び電気部品 |
US12/175,574 US7763971B2 (en) | 2007-07-18 | 2008-07-18 | Circuit module and electrical component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2007187258A JP2009026884A (ja) | 2007-07-18 | 2007-07-18 | 回路モジュール及び電気部品 |
Publications (1)
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JP2009026884A true JP2009026884A (ja) | 2009-02-05 |
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JP2007187258A Pending JP2009026884A (ja) | 2007-07-18 | 2007-07-18 | 回路モジュール及び電気部品 |
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US (1) | US7763971B2 (ja) |
JP (1) | JP2009026884A (ja) |
Families Citing this family (1)
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US9603252B1 (en) * | 2013-11-12 | 2017-03-21 | Smart Modular Technologies, Inc. | Integrated circuit device system with elevated configuration and method of manufacture thereof |
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JP2001053243A (ja) | 1999-08-06 | 2001-02-23 | Hitachi Ltd | 半導体記憶装置とメモリモジュール |
JP2002110856A (ja) | 2000-10-03 | 2002-04-12 | Sony Corp | 半導体装置の製造方法 |
JP4109839B2 (ja) | 2001-06-01 | 2008-07-02 | 株式会社東芝 | 半導体装置 |
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JP3507059B2 (ja) * | 2002-06-27 | 2004-03-15 | 沖電気工業株式会社 | 積層マルチチップパッケージ |
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TWI242861B (en) * | 2003-08-11 | 2005-11-01 | Siliconware Precision Industries Co Ltd | Multi-chip semiconductor package with heat sink and fabrication method thereof |
JP4507099B2 (ja) | 2004-07-09 | 2010-07-21 | エルピーダメモリ株式会社 | 半導体装置モジュール |
DE102004049356B4 (de) * | 2004-10-08 | 2006-06-29 | Infineon Technologies Ag | Halbleitermodul mit einem internen Halbleiterchipstapel und Verfahren zur Herstellung desselben |
US8198735B2 (en) * | 2006-12-31 | 2012-06-12 | Stats Chippac Ltd. | Integrated circuit package with molded cavity |
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2007
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2008
- 2008-07-18 US US12/175,574 patent/US7763971B2/en active Active
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JPH01305553A (ja) * | 1988-06-03 | 1989-12-08 | Nec Corp | 半導体集積回路用パッケージ |
JPH07263620A (ja) * | 1994-03-22 | 1995-10-13 | Hitachi Ltd | 半導体装置 |
JP2000031614A (ja) * | 1997-11-04 | 2000-01-28 | Seiko Epson Corp | メモリモジュールおよびメモリモジュールの積層体ならびにメモリモジュールを具備するメモリカードおよびコンピュータ |
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JP2005123463A (ja) * | 2003-10-17 | 2005-05-12 | Seiko Epson Corp | 半導体装置及びその製造方法、半導体装置モジュール、回路基板並びに電子機器 |
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US7763971B2 (en) | 2010-07-27 |
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