JP2012503149A - 熱抵抗材料 - Google Patents
熱抵抗材料 Download PDFInfo
- Publication number
- JP2012503149A JP2012503149A JP2011526998A JP2011526998A JP2012503149A JP 2012503149 A JP2012503149 A JP 2012503149A JP 2011526998 A JP2011526998 A JP 2011526998A JP 2011526998 A JP2011526998 A JP 2011526998A JP 2012503149 A JP2012503149 A JP 2012503149A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thermal insulation
- polymer layer
- ceramic layer
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000463 material Substances 0.000 title claims abstract description 82
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
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- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 4
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- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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Abstract
【選択図】 図1
Description
dQ/dt=熱流率
k=層の材料の熱伝導率
r=熱流の半径方向
dT/dr=半径方向における温度勾配
変化しないと推定されるが、これはシステムの物理的パラメータである単層の効果的な熱抵抗(REFF)の計算に影響を及ぼすものではない。このアプローチは、システムの時間依存性温度挙動の計算を提供するものではない。
dQ/dt=熱流率
k=層の材料の熱伝導率
r=熱流の半径方向
dT/dr=半径方向における温度勾配
Claims (96)
- 断熱材であって、
セラミック層または高分子層から形成されたオープンセル・ネットワークを含み、ここでセラミック層または高分子層は少なくとも一つの構造を持つ基板を含み、セラミック層または高分子層の配置によってセラミック層または高分子層の周辺で真空バリアを用いてシールされうる各層内部における体積の大きな空隙での近真空圧力の形成が可能となる断熱材。 - 前記オープンセル・ネットワークが材料体積に対して少なくとも40%の真空領域で特徴付けられる、請求項1に記載の断熱材。
- オープンセル構造を可能にする体積の大きな領域を形成しつつ、前記構造が空洞に構造的サポートを提供する、請求項1に記載の断熱材。
- 前記構造が先端部分よりも大きいベース部分で特徴付けられる、請求項1に記載の断熱材。
- 前記構造がレンズ状突起、蛇腹式構造、T字型、U字型、正方形、長方形、または不規則または正多面体の柱および柱断面、曲線、円形、かぎ状、楕円、およびその組み合わせである柱および柱断面を含む、請求項1に記載の断熱材。
- 前記構造がレンズ状突起である、請求項1に記載の断熱材。
- レンズ状突起の両側が曲線、直線またはその組み合わせである、請求項6に記載の断熱材。
- セラミック層または高分子層が複数の構造を含む、請求項1に記載の断熱材。
- 構造が基板の片側から延びている、請求項8に記載の断熱材。
- 構造が基板の両側から延びている、請求項8に記載の断熱材。
- セラミック層または高分子層が断熱材の熱抵抗を高めるような方法で積み重ねられた複数の基板を含む、請求項1に記載の断熱材。
- セラミック層または高分子層が表面反射材料を含む、請求項1に記載の断熱材。
- 表面反射材料がアルミニウム箔、金箔、あるいはアルミまたは二重アルミMYLAR(登録商標)フィルムから成る、請求項12に記載の断熱材。
- 表面反射材料が高反射性の誘電材料を含む、請求項12に記載の断熱材。
- 高反射性の誘電材料が二酸化チタンである、請求項14に記載の断熱材。
- 表面反射材料の厚さが約1.0μm以下である、請求項12に記載の断熱材。
- 表面反射材料が少なくとも一つの構造の各面に結合された、請求項12に記載の断熱材。
- 近真空圧力が最大で約10−3バールである、請求項1に記載の断熱材。
- 近真空圧力が約10−6バール以下である、請求項1に記載の断熱材。
- 断熱構造材料の厚さが約0.01mm〜約1mmである、請求項1に記載の断熱材。
- 第二のセラミック層または高分子層がストラタム形成のために少なくとも一つの構造を持つ基板を含む、第二のセラミック層または高分子層をさらに含む、請求項1に記載の断熱材。
- セラミック層または高分子層が複数の構造を含む、請求項21に記載の断熱材。
- 構造が基板の片側から延びている、請求項22に記載の断熱材。
- 構造が基板の両側から延びている、請求項22に記載の断熱材。
- 構造が基板にとって不可欠である、請求項21に記載の断熱材。
- 第二のセラミック層または高分子層の少なくとも一つの構造の形状が、第一のセラミック層または高分子層の少なくとも一つの構造の形状と同じである、請求項21に記載の断熱材。
- 第二のセラミック層または高分子層の少なくとも一つの構造が、第一のセラミック層または高分子層の少なくとも一つの構造とは異なる形で回転され、および角度付けられている、請求項22に記載の断熱材。
- 第二のセラミック層または高分子層の少なくとも一つの構造の形状が、第一のセラミック層または高分子層の少なくとも一つの構造の形状とは異なる、請求項21に記載の断熱材。
- 第二のセラミック層または高分子層の少なくとも一つの構造の周期性が、第一のセラミック層または高分子層の少なくとも一つの構造の周期性と同じである、請求項21に記載の断熱材。
- 第二のセラミック層または高分子層の少なくとも一つの構造の周期性が、第一のセラミック層または高分子層の少なくとも一つの構造の周期性とは異なる、請求項21に記載の断熱材。
- 第二のセラミック層または高分子層が、対応する構造が接触した状態で第一のセラミック層または高分子層の上に位置付けられている、請求項21に記載の断熱材。
- 第二のセラミック層または高分子層が、対応する基板が接触した状態で第一のセラミック層または高分子層の上に位置付けられている、請求項21に記載の断熱材。
- 第二のセラミック層または高分子層の少なくとも一つの構造が、第一のセラミック層または高分子層の少なくとも一つの構造と並行して位置付けられている、請求項21に記載の断熱材。
- 断熱材の熱抵抗が円筒状熱導体によって近似される、請求項33に記載の断熱材。
- 第二のセラミック層または高分子層の少なくとも一つの構造が、第一のセラミック層または高分子層の少なくとも一つの構造と直交して位置付けられている、請求項21に記載の断熱材。
- 断熱材の熱抵抗が球状熱導体によって近似される、請求項35に記載の断熱材。
- 第二のセラミック層または高分子層が表面反射材料を含む、請求項21に記載の断熱材。
- 第二のセラミック層または高分子層の表面反射材料がアルミニウム箔、金箔、あるいはアルミまたは二重アルミMYLAR(登録商標)フィルムから成る、請求項37に記載の断熱材。
- 第二のセラミック層または高分子層の表面反射材料が高反射性の誘電材料を含む、請求項37に記載の断熱材。
- 高反射性の誘電材料が二酸化チタンである、請求項39に記載の断熱材。
- 第二のセラミック層または高分子層の表面反射材料の厚さが約1.0μm以下である、請求項37に記載の断熱材。
- 第二のセラミック層または高分子層の表面反射材料が少なくとも一つの構造の各面に結合された、請求項37に記載の断熱材。
- 第二のセラミック層または高分子層の表面反射材料が、第一のセラミック層または高分子層の表面反射材料に面している、請求項37に記載の断熱材。
- 前記中間層が少なくとも一つの構造を持つ基板を含む、中間層をさらに含む請求項21に記載の断熱材。
- ストラタム形成のために中間層が第一のセラミック層または高分子層と第二のセラミック層または高分子層の間に位置している、請求項44に記載の断熱材。
- 中間層が複数の構造を含む、請求項44に記載の断熱材。
- 中間層が第一のセラミック層または高分子層に対して斜めに位置付けられている、請求項44に記載の断熱材。
- 中間層が第二のセラミック層または高分子層に対して斜めに位置付けられている、請求項44に記載の断熱材。
- 中間層の構造が基板の片側から延びている、請求項48に記載の断熱材。
- 中間層の構造が基板の両側から延びている、請求項48に記載の断熱材。
- 構造が基板にとって不可欠である、請求項44に記載の断熱材。
- 中間層の少なくとも一つの構造の形状が、第二のセラミック層または高分子層の少なくとも一つの構造の形状および第一のセラミック層または高分子層の少なくとも一つの構造の形状と同じである、請求項44に記載の断熱材。
- 中間層の少なくとも一つの構造の形状が、第二のセラミック層または高分子層の少なくとも一つの構造の形状および第一のセラミック層または高分子層の少なくとも一つの構造の形状とは異なる、請求項44に記載の断熱材。
- 中間層の少なくとも一つの構造が蛇腹式構造である、請求項44に記載の断熱材。
- 蛇腹式構造の上下の表面との接触領域が制御されるように、蛇腹式構造の三角形部分の先端が予め決められた幅である、請求項54に記載の断熱材。
- 断熱材が、反射性表面を持つ場合も持たない場合もある状態で、真空を実現・保護する保護的な高分子被覆で真空シールされている、請求項1〜55に記載の断熱材。
- 柔軟性のあるパネルである、請求項1〜55に記載の断熱材。
- 鋳造および硬化または型押し方法により製造されたマイクロレプリケーション構造である、請求項1〜55に記載の断熱材。
- 食品包装、飲料用缶、ボトル、柔軟性のある飲料用包装袋、送電ケーブルおよび機器用の断熱体、液体寒剤用の移動および輸送システム、ヒートパイプ、熱ポンプ、車両用推進剤タンク、供給ライン、冷蔵ユニット、電化製品、医療品包装、医療搬送用ボックス、容器、二酸化炭素、アンモニア、冷却水または塩水、石油および蒸気の移動および輸送システム、木製ボード、石こうボード、屋根断熱、および真空断熱材料から成る一群から選ばれた、請求項1に記載の断熱材を含む製品。
- 断熱材装置であって、
第一のセラミック層または高分子層が第一の構造を含む第一のセラミック層または高分子層、第二のセラミック層または高分子層が第二の構造を含む第二のセラミック層または高分子層、第一の中間層が第三の構造を含む第一の中間層、第二の中間層が第四の構造を含む第二の中間層および反射材料層から形成され、第一および第二のセラミック層または高分子層、第一および第二の中間層、および反射材料層の配置によって、シールされうる前記層それぞれの内部での真空の形成が可能となるオープンセル・ネットワークを含む四層のストラタム、および、
第一、第二、第三および第四の構造の総表面積の約1%以下が互いに接触し合っている保護的な高分子被覆を含む、断熱材装置。 - さらに表面反射材料を含む、請求項60に記載の断熱材装置。
- 前記オープンセル・ネットワークが材料体積に対して少なくとも40%の真空領域で特徴付けられる、請求項60に記載の断熱材装置。
- 第一および第二の中間層がセラミック層または高分子層である、請求項60に記載の断熱材装置。
- 第一、第二、第三、および第四の構造のいずれかが先端部分よりも大きいベース部分で特徴付けられる、請求項60に記載の断熱材装置。
- ベース部分がベース基板に取り付けられている、請求項64に記載の断熱材装置。
- 第一、第二、第三および第四の構造のいずれかがレンズ状突起である、請求項60に記載の断熱材装置。
- 第一、第二、第三および第四の構造のいずれかが蛇腹式構造である、請求項60に記載の断熱材装置。
- 反射材料層がアルミニウム箔、金箔、あるいはアルミまたは二重アルミMYLAR(登録商標)フィルムから成る、請求項60に記載の断熱材装置。
- 反射材料層が高反射性の誘電材料を含む、請求項60に記載の断熱材装置。
- 高反射性の誘電材料が二酸化チタンである、請求項69に記載の断熱材装置。
- 反射材料層の厚さが約1.0μm以下である、請求項60に記載の断熱材装置。?
- 反射材料層が第一、第二、第三および第四の構造の少なくとも一つの少なくとも一部分に結合されている、請求項60に記載の断熱材装置。
- 反射材料層が多層スタックである、請求項60に記載の断熱材装置。
- セル状のシーリング・マトリックス層をさらに含む、請求項60に記載の断熱材装置。
- 前記断熱材装置が約6ヵ月〜約50年間、真空を持続することができる、請求項60に記載の断熱材装置。
- 層ごとのガスバリアをさらに含む、請求項60に記載の断熱材装置。
- 層ごとの防湿層をさらに含む、請求項60に記載の断熱材装置。
- ナノ被覆材料がゲッターとしての役目を果たす、ナノ被覆材料をさらに含む請求項60に記載の断熱材装置。
- 複数の内部周辺真空シール層をさらに含む、請求項60に記載の断熱材装置。
- 真空蒸着した金属の層をさらに含む、請求項60に記載の断熱材装置。
- 容器の表面の所定の部分に前記断熱材装置が形成される、請求項60に記載の断熱材装置。
- 四層から成る第二のストラタムを少なくともさらに含み、前記第二のストラタムが、第一のセラミック層または高分子層が第一の構造を含む第一のセラミック層または高分子層、第二のセラミック層または高分子層が第二の構造を含む第二のセラミック層または高分子層、第一の中間層が第三の構造を含む第一の中間層、第二の中間層が第四の構造を含む第二の中間層および反射材料層から形成されるオープンセル・ネットワークを含み、第一および第二のセラミック層または高分子層、第一および第二の中間層、および反射材料層の配置によってシールされうる前記層それぞれの内部での真空の形成が可能となる、請求項60に記載の断熱材装置。
- 第一のストラタムの第一、第二、第三および第四の構造の形状が第二のストラタムの第一、第二、第三および第四の構造の対応する形状と同じである、請求項82に記載の断熱材装置。
- 第一のストラタムの第一、第二、第三および第四の構造の形状が第二のストラタムの第一、第二、第三および第四の構造の対応する形状とは異なる、請求項82に記載の断熱材装置。
- 第一のストラタムおよび第二のストラタムが対応する層と同じ周期性の層を持つ、請求項82に記載の断熱材装置。
- 第一のストラタムおよび第二の層ストラタムが少なくとも一つの対応する層で異なる周期性を持つ、請求項82に記載の断熱材装置。
- 第一のストラタムの少なくとも一つの層が第二のストラタムの対応する層からオフセットされている、請求項82に記載の断熱材装置。
- 第一および第二のストラタムそれぞれに内部切断点があり、第一のストラタムおよび第二のストラタムの前記内部切断点が断熱材装置にある程度の柔軟性を与えるように配列されている、請求項82に記載の断熱材装置。
- 円筒状または実質的に円筒状に形成され、近真空圧力でシールされて飲料または他の容器用の断熱内部層または外部層を形成する、請求項82に記載の断熱材装置。
- 第一のストラタムの第一、第二、第三および第四の構造の少なくとも一つが、第二のストラタムの第一、第二、第三および第四の構造の少なくとも一つに対して斜めに位置付けられている、請求項82に記載の断熱材装置。
- 第一のストラタムの第一、第二、第三および第四の構造の少なくとも一つが、第二のストラタムの第一、第二、第三および第四の構造の少なくとも一つに直交して位置付けられている、請求項82に記載の断熱材装置。
- 第一のストラタムの第一、第二、第三および第四の構造の少なくとも一つが、第二のストラタムの第一、第二、第三および第四の構造の少なくとも一つに並行して位置付けられている、請求項82に記載の断熱材装置。
- 前記断熱材装置が乾燥されている、請求項82に記載の断熱材装置。
- 層間で近真空を維持するために前記断熱材装置が真空シールされている、請求項82に記載の断熱材装置。
- 前記断熱材装置が装置周辺で、真空下でヒートシールされている、請求項82に記載の断熱材装置。
- 前記断熱材装置が前記装置の周辺に延びているガスバリアおよび防湿層の材料により同時に装置周辺で真空ヒートシールされている、請求項82に記載の断熱材装置。
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US9705108P | 2008-09-15 | 2008-09-15 | |
US61/097,051 | 2008-09-15 | ||
PCT/US2009/056674 WO2010030890A2 (en) | 2008-09-15 | 2009-09-11 | Thermal resistor material |
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US (1) | US20100068471A1 (ja) |
EP (1) | EP2334492A2 (ja) |
JP (1) | JP2012503149A (ja) |
CN (1) | CN102317065A (ja) |
AU (1) | AU2009291631A1 (ja) |
CA (1) | CA2737157A1 (ja) |
TW (1) | TW201022570A (ja) |
WO (1) | WO2010030890A2 (ja) |
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US20100068471A1 (en) * | 2008-09-15 | 2010-03-18 | Thin Thermal Barriers Limited | Thermal resistor material |
US10753023B2 (en) | 2010-08-13 | 2020-08-25 | Kimberly-Clark Worldwide, Inc. | Toughened polylactic acid fibers |
CN102383703A (zh) * | 2011-08-12 | 2012-03-21 | 浙江天泉表面技术有限公司 | 一种防火门 |
US20130101789A1 (en) * | 2011-10-25 | 2013-04-25 | Neil D. Lubart | Thermal resistor material |
KR102166747B1 (ko) * | 2013-06-12 | 2020-10-16 | 킴벌리-클라크 월드와이드, 인크. | 단열재에 사용하기 위한 중합체 물질 |
WO2014199270A1 (en) | 2013-06-12 | 2014-12-18 | Kimberly-Clark Worldwide, Inc. | Absorbent article containing a porous polyolefin film |
CN104131624B (zh) * | 2014-06-26 | 2016-08-24 | 成都绿迪科技有限公司 | 复合真空隔热板 |
KR101507541B1 (ko) | 2014-07-08 | 2015-03-31 | 이영주 | 단열필름 |
CN104344157B (zh) * | 2014-10-22 | 2017-02-01 | 杭州富士达特种材料股份有限公司 | 一种低温多层绝热结构及其加工方法 |
CN112157967A (zh) * | 2020-10-27 | 2021-01-01 | 李纪用 | 一种高性能生态板 |
CN114263664B (zh) * | 2021-10-19 | 2022-09-13 | 大连理工大学 | 一种高效兼顾承载与隔热需求的连接机构 |
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Also Published As
Publication number | Publication date |
---|---|
EP2334492A2 (en) | 2011-06-22 |
US20100068471A1 (en) | 2010-03-18 |
WO2010030890A3 (en) | 2010-09-16 |
WO2010030890A2 (en) | 2010-03-18 |
AU2009291631A1 (en) | 2010-03-18 |
CA2737157A1 (en) | 2010-03-18 |
CN102317065A (zh) | 2012-01-11 |
TW201022570A (en) | 2010-06-16 |
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