JP4766162B2 - パワーモジュール - Google Patents
パワーモジュール Download PDFInfo
- Publication number
- JP4766162B2 JP4766162B2 JP2009183269A JP2009183269A JP4766162B2 JP 4766162 B2 JP4766162 B2 JP 4766162B2 JP 2009183269 A JP2009183269 A JP 2009183269A JP 2009183269 A JP2009183269 A JP 2009183269A JP 4766162 B2 JP4766162 B2 JP 4766162B2
- Authority
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- Prior art keywords
- power module
- substrate
- finished product
- semi
- heat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 184
- 239000011265 semifinished product Substances 0.000 claims description 76
- 239000011347 resin Substances 0.000 claims description 74
- 229920005989 resin Polymers 0.000 claims description 74
- 238000000465 moulding Methods 0.000 claims description 43
- 239000004065 semiconductor Substances 0.000 claims description 22
- 239000000047 product Substances 0.000 description 41
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- 238000009413 insulation Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 8
- 230000006378 damage Effects 0.000 description 7
- 230000005484 gravity Effects 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 6
- 238000005336 cracking Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 231100000989 no adverse effect Toxicity 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20863—Forced ventilation, e.g. on heat dissipaters coupled to components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Description
2 ヒートプレート
3 パワーモジュール基板
4 パワー半導体素子
5、6 外部接続端子
5a、6a 基板接続側端部
5b、6b 外部表出側端部
7 成形樹脂層
7b 有底孔
7c アンダーカット部
8 位置決め孔
9 補助樹脂基板
11 上側成形型
12 下側成形型
13 キャビティー
14 位置決めピン
Y 積層基板体
X パワーモジュール半製品
Z 製品としてのパワーモジュール
イ 重心線
Claims (8)
- 絶縁基板の一方の面に一面側が接合されるヒートプレート、および前記絶縁基板の他方の面に接合し回路パターンが形成されたパワーモジュール基板を含む積層基板体と、前記パワーモジュール基板の回路パターン上に配設されるパワー半導体素子と、前記パワーモジュール基板の基板面に対して交差する方向に起立した状態で配置され、前記パワー半導体素子に電気的に導通する一対の外部接続端子と、を有するパワーモジュール半製品と、
前記一対の外部接続端子における一端側の外部表出側端部及び前記ヒートプレートの他面側をそれぞれ表出させた状態で、前記パワーモジュール半製品を封止する成形樹脂層と
を備え、
前記積層基板体を構成する前記パワーモジュール基板の前記基板面に突出して形成された筒状体に、位置決め孔が形成されたパワーモジュール。 - 絶縁基板の一方の面に一面側が接合されるヒートプレート、および前記絶縁基板の他方の面に接合し回路パターンが形成されたパワーモジュール基板を含む積層基板体と、前記パワーモジュール基板の回路パターン上に配設されるパワー半導体素子と、前記パワーモジュール基板の基板面に対して交差する方向に起立した状態で配置され、前記パワー半導体素子に電気的に導通する一対の外部接続端子と、を有するパワーモジュール半製品と、
前記一対の外部接続端子における一端側の外部表出側端部及び前記ヒートプレートの他面側をそれぞれ表出させた状態で、前記パワーモジュール半製品を封止する成形樹脂層と、
前記一対の外部接続端子における前記外部表出側端部と前記成形樹脂層によって封止される基板接続側端部との境界部に設置される補助樹脂基板と
を備え、
前記補助樹脂基板に位置決め孔が形成されたパワーモジュール。 - 前記成形樹脂層は、前記位置決め孔に挿入された位置決めピンにより形成された有底孔を有しており、該有底孔の内壁面にはアンダーカット部が形成されている請求項2に記載のパワーモジュール。
- 前記アンダーカット部は、前記内壁面に対して凹状である請求項3に記載のパワーモジュール。
- 前記アンダーカット部は、前記内壁面に対して内方に凸状である請求項3に記載のパワーモジュール。
- 前記アンダーカット部は、三角ねじ山状である請求項3に記載のパワーモジュール。
- 前記位置決め孔は、一対の位置決め孔である請求項1から請求項6の何れか一に記載のパワーモジュール。
- 前記一対の位置決め孔は、前記パワーモジュール半製品の重心線に対して互いに対称位置に形成される請求項7に記載のパワーモジュール。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009183269A JP4766162B2 (ja) | 2009-08-06 | 2009-08-06 | パワーモジュール |
KR1020117028616A KR101256763B1 (ko) | 2009-08-06 | 2010-06-22 | 파워 모듈 |
DE112010003191.6T DE112010003191B8 (de) | 2009-08-06 | 2010-06-22 | Verfahren zur Herstellung eines Leistungsmoduls |
PCT/JP2010/004151 WO2011016175A1 (ja) | 2009-08-06 | 2010-06-22 | パワーモジュール |
US13/376,282 US8854820B2 (en) | 2009-08-06 | 2010-06-22 | Power module |
CN201080026307.9A CN102473692B (zh) | 2009-08-06 | 2010-06-22 | 功率模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009183269A JP4766162B2 (ja) | 2009-08-06 | 2009-08-06 | パワーモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011035354A JP2011035354A (ja) | 2011-02-17 |
JP4766162B2 true JP4766162B2 (ja) | 2011-09-07 |
Family
ID=43544089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009183269A Active JP4766162B2 (ja) | 2009-08-06 | 2009-08-06 | パワーモジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US8854820B2 (ja) |
JP (1) | JP4766162B2 (ja) |
KR (1) | KR101256763B1 (ja) |
CN (1) | CN102473692B (ja) |
DE (1) | DE112010003191B8 (ja) |
WO (1) | WO2011016175A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103515340B (zh) | 2012-06-29 | 2016-09-07 | 三星电机株式会社 | 电源模块封装和用于制造电源模块封装的方法 |
CN103515364A (zh) | 2012-06-29 | 2014-01-15 | 三星电机株式会社 | 电源模块封装和用于制造电源模块封装的方法 |
EP4372804A2 (en) | 2012-09-20 | 2024-05-22 | Rohm Co., Ltd. | Power semiconductor device module |
CN103855107A (zh) * | 2012-12-05 | 2014-06-11 | 永济新时速电机电器有限责任公司 | 功率模块及变流器 |
KR101502669B1 (ko) * | 2012-12-14 | 2015-03-13 | 삼성전기주식회사 | 전력 모듈 패키지 및 그 제조방법 |
JP2015026820A (ja) * | 2013-06-18 | 2015-02-05 | 株式会社デンソー | 電子装置 |
JP6398399B2 (ja) * | 2013-09-06 | 2018-10-03 | 富士電機株式会社 | 半導体装置およびその製造方法 |
US9538691B2 (en) * | 2015-04-15 | 2017-01-03 | Ford Global Technologies, Llc | Power inverter for a vehicle |
WO2017038315A1 (ja) * | 2015-08-31 | 2017-03-09 | 日立オートモティブシステムズ株式会社 | ドライバ及びドライバ一体型電動アクチュエータ |
WO2017138092A1 (ja) * | 2016-02-09 | 2017-08-17 | 三菱電機株式会社 | 電力用半導体装置及びその製造方法 |
US10057989B1 (en) * | 2017-04-10 | 2018-08-21 | Tactotek Oy | Multilayer structure and related method of manufacture for electronics |
JP7052426B2 (ja) * | 2018-03-02 | 2022-04-12 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
CN116936561B (zh) | 2020-10-14 | 2024-05-03 | 罗姆股份有限公司 | 半导体模块 |
WO2022080063A1 (ja) | 2020-10-14 | 2022-04-21 | ローム株式会社 | 半導体モジュール |
DE112021002942T5 (de) | 2020-10-14 | 2023-04-20 | Rohm Co., Ltd. | Halbleitermodul |
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JP2891426B2 (ja) * | 1990-01-31 | 1999-05-17 | 株式会社秩父富士 | 半導体装置 |
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JP3516789B2 (ja) * | 1995-11-15 | 2004-04-05 | 三菱電機株式会社 | 半導体パワーモジュール |
JP3168901B2 (ja) * | 1996-02-22 | 2001-05-21 | 株式会社日立製作所 | パワー半導体モジュール |
US5977613A (en) * | 1996-03-07 | 1999-11-02 | Matsushita Electronics Corporation | Electronic component, method for making the same, and lead frame and mold assembly for use therein |
US5844310A (en) * | 1996-08-09 | 1998-12-01 | Hitachi Metals, Ltd. | Heat spreader semiconductor device with heat spreader and method for producing same |
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-
2009
- 2009-08-06 JP JP2009183269A patent/JP4766162B2/ja active Active
-
2010
- 2010-06-22 CN CN201080026307.9A patent/CN102473692B/zh active Active
- 2010-06-22 DE DE112010003191.6T patent/DE112010003191B8/de active Active
- 2010-06-22 WO PCT/JP2010/004151 patent/WO2011016175A1/ja active Application Filing
- 2010-06-22 US US13/376,282 patent/US8854820B2/en active Active
- 2010-06-22 KR KR1020117028616A patent/KR101256763B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE112010003191B8 (de) | 2017-05-04 |
DE112010003191T5 (de) | 2012-07-05 |
WO2011016175A1 (ja) | 2011-02-10 |
DE112010003191B4 (de) | 2016-08-11 |
US8854820B2 (en) | 2014-10-07 |
JP2011035354A (ja) | 2011-02-17 |
KR20120018781A (ko) | 2012-03-05 |
CN102473692A (zh) | 2012-05-23 |
CN102473692B (zh) | 2014-12-03 |
KR101256763B1 (ko) | 2013-04-25 |
US20120127668A1 (en) | 2012-05-24 |
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