JP5079183B2 - テクスチャ加工されたキャパシタ電極上のコンフォーマル薄膜 - Google Patents
テクスチャ加工されたキャパシタ電極上のコンフォーマル薄膜 Download PDFInfo
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- JP5079183B2 JP5079183B2 JP2000368569A JP2000368569A JP5079183B2 JP 5079183 B2 JP5079183 B2 JP 5079183B2 JP 2000368569 A JP2000368569 A JP 2000368569A JP 2000368569 A JP2000368569 A JP 2000368569A JP 5079183 B2 JP5079183 B2 JP 5079183B2
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- layer
- dielectric
- metal
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- silicon
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6502—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials
- H10P14/6506—Formation of intermediate materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6928—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides
- H10P14/6934—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides the material containing zirconium, e.g. ZrSiOx
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69391—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing aluminium, e.g. Al2O3
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69393—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing tantalum, e.g. Ta2O5
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69394—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing titanium, e.g. TiO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69395—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing zirconium, e.g. ZrO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
- H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
- H10D1/712—Electrodes having non-planar surfaces, e.g. formed by texturisation being rough surfaces, e.g. using hemispherical grains
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6339—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Landscapes
- Semiconductor Memories (AREA)
- Chemical Vapour Deposition (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/452844 | 1999-12-03 | ||
| US09/452,844 US6780704B1 (en) | 1999-12-03 | 1999-12-03 | Conformal thin films over textured capacitor electrodes |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001200363A JP2001200363A (ja) | 2001-07-24 |
| JP2001200363A5 JP2001200363A5 (https=) | 2008-01-24 |
| JP5079183B2 true JP5079183B2 (ja) | 2012-11-21 |
Family
ID=23798178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000368569A Expired - Fee Related JP5079183B2 (ja) | 1999-12-03 | 2000-12-04 | テクスチャ加工されたキャパシタ電極上のコンフォーマル薄膜 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US6780704B1 (https=) |
| JP (1) | JP5079183B2 (https=) |
| KR (1) | KR100737304B1 (https=) |
| TW (1) | TW486771B (https=) |
Families Citing this family (630)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI119941B (fi) * | 1999-10-15 | 2009-05-15 | Asm Int | Menetelmä nanolaminaattien valmistamiseksi |
| US20060219157A1 (en) * | 2001-06-28 | 2006-10-05 | Antti Rahtu | Oxide films containing titanium |
| US6974766B1 (en) | 1998-10-01 | 2005-12-13 | Applied Materials, Inc. | In situ deposition of a low κ dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application |
| KR100335775B1 (ko) * | 1999-06-25 | 2002-05-09 | 박종섭 | 반도체 소자의 캐패시터 제조 방법 |
| US7554829B2 (en) | 1999-07-30 | 2009-06-30 | Micron Technology, Inc. | Transmission lines for CMOS integrated circuits |
| WO2001029893A1 (en) * | 1999-10-15 | 2001-04-26 | Asm America, Inc. | Method for depositing nanolaminate thin films on sensitive surfaces |
| KR100363084B1 (ko) * | 1999-10-19 | 2002-11-30 | 삼성전자 주식회사 | 박막 구조를 위한 다중막을 포함하는 커패시터 및 그 제조 방법 |
| FI118804B (fi) * | 1999-12-03 | 2008-03-31 | Asm Int | Menetelmä oksidikalvojen kasvattamiseksi |
| KR100323874B1 (ko) * | 1999-12-22 | 2002-02-16 | 박종섭 | 반도체 소자의 알루미늄 산화막 형성 방법 |
| KR100356473B1 (ko) * | 1999-12-29 | 2002-10-18 | 주식회사 하이닉스반도체 | 반도체 소자의 알루미늄 옥사이드 박막 형성 방법 |
| US6319766B1 (en) | 2000-02-22 | 2001-11-20 | Applied Materials, Inc. | Method of tantalum nitride deposition by tantalum oxide densification |
| US7419903B2 (en) * | 2000-03-07 | 2008-09-02 | Asm International N.V. | Thin films |
| FI117979B (fi) * | 2000-04-14 | 2007-05-15 | Asm Int | Menetelmä oksidiohutkalvojen valmistamiseksi |
| KR100351056B1 (ko) * | 2000-06-27 | 2002-09-05 | 삼성전자 주식회사 | 선택적 금속산화막 형성단계를 포함하는 반도체 소자의 제조방법 |
| US6620723B1 (en) | 2000-06-27 | 2003-09-16 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
| US7101795B1 (en) | 2000-06-28 | 2006-09-05 | Applied Materials, Inc. | Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer |
| US6936538B2 (en) | 2001-07-16 | 2005-08-30 | Applied Materials, Inc. | Method and apparatus for depositing tungsten after surface treatment to improve film characteristics |
| US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
| US7732327B2 (en) | 2000-06-28 | 2010-06-08 | Applied Materials, Inc. | Vapor deposition of tungsten materials |
| US7964505B2 (en) | 2005-01-19 | 2011-06-21 | Applied Materials, Inc. | Atomic layer deposition of tungsten materials |
| US6551929B1 (en) | 2000-06-28 | 2003-04-22 | Applied Materials, Inc. | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques |
| US6461931B1 (en) * | 2000-08-29 | 2002-10-08 | Micron Technology, Inc. | Thin dielectric films for DRAM storage capacitors |
| US7217615B1 (en) * | 2000-08-31 | 2007-05-15 | Micron Technology, Inc. | Capacitor fabrication methods including forming a conductive layer |
| US7112503B1 (en) * | 2000-08-31 | 2006-09-26 | Micron Technology, Inc. | Enhanced surface area capacitor fabrication methods |
| US6420230B1 (en) * | 2000-08-31 | 2002-07-16 | Micron Technology, Inc. | Capacitor fabrication methods and capacitor constructions |
| JP5290488B2 (ja) * | 2000-09-28 | 2013-09-18 | プレジデント アンド フェロウズ オブ ハーバード カレッジ | 酸化物、ケイ酸塩及びリン酸塩の気相成長 |
| US7378719B2 (en) * | 2000-12-20 | 2008-05-27 | Micron Technology, Inc. | Low leakage MIM capacitor |
| US7192827B2 (en) * | 2001-01-05 | 2007-03-20 | Micron Technology, Inc. | Methods of forming capacitor structures |
| US7087482B2 (en) * | 2001-01-19 | 2006-08-08 | Samsung Electronics Co., Ltd. | Method of forming material using atomic layer deposition and method of forming capacitor of semiconductor device using the same |
| US6951804B2 (en) * | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
| KR100756618B1 (ko) * | 2001-02-23 | 2007-09-10 | 더 게이츠 코포레이션 | 적어도 제2 기재에 고무를 직접 결합시키기 위한 방법 및이 방법에 의해 형성된 물품 |
| US6852167B2 (en) | 2001-03-01 | 2005-02-08 | Micron Technology, Inc. | Methods, systems, and apparatus for uniform chemical-vapor depositions |
| US7563715B2 (en) | 2005-12-05 | 2009-07-21 | Asm International N.V. | Method of producing thin films |
| US9139906B2 (en) | 2001-03-06 | 2015-09-22 | Asm America, Inc. | Doping with ALD technology |
| US7491634B2 (en) | 2006-04-28 | 2009-02-17 | Asm International N.V. | Methods for forming roughened surfaces and applications thereof |
| US6596643B2 (en) * | 2001-05-07 | 2003-07-22 | Applied Materials, Inc. | CVD TiSiN barrier for copper integration |
| US7037574B2 (en) * | 2001-05-23 | 2006-05-02 | Veeco Instruments, Inc. | Atomic layer deposition for fabricating thin films |
| US6849545B2 (en) * | 2001-06-20 | 2005-02-01 | Applied Materials, Inc. | System and method to form a composite film stack utilizing sequential deposition techniques |
| US6620702B2 (en) * | 2001-06-25 | 2003-09-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of producing low thermal budget high dielectric constant structures |
| US6511867B2 (en) * | 2001-06-30 | 2003-01-28 | Ovonyx, Inc. | Utilizing atomic layer deposition for programmable device |
| US7211144B2 (en) | 2001-07-13 | 2007-05-01 | Applied Materials, Inc. | Pulsed nucleation deposition of tungsten layers |
| US20030198754A1 (en) * | 2001-07-16 | 2003-10-23 | Ming Xi | Aluminum oxide chamber and process |
| WO2003029515A2 (en) | 2001-07-16 | 2003-04-10 | Applied Materials, Inc. | Formation of composite tungsten films |
| US9051641B2 (en) | 2001-07-25 | 2015-06-09 | Applied Materials, Inc. | Cobalt deposition on barrier surfaces |
| US20030029715A1 (en) | 2001-07-25 | 2003-02-13 | Applied Materials, Inc. | An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems |
| US8110489B2 (en) | 2001-07-25 | 2012-02-07 | Applied Materials, Inc. | Process for forming cobalt-containing materials |
| US20090004850A1 (en) | 2001-07-25 | 2009-01-01 | Seshadri Ganguli | Process for forming cobalt and cobalt silicide materials in tungsten contact applications |
| WO2003030224A2 (en) | 2001-07-25 | 2003-04-10 | Applied Materials, Inc. | Barrier formation using novel sputter-deposition method |
| US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
| WO2003019643A1 (fr) * | 2001-08-23 | 2003-03-06 | Nec Corporation | Dispositif semi-conducteur comportant un film isolant presentant une permittivite elevee et son procede de production |
| US8026161B2 (en) | 2001-08-30 | 2011-09-27 | Micron Technology, Inc. | Highly reliable amorphous high-K gate oxide ZrO2 |
| US7160817B2 (en) * | 2001-08-30 | 2007-01-09 | Micron Technology, Inc. | Dielectric material forming methods |
| US6806145B2 (en) * | 2001-08-31 | 2004-10-19 | Asm International, N.V. | Low temperature method of forming a gate stack with a high k layer deposited over an interfacial oxide layer |
| US6718126B2 (en) | 2001-09-14 | 2004-04-06 | Applied Materials, Inc. | Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition |
| US6936906B2 (en) | 2001-09-26 | 2005-08-30 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
| US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
| TW589684B (en) * | 2001-10-10 | 2004-06-01 | Applied Materials Inc | Method for depositing refractory metal layers employing sequential deposition techniques |
| US6916398B2 (en) | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
| US7780785B2 (en) | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Gas delivery apparatus for atomic layer deposition |
| KR100760291B1 (ko) * | 2001-11-08 | 2007-09-19 | 에이에스엠지니텍코리아 주식회사 | 박막 형성 방법 |
| US6819540B2 (en) * | 2001-11-26 | 2004-11-16 | Shipley Company, L.L.C. | Dielectric structure |
| US6551893B1 (en) * | 2001-11-27 | 2003-04-22 | Micron Technology, Inc. | Atomic layer deposition of capacitor dielectric |
| US6773507B2 (en) * | 2001-12-06 | 2004-08-10 | Applied Materials, Inc. | Apparatus and method for fast-cycle atomic layer deposition |
| US7081271B2 (en) | 2001-12-07 | 2006-07-25 | Applied Materials, Inc. | Cyclical deposition of refractory metal silicon nitride |
| US6900122B2 (en) | 2001-12-20 | 2005-05-31 | Micron Technology, Inc. | Low-temperature grown high-quality ultra-thin praseodymium gate dielectrics |
| US6939801B2 (en) * | 2001-12-21 | 2005-09-06 | Applied Materials, Inc. | Selective deposition of a barrier layer on a dielectric material |
| US6809026B2 (en) | 2001-12-21 | 2004-10-26 | Applied Materials, Inc. | Selective deposition of a barrier layer on a metal film |
| FR2834387B1 (fr) * | 2001-12-31 | 2004-02-27 | Memscap | Composant electronique incorporant un circuit integre et un micro-condensateur |
| US6620670B2 (en) * | 2002-01-18 | 2003-09-16 | Applied Materials, Inc. | Process conditions and precursors for atomic layer deposition (ALD) of AL2O3 |
| AU2003238853A1 (en) | 2002-01-25 | 2003-09-02 | Applied Materials, Inc. | Apparatus for cyclical deposition of thin films |
| US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
| US6998014B2 (en) | 2002-01-26 | 2006-02-14 | Applied Materials, Inc. | Apparatus and method for plasma assisted deposition |
| US6827978B2 (en) | 2002-02-11 | 2004-12-07 | Applied Materials, Inc. | Deposition of tungsten films |
| US6833161B2 (en) | 2002-02-26 | 2004-12-21 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
| US20030159653A1 (en) * | 2002-02-28 | 2003-08-28 | Dando Ross S. | Manifold assembly for feeding reactive precursors to substrate processing chambers |
| US6972267B2 (en) | 2002-03-04 | 2005-12-06 | Applied Materials, Inc. | Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor |
| US6753618B2 (en) * | 2002-03-11 | 2004-06-22 | Micron Technology, Inc. | MIM capacitor with metal nitride electrode materials and method of formation |
| US6717226B2 (en) * | 2002-03-15 | 2004-04-06 | Motorola, Inc. | Transistor with layered high-K gate dielectric and method therefor |
| JP4621241B2 (ja) * | 2002-03-18 | 2011-01-26 | 株式会社日立国際電気 | 半導体装置の製造方法及び基板処理装置 |
| US6825134B2 (en) * | 2002-03-26 | 2004-11-30 | Applied Materials, Inc. | Deposition of film layers by alternately pulsing a precursor and high frequency power in a continuous gas flow |
| KR100996816B1 (ko) * | 2002-03-28 | 2010-11-25 | 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 | 이산화규소 나노라미네이트의 증기증착 |
| US7439191B2 (en) * | 2002-04-05 | 2008-10-21 | Applied Materials, Inc. | Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications |
| US6720027B2 (en) * | 2002-04-08 | 2004-04-13 | Applied Materials, Inc. | Cyclical deposition of a variable content titanium silicon nitride layer |
| US6846516B2 (en) | 2002-04-08 | 2005-01-25 | Applied Materials, Inc. | Multiple precursor cyclical deposition system |
| US6743736B2 (en) * | 2002-04-11 | 2004-06-01 | Micron Technology, Inc. | Reactive gaseous deposition precursor feed apparatus |
| US6932871B2 (en) * | 2002-04-16 | 2005-08-23 | Applied Materials, Inc. | Multi-station deposition apparatus and method |
| US7279432B2 (en) * | 2002-04-16 | 2007-10-09 | Applied Materials, Inc. | System and method for forming an integrated barrier layer |
| JP2005523384A (ja) * | 2002-04-19 | 2005-08-04 | マットソン テクノロジイ インコーポレイテッド | 低蒸気圧のガス前駆体を用いて基板上にフィルムを蒸着させるシステム |
| US7105065B2 (en) | 2002-04-25 | 2006-09-12 | Micron Technology, Inc. | Metal layer forming methods and capacitor electrode forming methods |
| US7374617B2 (en) | 2002-04-25 | 2008-05-20 | Micron Technology, Inc. | Atomic layer deposition methods and chemical vapor deposition methods |
| US7589029B2 (en) | 2002-05-02 | 2009-09-15 | Micron Technology, Inc. | Atomic layer deposition and conversion |
| US7160577B2 (en) | 2002-05-02 | 2007-01-09 | Micron Technology, Inc. | Methods for atomic-layer deposition of aluminum oxides in integrated circuits |
| US7164165B2 (en) * | 2002-05-16 | 2007-01-16 | Micron Technology, Inc. | MIS capacitor |
| US6838114B2 (en) | 2002-05-24 | 2005-01-04 | Micron Technology, Inc. | Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpieces |
| US7041335B2 (en) * | 2002-06-04 | 2006-05-09 | Applied Materials, Inc. | Titanium tantalum nitride silicide layer |
| US7205218B2 (en) * | 2002-06-05 | 2007-04-17 | Micron Technology, Inc. | Method including forming gate dielectrics having multiple lanthanide oxide layers |
| US7135421B2 (en) | 2002-06-05 | 2006-11-14 | Micron Technology, Inc. | Atomic layer-deposited hafnium aluminum oxide |
| US20060014384A1 (en) * | 2002-06-05 | 2006-01-19 | Jong-Cheol Lee | Method of forming a layer and forming a capacitor of a semiconductor device having the same layer |
| US6896730B2 (en) * | 2002-06-05 | 2005-05-24 | Micron Technology, Inc. | Atomic layer deposition apparatus and methods |
| US20030232501A1 (en) | 2002-06-14 | 2003-12-18 | Kher Shreyas S. | Surface pre-treatment for enhancement of nucleation of high dielectric constant materials |
| US6858547B2 (en) | 2002-06-14 | 2005-02-22 | Applied Materials, Inc. | System and method for forming a gate dielectric |
| US7067439B2 (en) * | 2002-06-14 | 2006-06-27 | Applied Materials, Inc. | ALD metal oxide deposition process using direct oxidation |
| JP2004039821A (ja) * | 2002-07-02 | 2004-02-05 | Elpida Memory Inc | 半導体装置の製造方法 |
| US7221586B2 (en) | 2002-07-08 | 2007-05-22 | Micron Technology, Inc. | Memory utilizing oxide nanolaminates |
| US6821347B2 (en) | 2002-07-08 | 2004-11-23 | Micron Technology, Inc. | Apparatus and method for depositing materials onto microelectronic workpieces |
| US6838125B2 (en) | 2002-07-10 | 2005-01-04 | Applied Materials, Inc. | Method of film deposition using activated precursor gases |
| US20040009336A1 (en) * | 2002-07-11 | 2004-01-15 | Applied Materials, Inc. | Titanium silicon nitride (TISIN) barrier layer for copper diffusion |
| US7524766B2 (en) * | 2002-07-15 | 2009-04-28 | Hitachi Kokusai Electric Inc. | Method for manufacturing semiconductor device and substrate processing apparatus |
| US20040013803A1 (en) * | 2002-07-16 | 2004-01-22 | Applied Materials, Inc. | Formation of titanium nitride films using a cyclical deposition process |
| US7186385B2 (en) | 2002-07-17 | 2007-03-06 | Applied Materials, Inc. | Apparatus for providing gas to a processing chamber |
| US6955211B2 (en) | 2002-07-17 | 2005-10-18 | Applied Materials, Inc. | Method and apparatus for gas temperature control in a semiconductor processing system |
| US7066194B2 (en) * | 2002-07-19 | 2006-06-27 | Applied Materials, Inc. | Valve design and configuration for fast delivery system |
| US6772072B2 (en) | 2002-07-22 | 2004-08-03 | Applied Materials, Inc. | Method and apparatus for monitoring solid precursor delivery |
| KR100464855B1 (ko) * | 2002-07-26 | 2005-01-06 | 삼성전자주식회사 | 박막 형성 방법과, 이를 이용한 커패시터 형성 방법 및트랜지스터 형성 방법 |
| JP2004063807A (ja) * | 2002-07-29 | 2004-02-26 | Elpida Memory Inc | 半導体装置の製造方法 |
| US7150789B2 (en) * | 2002-07-29 | 2006-12-19 | Micron Technology, Inc. | Atomic layer deposition methods |
| US6915592B2 (en) | 2002-07-29 | 2005-07-12 | Applied Materials, Inc. | Method and apparatus for generating gas to a processing chamber |
| US6921702B2 (en) | 2002-07-30 | 2005-07-26 | Micron Technology Inc. | Atomic layer deposited nanolaminates of HfO2/ZrO2 films as gate dielectrics |
| CA2492890A1 (en) * | 2002-07-30 | 2004-02-05 | Stephen John Henderson | High reflectivity and high flux x-ray optic element and method of making same using atomic layer deposition techniques |
| US6790791B2 (en) | 2002-08-15 | 2004-09-14 | Micron Technology, Inc. | Lanthanide doped TiOx dielectric films |
| US6753271B2 (en) * | 2002-08-15 | 2004-06-22 | Micron Technology, Inc. | Atomic layer deposition methods |
| US6884739B2 (en) | 2002-08-15 | 2005-04-26 | Micron Technology Inc. | Lanthanide doped TiOx dielectric films by plasma oxidation |
| US6890596B2 (en) * | 2002-08-15 | 2005-05-10 | Micron Technology, Inc. | Deposition methods |
| US6955725B2 (en) | 2002-08-15 | 2005-10-18 | Micron Technology, Inc. | Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces |
| US6897106B2 (en) * | 2002-08-16 | 2005-05-24 | Samsung Electronics Co., Ltd. | Capacitor of semiconductor memory device that has composite Al2O3/HfO2 dielectric layer and method of manufacturing the same |
| KR100450681B1 (ko) | 2002-08-16 | 2004-10-02 | 삼성전자주식회사 | 반도체 메모리 소자의 커패시터 및 그 제조 방법 |
| WO2004017383A2 (en) * | 2002-08-18 | 2004-02-26 | Aviza Technology, Inc. | Low termperature deposition of silicon oxides and oxynitrides |
| US6673701B1 (en) * | 2002-08-27 | 2004-01-06 | Micron Technology, Inc. | Atomic layer deposition methods |
| US7041609B2 (en) * | 2002-08-28 | 2006-05-09 | Micron Technology, Inc. | Systems and methods for forming metal oxides using alcohols |
| US6958300B2 (en) | 2002-08-28 | 2005-10-25 | Micron Technology, Inc. | Systems and methods for forming metal oxides using metal organo-amines and metal organo-oxides |
| US7112485B2 (en) * | 2002-08-28 | 2006-09-26 | Micron Technology, Inc. | Systems and methods for forming zirconium and/or hafnium-containing layers |
| US7199023B2 (en) | 2002-08-28 | 2007-04-03 | Micron Technology, Inc. | Atomic layer deposited HfSiON dielectric films wherein each precursor is independendently pulsed |
| US7084078B2 (en) | 2002-08-29 | 2006-08-01 | Micron Technology, Inc. | Atomic layer deposited lanthanide doped TiOx dielectric films |
| US6607973B1 (en) * | 2002-09-16 | 2003-08-19 | Advanced Micro Devices, Inc. | Preparation of high-k nitride silicate layers by cyclic molecular layer deposition |
| US6821563B2 (en) * | 2002-10-02 | 2004-11-23 | Applied Materials, Inc. | Gas distribution system for cyclical layer deposition |
| US6905737B2 (en) * | 2002-10-11 | 2005-06-14 | Applied Materials, Inc. | Method of delivering activated species for rapid cyclical deposition |
| US7540920B2 (en) | 2002-10-18 | 2009-06-02 | Applied Materials, Inc. | Silicon-containing layer deposition with silicon compounds |
| US20040087081A1 (en) * | 2002-11-01 | 2004-05-06 | Aitchison Bradley J. | Capacitor fabrication methods and capacitor structures including niobium oxide |
| EP1420080A3 (en) | 2002-11-14 | 2005-11-09 | Applied Materials, Inc. | Apparatus and method for hybrid chemical deposition processes |
| US6958302B2 (en) | 2002-12-04 | 2005-10-25 | Micron Technology, Inc. | Atomic layer deposited Zr-Sn-Ti-O films using TiI4 |
| US7101813B2 (en) | 2002-12-04 | 2006-09-05 | Micron Technology Inc. | Atomic layer deposited Zr-Sn-Ti-O films |
| US7092287B2 (en) * | 2002-12-18 | 2006-08-15 | Asm International N.V. | Method of fabricating silicon nitride nanodots |
| KR100522427B1 (ko) * | 2002-12-30 | 2005-10-20 | 주식회사 하이닉스반도체 | 반도체 소자의 캐패시터 제조방법 |
| US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
| WO2004064147A2 (en) | 2003-01-07 | 2004-07-29 | Applied Materials, Inc. | Integration of ald/cvd barriers with porous low k materials |
| US7071519B2 (en) | 2003-01-08 | 2006-07-04 | Texas Instruments Incorporated | Control of high-k gate dielectric film composition profile for property optimization |
| US6753248B1 (en) | 2003-01-27 | 2004-06-22 | Applied Materials, Inc. | Post metal barrier/adhesion film |
| US6863725B2 (en) * | 2003-02-04 | 2005-03-08 | Micron Technology, Inc. | Method of forming a Ta2O5 comprising layer |
| US7192892B2 (en) | 2003-03-04 | 2007-03-20 | Micron Technology, Inc. | Atomic layer deposited dielectric layers |
| KR100518560B1 (ko) * | 2003-03-04 | 2005-10-04 | 삼성전자주식회사 | 원자층 증착법을 이용한 박막 형성방법 |
| US7019351B2 (en) * | 2003-03-12 | 2006-03-28 | Micron Technology, Inc. | Transistor devices, and methods of forming transistor devices and circuit devices |
| JP4009550B2 (ja) * | 2003-03-27 | 2007-11-14 | エルピーダメモリ株式会社 | 金属酸化膜の形成方法 |
| US7135369B2 (en) | 2003-03-31 | 2006-11-14 | Micron Technology, Inc. | Atomic layer deposited ZrAlxOy dielectric layers including Zr4AlO9 |
| US7294360B2 (en) | 2003-03-31 | 2007-11-13 | Planar Systems, Inc. | Conformal coatings for micro-optical elements, and method for making the same |
| US20040198069A1 (en) | 2003-04-04 | 2004-10-07 | Applied Materials, Inc. | Method for hafnium nitride deposition |
| US6951813B2 (en) * | 2003-04-04 | 2005-10-04 | Micron Technology, Inc. | Methods of forming metal-containing layers including a metal bonded to halogens and trialkylaluminum |
| US20050170665A1 (en) * | 2003-04-17 | 2005-08-04 | Fujitsu Limited | Method of forming a high dielectric film |
| US7183186B2 (en) | 2003-04-22 | 2007-02-27 | Micro Technology, Inc. | Atomic layer deposited ZrTiO4 films |
| JP4563655B2 (ja) * | 2003-04-23 | 2010-10-13 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
| US7335396B2 (en) | 2003-04-24 | 2008-02-26 | Micron Technology, Inc. | Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers |
| US7092234B2 (en) * | 2003-05-20 | 2006-08-15 | Micron Technology, Inc. | DRAM cells and electronic systems |
| KR20060079144A (ko) | 2003-06-18 | 2006-07-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 배리어 물질의 원자층 증착 |
| US7049192B2 (en) | 2003-06-24 | 2006-05-23 | Micron Technology, Inc. | Lanthanide oxide / hafnium oxide dielectrics |
| US7192824B2 (en) | 2003-06-24 | 2007-03-20 | Micron Technology, Inc. | Lanthanide oxide / hafnium oxide dielectric layers |
| KR100725690B1 (ko) * | 2003-07-08 | 2007-06-07 | 마츠시타 덴끼 산교 가부시키가이샤 | 반도체장치 및 그 제조방법 |
| US7440255B2 (en) * | 2003-07-21 | 2008-10-21 | Micron Technology, Inc. | Capacitor constructions and methods of forming |
| US7230292B2 (en) * | 2003-08-05 | 2007-06-12 | Micron Technology, Inc. | Stud electrode and process for making same |
| JP3913723B2 (ja) * | 2003-08-15 | 2007-05-09 | 株式会社日立国際電気 | 基板処理装置及び半導体デバイスの製造方法 |
| US7378129B2 (en) * | 2003-08-18 | 2008-05-27 | Micron Technology, Inc. | Atomic layer deposition methods of forming conductive metal nitride comprising layers |
| US7344755B2 (en) | 2003-08-21 | 2008-03-18 | Micron Technology, Inc. | Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers |
| US7235138B2 (en) | 2003-08-21 | 2007-06-26 | Micron Technology, Inc. | Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces |
| US7422635B2 (en) | 2003-08-28 | 2008-09-09 | Micron Technology, Inc. | Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces |
| KR100527048B1 (ko) * | 2003-08-29 | 2005-11-09 | 주식회사 아이피에스 | 박막증착방법 |
| US7235482B2 (en) * | 2003-09-08 | 2007-06-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technology |
| US7056806B2 (en) | 2003-09-17 | 2006-06-06 | Micron Technology, Inc. | Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces |
| US7282239B2 (en) | 2003-09-18 | 2007-10-16 | Micron Technology, Inc. | Systems and methods for depositing material onto microfeature workpieces in reaction chambers |
| US7018469B2 (en) * | 2003-09-23 | 2006-03-28 | Micron Technology, Inc. | Atomic layer deposition methods of forming silicon dioxide comprising layers |
| US20050067103A1 (en) * | 2003-09-26 | 2005-03-31 | Applied Materials, Inc. | Interferometer endpoint monitoring device |
| US7323231B2 (en) | 2003-10-09 | 2008-01-29 | Micron Technology, Inc. | Apparatus and methods for plasma vapor deposition processes |
| US7581511B2 (en) | 2003-10-10 | 2009-09-01 | Micron Technology, Inc. | Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes |
| US7166528B2 (en) | 2003-10-10 | 2007-01-23 | Applied Materials, Inc. | Methods of selective deposition of heavily doped epitaxial SiGe |
| US7647886B2 (en) | 2003-10-15 | 2010-01-19 | Micron Technology, Inc. | Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers |
| US7071118B2 (en) * | 2003-11-12 | 2006-07-04 | Veeco Instruments, Inc. | Method and apparatus for fabricating a conformal thin film on a substrate |
| KR100550641B1 (ko) * | 2003-11-22 | 2006-02-09 | 주식회사 하이닉스반도체 | 산화하프늄과 산화알루미늄이 혼합된 유전막 및 그 제조방법 |
| US7253104B2 (en) * | 2003-12-01 | 2007-08-07 | Micron Technology, Inc. | Methods of forming particle-containing materials |
| US7258892B2 (en) | 2003-12-10 | 2007-08-21 | Micron Technology, Inc. | Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition |
| KR100552704B1 (ko) * | 2003-12-17 | 2006-02-20 | 삼성전자주식회사 | 반도체 장치의 불휘발성 커패시터, 이를 포함하는 반도체메모리 소자 및 그 동작방법 |
| US8513634B2 (en) * | 2003-12-17 | 2013-08-20 | Samsung Electronics Co., Ltd. | Nonvolatile data storage, semicoductor memory device including nonvolatile data storage and method of forming the same |
| US7906393B2 (en) | 2004-01-28 | 2011-03-15 | Micron Technology, Inc. | Methods for forming small-scale capacitor structures |
| US7098150B2 (en) * | 2004-03-05 | 2006-08-29 | Air Liquide America L.P. | Method for novel deposition of high-k MSiON dielectric films |
| US7584942B2 (en) | 2004-03-31 | 2009-09-08 | Micron Technology, Inc. | Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers |
| US7115929B2 (en) * | 2004-04-08 | 2006-10-03 | Micron Technology, Inc. | Semiconductor constructions comprising aluminum oxide and metal oxide dielectric materials |
| US8133554B2 (en) | 2004-05-06 | 2012-03-13 | Micron Technology, Inc. | Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces |
| US20050252449A1 (en) | 2004-05-12 | 2005-11-17 | Nguyen Son T | Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system |
| US7651729B2 (en) * | 2004-05-14 | 2010-01-26 | Samsung Electronics Co., Ltd. | Method of fabricating metal silicate layer using atomic layer deposition technique |
| US8323754B2 (en) | 2004-05-21 | 2012-12-04 | Applied Materials, Inc. | Stabilization of high-k dielectric materials |
| US8119210B2 (en) | 2004-05-21 | 2012-02-21 | Applied Materials, Inc. | Formation of a silicon oxynitride layer on a high-k dielectric material |
| US7699932B2 (en) | 2004-06-02 | 2010-04-20 | Micron Technology, Inc. | Reactors, systems and methods for depositing thin films onto microfeature workpieces |
| KR100581993B1 (ko) * | 2004-06-09 | 2006-05-22 | 삼성전자주식회사 | 원자층 증착법을 이용한 물질 형성방법 |
| US7241686B2 (en) * | 2004-07-20 | 2007-07-10 | Applied Materials, Inc. | Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA |
| CN101088131A (zh) * | 2004-07-23 | 2007-12-12 | 桑德夫技术有限公司 | 具有高蓄能密度和低等效串联电阻的电容器 |
| TWI268522B (en) * | 2004-07-29 | 2006-12-11 | Rohm And Haas Electronic Materials L L C | Dielectric structure |
| US7601649B2 (en) | 2004-08-02 | 2009-10-13 | Micron Technology, Inc. | Zirconium-doped tantalum oxide films |
| US7482037B2 (en) * | 2004-08-20 | 2009-01-27 | Micron Technology, Inc. | Methods for forming niobium and/or vanadium containing layers using atomic layer deposition |
| US7081421B2 (en) | 2004-08-26 | 2006-07-25 | Micron Technology, Inc. | Lanthanide oxide dielectric layer |
| US7588988B2 (en) | 2004-08-31 | 2009-09-15 | Micron Technology, Inc. | Method of forming apparatus having oxide films formed using atomic layer deposition |
| US7494939B2 (en) | 2004-08-31 | 2009-02-24 | Micron Technology, Inc. | Methods for forming a lanthanum-metal oxide dielectric layer |
| US20060060930A1 (en) * | 2004-09-17 | 2006-03-23 | Metz Matthew V | Atomic layer deposition of high dielectric constant gate dielectrics |
| KR100580771B1 (ko) * | 2004-10-01 | 2006-05-15 | 주식회사 하이닉스반도체 | 플래쉬 메모리소자의 형성방법 |
| US7190016B2 (en) * | 2004-10-08 | 2007-03-13 | Rohm And Haas Electronic Materials Llc | Capacitor structure |
| US20060088660A1 (en) * | 2004-10-26 | 2006-04-27 | Putkonen Matti I | Methods of depositing lead containing oxides films |
| KR100593645B1 (ko) * | 2004-10-28 | 2006-06-28 | 삼성전자주식회사 | 반도체 장치의 제조 방법 |
| JP3998678B2 (ja) * | 2004-11-01 | 2007-10-31 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JP2008522401A (ja) | 2004-11-26 | 2008-06-26 | エヌエックスピー ビー ヴィ | 表面域の改質方法および電子デバイス |
| US7682940B2 (en) | 2004-12-01 | 2010-03-23 | Applied Materials, Inc. | Use of Cl2 and/or HCl during silicon epitaxial film formation |
| US7560352B2 (en) * | 2004-12-01 | 2009-07-14 | Applied Materials, Inc. | Selective deposition |
| US7312128B2 (en) * | 2004-12-01 | 2007-12-25 | Applied Materials, Inc. | Selective epitaxy process with alternating gas supply |
| US7429402B2 (en) | 2004-12-10 | 2008-09-30 | Applied Materials, Inc. | Ruthenium as an underlayer for tungsten film deposition |
| US7235501B2 (en) | 2004-12-13 | 2007-06-26 | Micron Technology, Inc. | Lanthanum hafnium oxide dielectrics |
| KR100667633B1 (ko) * | 2004-12-20 | 2007-01-12 | 삼성전자주식회사 | 박막 제조 방법 및 이를 이용한 게이트 구조물,커패시터와 플래시 메모리 장치의 제조 방법 |
| FI117728B (fi) * | 2004-12-21 | 2007-01-31 | Planar Systems Oy | Monikerrosmateriaali ja menetelmä sen valmistamiseksi |
| US7560395B2 (en) | 2005-01-05 | 2009-07-14 | Micron Technology, Inc. | Atomic layer deposited hafnium tantalum oxide dielectrics |
| US20060162658A1 (en) * | 2005-01-27 | 2006-07-27 | Applied Materials, Inc. | Ruthenium layer deposition apparatus and method |
| US7235492B2 (en) * | 2005-01-31 | 2007-06-26 | Applied Materials, Inc. | Low temperature etchant for treatment of silicon-containing surfaces |
| US7508648B2 (en) * | 2005-02-08 | 2009-03-24 | Micron Technology, Inc. | Atomic layer deposition of Dy doped HfO2 films as gate dielectrics |
| US7399666B2 (en) * | 2005-02-15 | 2008-07-15 | Micron Technology, Inc. | Atomic layer deposition of Zr3N4/ZrO2 films as gate dielectrics |
| US7498247B2 (en) | 2005-02-23 | 2009-03-03 | Micron Technology, Inc. | Atomic layer deposition of Hf3N4/HfO2 films as gate dielectrics |
| US8025922B2 (en) * | 2005-03-15 | 2011-09-27 | Asm International N.V. | Enhanced deposition of noble metals |
| US7365027B2 (en) * | 2005-03-29 | 2008-04-29 | Micron Technology, Inc. | ALD of amorphous lanthanide doped TiOx films |
| US7687409B2 (en) | 2005-03-29 | 2010-03-30 | Micron Technology, Inc. | Atomic layer deposited titanium silicon oxide films |
| US7390756B2 (en) * | 2005-04-28 | 2008-06-24 | Micron Technology, Inc. | Atomic layer deposited zirconium silicon oxide films |
| US7662729B2 (en) | 2005-04-28 | 2010-02-16 | Micron Technology, Inc. | Atomic layer deposition of a ruthenium layer to a lanthanide oxide dielectric layer |
| US7572695B2 (en) * | 2005-05-27 | 2009-08-11 | Micron Technology, Inc. | Hafnium titanium oxide films |
| US20060272577A1 (en) * | 2005-06-03 | 2006-12-07 | Ming Mao | Method and apparatus for decreasing deposition time of a thin film |
| US7648927B2 (en) | 2005-06-21 | 2010-01-19 | Applied Materials, Inc. | Method for forming silicon-containing materials during a photoexcitation deposition process |
| US7651955B2 (en) | 2005-06-21 | 2010-01-26 | Applied Materials, Inc. | Method for forming silicon-containing materials during a photoexcitation deposition process |
| US20070001231A1 (en) * | 2005-06-29 | 2007-01-04 | Amberwave Systems Corporation | Material systems for dielectrics and metal electrodes |
| US7432139B2 (en) * | 2005-06-29 | 2008-10-07 | Amberwave Systems Corp. | Methods for forming dielectrics and metal electrodes |
| US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
| KR100753411B1 (ko) * | 2005-08-18 | 2007-08-30 | 주식회사 하이닉스반도체 | 반도체 소자의 캐패시터 형성방법 |
| US7402534B2 (en) | 2005-08-26 | 2008-07-22 | Applied Materials, Inc. | Pretreatment processes within a batch ALD reactor |
| US8110469B2 (en) | 2005-08-30 | 2012-02-07 | Micron Technology, Inc. | Graded dielectric layers |
| US7410910B2 (en) | 2005-08-31 | 2008-08-12 | Micron Technology, Inc. | Lanthanum aluminum oxynitride dielectric films |
| US20070054048A1 (en) * | 2005-09-07 | 2007-03-08 | Suvi Haukka | Extended deposition range by hot spots |
| FR2890982B1 (fr) * | 2005-09-21 | 2008-05-02 | St Microelectronics Sa | Procede de realisation d'une couche dielectrique sur un materiau porteur et un circuit integre comprenant un condensateur incorporant une couche dielectrique |
| US7582562B2 (en) | 2005-10-06 | 2009-09-01 | Micron Technology, Inc. | Atomic layer deposition methods |
| US8993055B2 (en) | 2005-10-27 | 2015-03-31 | Asm International N.V. | Enhanced thin film deposition |
| US20070128862A1 (en) | 2005-11-04 | 2007-06-07 | Paul Ma | Apparatus and process for plasma-enhanced atomic layer deposition |
| US7592251B2 (en) | 2005-12-08 | 2009-09-22 | Micron Technology, Inc. | Hafnium tantalum titanium oxide films |
| JP2007165733A (ja) * | 2005-12-16 | 2007-06-28 | Elpida Memory Inc | 半導体装置及びその製造方法 |
| DE102005062917A1 (de) * | 2005-12-29 | 2007-07-12 | Infineon Technologies Ag | Atomlagenabscheideverfahren |
| GB0601319D0 (en) | 2006-01-23 | 2006-03-01 | Imp Innovations Ltd | A method of fabricating pillars composed of silicon-based material |
| JP2007201083A (ja) * | 2006-01-25 | 2007-08-09 | Elpida Memory Inc | キャパシタの製造方法 |
| US7709402B2 (en) | 2006-02-16 | 2010-05-04 | Micron Technology, Inc. | Conductive layers for hafnium silicon oxynitride films |
| US7674337B2 (en) * | 2006-04-07 | 2010-03-09 | Applied Materials, Inc. | Gas manifolds for use during epitaxial film formation |
| US7798096B2 (en) | 2006-05-05 | 2010-09-21 | Applied Materials, Inc. | Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool |
| US7795160B2 (en) * | 2006-07-21 | 2010-09-14 | Asm America Inc. | ALD of metal silicate films |
| CN101496150B (zh) | 2006-07-31 | 2012-07-18 | 应用材料公司 | 控制外延层形成期间形态的方法 |
| JP5090451B2 (ja) | 2006-07-31 | 2012-12-05 | アプライド マテリアルズ インコーポレイテッド | 炭素含有シリコンエピタキシャル層の形成方法 |
| US7605030B2 (en) | 2006-08-31 | 2009-10-20 | Micron Technology, Inc. | Hafnium tantalum oxynitride high-k dielectric and metal gates |
| JP2010506408A (ja) * | 2006-10-05 | 2010-02-25 | エーエスエム アメリカ インコーポレイテッド | 金属シリケート膜のald |
| US7521379B2 (en) | 2006-10-09 | 2009-04-21 | Applied Materials, Inc. | Deposition and densification process for titanium nitride barrier layers |
| US20080087890A1 (en) * | 2006-10-16 | 2008-04-17 | Micron Technology, Inc. | Methods to form dielectric structures in semiconductor devices and resulting devices |
| US8795771B2 (en) | 2006-10-27 | 2014-08-05 | Sean T. Barry | ALD of metal-containing films using cyclopentadienyl compounds |
| US8092695B2 (en) * | 2006-10-30 | 2012-01-10 | Applied Materials, Inc. | Endpoint detection for photomask etching |
| US20080099436A1 (en) * | 2006-10-30 | 2008-05-01 | Michael Grimbergen | Endpoint detection for photomask etching |
| US11136667B2 (en) * | 2007-01-08 | 2021-10-05 | Eastman Kodak Company | Deposition system and method using a delivery head separated from a substrate by gas pressure |
| DE102007002965A1 (de) * | 2007-01-19 | 2008-07-24 | Infineon Technologies Ag | Verfahren zur Herstellung einer kapazitiven Struktur oder Varistorstruktur in einem Graben eines Halbleiterkörper |
| US20080214015A1 (en) * | 2007-03-02 | 2008-09-04 | Tim Boescke | Semiconductor devices and methods of manufacture thereof |
| US20100110728A1 (en) | 2007-03-19 | 2010-05-06 | Nanosys, Inc. | Light-emitting diode (led) devices comprising nanocrystals |
| EP2121872B1 (en) * | 2007-03-19 | 2015-12-09 | Nanosys, Inc. | Methods for encapsulating nanocrystals |
| FR2915315B1 (fr) * | 2007-04-19 | 2009-06-26 | St Microelectronics Crolles 2 | Procede de fabrication d'un condensateur a stabilite elevee et condensateur correspondant. |
| JP2008283026A (ja) | 2007-05-11 | 2008-11-20 | Elpida Memory Inc | 半導体装置の製造方法および半導体装置 |
| GB0709165D0 (en) | 2007-05-11 | 2007-06-20 | Nexeon Ltd | A silicon anode for a rechargeable battery |
| JP4735601B2 (ja) * | 2007-05-14 | 2011-07-27 | ソニー株式会社 | 原子層蒸着法を用いた薄膜形成方法 |
| US7638170B2 (en) | 2007-06-21 | 2009-12-29 | Asm International N.V. | Low resistivity metal carbonitride thin film deposition by atomic layer deposition |
| US8017182B2 (en) * | 2007-06-21 | 2011-09-13 | Asm International N.V. | Method for depositing thin films by mixed pulsed CVD and ALD |
| GB0713898D0 (en) | 2007-07-17 | 2007-08-29 | Nexeon Ltd | A method of fabricating structured particles composed of silcon or a silicon-based material and their use in lithium rechargeable batteries |
| US7851307B2 (en) * | 2007-08-17 | 2010-12-14 | Micron Technology, Inc. | Method of forming complex oxide nanodots for a charge trap |
| US7678298B2 (en) | 2007-09-25 | 2010-03-16 | Applied Materials, Inc. | Tantalum carbide nitride materials by vapor deposition processes |
| US7585762B2 (en) | 2007-09-25 | 2009-09-08 | Applied Materials, Inc. | Vapor deposition processes for tantalum carbide nitride materials |
| US7824743B2 (en) | 2007-09-28 | 2010-11-02 | Applied Materials, Inc. | Deposition processes for titanium nitride barrier and aluminum |
| KR100902106B1 (ko) * | 2007-10-31 | 2009-06-09 | 주식회사 하이닉스반도체 | 텅스텐함유막이 포함된 패턴을 구비한 반도체소자의 제조방법 |
| US8501637B2 (en) * | 2007-12-21 | 2013-08-06 | Asm International N.V. | Silicon dioxide thin films by ALD |
| US8545936B2 (en) | 2008-03-28 | 2013-10-01 | Asm International N.V. | Methods for forming carbon nanotubes |
| US7659158B2 (en) | 2008-03-31 | 2010-02-09 | Applied Materials, Inc. | Atomic layer deposition processes for non-volatile memory devices |
| KR101540077B1 (ko) | 2008-04-16 | 2015-07-28 | 에이에스엠 아메리카, 인코포레이티드 | 알루미늄 탄화수소 화합물들을 이용한 금속 카바이드 막들의 원자층 증착법 |
| US8900422B2 (en) * | 2008-04-23 | 2014-12-02 | Intermolecular, Inc. | Yttrium and titanium high-K dielectric film |
| US8383525B2 (en) | 2008-04-25 | 2013-02-26 | Asm America, Inc. | Plasma-enhanced deposition process for forming a metal oxide thin film and related structures |
| US20100062149A1 (en) | 2008-09-08 | 2010-03-11 | Applied Materials, Inc. | Method for tuning a deposition rate during an atomic layer deposition process |
| US8491967B2 (en) | 2008-09-08 | 2013-07-23 | Applied Materials, Inc. | In-situ chamber treatment and deposition process |
| TW201014926A (en) * | 2008-10-15 | 2010-04-16 | Nat Univ Tsing Hua | Method for producing metallic oxide film having high dielectric constant |
| US7820506B2 (en) | 2008-10-15 | 2010-10-26 | Micron Technology, Inc. | Capacitors, dielectric structures, and methods of forming dielectric structures |
| US8146896B2 (en) | 2008-10-31 | 2012-04-03 | Applied Materials, Inc. | Chemical precursor ampoule for vapor deposition processes |
| WO2010088684A2 (en) * | 2009-02-02 | 2010-08-05 | Space Charge, LLC | Capacitor using carbon-based extensions |
| US9117773B2 (en) * | 2009-08-26 | 2015-08-25 | Asm America, Inc. | High concentration water pulses for atomic layer deposition |
| US20110293830A1 (en) | 2010-02-25 | 2011-12-01 | Timo Hatanpaa | Precursors and methods for atomic layer deposition of transition metal oxides |
| JP5573772B2 (ja) | 2010-06-22 | 2014-08-20 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
| US8420534B2 (en) * | 2010-10-12 | 2013-04-16 | Micron Technology, Inc. | Atomic layer deposition of crystalline PrCaMnO (PCMO) and related methods |
| US8778204B2 (en) | 2010-10-29 | 2014-07-15 | Applied Materials, Inc. | Methods for reducing photoresist interference when monitoring a target layer in a plasma process |
| JP5963456B2 (ja) * | 2011-02-18 | 2016-08-03 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置、及び基板処理方法 |
| JP5514365B2 (ja) | 2011-03-23 | 2014-06-04 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法および基板処理装置 |
| JP5744202B2 (ja) * | 2011-06-30 | 2015-07-08 | 京セラ株式会社 | アルミナ膜の形成方法 |
| US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
| US8426270B2 (en) * | 2011-07-22 | 2013-04-23 | Intermolecular, Inc. | Memory device with a textured lowered electrode |
| US9062390B2 (en) | 2011-09-12 | 2015-06-23 | Asm International N.V. | Crystalline strontium titanate and methods of forming the same |
| US8664076B2 (en) * | 2011-09-21 | 2014-03-04 | Texas Instruments Incorporated | Method of forming a robust, modular MIS (metal-insulator-semiconductor) capacitor with improved capacitance density |
| US8961804B2 (en) | 2011-10-25 | 2015-02-24 | Applied Materials, Inc. | Etch rate detection for photomask etching |
| US8808559B2 (en) | 2011-11-22 | 2014-08-19 | Applied Materials, Inc. | Etch rate detection for reflective multi-material layers etching |
| US8900469B2 (en) | 2011-12-19 | 2014-12-02 | Applied Materials, Inc. | Etch rate detection for anti-reflective coating layer and absorber layer etching |
| US9238865B2 (en) | 2012-02-06 | 2016-01-19 | Asm Ip Holding B.V. | Multiple vapor sources for vapor deposition |
| US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
| US9805939B2 (en) | 2012-10-12 | 2017-10-31 | Applied Materials, Inc. | Dual endpoint detection for advanced phase shift and binary photomasks |
| US8778574B2 (en) | 2012-11-30 | 2014-07-15 | Applied Materials, Inc. | Method for etching EUV material layers utilized to form a photomask |
| US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
| US20160376700A1 (en) | 2013-02-01 | 2016-12-29 | Asm Ip Holding B.V. | System for treatment of deposition reactor |
| US9412602B2 (en) | 2013-03-13 | 2016-08-09 | Asm Ip Holding B.V. | Deposition of smooth metal nitride films |
| US8841182B1 (en) | 2013-03-14 | 2014-09-23 | Asm Ip Holding B.V. | Silane and borane treatments for titanium carbide films |
| US8846550B1 (en) | 2013-03-14 | 2014-09-30 | Asm Ip Holding B.V. | Silane or borane treatment of metal thin films |
| US20150162369A1 (en) * | 2013-12-09 | 2015-06-11 | Tower Semiconductor Ltd. | Single-Poly Floating Gate Solid State Direct Radiation Sensor Using STI Dielectric And Isolated PWells |
| US9394609B2 (en) | 2014-02-13 | 2016-07-19 | Asm Ip Holding B.V. | Atomic layer deposition of aluminum fluoride thin films |
| US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
| US10643925B2 (en) | 2014-04-17 | 2020-05-05 | Asm Ip Holding B.V. | Fluorine-containing conductive films |
| US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
| US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
| KR102216575B1 (ko) | 2014-10-23 | 2021-02-18 | 에이에스엠 아이피 홀딩 비.브이. | 티타늄 알루미늄 및 탄탈륨 알루미늄 박막들 |
| US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
| US10177185B2 (en) * | 2015-05-07 | 2019-01-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof |
| US10458018B2 (en) | 2015-06-26 | 2019-10-29 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
| US9941425B2 (en) | 2015-10-16 | 2018-04-10 | Asm Ip Holdings B.V. | Photoactive devices and materials |
| US10211308B2 (en) | 2015-10-21 | 2019-02-19 | Asm Ip Holding B.V. | NbMC layers |
| US9786491B2 (en) | 2015-11-12 | 2017-10-10 | Asm Ip Holding B.V. | Formation of SiOCN thin films |
| US9786492B2 (en) | 2015-11-12 | 2017-10-10 | Asm Ip Holding B.V. | Formation of SiOCN thin films |
| US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
| JP6583014B2 (ja) * | 2016-01-22 | 2019-10-02 | 株式会社デンソー | 半導体装置の製造方法 |
| US10529554B2 (en) | 2016-02-19 | 2020-01-07 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
| US10343920B2 (en) | 2016-03-18 | 2019-07-09 | Asm Ip Holding B.V. | Aligned carbon nanotubes |
| US10367080B2 (en) | 2016-05-02 | 2019-07-30 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
| KR102378021B1 (ko) | 2016-05-06 | 2022-03-23 | 에이에스엠 아이피 홀딩 비.브이. | SiOC 박막의 형성 |
| US11453943B2 (en) | 2016-05-25 | 2022-09-27 | Asm Ip Holding B.V. | Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor |
| US9859151B1 (en) | 2016-07-08 | 2018-01-02 | Asm Ip Holding B.V. | Selective film deposition method to form air gaps |
| US10612137B2 (en) | 2016-07-08 | 2020-04-07 | Asm Ip Holdings B.V. | Organic reactants for atomic layer deposition |
| US9812320B1 (en) | 2016-07-28 | 2017-11-07 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
| KR102532607B1 (ko) | 2016-07-28 | 2023-05-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 가공 장치 및 그 동작 방법 |
| US9887082B1 (en) | 2016-07-28 | 2018-02-06 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
| US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
| US10714350B2 (en) * | 2016-11-01 | 2020-07-14 | ASM IP Holdings, B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
| KR102546317B1 (ko) | 2016-11-15 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기체 공급 유닛 및 이를 포함하는 기판 처리 장치 |
| US10186420B2 (en) | 2016-11-29 | 2019-01-22 | Asm Ip Holding B.V. | Formation of silicon-containing thin films |
| KR102762543B1 (ko) | 2016-12-14 | 2025-02-05 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
| US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
| US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
| KR102700194B1 (ko) | 2016-12-19 | 2024-08-28 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
| US10269558B2 (en) | 2016-12-22 | 2019-04-23 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
| US11390950B2 (en) | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
| JP6814057B2 (ja) * | 2017-01-27 | 2021-01-13 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理装置、およびプログラム |
| US10468261B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
| US11121209B2 (en) | 2017-03-27 | 2021-09-14 | International Business Machines Corporation | Surface area enhancement for stacked metal-insulator-metal (MIM) capacitor |
| US10529563B2 (en) | 2017-03-29 | 2020-01-07 | Asm Ip Holdings B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
| US10847529B2 (en) | 2017-04-13 | 2020-11-24 | Asm Ip Holding B.V. | Substrate processing method and device manufactured by the same |
| US10504901B2 (en) | 2017-04-26 | 2019-12-10 | Asm Ip Holding B.V. | Substrate processing method and device manufactured using the same |
| KR102627238B1 (ko) | 2017-05-05 | 2024-01-19 | 에이에스엠 아이피 홀딩 비.브이. | 산소 함유 박막의 형성을 제어하기 위한 플라즈마 강화 증착 공정 |
| US10770286B2 (en) | 2017-05-08 | 2020-09-08 | Asm Ip Holdings B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
| US12040200B2 (en) | 2017-06-20 | 2024-07-16 | Asm Ip Holding B.V. | Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus |
| US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
| KR20190009245A (ko) | 2017-07-18 | 2019-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물 |
| US11018002B2 (en) | 2017-07-19 | 2021-05-25 | Asm Ip Holding B.V. | Method for selectively depositing a Group IV semiconductor and related semiconductor device structures |
| US10541333B2 (en) | 2017-07-19 | 2020-01-21 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
| US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
| US10590535B2 (en) | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
| TWI815813B (zh) | 2017-08-04 | 2023-09-21 | 荷蘭商Asm智慧財產控股公司 | 用於分配反應腔內氣體的噴頭總成 |
| US10692741B2 (en) | 2017-08-08 | 2020-06-23 | Asm Ip Holdings B.V. | Radiation shield |
| US10770336B2 (en) | 2017-08-08 | 2020-09-08 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
| US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
| US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
| US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
| KR102491945B1 (ko) | 2017-08-30 | 2023-01-26 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
| US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
| US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
| US10658205B2 (en) | 2017-09-28 | 2020-05-19 | Asm Ip Holdings B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
| US10403504B2 (en) | 2017-10-05 | 2019-09-03 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
| US10923344B2 (en) | 2017-10-30 | 2021-02-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
| US11022879B2 (en) | 2017-11-24 | 2021-06-01 | Asm Ip Holding B.V. | Method of forming an enhanced unexposed photoresist layer |
| CN111316417B (zh) | 2017-11-27 | 2023-12-22 | 阿斯莫Ip控股公司 | 与批式炉偕同使用的用于储存晶圆匣的储存装置 |
| KR102633318B1 (ko) | 2017-11-27 | 2024-02-05 | 에이에스엠 아이피 홀딩 비.브이. | 청정 소형 구역을 포함한 장치 |
| KR20190065962A (ko) | 2017-12-04 | 2019-06-12 | 에이에스엠 아이피 홀딩 비.브이. | 유전체와 금속 표면 상에 SiOC의 균일한 증착 |
| US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
| TWI799494B (zh) | 2018-01-19 | 2023-04-21 | 荷蘭商Asm 智慧財產控股公司 | 沈積方法 |
| KR102695659B1 (ko) | 2018-01-19 | 2024-08-14 | 에이에스엠 아이피 홀딩 비.브이. | 플라즈마 보조 증착에 의해 갭 충진 층을 증착하는 방법 |
| US11081345B2 (en) | 2018-02-06 | 2021-08-03 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
| US10896820B2 (en) | 2018-02-14 | 2021-01-19 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
| US11685991B2 (en) | 2018-02-14 | 2023-06-27 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
| US10731249B2 (en) | 2018-02-15 | 2020-08-04 | Asm Ip Holding B.V. | Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus |
| KR102636427B1 (ko) | 2018-02-20 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 장치 |
| US10975470B2 (en) | 2018-02-23 | 2021-04-13 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
| US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
| US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
| US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
| KR102646467B1 (ko) | 2018-03-27 | 2024-03-11 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조 |
| US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
| US11088002B2 (en) | 2018-03-29 | 2021-08-10 | Asm Ip Holding B.V. | Substrate rack and a substrate processing system and method |
| KR102600229B1 (ko) | 2018-04-09 | 2023-11-10 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 장치, 이를 포함하는 기판 처리 장치 및 기판 처리 방법 |
| CN111902918B (zh) | 2018-04-27 | 2024-07-26 | 株式会社国际电气 | 半导体装置的制造方法、基板处理装置以及记录介质 |
| US12025484B2 (en) | 2018-05-08 | 2024-07-02 | Asm Ip Holding B.V. | Thin film forming method |
| KR102709511B1 (ko) * | 2018-05-08 | 2024-09-24 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 산화물 막을 주기적 증착 공정에 의해 증착하기 위한 방법 및 관련 소자 구조 |
| US12272527B2 (en) | 2018-05-09 | 2025-04-08 | Asm Ip Holding B.V. | Apparatus for use with hydrogen radicals and method of using same |
| KR102596988B1 (ko) | 2018-05-28 | 2023-10-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 그에 의해 제조된 장치 |
| TWI840362B (zh) | 2018-06-04 | 2024-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 水氣降低的晶圓處置腔室 |
| US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
| US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
| KR102568797B1 (ko) | 2018-06-21 | 2023-08-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 시스템 |
| US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
| CN120591748A (zh) | 2018-06-27 | 2025-09-05 | Asm Ip私人控股有限公司 | 用于形成含金属的材料的循环沉积方法及膜和结构 |
| US11492703B2 (en) | 2018-06-27 | 2022-11-08 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
| US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
| US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
| US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
| US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
| US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
| US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
| KR102707956B1 (ko) | 2018-09-11 | 2024-09-19 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 |
| US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
| CN110970344B (zh) | 2018-10-01 | 2024-10-25 | Asmip控股有限公司 | 衬底保持设备、包含所述设备的系统及其使用方法 |
| US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
| KR102592699B1 (ko) | 2018-10-08 | 2023-10-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치 |
| KR102605121B1 (ko) | 2018-10-19 | 2023-11-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
| KR102546322B1 (ko) | 2018-10-19 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
| USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
| US12378665B2 (en) | 2018-10-26 | 2025-08-05 | Asm Ip Holding B.V. | High temperature coatings for a preclean and etch apparatus and related methods |
| US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
| KR102748291B1 (ko) | 2018-11-02 | 2024-12-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 기판 처리 장치 |
| US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
| US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
| US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
| US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
| US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
| US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
| KR102636428B1 (ko) | 2018-12-04 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치를 세정하는 방법 |
| US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
| JP7504584B2 (ja) | 2018-12-14 | 2024-06-24 | エーエスエム・アイピー・ホールディング・ベー・フェー | 窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム |
| US11038153B2 (en) | 2019-01-15 | 2021-06-15 | Applied Materials, Inc. | Methods for HMDSO thermal stability |
| TWI866480B (zh) | 2019-01-17 | 2024-12-11 | 荷蘭商Asm Ip 私人控股有限公司 | 藉由循環沈積製程於基板上形成含過渡金屬膜之方法 |
| KR102727227B1 (ko) | 2019-01-22 | 2024-11-07 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
| CN111524788B (zh) | 2019-02-01 | 2023-11-24 | Asm Ip私人控股有限公司 | 氧化硅的拓扑选择性膜形成的方法 |
| US12359315B2 (en) | 2019-02-14 | 2025-07-15 | Asm Ip Holding B.V. | Deposition of oxides and nitrides |
| US11482533B2 (en) | 2019-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Apparatus and methods for plug fill deposition in 3-D NAND applications |
| KR102626263B1 (ko) | 2019-02-20 | 2024-01-16 | 에이에스엠 아이피 홀딩 비.브이. | 처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치 |
| TWI873122B (zh) | 2019-02-20 | 2025-02-21 | 荷蘭商Asm Ip私人控股有限公司 | 填充一基板之一表面內所形成的一凹槽的方法、根據其所形成之半導體結構、及半導體處理設備 |
| JP7509548B2 (ja) | 2019-02-20 | 2024-07-02 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基材表面内に形成された凹部を充填するための周期的堆積方法および装置 |
| TWI842826B (zh) | 2019-02-22 | 2024-05-21 | 荷蘭商Asm Ip私人控股有限公司 | 基材處理設備及處理基材之方法 |
| KR102858005B1 (ko) | 2019-03-08 | 2025-09-09 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체 |
| US11742198B2 (en) | 2019-03-08 | 2023-08-29 | Asm Ip Holding B.V. | Structure including SiOCN layer and method of forming same |
| KR102782593B1 (ko) | 2019-03-08 | 2025-03-14 | 에이에스엠 아이피 홀딩 비.브이. | SiOC 층을 포함한 구조체 및 이의 형성 방법 |
| KR20200116033A (ko) | 2019-03-28 | 2020-10-08 | 에이에스엠 아이피 홀딩 비.브이. | 도어 개방기 및 이를 구비한 기판 처리 장치 |
| KR102809999B1 (ko) | 2019-04-01 | 2025-05-19 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자를 제조하는 방법 |
| US11447864B2 (en) | 2019-04-19 | 2022-09-20 | Asm Ip Holding B.V. | Layer forming method and apparatus |
| KR20200125453A (ko) | 2019-04-24 | 2020-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 기상 반응기 시스템 및 이를 사용하는 방법 |
| KR102929471B1 (ko) | 2019-05-07 | 2026-02-20 | 에이에스엠 아이피 홀딩 비.브이. | 딥 튜브가 있는 화학물질 공급원 용기 |
| KR102869364B1 (ko) | 2019-05-07 | 2025-10-10 | 에이에스엠 아이피 홀딩 비.브이. | 비정질 탄소 중합체 막을 개질하는 방법 |
| KR102929472B1 (ko) | 2019-05-10 | 2026-02-20 | 에이에스엠 아이피 홀딩 비.브이. | 표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조 |
| JP7612342B2 (ja) | 2019-05-16 | 2025-01-14 | エーエスエム・アイピー・ホールディング・ベー・フェー | ウェハボートハンドリング装置、縦型バッチ炉および方法 |
| JP7598201B2 (ja) | 2019-05-16 | 2024-12-11 | エーエスエム・アイピー・ホールディング・ベー・フェー | ウェハボートハンドリング装置、縦型バッチ炉および方法 |
| USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
| USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
| USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
| USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
| KR20200141002A (ko) | 2019-06-06 | 2020-12-17 | 에이에스엠 아이피 홀딩 비.브이. | 배기 가스 분석을 포함한 기상 반응기 시스템을 사용하는 방법 |
| KR102918757B1 (ko) | 2019-06-10 | 2026-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 석영 에피택셜 챔버를 세정하는 방법 |
| KR20200143254A (ko) | 2019-06-11 | 2020-12-23 | 에이에스엠 아이피 홀딩 비.브이. | 개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조 |
| USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
| US11649560B2 (en) | 2019-06-20 | 2023-05-16 | Applied Materials, Inc. | Method for forming silicon-phosphorous materials |
| USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
| KR102911421B1 (ko) | 2019-07-03 | 2026-01-12 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법 |
| US11788190B2 (en) | 2019-07-05 | 2023-10-17 | Asm Ip Holding B.V. | Liquid vaporizer |
| JP7499079B2 (ja) | 2019-07-09 | 2024-06-13 | エーエスエム・アイピー・ホールディング・ベー・フェー | 同軸導波管を用いたプラズマ装置、基板処理方法 |
| CN112216646B (zh) | 2019-07-10 | 2026-02-10 | Asmip私人控股有限公司 | 基板支撑组件及包括其的基板处理装置 |
| KR102895115B1 (ko) | 2019-07-16 | 2025-12-03 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
| TWI826704B (zh) | 2019-07-17 | 2023-12-21 | 荷蘭商Asm Ip私人控股有限公司 | 自由基輔助引燃電漿系統和方法 |
| KR102860110B1 (ko) | 2019-07-17 | 2025-09-16 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 게르마늄 구조를 형성하는 방법 |
| US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
| KR102903090B1 (ko) | 2019-07-19 | 2025-12-19 | 에이에스엠 아이피 홀딩 비.브이. | 토폴로지-제어된 비정질 탄소 중합체 막을 형성하는 방법 |
| TWI839544B (zh) | 2019-07-19 | 2024-04-21 | 荷蘭商Asm Ip私人控股有限公司 | 形成形貌受控的非晶碳聚合物膜之方法 |
| CN112309843B (zh) | 2019-07-29 | 2026-01-23 | Asmip私人控股有限公司 | 实现高掺杂剂掺入的选择性沉积方法 |
| CN112309899B (zh) | 2019-07-30 | 2025-11-14 | Asmip私人控股有限公司 | 基板处理设备 |
| CN112309900B (zh) | 2019-07-30 | 2025-11-04 | Asmip私人控股有限公司 | 基板处理设备 |
| US12169361B2 (en) | 2019-07-30 | 2024-12-17 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
| US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
| US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
| US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
| CN112323048B (zh) | 2019-08-05 | 2024-02-09 | Asm Ip私人控股有限公司 | 用于化学源容器的液位传感器 |
| KR20210018761A (ko) | 2019-08-09 | 2021-02-18 | 에이에스엠 아이피 홀딩 비.브이. | 냉각 장치를 포함한 히터 어셈블리 및 이를 사용하는 방법 |
| KR20210021266A (ko) | 2019-08-14 | 2021-02-25 | 에이에스엠 아이피 홀딩 비.브이. | 웨이퍼를 처리하는 장치 및 방법 |
| USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
| USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
| JP7810514B2 (ja) | 2019-08-21 | 2026-02-03 | エーエスエム・アイピー・ホールディング・ベー・フェー | 成膜原料混合ガス生成装置及び成膜装置 |
| USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
| USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
| USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
| KR20210024423A (ko) | 2019-08-22 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 홀을 구비한 구조체를 형성하기 위한 방법 |
| USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
| US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
| KR102928101B1 (ko) | 2019-08-23 | 2026-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법 |
| KR102868968B1 (ko) | 2019-09-03 | 2025-10-10 | 에이에스엠 아이피 홀딩 비.브이. | 칼코지나이드 막 및 상기 막을 포함한 구조체를 증착하기 위한 방법 및 장치 |
| KR102806450B1 (ko) | 2019-09-04 | 2025-05-12 | 에이에스엠 아이피 홀딩 비.브이. | 희생 캡핑 층을 이용한 선택적 증착 방법 |
| KR102733104B1 (ko) | 2019-09-05 | 2024-11-22 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
| US12469693B2 (en) | 2019-09-17 | 2025-11-11 | Asm Ip Holding B.V. | Method of forming a carbon-containing layer and structure including the layer |
| US11946136B2 (en) | 2019-09-20 | 2024-04-02 | Asm Ip Holding B.V. | Semiconductor processing device |
| US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
| CN112593212B (zh) | 2019-10-02 | 2023-12-22 | Asm Ip私人控股有限公司 | 通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法 |
| KR102948143B1 (ko) | 2019-10-08 | 2026-04-07 | 에이에스엠 아이피 홀딩 비.브이. | 활성 종을 이용하기 위한 가스 분배 어셈블리를 포함한 반응기 시스템 및 이를 사용하는 방법 |
| TW202128273A (zh) | 2019-10-08 | 2021-08-01 | 荷蘭商Asm Ip私人控股有限公司 | 氣體注入系統、及將材料沉積於反應室內之基板表面上的方法 |
| TWI846953B (zh) | 2019-10-08 | 2024-07-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理裝置 |
| TWI846966B (zh) | 2019-10-10 | 2024-07-01 | 荷蘭商Asm Ip私人控股有限公司 | 形成光阻底層之方法及包括光阻底層之結構 |
| US12009241B2 (en) | 2019-10-14 | 2024-06-11 | Asm Ip Holding B.V. | Vertical batch furnace assembly with detector to detect cassette |
| TWI834919B (zh) | 2019-10-16 | 2024-03-11 | 荷蘭商Asm Ip私人控股有限公司 | 氧化矽之拓撲選擇性膜形成之方法 |
| US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
| KR102845724B1 (ko) | 2019-10-21 | 2025-08-13 | 에이에스엠 아이피 홀딩 비.브이. | 막을 선택적으로 에칭하기 위한 장치 및 방법 |
| KR20210050453A (ko) | 2019-10-25 | 2021-05-07 | 에이에스엠 아이피 홀딩 비.브이. | 기판 표면 상의 갭 피처를 충진하는 방법 및 이와 관련된 반도체 소자 구조 |
| US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
| KR102890638B1 (ko) | 2019-11-05 | 2025-11-25 | 에이에스엠 아이피 홀딩 비.브이. | 도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템 |
| US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
| KR102861314B1 (ko) | 2019-11-20 | 2025-09-17 | 에이에스엠 아이피 홀딩 비.브이. | 기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템 |
| US11450529B2 (en) | 2019-11-26 | 2022-09-20 | Asm Ip Holding B.V. | Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface |
| CN112951697B (zh) | 2019-11-26 | 2025-07-29 | Asmip私人控股有限公司 | 基板处理设备 |
| CN120432376A (zh) | 2019-11-29 | 2025-08-05 | Asm Ip私人控股有限公司 | 基板处理设备 |
| CN112885692B (zh) | 2019-11-29 | 2025-08-15 | Asmip私人控股有限公司 | 基板处理设备 |
| JP7527928B2 (ja) | 2019-12-02 | 2024-08-05 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基板処理装置、基板処理方法 |
| KR20210070898A (ko) | 2019-12-04 | 2021-06-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
| US11885013B2 (en) | 2019-12-17 | 2024-01-30 | Asm Ip Holding B.V. | Method of forming vanadium nitride layer and structure including the vanadium nitride layer |
| US11527403B2 (en) | 2019-12-19 | 2022-12-13 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
| KR102795919B1 (ko) * | 2019-12-30 | 2025-04-16 | 삼성전자주식회사 | 커패시터 구조물, 이의 제조 방법, 상기 커패시터 구조물을 포함하는 반도체 장치 및 이의 제조 방법 |
| KR20210089077A (ko) | 2020-01-06 | 2021-07-15 | 에이에스엠 아이피 홀딩 비.브이. | 가스 공급 어셈블리, 이의 구성 요소, 및 이를 포함하는 반응기 시스템 |
| TWI887322B (zh) | 2020-01-06 | 2025-06-21 | 荷蘭商Asm Ip私人控股有限公司 | 反應器系統、抬升銷、及處理方法 |
| US11993847B2 (en) | 2020-01-08 | 2024-05-28 | Asm Ip Holding B.V. | Injector |
| KR102882467B1 (ko) | 2020-01-16 | 2025-11-05 | 에이에스엠 아이피 홀딩 비.브이. | 고 종횡비 피처를 형성하는 방법 |
| US12341005B2 (en) | 2020-01-17 | 2025-06-24 | Asm Ip Holding B.V. | Formation of SiCN thin films |
| US12142479B2 (en) | 2020-01-17 | 2024-11-12 | Asm Ip Holding B.V. | Formation of SiOCN thin films |
| KR102675856B1 (ko) | 2020-01-20 | 2024-06-17 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 및 박막 표면 개질 방법 |
| TWI889744B (zh) | 2020-01-29 | 2025-07-11 | 荷蘭商Asm Ip私人控股有限公司 | 污染物捕集系統、及擋板堆疊 |
| TW202513845A (zh) | 2020-02-03 | 2025-04-01 | 荷蘭商Asm Ip私人控股有限公司 | 半導體裝置結構及其形成方法 |
| TWI908758B (zh) | 2020-02-04 | 2025-12-21 | 荷蘭商Asm Ip私人控股有限公司 | 驗證一物品之方法、用於驗證一物品之設備、及用於驗證一反應室之系統 |
| US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
| KR20210103953A (ko) | 2020-02-13 | 2021-08-24 | 에이에스엠 아이피 홀딩 비.브이. | 가스 분배 어셈블리 및 이를 사용하는 방법 |
| KR102916725B1 (ko) | 2020-02-13 | 2026-01-23 | 에이에스엠 아이피 홀딩 비.브이. | 수광 장치를 포함하는 기판 처리 장치 및 수광 장치의 교정 방법 |
| US11781243B2 (en) | 2020-02-17 | 2023-10-10 | Asm Ip Holding B.V. | Method for depositing low temperature phosphorous-doped silicon |
| TWI895326B (zh) | 2020-02-28 | 2025-09-01 | 荷蘭商Asm Ip私人控股有限公司 | 專用於零件清潔的系統 |
| KR102943116B1 (ko) | 2020-03-04 | 2026-03-23 | 에이에스엠 아이피 홀딩 비.브이. | 반응기 시스템용 정렬 고정구 |
| KR20210116240A (ko) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | 조절성 접합부를 갖는 기판 핸들링 장치 |
| US11876356B2 (en) | 2020-03-11 | 2024-01-16 | Asm Ip Holding B.V. | Lockout tagout assembly and system and method of using same |
| CN113394086A (zh) | 2020-03-12 | 2021-09-14 | Asm Ip私人控股有限公司 | 用于制造具有目标拓扑轮廓的层结构的方法 |
| US12173404B2 (en) | 2020-03-17 | 2024-12-24 | Asm Ip Holding B.V. | Method of depositing epitaxial material, structure formed using the method, and system for performing the method |
| KR102755229B1 (ko) | 2020-04-02 | 2025-01-14 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 |
| TWI887376B (zh) | 2020-04-03 | 2025-06-21 | 荷蘭商Asm Ip私人控股有限公司 | 半導體裝置的製造方法 |
| TWI888525B (zh) | 2020-04-08 | 2025-07-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於選擇性蝕刻氧化矽膜之設備及方法 |
| KR20210127620A (ko) | 2020-04-13 | 2021-10-22 | 에이에스엠 아이피 홀딩 비.브이. | 질소 함유 탄소 막을 형성하는 방법 및 이를 수행하기 위한 시스템 |
| KR20210128343A (ko) | 2020-04-15 | 2021-10-26 | 에이에스엠 아이피 홀딩 비.브이. | 크롬 나이트라이드 층을 형성하는 방법 및 크롬 나이트라이드 층을 포함하는 구조 |
| US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
| US11996289B2 (en) | 2020-04-16 | 2024-05-28 | Asm Ip Holding B.V. | Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods |
| TW202143328A (zh) | 2020-04-21 | 2021-11-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於調整膜應力之方法 |
| KR102866804B1 (ko) | 2020-04-24 | 2025-09-30 | 에이에스엠 아이피 홀딩 비.브이. | 냉각 가스 공급부를 포함한 수직형 배치 퍼니스 어셈블리 |
| KR102934380B1 (ko) | 2020-04-24 | 2026-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐 보라이드 및 바나듐 포스파이드 층을 포함한 구조체를 형성하는 방법 |
| CN113555279A (zh) | 2020-04-24 | 2021-10-26 | Asm Ip私人控股有限公司 | 形成含氮化钒的层的方法及包含其的结构 |
| KR20210132600A (ko) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템 |
| KR20210132612A (ko) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐 화합물들을 안정화하기 위한 방법들 및 장치 |
| KR102783898B1 (ko) | 2020-04-29 | 2025-03-18 | 에이에스엠 아이피 홀딩 비.브이. | 고체 소스 전구체 용기 |
| KR20210134869A (ko) | 2020-05-01 | 2021-11-11 | 에이에스엠 아이피 홀딩 비.브이. | Foup 핸들러를 이용한 foup의 빠른 교환 |
| JP7726664B2 (ja) | 2020-05-04 | 2025-08-20 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基板を処理するための基板処理システム |
| KR20210137395A (ko) | 2020-05-07 | 2021-11-17 | 에이에스엠 아이피 홀딩 비.브이. | 불소계 라디칼을 이용하여 반응 챔버의 인시츄 식각을 수행하기 위한 장치 및 방법 |
| JP7736446B2 (ja) | 2020-05-07 | 2025-09-09 | エーエスエム・アイピー・ホールディング・ベー・フェー | 同調回路を備える反応器システム |
| KR102788543B1 (ko) | 2020-05-13 | 2025-03-27 | 에이에스엠 아이피 홀딩 비.브이. | 반응기 시스템용 레이저 정렬 고정구 |
| KR102936676B1 (ko) | 2020-05-15 | 2026-03-10 | 에이에스엠 아이피 홀딩 비.브이. | 다중 전구체를 사용하여 실리콘 게르마늄 균일도를 제어하기 위한 방법 |
| TWI911214B (zh) | 2020-05-19 | 2026-01-11 | 荷蘭商Asm Ip私人控股有限公司 | 基材處理設備 |
| KR102795476B1 (ko) | 2020-05-21 | 2025-04-11 | 에이에스엠 아이피 홀딩 비.브이. | 다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법 |
| KR20210145079A (ko) | 2020-05-21 | 2021-12-01 | 에이에스엠 아이피 홀딩 비.브이. | 기판을 처리하기 위한 플랜지 및 장치 |
| KR102702526B1 (ko) | 2020-05-22 | 2024-09-03 | 에이에스엠 아이피 홀딩 비.브이. | 과산화수소를 사용하여 박막을 증착하기 위한 장치 |
| KR20210146802A (ko) | 2020-05-26 | 2021-12-06 | 에이에스엠 아이피 홀딩 비.브이. | 붕소 및 갈륨을 함유한 실리콘 게르마늄 층을 증착하는 방법 |
| TWI876048B (zh) | 2020-05-29 | 2025-03-11 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
| TW202212620A (zh) | 2020-06-02 | 2022-04-01 | 荷蘭商Asm Ip私人控股有限公司 | 處理基板之設備、形成膜之方法、及控制用於處理基板之設備之方法 |
| KR20210156219A (ko) | 2020-06-16 | 2021-12-24 | 에이에스엠 아이피 홀딩 비.브이. | 붕소를 함유한 실리콘 게르마늄 층을 증착하는 방법 |
| TWI908816B (zh) | 2020-06-24 | 2025-12-21 | 荷蘭商Asm Ip私人控股有限公司 | 形成含矽層之方法 |
| TWI873359B (zh) | 2020-06-30 | 2025-02-21 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
| US12431354B2 (en) | 2020-07-01 | 2025-09-30 | Asm Ip Holding B.V. | Silicon nitride and silicon oxide deposition methods using fluorine inhibitor |
| TW202202649A (zh) | 2020-07-08 | 2022-01-16 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
| TWI864307B (zh) | 2020-07-17 | 2024-12-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於光微影之結構、方法與系統 |
| KR20220011092A (ko) | 2020-07-20 | 2022-01-27 | 에이에스엠 아이피 홀딩 비.브이. | 전이 금속층을 포함하는 구조체를 형성하기 위한 방법 및 시스템 |
| TWI878570B (zh) | 2020-07-20 | 2025-04-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於沉積鉬層之方法及系統 |
| US12322591B2 (en) | 2020-07-27 | 2025-06-03 | Asm Ip Holding B.V. | Thin film deposition process |
| KR20220020210A (ko) | 2020-08-11 | 2022-02-18 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 티타늄 알루미늄 카바이드 막 구조체 및 관련 반도체 구조체를 증착하는 방법 |
| KR102915124B1 (ko) | 2020-08-14 | 2026-01-19 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
| US12040177B2 (en) | 2020-08-18 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a laminate film by cyclical plasma-enhanced deposition processes |
| JP7777531B2 (ja) * | 2020-08-19 | 2025-11-28 | 株式会社半導体エネルギー研究所 | ハフニウムジルコニウム酸化物の製造方法 |
| JP7805298B2 (ja) * | 2020-08-21 | 2026-01-23 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TWI911263B (zh) | 2020-08-25 | 2026-01-11 | 荷蘭商Asm Ip私人控股有限公司 | 清潔基板的方法、選擇性沉積的方法、及反應器系統 |
| TW202534193A (zh) | 2020-08-26 | 2025-09-01 | 荷蘭商Asm Ip私人控股有限公司 | 形成金屬氧化矽層及金屬氮氧化矽層的方法 |
| TWI911265B (zh) | 2020-08-27 | 2026-01-11 | 荷蘭商Asm Ip私人控股有限公司 | 形成圖案化結構的方法、操控機械特性的方法、及裝置結構 |
| US12538495B2 (en) | 2020-09-06 | 2026-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, capacitor, and manufacturing method thereof |
| TW202210653A (zh) * | 2020-09-07 | 2022-03-16 | 日商半導體能源研究所股份有限公司 | 金屬氧化物膜、半導體裝置以及其製造方法 |
| TWI904232B (zh) | 2020-09-10 | 2025-11-11 | 荷蘭商Asm Ip私人控股有限公司 | 沉積間隙填充流體之方法及相關系統和裝置 |
| USD990534S1 (en) | 2020-09-11 | 2023-06-27 | Asm Ip Holding B.V. | Weighted lift pin |
| KR20220036866A (ko) | 2020-09-16 | 2022-03-23 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 산화물 증착 방법 |
| USD1012873S1 (en) | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
| TWI889903B (zh) | 2020-09-25 | 2025-07-11 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
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Family Cites Families (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE393967B (sv) | 1974-11-29 | 1977-05-31 | Sateko Oy | Forfarande och for utforande av stroleggning mellan lagren i ett virkespaket |
| US5769950A (en) | 1985-07-23 | 1998-06-23 | Canon Kabushiki Kaisha | Device for forming deposited film |
| US4747367A (en) | 1986-06-12 | 1988-05-31 | Crystal Specialties, Inc. | Method and apparatus for producing a constant flow, constant pressure chemical vapor deposition |
| US4761269A (en) | 1986-06-12 | 1988-08-02 | Crystal Specialties, Inc. | Apparatus for depositing material on a substrate |
| US5519234A (en) * | 1991-02-25 | 1996-05-21 | Symetrix Corporation | Ferroelectric dielectric memory cell can switch at least giga cycles and has low fatigue - has high dielectric constant and low leakage current |
| DE69017802T2 (de) * | 1989-08-30 | 1995-09-07 | Nippon Electric Co | Dünnfilmkondensator und dessen Herstellungsverfahren. |
| US5071670A (en) | 1990-06-11 | 1991-12-10 | Kelly Michael A | Method for chemical vapor deposition under a single reactor vessel divided into separate reaction chambers each with its own depositing and exhausting means |
| US5182232A (en) * | 1991-04-08 | 1993-01-26 | Micron Technology, Inc. | Metal silicide texturizing technique |
| US5313089A (en) * | 1992-05-26 | 1994-05-17 | Motorola, Inc. | Capacitor and a memory cell formed therefrom |
| JPH0677402A (ja) | 1992-07-02 | 1994-03-18 | Natl Semiconductor Corp <Ns> | 半導体デバイス用誘電体構造及びその製造方法 |
| US5187638A (en) | 1992-07-27 | 1993-02-16 | Micron Technology, Inc. | Barrier layers for ferroelectric and pzt dielectric on silicon |
| US5392189A (en) | 1993-04-02 | 1995-02-21 | Micron Semiconductor, Inc. | Capacitor compatible with high dielectric constant materials having two independent insulative layers and the method for forming same |
| JPH07221034A (ja) * | 1994-01-31 | 1995-08-18 | Nec Corp | 半導体装置の製造方法 |
| US5418180A (en) | 1994-06-14 | 1995-05-23 | Micron Semiconductor, Inc. | Process for fabricating storage capacitor structures using CVD tin on hemispherical grain silicon |
| US5566045A (en) | 1994-08-01 | 1996-10-15 | Texas Instruments, Inc. | High-dielectric-constant material electrodes comprising thin platinum layers |
| US5622893A (en) | 1994-08-01 | 1997-04-22 | Texas Instruments Incorporated | Method of forming conductive noble-metal-insulator-alloy barrier layer for high-dielectric-constant material electrodes |
| US5504041A (en) | 1994-08-01 | 1996-04-02 | Texas Instruments Incorporated | Conductive exotic-nitride barrier layer for high-dielectric-constant materials |
| US6331325B1 (en) | 1994-09-30 | 2001-12-18 | Texas Instruments Incorporated | Barium strontium titanate (BST) thin films using boron |
| KR100199346B1 (ko) | 1995-04-04 | 1999-06-15 | 김영환 | 반도체 소자의 전하저장전극 형성방법 |
| EP0740348B1 (de) | 1995-04-24 | 2002-02-27 | Infineon Technologies AG | Halbleiter-Speichervorrichtung unter Verwendung eines ferroelektrischen Dielektrikums und Verfahren zur Herstellung |
| US6088216A (en) * | 1995-04-28 | 2000-07-11 | International Business Machines Corporation | Lead silicate based capacitor structures |
| US5633781A (en) | 1995-12-22 | 1997-05-27 | International Business Machines Corporation | Isolated sidewall capacitor having a compound plate electrode |
| US5650351A (en) * | 1996-01-11 | 1997-07-22 | Vanguard International Semiconductor Company | Method to form a capacitor having multiple pillars for advanced DRAMS |
| US5754390A (en) * | 1996-01-23 | 1998-05-19 | Micron Technology, Inc. | Integrated capacitor bottom electrode for use with conformal dielectric |
| US5554557A (en) * | 1996-02-02 | 1996-09-10 | Vanguard International Semiconductor Corp. | Method for fabricating a stacked capacitor with a self aligned node contact in a memory cell |
| US5916365A (en) | 1996-08-16 | 1999-06-29 | Sherman; Arthur | Sequential chemical vapor deposition |
| US5923056A (en) | 1996-10-10 | 1999-07-13 | Lucent Technologies Inc. | Electronic components with doped metal oxide dielectric materials and a process for making electronic components with doped metal oxide dielectric materials |
| TW468253B (en) | 1997-01-13 | 2001-12-11 | Hitachi Ltd | Semiconductor memory device |
| US6218260B1 (en) * | 1997-04-22 | 2001-04-17 | Samsung Electronics Co., Ltd. | Methods of forming integrated circuit capacitors having improved electrode and dielectric layer characteristics and capacitors formed thereby |
| KR19990031571A (ko) * | 1997-10-13 | 1999-05-06 | 윤종용 | 반구형 실리콘층을 이용하는 커패시터 형성방법 |
| US6200487B1 (en) * | 1997-11-05 | 2001-03-13 | Zodiac Pool Care, Inc. | In-line, in-pool water purification system |
| JP3221376B2 (ja) * | 1997-11-07 | 2001-10-22 | 日本電気株式会社 | 半導体装置の製造方法 |
| KR19990039625A (ko) * | 1997-11-13 | 1999-06-05 | 윤종용 | 반구형 결정립층을 이용하는 반도체 장치의 커패시터 형성 방법 |
| KR100280206B1 (ko) | 1997-12-06 | 2001-03-02 | 윤종용 | 고유전체 캐패시터 및 그의 제조 방법 |
| US6184074B1 (en) | 1997-12-17 | 2001-02-06 | Texas Instruments Incorporated | Method of fabrication a self-aligned polysilicon/diffusion barrier/oxygen stable sidewall bottom electrode structure for high-K DRAMS |
| KR100275727B1 (ko) * | 1998-01-06 | 2001-01-15 | 윤종용 | 반도체 장치의 커패시터 형성방법 |
| JP3191757B2 (ja) * | 1998-02-03 | 2001-07-23 | 日本電気株式会社 | 半導体装置の製造方法 |
| TW372365B (en) | 1998-04-20 | 1999-10-21 | United Microelectronics Corp | Manufacturing method for capacitors of dynamic random access memory |
| KR100275738B1 (ko) | 1998-08-07 | 2000-12-15 | 윤종용 | 원자층 증착법을 이용한 박막 제조방법 |
| US6107136A (en) | 1998-08-17 | 2000-08-22 | Motorola Inc. | Method for forming a capacitor structure |
| KR20000020950A (ko) * | 1998-09-24 | 2000-04-15 | 김영환 | 커패시터의 하부전극 제조방법 |
| KR100327328B1 (ko) | 1998-10-13 | 2002-05-09 | 윤종용 | 부분적으로다른두께를갖는커패시터의유전막형성방버뵤 |
| KR100310824B1 (ko) | 1999-01-29 | 2001-10-17 | 김영환 | 반도체장치의 캐패시터 및 그 제조방법 |
| JP3408450B2 (ja) | 1999-04-20 | 2003-05-19 | 日本電気株式会社 | 半導体装置およびその製造方法 |
| US6200897B1 (en) * | 1999-06-06 | 2001-03-13 | United Semiconductor Corp. | Method for manufacturing even dielectric layer |
| US6297539B1 (en) * | 1999-07-19 | 2001-10-02 | Sharp Laboratories Of America, Inc. | Doped zirconia, or zirconia-like, dielectric film transistor structure and deposition method for same |
| US6281543B1 (en) | 1999-08-31 | 2001-08-28 | Micron Technology, Inc. | Double layer electrode and barrier system on hemispherical grain silicon for use with high dielectric constant materials and methods for fabricating the same |
| US6203613B1 (en) * | 1999-10-19 | 2001-03-20 | International Business Machines Corporation | Atomic layer deposition with nitrate containing precursors |
-
1999
- 1999-12-03 US US09/452,844 patent/US6780704B1/en not_active Expired - Lifetime
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2000
- 2000-12-04 JP JP2000368569A patent/JP5079183B2/ja not_active Expired - Fee Related
- 2000-12-04 KR KR1020000072991A patent/KR100737304B1/ko not_active Expired - Lifetime
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2001
- 2001-02-22 US US09/791,072 patent/US6831315B2/en not_active Expired - Fee Related
- 2001-03-13 TW TW089125655A patent/TW486771B/zh not_active IP Right Cessation
-
2004
- 2004-03-03 US US10/795,696 patent/US20040175586A1/en not_active Abandoned
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| US6780704B1 (en) | 2004-08-24 |
| KR100737304B1 (ko) | 2007-07-09 |
| US6831315B2 (en) | 2004-12-14 |
| JP2001200363A (ja) | 2001-07-24 |
| TW486771B (en) | 2002-05-11 |
| US20040175586A1 (en) | 2004-09-09 |
| KR20010070264A (ko) | 2001-07-25 |
| US20010024387A1 (en) | 2001-09-27 |
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