KR100756303B1 - 몰드수지 밀봉형 파워 반도체장치 및 그 제조방법 - Google Patents
몰드수지 밀봉형 파워 반도체장치 및 그 제조방법 Download PDFInfo
- Publication number
- KR100756303B1 KR100756303B1 KR1020030041430A KR20030041430A KR100756303B1 KR 100756303 B1 KR100756303 B1 KR 100756303B1 KR 1020030041430 A KR1020030041430 A KR 1020030041430A KR 20030041430 A KR20030041430 A KR 20030041430A KR 100756303 B1 KR100756303 B1 KR 100756303B1
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- South Korea
- Prior art keywords
- resin layer
- insulating resin
- mold
- layer
- metal plate
- Prior art date
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Abstract
Description
<과제의 정리>
Claims (3)
- 주표면과, 그 두께 방향으로 상기 주표면에 대향한 저면과, 상기 주표면과 상기 저면 사이에 끼워진 측면을 구비하는 히트싱크로서의 금속판과,상기 금속판의 상기 주표면의 둘레부 상에 직접적으로 고착된 선단부를 구비하는 제1 내부 리드부와, 상기 제1 내부 리드부에 연속적으로 연결된 제1 외부 리드부를 구비하는 제1 리드프레임과,전극을 갖는 선단부를 구비하는 제2 내부 리드부와, 상기 제2 내부 리드부에 연속적으로 연결된 제2 외부 리드부를 구비하는 제2 리드프레임과,상기 금속판의 상기 주표면의 중앙부 상에 도전층을 통해 고착된 도전패턴을 갖는 하면과, 그 두께 방향으로 상기 하면에 대향하고 있는 동시에 상기 제2 내부 리드부의 상기 전극과 금속배선을 통해 전기적으로 접속된 전극패턴을 갖는 상면과, 상기 상면과 상기 하면 사이에 끼워진 측면을 구비하는 파워 반도체칩과,상기 금속판의 상기 저면에 접촉하면서 상기 저면에 고착된 상면과, 그 두께 방향으로 상기 상면에 대향하는 하면과, 상기 상면과 상기 하면 사이에 끼워진 측면을 구비하는 절연수지층과,상기 절연수지층의 상기 하면에 접촉하면서 해당 하면에 고착된 상면과, 그 두께 방향으로 상기 상면에 대향함과 동시에, 적어도 상기 절연수지층과 상기 금속판과의 계면 바로 아래에 위치하는 부분은 외부에 노출되어 있는 하면과, 상기 상면과 상기 노출 하면 사이에 끼워진 측면을 구비하는 금속층과,적어도, 상기 제1 및 제2 내부 리드부와, 상기 금속배선과, 상기 파워 반도체칩의 상기 상면 및 상기 측면과, 상기 도전층과, 상기 금속판의 상기 주표면 및 상기 측면을 피복하여 패키지를 형성하는 몰드수지를 구비한 것을 특징으로 하는 몰드수지 밀봉형 파워 반도체장치.
- 제 1 항에 있어서,상기 절연수지층의 상기 상면의 치수는 상기 금속판의 상기 저면의 치수보다도 크고,상기 절연수지층의 상기 상면은 상기 절연수지층과 상기 금속판과의 상기 계면을 전면적으로 포함하고 있으며,상기 금속층의 상기 상면의 치수는 상기 절연수지층의 상기 하면의 치수와 같고,상기 몰드수지는, 적어도, 상기 제1 및 제2 내부 리드부와, 상기 금속배선과, 상기 파워 반도체칩의 상기 상면 및 상기 측면과, 상기 도전층과, 상기 금속판의 상기 주표면 및 상기 측면과, 상기 절연수지층의 상기 상면 내에서 상기 절연수지층과 상기 금속판과의 상기 계면의 외측부분과, 상기 절연수지층의 상기 측면과, 상기 금속층의 상기 측면을 완전히 피복하고 있으며,상기 금속층의 상기 하면에서의 상기 노출부분은 상기 패키지의 상기 저면의 일부를 이루고 있는 것을 특징으로 하는 몰드수지 밀봉형 파워 반도체장치.
- 금속층과, 상기 금속층의 상면 상에 적층 고착된 미경화의 절연수지층과의 복합체인 절연시트를 몰드금형 내의 소정의 위치에 배치하고, 상기 금속층의 하면을 상기 몰드금형의 캐비티 저면에 면 접촉시키는 공정과,상기 몰드금형 내에서, 상기 절연시트의 표면 상에, 파워 반도체칩이 그 위에 탑재된 주표면과 그 두께 방향에 관해서 상기 주표면과 대향하는 저면을 구비하는 히트싱크로서의 금속판을 배치하고, 상기 금속판의 상기 저면을 상기 미경화의 절연수지층의 상면에 면 접촉시키는 공정과,상기 금속판으로부터 상기 절연시트에 대한 압력을 인가하면서 몰드수지를 상기 몰드금형의 캐비티 내에 주입하는 공정과,상기 캐비티가 모두 상기 몰드수지로 충전된 후에 상기 압력의 인가를 중지하고, 상기 몰드수지와 상기 미경화의 절연수지층을 경화시키는 공정을 구비한 것을 특징으로 하는 몰드수지 밀봉형 파워 반도체장치의 제조방법
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JP4459883B2 (ja) * | 2005-04-28 | 2010-04-28 | 三菱電機株式会社 | 半導体装置 |
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JP2007288054A (ja) * | 2006-04-19 | 2007-11-01 | Toyota Motor Corp | パワーモジュール |
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US7151311B2 (en) | 2006-12-19 |
CN1290183C (zh) | 2006-12-13 |
DE10331857A1 (de) | 2004-05-27 |
CN1499619A (zh) | 2004-05-26 |
DE10331857B4 (de) | 2008-01-24 |
JP3740116B2 (ja) | 2006-02-01 |
JP2004165281A (ja) | 2004-06-10 |
US20040089928A1 (en) | 2004-05-13 |
KR20040041486A (ko) | 2004-05-17 |
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