JP2008522401A - 表面域の改質方法および電子デバイス - Google Patents
表面域の改質方法および電子デバイス Download PDFInfo
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- JP2008522401A JP2008522401A JP2007542482A JP2007542482A JP2008522401A JP 2008522401 A JP2008522401 A JP 2008522401A JP 2007542482 A JP2007542482 A JP 2007542482A JP 2007542482 A JP2007542482 A JP 2007542482A JP 2008522401 A JP2008522401 A JP 2008522401A
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- 238000002715 modification method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 238000000034 method Methods 0.000 claims abstract description 60
- 239000010410 layer Substances 0.000 claims abstract description 53
- 239000011241 protective layer Substances 0.000 claims abstract description 8
- 238000001312 dry etching Methods 0.000 claims abstract description 3
- 239000004065 semiconductor Substances 0.000 claims description 22
- 230000008569 process Effects 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 14
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- 238000012986 modification Methods 0.000 claims description 11
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- 239000007772 electrode material Substances 0.000 claims description 7
- 239000002800 charge carrier Substances 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 4
- 239000007784 solid electrolyte Substances 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 abstract description 6
- 230000000717 retained effect Effects 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 17
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 7
- 238000000231 atomic layer deposition Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
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- 239000011574 phosphorus Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- -1 argon ion Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
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- 229910052737 gold Inorganic materials 0.000 description 1
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- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
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- 238000004904 shortening Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- 238000003631 wet chemical etching Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/84—Electrodes with an enlarged surface, e.g. formed by texturisation being a rough surface, e.g. using hemispherical grains
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/66181—Conductor-insulator-semiconductor capacitors, e.g. trench capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
- H10B12/0387—Making the trench
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
- Secondary Cells (AREA)
Abstract
Description
次の各ステップを含む方法によってこの目的を達成する。
基板の表面上及びトレンチ内に第1層を付加する。
エッチング処理により基板の表面から第1層を取り除く。そして、
表面改質処理を適用して、トレンチだけに対して表面改質を行う。
請求の範囲1〜4のいずれか一項に記載の方法によりトレンチ内の表面域を改質し、改質後の表面を導電性とするステップ。
絶縁材料をトレンチ内及び基板表面に堆積させるステップ。
絶縁材料の上に電極材を堆積させるステップ。
基板表面上の絶縁材料および電極材をパターニングして、トレンチの改質した表面域内に規定した第1の電極およびトレンチ内の電極材内に規定した第2の電極への電気接続を設けるステップ。
これらの図は、一定の縮尺で描画したものではない。異なる図の等しい参照番号は、類似の要素を参照するものである。これらの図は、単に例示のためのものであり、本発明を制限するものではない。
Claims (12)
- 半導体基板のトレンチ内の表面域を改質する方法において、
前記基板の表面上及び前記トレンチ内に第1層を付加するステップと、
前記第1層を前記基板の表面からエッチング処理によって取り除くステップと、
前記トレンチ内のみで表面の改質を実行すべく表面改質処理を施すステップと
を具えていることを特徴とする表面域改質方法。 - 請求項1に記載の方法において、前記エッチング処理をマスク無しで実行することを特徴とする表面域改質方法。
- 請求項2に記載の方法において、前記エッチング処理が乾式エッチング技術であることを特徴とする表面域改質方法。
- 請求項1に記載の方法において、前記トレンチ及び前記第1層を付加する前に、前記基板の一部を保護層で覆うことを特徴とする表面域改質方法。
- 請求項1〜4のいずれか一項に記載の方法により前記トレンチ内の表面域を改質し、前記改質した表面を導電性とするステップと、
前記トレンチ内及び前記基板表面上に絶縁材料を堆積させるステップと、
前記絶縁材料上に電極材を堆積させるステップと、
前記基板表面上の前記絶縁材料および前記電極材をパターニングして、前記トレンチの前記改質した表面域内に規定された第1電極および前記トレンチ内の前記電極材中に規定された第2電極への電気接続を提供するステップと
を具えていることを特徴とする電子デバイス製造方法。 - 請求項5に記載の方法において、前記絶縁材料が固体電解質であり、前記第1電極、前記絶縁材料および前記第2電極の構造が蓄電池を構成することを特徴とする電子デバイス製造方法。
- ほぼ平坦な基板表面と、
前記基板表面内に開口を有し、かつ凹凸のあるトレンチ面を有するトレンチと
が設けられた半導体基板を具えた電子デバイスにおいて、
さらに、前記基板に、前記トレンチに隣接した基板ゾーンが設けられ、この基板ゾーン内及び/またはこの基板上に電気素子が規定されていることを特徴とする電子デバイス。 - 請求項7に記載の電子デバイスにおいて、前記トレンチ面の前記凹凸形状が、半球状に成長させた半導体材料によって構成されることを特徴とする電子デバイス。
- 請求項7に記載の電子デバイスにおいて、前記基板ゾーンに荷電担体が実質的に存在しないことを特徴とする電子デバイス。
- 請求項9に記載の電子デバイスにおいて、前記電気素子がインダクタであることを特徴とする電子デバイス。
- 請求項9に記載の電子デバイスにおいて、前記電気素子が半導体素子であり、前記基板ゾーンが、前記半導体素子におけるチャネルまたは絶縁ゾーンとして作用することを特徴とする電子デバイス。
- 請求項7〜11のいずれか一項に記載の電子デバイス、及びこの電子デバイスに組み付けられた半導体素子を具えていることを特徴とするアセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04106120 | 2004-11-26 | ||
EP05100364 | 2005-01-21 | ||
PCT/IB2005/053905 WO2006056959A1 (en) | 2004-11-26 | 2005-11-25 | Method of modifying surface area and electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008522401A true JP2008522401A (ja) | 2008-06-26 |
Family
ID=36096320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007542482A Pending JP2008522401A (ja) | 2004-11-26 | 2005-11-25 | 表面域の改質方法および電子デバイス |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090302419A1 (ja) |
EP (1) | EP1820209A1 (ja) |
JP (1) | JP2008522401A (ja) |
WO (1) | WO2006056959A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017130669A (ja) * | 2017-02-27 | 2017-07-27 | インテル コーポレイション | エネルギー貯蔵デバイスのエネルギー密度及び達成可能な電力出力を増やす方法 |
US10777366B2 (en) | 2011-09-30 | 2020-09-15 | Intel Corporation | Method of increasing an energy density and an achievable power output of an energy storage device |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102164845A (zh) | 2008-09-30 | 2011-08-24 | Nxp股份有限公司 | 鲁棒高宽比半导体器件 |
WO2010049852A1 (en) | 2008-10-30 | 2010-05-06 | Nxp B.V. | Through-substrate via and redistribution layer with metal paste |
WO2012002136A1 (en) | 2010-06-30 | 2012-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of power storage device |
US10559859B2 (en) | 2013-09-26 | 2020-02-11 | Infineon Technologies Ag | Integrated circuit structure and a battery structure |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0878639A (ja) * | 1994-09-06 | 1996-03-22 | Mitsubishi Electric Corp | 半導体記憶装置およびその製造方法 |
JPH10284130A (ja) * | 1997-04-04 | 1998-10-23 | Nec Corp | 半導体基板搭載型二次電池 |
JP2001345428A (ja) * | 2000-03-27 | 2001-12-14 | Toshiba Corp | 半導体装置とその製造方法 |
US6455369B1 (en) * | 2000-08-18 | 2002-09-24 | Infineon Technologies Ag | Method for fabricating a trench capacitor |
Family Cites Families (18)
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US63297A (en) * | 1867-03-26 | Joshua c | ||
US72171A (en) * | 1867-12-17 | Robert creuzbaur | ||
US5191509A (en) * | 1991-12-11 | 1993-03-02 | International Business Machines Corporation | Textured polysilicon stacked trench capacitor |
US5893735A (en) * | 1996-02-22 | 1999-04-13 | Siemens Aktiengesellschaft | Three-dimensional device layout with sub-groundrule features |
US6025225A (en) * | 1998-01-22 | 2000-02-15 | Micron Technology, Inc. | Circuits with a trench capacitor having micro-roughened semiconductor surfaces and methods for forming the same |
US6177696B1 (en) * | 1998-08-13 | 2001-01-23 | International Business Machines Corporation | Integration scheme enhancing deep trench capacitance in semiconductor integrated circuit devices |
US6197450B1 (en) * | 1998-10-22 | 2001-03-06 | Ramot University Authority For Applied Research & Industrial Development Ltd. | Micro electrochemical energy storage cells |
US6326277B1 (en) | 1999-08-30 | 2001-12-04 | Micron Technology, Inc. | Methods of forming recessed hemispherical grain silicon capacitor structures |
US6159874A (en) * | 1999-10-27 | 2000-12-12 | Infineon Technologies North America Corp. | Method of forming a hemispherical grained capacitor |
US6780704B1 (en) | 1999-12-03 | 2004-08-24 | Asm International Nv | Conformal thin films over textured capacitor electrodes |
DE10038378A1 (de) * | 2000-08-07 | 2002-02-28 | Infineon Technologies Ag | Verfahren zur Herstellung von Kondensatorelektroden |
US6440845B1 (en) * | 2000-10-05 | 2002-08-27 | United Microelectronics Corp. | Method of fabricating interconnect of capacitor |
US6503793B1 (en) | 2001-08-10 | 2003-01-07 | Agere Systems Inc. | Method for concurrently forming an ESD protection device and a shallow trench isolation region |
DE10227492B4 (de) * | 2002-06-19 | 2006-03-09 | Infineon Technologies Ag | Verfahren zur Herstellung eines Deep-Trench-Kondensators für dynamische Speicherzellen |
JP3711343B2 (ja) * | 2002-06-26 | 2005-11-02 | 株式会社トッパンNecサーキットソリューションズ | 印刷配線板及びその製造方法並びに半導体装置 |
US6936512B2 (en) * | 2002-09-27 | 2005-08-30 | International Business Machines Corporation | Semiconductor method and structure for simultaneously forming a trench capacitor dielectric and trench sidewall device dielectric |
US7101768B2 (en) * | 2002-09-27 | 2006-09-05 | International Business Machines Corporation | Self-aligned selective hemispherical grain deposition process and structure for enhanced capacitance trench capacitor |
DE602004006883T2 (de) | 2003-09-15 | 2008-02-14 | Koninklijke Philips Electronics N.V. | Elektrochemische energiequelle, elektronische einrichtung und verfahren zur herstellung der energiequelle |
-
2005
- 2005-11-25 US US11/720,322 patent/US20090302419A1/en not_active Abandoned
- 2005-11-25 WO PCT/IB2005/053905 patent/WO2006056959A1/en active Application Filing
- 2005-11-25 JP JP2007542482A patent/JP2008522401A/ja active Pending
- 2005-11-25 EP EP05819049A patent/EP1820209A1/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0878639A (ja) * | 1994-09-06 | 1996-03-22 | Mitsubishi Electric Corp | 半導体記憶装置およびその製造方法 |
JPH10284130A (ja) * | 1997-04-04 | 1998-10-23 | Nec Corp | 半導体基板搭載型二次電池 |
JP2001345428A (ja) * | 2000-03-27 | 2001-12-14 | Toshiba Corp | 半導体装置とその製造方法 |
US6455369B1 (en) * | 2000-08-18 | 2002-09-24 | Infineon Technologies Ag | Method for fabricating a trench capacitor |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10777366B2 (en) | 2011-09-30 | 2020-09-15 | Intel Corporation | Method of increasing an energy density and an achievable power output of an energy storage device |
JP2017130669A (ja) * | 2017-02-27 | 2017-07-27 | インテル コーポレイション | エネルギー貯蔵デバイスのエネルギー密度及び達成可能な電力出力を増やす方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090302419A1 (en) | 2009-12-10 |
WO2006056959A1 (en) | 2006-06-01 |
EP1820209A1 (en) | 2007-08-22 |
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