JP2015144250A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2015144250A JP2015144250A JP2014249834A JP2014249834A JP2015144250A JP 2015144250 A JP2015144250 A JP 2015144250A JP 2014249834 A JP2014249834 A JP 2014249834A JP 2014249834 A JP2014249834 A JP 2014249834A JP 2015144250 A JP2015144250 A JP 2015144250A
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- film
- oxide semiconductor
- semiconductor film
- transistor
- conductive film
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 1061
- 239000012535 impurity Substances 0.000 claims abstract description 173
- 239000007789 gas Substances 0.000 claims description 131
- 229910052739 hydrogen Inorganic materials 0.000 claims description 96
- 239000001257 hydrogen Substances 0.000 claims description 90
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 88
- 229910052751 metal Inorganic materials 0.000 claims description 72
- 125000004429 atom Chemical group 0.000 claims description 71
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 59
- 239000002184 metal Substances 0.000 claims description 56
- 229910052782 aluminium Inorganic materials 0.000 claims description 45
- 229910052757 nitrogen Inorganic materials 0.000 claims description 44
- 229910052710 silicon Inorganic materials 0.000 claims description 44
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 43
- 239000010703 silicon Substances 0.000 claims description 43
- 150000002431 hydrogen Chemical group 0.000 claims description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 29
- -1 silicide nitride Chemical class 0.000 claims description 25
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- 229910052799 carbon Inorganic materials 0.000 claims description 19
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 13
- 229910052801 chlorine Inorganic materials 0.000 claims description 13
- 239000000460 chlorine Substances 0.000 claims description 13
- 229910052698 phosphorus Inorganic materials 0.000 claims description 13
- 239000011574 phosphorus Substances 0.000 claims description 13
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 12
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 12
- 229910052796 boron Inorganic materials 0.000 claims description 12
- 229910052731 fluorine Inorganic materials 0.000 claims description 12
- 239000011737 fluorine Substances 0.000 claims description 12
- 229910021332 silicide Inorganic materials 0.000 claims description 6
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 3
- 239000010408 film Substances 0.000 description 2260
- 238000000034 method Methods 0.000 description 207
- 239000000758 substrate Substances 0.000 description 178
- 229910052760 oxygen Inorganic materials 0.000 description 134
- 239000001301 oxygen Substances 0.000 description 134
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 130
- 239000008188 pellet Substances 0.000 description 114
- 239000011701 zinc Substances 0.000 description 104
- 239000013078 crystal Substances 0.000 description 89
- 230000006870 function Effects 0.000 description 87
- 239000010410 layer Substances 0.000 description 67
- 238000004519 manufacturing process Methods 0.000 description 58
- 239000004973 liquid crystal related substance Substances 0.000 description 51
- 230000015572 biosynthetic process Effects 0.000 description 47
- 238000010438 heat treatment Methods 0.000 description 44
- 239000000463 material Substances 0.000 description 39
- 239000003990 capacitor Substances 0.000 description 35
- 230000008569 process Effects 0.000 description 34
- 230000007547 defect Effects 0.000 description 30
- 238000004544 sputter deposition Methods 0.000 description 28
- 230000005669 field effect Effects 0.000 description 27
- 150000004767 nitrides Chemical class 0.000 description 25
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 22
- 238000000151 deposition Methods 0.000 description 20
- 239000000203 mixture Substances 0.000 description 20
- 238000012545 processing Methods 0.000 description 20
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 19
- 239000012298 atmosphere Substances 0.000 description 19
- 230000008021 deposition Effects 0.000 description 19
- 238000005530 etching Methods 0.000 description 18
- 238000002173 high-resolution transmission electron microscopy Methods 0.000 description 18
- 239000000523 sample Substances 0.000 description 18
- 229910052779 Neodymium Inorganic materials 0.000 description 17
- 229910052721 tungsten Inorganic materials 0.000 description 17
- 239000010937 tungsten Substances 0.000 description 17
- 229910052727 yttrium Inorganic materials 0.000 description 17
- 229910052726 zirconium Inorganic materials 0.000 description 17
- 229910052684 Cerium Inorganic materials 0.000 description 16
- 150000002500 ions Chemical class 0.000 description 16
- 229910052746 lanthanum Inorganic materials 0.000 description 16
- 229910052749 magnesium Inorganic materials 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 239000010949 copper Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 15
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 15
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 14
- 230000003071 parasitic effect Effects 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052581 Si3N4 Inorganic materials 0.000 description 13
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 13
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 13
- 229910052814 silicon oxide Inorganic materials 0.000 description 13
- 239000010936 titanium Substances 0.000 description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 11
- 229910021529 ammonia Inorganic materials 0.000 description 11
- 239000004020 conductor Substances 0.000 description 11
- 229910052719 titanium Inorganic materials 0.000 description 11
- 229910016344 CuSi Inorganic materials 0.000 description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 10
- 229910007541 Zn O Inorganic materials 0.000 description 10
- 229910052786 argon Inorganic materials 0.000 description 10
- 239000000969 carrier Substances 0.000 description 10
- 238000002003 electron diffraction Methods 0.000 description 10
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 10
- 229910000077 silane Inorganic materials 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 238000000231 atomic layer deposition Methods 0.000 description 9
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 239000002159 nanocrystal Substances 0.000 description 9
- 125000004430 oxygen atom Chemical group O* 0.000 description 9
- 239000002356 single layer Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000000470 constituent Substances 0.000 description 8
- 238000001312 dry etching Methods 0.000 description 8
- 239000011261 inert gas Substances 0.000 description 8
- 238000001459 lithography Methods 0.000 description 8
- 229910052750 molybdenum Inorganic materials 0.000 description 8
- 238000007639 printing Methods 0.000 description 8
- 238000012916 structural analysis Methods 0.000 description 8
- 229910052715 tantalum Inorganic materials 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 229910001868 water Inorganic materials 0.000 description 8
- 229910052804 chromium Inorganic materials 0.000 description 7
- 239000011651 chromium Substances 0.000 description 7
- 239000005262 ferroelectric liquid crystals (FLCs) Substances 0.000 description 7
- 229910052735 hafnium Inorganic materials 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 239000011787 zinc oxide Substances 0.000 description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 6
- 230000009471 action Effects 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 238000004040 coloring Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 229910000449 hafnium oxide Inorganic materials 0.000 description 6
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 6
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000011733 molybdenum Substances 0.000 description 6
- 238000009832 plasma treatment Methods 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 229910001195 gallium oxide Inorganic materials 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical group [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000004549 pulsed laser deposition Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 230000001186 cumulative effect Effects 0.000 description 4
- 238000003795 desorption Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- 229910003437 indium oxide Inorganic materials 0.000 description 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 229910052743 krypton Inorganic materials 0.000 description 4
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 4
- 229910052748 manganese Inorganic materials 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 229910052754 neon Inorganic materials 0.000 description 4
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 4
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- 229910001930 tungsten oxide Inorganic materials 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- 229910052724 xenon Inorganic materials 0.000 description 4
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 4
- UWCWUCKPEYNDNV-LBPRGKRZSA-N 2,6-dimethyl-n-[[(2s)-pyrrolidin-2-yl]methyl]aniline Chemical compound CC1=CC=CC(C)=C1NC[C@H]1NCCC1 UWCWUCKPEYNDNV-LBPRGKRZSA-N 0.000 description 3
- 239000004983 Polymer Dispersed Liquid Crystal Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 150000001340 alkali metals Chemical class 0.000 description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 3
- 150000001342 alkaline earth metals Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000003776 cleavage reaction Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000001747 exhibiting effect Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052756 noble gas Inorganic materials 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000007017 scission Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000005477 sputtering target Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 2
- VUFNLQXQSDUXKB-DOFZRALJSA-N 2-[4-[4-[bis(2-chloroethyl)amino]phenyl]butanoyloxy]ethyl (5z,8z,11z,14z)-icosa-5,8,11,14-tetraenoate Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(=O)OCCOC(=O)CCCC1=CC=C(N(CCCl)CCCl)C=C1 VUFNLQXQSDUXKB-DOFZRALJSA-N 0.000 description 2
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011449 brick Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 230000003098 cholesteric effect Effects 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- ZYLGGWPMIDHSEZ-UHFFFAOYSA-N dimethylazanide;hafnium(4+) Chemical compound [Hf+4].C[N-]C.C[N-]C.C[N-]C.C[N-]C ZYLGGWPMIDHSEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000002524 electron diffraction data Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 2
- 229960001730 nitrous oxide Drugs 0.000 description 2
- 235000013842 nitrous oxide Nutrition 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 230000001151 other effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000001350 scanning transmission electron microscopy Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 1
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 239000004986 Cholesteric liquid crystals (ChLC) Substances 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910004129 HfSiO Inorganic materials 0.000 description 1
- 239000005264 High molar mass liquid crystal Substances 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 239000004990 Smectic liquid crystal Substances 0.000 description 1
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910009369 Zn Mg Inorganic materials 0.000 description 1
- 229910007573 Zn-Mg Inorganic materials 0.000 description 1
- 239000002156 adsorbate Substances 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- 229910052800 carbon group element Inorganic materials 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 235000005607 chanvre indien Nutrition 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000001362 electron spin resonance spectrum Methods 0.000 description 1
- 238000010893 electron trap Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- NPEOKFBCHNGLJD-UHFFFAOYSA-N ethyl(methyl)azanide;hafnium(4+) Chemical compound [Hf+4].CC[N-]C.CC[N-]C.CC[N-]C.CC[N-]C NPEOKFBCHNGLJD-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000011487 hemp Substances 0.000 description 1
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000005499 laser crystallization Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- LXEXBJXDGVGRAR-UHFFFAOYSA-N trichloro(trichlorosilyl)silane Chemical compound Cl[Si](Cl)(Cl)[Si](Cl)(Cl)Cl LXEXBJXDGVGRAR-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 1
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1233—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with different thicknesses of the active layer in different devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1251—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs comprising TFTs having a different architecture, e.g. top- and bottom gate TFTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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Abstract
【解決手段】駆動回路部に設けられた第1のトランジスタと、画素部に設けられた第2のトランジスタとを有する半導体装置であって、第1のトランジスタと第2のトランジスタは構造が異なる。また、第1のトランジスタ及び第2のトランジスタは、トップゲート構造のトランジスタであって、ゲート電極とソース電極及びドレイン電極として機能する導電膜が重ならない。また、酸化物半導体膜において、ゲート電極と、ソース電極及びドレイン電極と重ならない領域に不純物元素を有する。
【選択図】図1
Description
本実施の形態では、半導体装置及び半導体装置の作製方法の一形態を、図1乃至図11を用いて説明する。
図1及び図6に、半導体装置に含まれるトランジスタの一例として、トップゲート構造のトランジスタを示す。ここでは、半導体装置の一例として表示装置を用いて説明する。また、表示装置の駆動回路及び画素部それぞれに設けられるトランジスタの構造を説明する。
次に、半導体装置の別の構成について、図3を用いて説明する。ここでは、画素部に設けられたトランジスタ150の変形例としてトランジスタ151を用いて説明するが、駆動回路部のトランジスタ154にトランジスタ151の絶縁膜104の構成、又は導電膜110、導電膜112及び導電膜114の構造を適宜適用することができる。
次に、半導体装置の別の構成について図4、図5及び図11を用いて説明する。ここでは、画素部に設けられたトランジスタ150の変形例としてトランジスタ152及びトランジスタ153を用いて説明するが、駆動回路部のトランジスタ154に、トランジスタ152に含まれる酸化物半導体膜106の構成、又はトランジスタ153に含まれる酸化物半導体膜106の構成を適宜適用することができる。
ここで、図4及び図5に示すトランジスタのバンド構造について説明する。なお、図11(A)は、図4に示すトランジスタ153のバンド構造であり、理解を容易にするため、絶縁膜104、酸化物半導体膜107a、酸化物半導体膜107b、酸化物半導体膜107c及び絶縁膜108の伝導帯下端のエネルギー(Ec)を示す。また、図11(B)は、図5に示すトランジスタ154のバンド構造であり、理解を容易にするため、絶縁膜104、酸化物半導体膜107b、酸化物半導体膜107c及び絶縁膜108の伝導帯下端のエネルギー(Ec)を示す。
次に、図1に示すトランジスタ150及びトランジスタ154の作製方法について、図7乃至図9を用いて説明する。
図3に示すトランジスタ151の作製方法を説明する。なお、ここでは、トランジスタ151の導電膜110、導電膜112及び導電膜114に含まれる導電膜110c、導電膜112c及び導電膜114cの形成工程と、酸化物半導体膜106に不純物元素117を添加する工程について説明する。
本実施の形態では、半導体装置及び半導体装置の作製方法の一形態を、図12乃至図22を用いて説明する。なお、本実施の形態は、実施の形態1と比較して、低抵抗領域の作製方法が異なる。
図12及び図17に、半導体装置に含まれるトランジスタの一例として、トップゲート構造のトランジスタを示す。
次に、半導体装置の別の構成について、図14を用いて説明する。ここでは、画素部に設けられたトランジスタ190の変形例としてトランジスタ191を用いて説明するが、駆動回路部のトランジスタ194に、トランジスタ191の絶縁膜164の構成、又は導電膜170、導電膜172及び導電膜174の構造を適宜適用することができる。
次に、半導体装置の別の構成について図15及び図16を用いて説明する。ここでは、画素部に設けられたトランジスタ190の変形例としてトランジスタ192及びトランジスタ193を用いて説明するが、駆動回路部のトランジスタ194に、トランジスタ192に含まれる酸化物半導体膜166の構成、又はトランジスタ193に含まれる酸化物半導体膜166の構成を適宜適用することができる。
次に、図12に示すトランジスタ190及びトランジスタ194の作製方法について、図18乃至図20を用いて説明する。
図14に示すトランジスタ191の作製方法を説明する。なお、ここでは、トランジスタ191の導電膜170、導電膜172及び導電膜174に含まれる導電膜170c、導電膜172c及び導電膜174cの形成工程と、酸化物半導体膜166に不純物元素177を添加する工程について説明する。
図12に示すトランジスタ190の別の作製方法を説明する。なお、ここでは、不純物元素の添加工程と、絶縁膜176の作製工程について図22を用いて説明する。
本実施の形態では、半導体装置及び半導体装置の作製方法の一形態を、図23乃至図35を用いて説明する。なお、本実施の形態は、実施の形態1と比較して、ゲート電極として機能する導電膜と、ソース電極として機能する導電膜及びドレイン電極として機能する導電膜との形成方法が異なる。また、トランジスタに含まれる低抵抗領域の作製方法として、実施の形態2に示す方法を用いる。
図23に、半導体装置に含まれるトランジスタの一例として、トップゲート構造のトランジスタを示す。
次に、半導体装置の別の構成について、図25を用いて説明する。ここでは、画素部に設けられたトランジスタ390の変形例としてトランジスタ391を用いて説明するが、駆動回路部のトランジスタ394にトランジスタ391の絶縁膜364の構成、又は導電膜368、導電膜370及び導電膜374の構造を適宜適用することができる。
次に、半導体装置の別の構成について図26及び図27を用いて説明する。ここでは、画素部に設けられたトランジスタ390の変形例としてトランジスタ392及びトランジスタ393を用いて説明するが、駆動回路部のトランジスタ394に、トランジスタ392に含まれる酸化物半導体膜366の構成、又はトランジスタ393に含まれる酸化物半導体膜366の構成を適宜適用することができる。
次に、半導体装置の別の構成について図36を用いて説明する。ここでは、実施の形態1に示す方法を用いて低抵抗領域が形成されたトランジスタについて説明する。
次に、半導体装置の別の構成について、図53を用いて説明する。
次に、図23に示すトランジスタ390及びトランジスタ394の作製方法について、図29乃至図31を用いて説明する。
図25に示すトランジスタ391の作製方法を説明する。なお、ここでは、トランジスタ391の導電膜368及び導電膜370に含まれる導電膜368c及び導電膜370cの形成工程と、酸化物半導体膜366に不純物元素377を添加する工程について説明する。
図23に示すトランジスタ390の別の作製方法を説明する。なお、ここでは、不純物元素の添加工程と、絶縁膜376の作製工程について図33を用いて説明する。
側壁絶縁膜を有するトランジスタの作製方法について、図34及び図35を用いて説明する。
本実施の形態では、半導体装置及び半導体装置の作製方法の一形態を、図50乃至図52を用いて説明する。なお、本実施の形態は、実施の形態1と比較して、駆動回路部のトランジスタに含まれる酸化物半導体膜の構成が異なる。また、トランジスタに含まれる低抵抗領域の作製方法として、実施の形態3に示す方法を用いる。
図50に、半導体装置に含まれるトランジスタの一例として、トップゲート構造のトランジスタを示す。
次に、図51(A)に示すトランジスタ390及びトランジスタ397aの作製方法について、図52を用いて説明する。
本実施の形態では、半導体装置の一形態を、図37乃至図39を用いて説明する。ここでは、半導体装置の一例として表示装置を用いて説明する。また、表示装置の画素部は複数の画素で構成される。ここでは、一画素に設けられるトランジスタと、該トランジスタに接続する容量素子の構造について説明する。
図37に、画素に含まれるトランジスタ150と、該トランジスタ150と接続する容量素子159の構造を示す。
図38に、画素に含まれるトランジスタ190と、該トランジスタ190と接続する容量素子199の構造を示す。
図39に、画素に含まれるトランジスタ390と、該トランジスタ390と接続する容量素子399の構造を示す。
本実施の形態では、本発明の一態様の半導体装置に含まれる酸化物半導体膜の構成について以下詳細に説明を行う。
以下では、酸化物半導体の構造について説明する。
まずは、CAAC−OSについて説明する。なお、CAAC−OSを、CANC(C−Axis Aligned nanocrystals)を有する酸化物半導体と呼ぶこともできる。
次に、微結晶酸化物半導体について説明する。
次に、非晶質酸化物半導体について説明する。
なお、酸化物半導体は、nc−OSと非晶質酸化物半導体との間の構造を有する場合がある。そのような構造を有する酸化物半導体を、特に非晶質ライク酸化物半導体(a−like OS:amorphous−like Oxide Semiconductor)と呼ぶ。
以下では、CAAC−OSおよびnc−OSの成膜モデルの一例について説明する。
本実施の形態においては、先の例示したトランジスタを用いて表示機能を有する表示装置の一例について、図40乃至図42を用いて以下説明を行う。
図41は、図40(A)に示す一点鎖線Q−Rにおける切断面に相当する断面図である。図42は、図40(B)に示す一点鎖線V−Wにおける切断面に相当する断面図である。
図41に示す表示装置700は、液晶素子775を有する。液晶素子775は、導電膜772、導電膜774、及び液晶層776を有する。導電膜774は、第2の基板705側に設けられ、対向電極としての機能を有する。図41に示す表示装置700は、導電膜772と導電膜774に印加される電圧によって、液晶層776の配向状態が変わることによって光の透過、非透過が制御され画像を表示することができる。
図42に示す表示装置800は、発光素子880を有する。発光素子880は、導電膜844、EL層846、及び導電膜848を有する。表示装置800は、発光素子880が有するEL層846が発光することによって、画像を表示することができる。
図43に示す表示装置700aは、液晶素子775を有する。液晶素子775は、導電膜773、導電膜777、及び液晶層776を有する。導電膜773は、第1の基板701上の平坦化絶縁膜770上に設けられ、反射電極としての機能を有する。図43に示す表示装置700aは、外光を利用し導電膜773で光を反射して着色膜836を介して表示する、所謂反射型のカラー液晶表示装置である。
本実施の形態では、本発明の一態様の半導体装置を用いることができる表示装置について、図44を用いて説明を行う。
本実施の形態では、本発明の一態様の半導体装置を用いることができる表示モジュール及び電子機器について、図45及び図46を用いて説明を行う。
Claims (19)
- 絶縁表面上に、第1のトランジスタ及び第2のトランジスタを有し、
前記第1のトランジスタは、第1のゲート電極と、第1の絶縁膜と、第1の酸化物半導体膜と、一対の第1の導電膜と、第2の絶縁膜と、第2のゲート電極を有し、
前記第1の絶縁膜は、前記第1のゲート電極と前記第1の酸化物半導体膜との間に設けられ、
前記第1のゲート電極は、前記第1のトランジスタのチャネル幅方向において、前記第1の絶縁膜及び前記第2の絶縁膜に設けられる開口部で、前記第2のゲート電極と接続され、
前記一対の第1の導電膜は、前記第1の酸化物半導体膜と接し、
前記第2の絶縁膜は、前記第1の酸化物半導体膜と前記第2のゲート電極との間に設けられ、
前記第1の酸化物半導体膜は、前記第2のゲート電極及び前記一対の第1の導電膜と重ならない領域において、不純物元素を有し、
前記第2のトランジスタは、第2の酸化物半導体膜と、一対の第2の導電膜と、前記第2の絶縁膜と、第3のゲート電極と、を有し、
前記一対の第2の導電膜は、前記第2の酸化物半導体膜と接し、
前記第2の絶縁膜は、前記第2の酸化物半導体膜と前記第3のゲート電極との間に設けられ、
前記第2の酸化物半導体膜は、前記第3のゲート電極及び前記一対の第2の導電膜と重ならない領域において、前記不純物元素を有することを特徴とする半導体装置。 - 請求項1において、
前記第1の酸化物半導体膜及び前記第2の酸化物半導体膜はそれぞれ、第1の膜及び第2の膜を含む多層構造であり、
前記第1の膜は、前記第2の膜と金属元素の原子数比が異なることを特徴とする半導体装置。 - 請求項1において、
前記第1の酸化物半導体膜及び前記第2の酸化物半導体膜はそれぞれ、第1の膜、第2の膜、及び第3の膜が順に積層された多層構造であり、
前記第2の膜は、前記第1の膜及び前記第3の膜と、金属元素の原子数比が異なることを特徴とする半導体装置。 - 請求項1において、
前記第1の酸化物半導体膜において、前記不純物元素を有する領域の不純物元素の濃度は、前記第2のゲート電極と重なる領域と比較して高く、1×1018atoms/cm3以上1×1022atoms/cm3以下であり、
前記第2の酸化物半導体膜において、前記不純物元素を有する領域の不純物元素の濃度は、前記第3のゲート電極と重なる領域と比較して高く、1×1018atoms/cm3以上1×1022atoms/cm3以下であることを特徴とする半導体装置。 - 請求項1において、
前記第1の酸化物半導体膜において、前記不純物元素を有する領域の水素濃度は、第2のゲート電極と重なる領域と比較して高く、8×1019atoms/cm3以上であり、
前記第2の酸化物半導体膜おいて、前記不純物元素を有する領域の水素濃度は、前記第3のゲート電極と重なる領域と比較して高く、8×1019atoms/cm3以上であることを特徴とする半導体装置。 - 請求項1において、
前記不純物元素は、水素、ホウ素、炭素、窒素、フッ素、アルミニウム、シリコン、リン、塩素、または希ガス元素であることを特徴とする半導体装置。 - 請求項1において、
前記第1の酸化物半導体膜及び前記第2の酸化物半導体膜において、前記不純物元素を有する領域は、水素を含む膜と接することを特徴とする半導体装置。 - 請求項1において、
前記一対の第1の導電膜及び前記一対の第2の導電膜の表面を含む一部は、金属珪素化物または金属珪素化窒化物を有することを特徴とする半導体装置。 - 請求項1において、
前記第1のトランジスタは駆動回路部に設けられ、前記第2のトランジスタは画素部に設けられることを特徴とする半導体装置。 - 絶縁表面上に、第1のトランジスタ及び第2のトランジスタを有し、
前記第1のトランジスタは、第1の酸化物半導体膜と、一対の第1の導電膜と、第1の絶縁膜と、第1のゲート電極を有し、
前記一対の第1の導電膜は、前記第1の酸化物半導体膜と接し、
前記第1の絶縁膜は、前記第1の酸化物半導体膜と前記第1のゲート電極との間に設けられ、
前記第1の酸化物半導体膜は、前記第1のゲート電極及び前記一対の第1の導電膜と重ならない領域において、不純物元素を有し、
前記第1の酸化物半導体膜は、少なくとも第1の膜及び第2の膜が前記絶縁表面側から順に積層され、
前記第2のトランジスタは、第2の酸化物半導体膜と、一対の第2の導電膜と、前記第1の絶縁膜と、第2のゲート電極と、を有し、
前記一対の第2の導電膜は、前記第2の酸化物半導体膜と接し、
前記第1の絶縁膜は、前記第2の酸化物半導体膜と前記第2のゲート電極との間に設けられ、
前記第2の酸化物半導体膜は、前記第2のゲート電極及び前記一対の第2の導電膜と重ならない領域において、前記不純物元素を有し、
前記第2の酸化物半導体膜は、前記第1の膜と金属元素の原子数比が異なることを特徴とする半導体装置。 - 請求項10において、
前記第2の酸化物半導体膜は、前記第2の膜と金属元素の原子数比が同じであることを特徴とする半導体装置。 - 請求項10において、
前記第2の膜の端部は、前記第1の膜の端部より外側に位置することを特徴とする半導体装置。 - 請求項10において、
前記第1のトランジスタは、前記絶縁表面及び前記第1の酸化物半導体膜の間に、第3のゲート電極及び第2の絶縁膜を有することを特徴とする半導体装置。 - 請求項10において、
前記第1の酸化物半導体膜において、前記不純物元素を有する領域の前記不純物元素の濃度は、第1のゲート電極と重なる領域と比較して高く、1×1018atoms/cm3以上1×1022atoms/cm3以下であり、
前記第2の酸化物半導体膜おいて、前記不純物元素を有する領域の前記不純物元素の濃度は、前記第2のゲート電極と重なる領域と比較して高く、1×1018atoms/cm3以上1×1022atoms/cm3以下であることを特徴とする半導体装置。 - 請求項10において、
前記第1の酸化物半導体膜において、前記不純物元素を有する領域の水素濃度は、第1のゲート電極と重なる領域と比較して高く、8×1019atoms/cm3以上であり、
前記第2の酸化物半導体膜おいて、前記不純物元素を有する領域の水素濃度は、前記第2のゲート電極と重なる領域と比較して高く、8×1019atoms/cm3以上であることを特徴とする半導体装置。 - 請求項10において、
前記不純物元素は、水素、ホウ素、炭素、窒素、フッ素、アルミニウム、シリコン、リン、塩素、または希ガス元素であることを特徴とする半導体装置。 - 請求項10において、
前記第1の酸化物半導体膜及び前記第2の酸化物半導体膜において、前記不純物元素を有する領域は、水素を含む膜と接することを特徴とする半導体装置。 - 請求項10において、
前記一対の第1の導電膜及び前記一対の第2の導電膜の表面を含む一部が金属珪素化物または金属珪素化窒化物を有する半導体装置。 - 請求項10において、
前記第1のトランジスタは駆動回路部に設けられ、前記第2のトランジスタは画素部に設けられることを特徴とする半導体装置。
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---|---|---|---|---|
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Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
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US11799032B2 (en) * | 2018-03-16 | 2023-10-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
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TWI753712B (zh) | 2020-12-21 | 2022-01-21 | 財團法人工業技術研究院 | 微機電紅外光感測裝置 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009278115A (ja) * | 2008-05-15 | 2009-11-26 | Samsung Electronics Co Ltd | トランジスタとこれを含む半導体素子及びそれらの製造方法 |
JP2011233889A (ja) * | 2010-04-28 | 2011-11-17 | Electronics And Telecommunications Research Institute | 半導体装置及びその製造方法 |
JP2012169605A (ja) * | 2011-01-26 | 2012-09-06 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2013048217A (ja) * | 2011-07-22 | 2013-03-07 | Semiconductor Energy Lab Co Ltd | 酸化物半導体膜の処理方法および半導体装置の作製方法 |
JP2013247142A (ja) * | 2012-05-23 | 2013-12-09 | Semiconductor Energy Lab Co Ltd | 半導体膜の形成方法、半導体装置の作製方法、及び半導体装置 |
Family Cites Families (219)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH027563A (ja) | 1988-06-27 | 1990-01-11 | Hitachi Ltd | 半導体装置の製造方法 |
JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
JPH08330599A (ja) | 1994-11-29 | 1996-12-13 | Sanyo Electric Co Ltd | 薄膜トランジスタ、その製造方法及び表示装置 |
JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
KR100394896B1 (ko) | 1995-08-03 | 2003-11-28 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 투명스위칭소자를포함하는반도체장치 |
JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
DE69942442D1 (de) | 1999-01-11 | 2010-07-15 | Semiconductor Energy Lab | Halbleiteranordnung mit Treiber-TFT und Pixel-TFT auf einem Substrat |
JP4558707B2 (ja) | 1999-01-11 | 2010-10-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
JP4127466B2 (ja) | 2000-07-31 | 2008-07-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US6613620B2 (en) | 2000-07-31 | 2003-09-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
US6952023B2 (en) | 2001-07-17 | 2005-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
JP3600229B2 (ja) * | 2001-10-31 | 2004-12-15 | 株式会社半導体エネルギー研究所 | 電界効果型トランジスタの製造方法 |
US6737302B2 (en) | 2001-10-31 | 2004-05-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method for field-effect transistor |
JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
EP1443130B1 (en) | 2001-11-05 | 2011-09-28 | Japan Science and Technology Agency | Natural superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
CN1445821A (zh) | 2002-03-15 | 2003-10-01 | 三洋电机株式会社 | ZnO膜和ZnO半导体层的形成方法、半导体元件及其制造方法 |
JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
JP3873814B2 (ja) | 2002-05-21 | 2007-01-31 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
CN1229682C (zh) | 2002-05-21 | 2005-11-30 | 精工爱普生株式会社 | 电光装置和电子设备 |
JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
EP2413366B1 (en) | 2004-03-12 | 2017-01-11 | Japan Science And Technology Agency | A switching element of LCDs or organic EL displays |
US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
CN101057339B (zh) | 2004-11-10 | 2012-12-26 | 佳能株式会社 | 无定形氧化物和场效应晶体管 |
KR100953596B1 (ko) | 2004-11-10 | 2010-04-21 | 캐논 가부시끼가이샤 | 발광장치 |
US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
JP5138163B2 (ja) | 2004-11-10 | 2013-02-06 | キヤノン株式会社 | 電界効果型トランジスタ |
CN101057338B (zh) | 2004-11-10 | 2011-03-16 | 佳能株式会社 | 采用无定形氧化物的场效应晶体管 |
US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
TWI569441B (zh) | 2005-01-28 | 2017-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
TWI472037B (zh) | 2005-01-28 | 2015-02-01 | Semiconductor Energy Lab | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
WO2006105077A2 (en) | 2005-03-28 | 2006-10-05 | Massachusetts Institute Of Technology | Low voltage thin film transistor with high-k dielectric material |
US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
EP3614442A3 (en) | 2005-09-29 | 2020-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having oxide semiconductor layer and manufactoring method thereof |
JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
KR20090115222A (ko) | 2005-11-15 | 2009-11-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 제조방법 |
TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
US7576394B2 (en) | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
JP5015470B2 (ja) * | 2006-02-15 | 2012-08-29 | 財団法人高知県産業振興センター | 薄膜トランジスタ及びその製法 |
KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
US7557498B2 (en) | 2006-05-17 | 2009-07-07 | Tpo Displays Corp. | System for displaying images including electroluminescent device and method for fabricating the same |
JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
JP5090708B2 (ja) | 2006-10-20 | 2012-12-05 | 株式会社ジャパンディスプレイイースト | 画像表示装置とその製造方法 |
JP2008129314A (ja) | 2006-11-21 | 2008-06-05 | Hitachi Displays Ltd | 画像表示装置およびその製造方法 |
US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
JP2008140684A (ja) | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
JP5197058B2 (ja) | 2007-04-09 | 2013-05-15 | キヤノン株式会社 | 発光装置とその作製方法 |
WO2008126879A1 (en) | 2007-04-09 | 2008-10-23 | Canon Kabushiki Kaisha | Light-emitting apparatus and production method thereof |
US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
CN101663762B (zh) | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
TWI354377B (en) * | 2007-05-30 | 2011-12-11 | Au Optronics Corp | Pixel structure of lcd and fabrication method ther |
KR101375831B1 (ko) | 2007-12-03 | 2014-04-02 | 삼성전자주식회사 | 산화물 반도체 박막 트랜지스터를 이용한 디스플레이 장치 |
WO2009075281A1 (ja) | 2007-12-13 | 2009-06-18 | Idemitsu Kosan Co., Ltd. | 酸化物半導体を用いた電界効果型トランジスタ及びその製造方法 |
JP5215158B2 (ja) | 2007-12-17 | 2013-06-19 | 富士フイルム株式会社 | 無機結晶性配向膜及びその製造方法、半導体デバイス |
JP5704790B2 (ja) | 2008-05-07 | 2015-04-22 | キヤノン株式会社 | 薄膜トランジスタ、および、表示装置 |
TWI642113B (zh) | 2008-08-08 | 2018-11-21 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
KR101999970B1 (ko) | 2008-09-19 | 2019-07-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
WO2010038820A1 (en) * | 2008-10-03 | 2010-04-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
US8106400B2 (en) | 2008-10-24 | 2012-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
KR102378956B1 (ko) | 2008-10-24 | 2022-03-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
KR102359831B1 (ko) | 2008-11-21 | 2022-02-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
JP5491833B2 (ja) | 2008-12-05 | 2014-05-14 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US20100224880A1 (en) | 2009-03-05 | 2010-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
TWI617029B (zh) | 2009-03-27 | 2018-03-01 | 半導體能源研究所股份有限公司 | 半導體裝置 |
TWI476917B (zh) | 2009-04-16 | 2015-03-11 | Semiconductor Energy Lab | 半導體裝置和其製造方法 |
WO2011010541A1 (en) | 2009-07-18 | 2011-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
KR102215941B1 (ko) | 2009-07-31 | 2021-02-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
KR101073542B1 (ko) | 2009-09-03 | 2011-10-17 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
WO2011027702A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
KR101851926B1 (ko) | 2009-09-04 | 2018-04-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 제작하기 위한 방법 |
WO2011027656A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and display device |
KR101746198B1 (ko) | 2009-09-04 | 2017-06-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 전자기기 |
WO2011027664A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
KR20110037220A (ko) | 2009-10-06 | 2011-04-13 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를 구비하는 유기전계발광 표시 장치 |
EP2486595B1 (en) | 2009-10-09 | 2019-10-23 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
JP2011091110A (ja) | 2009-10-20 | 2011-05-06 | Canon Inc | 酸化物半導体素子を用いた回路及びその製造方法、並びに表示装置 |
CN102598280B (zh) | 2009-10-21 | 2016-05-18 | 株式会社半导体能源研究所 | 液晶显示器件及包括该液晶显示器件的电子设备 |
KR102019239B1 (ko) | 2009-10-30 | 2019-09-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
WO2011068032A1 (en) * | 2009-12-04 | 2011-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
WO2011070901A1 (en) * | 2009-12-11 | 2011-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
WO2011096153A1 (en) | 2010-02-05 | 2011-08-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP5133468B2 (ja) | 2010-05-24 | 2013-01-30 | シャープ株式会社 | 薄膜トランジスタ基板及びその製造方法 |
JP2012015491A (ja) * | 2010-06-04 | 2012-01-19 | Semiconductor Energy Lab Co Ltd | 光電変換装置 |
JP5269253B2 (ja) | 2010-07-09 | 2013-08-21 | シャープ株式会社 | 薄膜トランジスタ基板の製造方法 |
US8537600B2 (en) | 2010-08-04 | 2013-09-17 | Semiconductor Energy Laboratory Co., Ltd. | Low off-state leakage current semiconductor memory device |
JP5275523B2 (ja) | 2010-11-04 | 2013-08-28 | シャープ株式会社 | 表示装置、ならびに半導体装置および表示装置の製造方法 |
JP2012104566A (ja) | 2010-11-08 | 2012-05-31 | Toshiba Mobile Display Co Ltd | 薄膜トランジスタ回路基板及びその製造方法 |
US9443984B2 (en) | 2010-12-28 | 2016-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
TWI570809B (zh) | 2011-01-12 | 2017-02-11 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
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JP2012160679A (ja) | 2011-02-03 | 2012-08-23 | Sony Corp | 薄膜トランジスタ、表示装置および電子機器 |
US9023684B2 (en) | 2011-03-04 | 2015-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP2012191025A (ja) * | 2011-03-11 | 2012-10-04 | Dainippon Printing Co Ltd | 薄膜トランジスタアレー基板、薄膜集積回路装置及びそれらの製造方法 |
JP5717546B2 (ja) | 2011-06-01 | 2015-05-13 | 三菱電機株式会社 | 薄膜トランジスタ基板およびその製造方法 |
JP6005401B2 (ja) | 2011-06-10 | 2016-10-12 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US9112036B2 (en) | 2011-06-10 | 2015-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
KR101860859B1 (ko) | 2011-06-13 | 2018-05-25 | 삼성디스플레이 주식회사 | 박막트랜지스터의 제조 방법, 상기 방법에 의해 제조된 박막트랜지스터, 유기발광표시장치의 제조방법, 및 상기 방법에 의해 제조된 유기발광표시장치 |
JP2013002295A (ja) | 2011-06-13 | 2013-01-07 | Daikin Industries Ltd | スクリュー圧縮機 |
KR20130007426A (ko) | 2011-06-17 | 2013-01-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
US9214474B2 (en) | 2011-07-08 | 2015-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
US8643008B2 (en) | 2011-07-22 | 2014-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8994019B2 (en) | 2011-08-05 | 2015-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
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KR20130040706A (ko) | 2011-10-14 | 2013-04-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
TWI567985B (zh) * | 2011-10-21 | 2017-01-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
JP6226518B2 (ja) | 2011-10-24 | 2017-11-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR20130055521A (ko) | 2011-11-18 | 2013-05-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 소자, 및 반도체 소자의 제작 방법, 및 반도체 소자를 포함하는 반도체 장치 |
US8981367B2 (en) | 2011-12-01 | 2015-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR102084274B1 (ko) | 2011-12-15 | 2020-03-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
JP6111398B2 (ja) | 2011-12-20 | 2017-04-12 | 株式会社Joled | 表示装置および電子機器 |
KR102100425B1 (ko) | 2011-12-27 | 2020-04-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
KR102101167B1 (ko) | 2012-02-03 | 2020-04-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
US8916424B2 (en) | 2012-02-07 | 2014-12-23 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
JP6148024B2 (ja) | 2012-02-09 | 2017-06-14 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US20130221345A1 (en) | 2012-02-28 | 2013-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
TW201338173A (zh) | 2012-02-28 | 2013-09-16 | Sony Corp | 電晶體、製造電晶體之方法、顯示裝置及電子機器 |
JP6142136B2 (ja) | 2012-02-28 | 2017-06-07 | 株式会社Joled | トランジスタの製造方法、表示装置の製造方法および電子機器の製造方法 |
US9553200B2 (en) | 2012-02-29 | 2017-01-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
JP6168795B2 (ja) | 2012-03-14 | 2017-07-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP6139187B2 (ja) * | 2012-03-29 | 2017-05-31 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US8941113B2 (en) * | 2012-03-30 | 2015-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element, semiconductor device, and manufacturing method of semiconductor element |
US8999773B2 (en) | 2012-04-05 | 2015-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Processing method of stacked-layer film and manufacturing method of semiconductor device |
JP6139952B2 (ja) | 2012-04-13 | 2017-05-31 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP6035195B2 (ja) | 2012-05-01 | 2016-11-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2013235935A (ja) | 2012-05-08 | 2013-11-21 | Canon Inc | 検出装置の製造方法、その検出装置及び検出システム |
JP5942574B2 (ja) | 2012-05-10 | 2016-06-29 | セイコーエプソン株式会社 | 力検出素子、力検出モジュール、力検出ユニットおよびロボット |
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US20140014948A1 (en) | 2012-07-12 | 2014-01-16 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
DE112013007566B3 (de) | 2012-08-03 | 2018-02-22 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
US8937307B2 (en) | 2012-08-10 | 2015-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
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DE102013216824A1 (de) | 2012-08-28 | 2014-03-06 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
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US9018624B2 (en) | 2012-09-13 | 2015-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic appliance |
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US8927985B2 (en) | 2012-09-20 | 2015-01-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
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US9915848B2 (en) | 2013-04-19 | 2018-03-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
JP6456598B2 (ja) | 2013-04-19 | 2019-01-23 | 株式会社半導体エネルギー研究所 | 表示装置 |
US9231002B2 (en) | 2013-05-03 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
US9704894B2 (en) | 2013-05-10 | 2017-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device including pixel electrode including oxide |
JP2015179247A (ja) | 2013-10-22 | 2015-10-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
US9583516B2 (en) | 2013-10-25 | 2017-02-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP2016001712A (ja) | 2013-11-29 | 2016-01-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US9577110B2 (en) | 2013-12-27 | 2017-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including an oxide semiconductor and the display device including the semiconductor device |
CN105849796B (zh) | 2013-12-27 | 2020-02-07 | 株式会社半导体能源研究所 | 发光装置 |
JP2015188062A (ja) | 2014-02-07 | 2015-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI658597B (zh) | 2014-02-07 | 2019-05-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
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- 2024-02-05 JP JP2024015437A patent/JP2024045414A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009278115A (ja) * | 2008-05-15 | 2009-11-26 | Samsung Electronics Co Ltd | トランジスタとこれを含む半導体素子及びそれらの製造方法 |
JP2011233889A (ja) * | 2010-04-28 | 2011-11-17 | Electronics And Telecommunications Research Institute | 半導体装置及びその製造方法 |
JP2012169605A (ja) * | 2011-01-26 | 2012-09-06 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2013048217A (ja) * | 2011-07-22 | 2013-03-07 | Semiconductor Energy Lab Co Ltd | 酸化物半導体膜の処理方法および半導体装置の作製方法 |
JP2013247142A (ja) * | 2012-05-23 | 2013-12-09 | Semiconductor Energy Lab Co Ltd | 半導体膜の形成方法、半導体装置の作製方法、及び半導体装置 |
Cited By (23)
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JP2018022713A (ja) * | 2015-06-19 | 2018-02-08 | 株式会社半導体エネルギー研究所 | 半導体装置、その作製方法、電子機器 |
JP2017085079A (ja) * | 2015-10-27 | 2017-05-18 | Nltテクノロジー株式会社 | 薄膜トランジスタ、表示装置及び薄膜トランジスタの製造方法 |
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US11757007B2 (en) | 2015-12-29 | 2023-09-12 | Semiconductor Energy Laboratory Co., Ltd. | Metal oxide film and semiconductor device |
JP2022016470A (ja) * | 2015-12-29 | 2022-01-21 | 株式会社半導体エネルギー研究所 | トランジスタ |
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US11107930B2 (en) | 2016-01-29 | 2021-08-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
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US11830950B2 (en) | 2016-01-29 | 2023-11-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
JP7293426B2 (ja) | 2016-07-25 | 2023-06-19 | 株式会社半導体エネルギー研究所 | トランジスタ |
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