IN2012DN05920A - - Google Patents
Download PDFInfo
- Publication number
- IN2012DN05920A IN2012DN05920A IN5920DEN2012A IN2012DN05920A IN 2012DN05920 A IN2012DN05920 A IN 2012DN05920A IN 5920DEN2012 A IN5920DEN2012 A IN 5920DEN2012A IN 2012DN05920 A IN2012DN05920 A IN 2012DN05920A
- Authority
- IN
- India
- Prior art keywords
- basic blocks
- power supply
- supply voltage
- basic
- connections
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 abstract 3
- 230000005669 field effect Effects 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0008—Arrangements for reducing power consumption
- H03K19/0013—Arrangements for reducing power consumption in field effect transistor circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/16—Modifications for eliminating interference voltages or currents
- H03K17/161—Modifications for eliminating interference voltages or currents in field-effect transistor switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17724—Structural details of logic blocks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17736—Structural details of routing resources
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17748—Structural details of configuration resources
- H03K19/1776—Structural details of configuration resources for memories
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/17748—Structural details of configuration resources
- H03K19/17772—Structural details of configuration resources for powering on or off
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
- H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
- H03K19/1778—Structural details for adapting physical parameters
- H03K19/17784—Structural details for adapting physical parameters for supply voltage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Networks & Wireless Communication (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Thin Film Transistor (AREA)
- Logic Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Control Of El Displays (AREA)
- Electrodes Of Semiconductors (AREA)
- Dram (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010009569 | 2010-01-20 | ||
PCT/JP2010/072839 WO2011089808A1 (en) | 2010-01-20 | 2010-12-14 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2012DN05920A true IN2012DN05920A (ja) | 2015-09-18 |
Family
ID=44277178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN5920DEN2012 IN2012DN05920A (ja) | 2010-01-20 | 2010-12-14 |
Country Status (10)
Country | Link |
---|---|
US (4) | US8547753B2 (ja) |
EP (1) | EP2526622B1 (ja) |
JP (7) | JP5660902B2 (ja) |
KR (5) | KR101745749B1 (ja) |
CN (1) | CN102714496B (ja) |
IN (1) | IN2012DN05920A (ja) |
MY (2) | MY187143A (ja) |
SG (2) | SG10201500353WA (ja) |
TW (5) | TWI512899B (ja) |
WO (1) | WO2011089808A1 (ja) |
Families Citing this family (118)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102046308B1 (ko) | 2009-12-11 | 2019-11-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
KR101745749B1 (ko) * | 2010-01-20 | 2017-06-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
KR102008754B1 (ko) | 2010-01-24 | 2019-08-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치와 이의 제조 방법 |
WO2011096264A1 (en) * | 2010-02-05 | 2011-08-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of driving semiconductor device |
KR101862823B1 (ko) | 2010-02-05 | 2018-05-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 구동 방법 |
CN102725842B (zh) | 2010-02-05 | 2014-12-03 | 株式会社半导体能源研究所 | 半导体器件 |
KR102094131B1 (ko) | 2010-02-05 | 2020-03-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치를 구동하는 방법 |
US8416622B2 (en) | 2010-05-20 | 2013-04-09 | Semiconductor Energy Laboratory Co., Ltd. | Driving method of a semiconductor device with an inverted period having a negative potential applied to a gate of an oxide semiconductor transistor |
US9473714B2 (en) | 2010-07-01 | 2016-10-18 | Semiconductor Energy Laboratory Co., Ltd. | Solid-state imaging device and semiconductor display device |
US8582348B2 (en) | 2010-08-06 | 2013-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for driving semiconductor device |
US8422272B2 (en) | 2010-08-06 | 2013-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
JP5727892B2 (ja) | 2010-08-26 | 2015-06-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI543158B (zh) | 2010-10-25 | 2016-07-21 | 半導體能源研究所股份有限公司 | 半導體儲存裝置及其驅動方法 |
US9048142B2 (en) | 2010-12-28 | 2015-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR101899880B1 (ko) | 2011-02-17 | 2018-09-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 프로그래머블 lsi |
US8659015B2 (en) * | 2011-03-04 | 2014-02-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP5827145B2 (ja) | 2011-03-08 | 2015-12-02 | 株式会社半導体エネルギー研究所 | 信号処理回路 |
JP5883699B2 (ja) | 2011-04-13 | 2016-03-15 | 株式会社半導体エネルギー研究所 | プログラマブルlsi |
KR101889383B1 (ko) | 2011-05-16 | 2018-08-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 프로그래머블 로직 디바이스 |
US9673823B2 (en) | 2011-05-18 | 2017-06-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of driving semiconductor device |
US8779799B2 (en) | 2011-05-19 | 2014-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit |
US8581625B2 (en) | 2011-05-19 | 2013-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Programmable logic device |
JP5892852B2 (ja) | 2011-05-20 | 2016-03-23 | 株式会社半導体エネルギー研究所 | プログラマブルロジックデバイス |
JP6013682B2 (ja) | 2011-05-20 | 2016-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置の駆動方法 |
JP5912844B2 (ja) | 2011-05-31 | 2016-04-27 | 株式会社半導体エネルギー研究所 | プログラマブルロジックデバイス |
US8669781B2 (en) | 2011-05-31 | 2014-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR101962261B1 (ko) | 2011-07-15 | 2019-03-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 구동 방법 |
US8802493B2 (en) * | 2011-09-13 | 2014-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of oxide semiconductor device |
US9117916B2 (en) | 2011-10-13 | 2015-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising oxide semiconductor film |
KR20130043063A (ko) * | 2011-10-19 | 2013-04-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
KR101976212B1 (ko) * | 2011-10-24 | 2019-05-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
CN102646676B (zh) * | 2011-11-03 | 2015-06-10 | 京东方科技集团股份有限公司 | 一种tft阵列基板 |
TWI621183B (zh) | 2011-12-01 | 2018-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
US9257422B2 (en) | 2011-12-06 | 2016-02-09 | Semiconductor Energy Laboratory Co., Ltd. | Signal processing circuit and method for driving signal processing circuit |
WO2013111757A1 (en) | 2012-01-23 | 2013-08-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP6125850B2 (ja) | 2012-02-09 | 2017-05-10 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の作製方法 |
US9312257B2 (en) | 2012-02-29 | 2016-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8975917B2 (en) * | 2012-03-01 | 2015-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Programmable logic device |
JP6100559B2 (ja) | 2012-03-05 | 2017-03-22 | 株式会社半導体エネルギー研究所 | 半導体記憶装置 |
KR20210078571A (ko) * | 2012-03-13 | 2021-06-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 그 구동 방법 |
US9230683B2 (en) * | 2012-04-25 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
US9654107B2 (en) * | 2012-04-27 | 2017-05-16 | Semiconductor Energy Laboratory Co., Ltd. | Programmable LSI |
JP6228381B2 (ja) * | 2012-04-30 | 2017-11-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US8975918B2 (en) | 2012-05-01 | 2015-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Lookup table and programmable logic device including lookup table |
US9007090B2 (en) | 2012-05-01 | 2015-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Method of driving semiconductor device |
KR101978932B1 (ko) * | 2012-05-02 | 2019-05-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 프로그램 가능한 로직 디바이스 |
US20130300456A1 (en) * | 2012-05-10 | 2013-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor chip and semiconductor device |
JP6077382B2 (ja) * | 2012-05-11 | 2017-02-08 | 株式会社半導体エネルギー研究所 | 半導体装置および半導体装置の作製方法 |
KR102059218B1 (ko) * | 2012-05-25 | 2019-12-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 프로그래머블 로직 디바이스 및 반도체 장치 |
JP6250955B2 (ja) | 2012-05-25 | 2017-12-20 | 株式会社半導体エネルギー研究所 | 半導体装置の駆動方法 |
US9571103B2 (en) * | 2012-05-25 | 2017-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Lookup table and programmable logic device including lookup table |
JP6377317B2 (ja) | 2012-05-30 | 2018-08-22 | 株式会社半導体エネルギー研究所 | プログラマブルロジックデバイス |
KR102107591B1 (ko) * | 2012-07-18 | 2020-05-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 기억 소자 및 프로그래머블 로직 디바이스 |
TWI591966B (zh) | 2012-10-17 | 2017-07-11 | 半導體能源研究所股份有限公司 | 可編程邏輯裝置及可編程邏輯裝置的驅動方法 |
DE112013005029T5 (de) * | 2012-10-17 | 2015-07-30 | Semiconductor Energy Laboratory Co., Ltd. | Mikrocontroller und Herstellungsverfahren dafür |
WO2014061567A1 (en) * | 2012-10-17 | 2014-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Programmable logic device |
KR102227591B1 (ko) | 2012-10-17 | 2021-03-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
TWI600157B (zh) | 2012-11-16 | 2017-09-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
KR102112364B1 (ko) | 2012-12-06 | 2020-05-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
TWI611419B (zh) * | 2012-12-24 | 2018-01-11 | 半導體能源研究所股份有限公司 | 可程式邏輯裝置及半導體裝置 |
WO2014125979A1 (en) * | 2013-02-13 | 2014-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Programmable logic device and semiconductor device |
JP2014195243A (ja) | 2013-02-28 | 2014-10-09 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP6068748B2 (ja) * | 2013-03-13 | 2017-01-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9612795B2 (en) | 2013-03-14 | 2017-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Data processing device, data processing method, and computer program |
US9112460B2 (en) | 2013-04-05 | 2015-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Signal processing device |
TWI621337B (zh) * | 2013-05-14 | 2018-04-11 | 半導體能源研究所股份有限公司 | 信號處理裝置 |
US9704886B2 (en) | 2013-05-16 | 2017-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Signal processing device |
US9209795B2 (en) | 2013-05-17 | 2015-12-08 | Semiconductor Energy Laboratory Co., Ltd. | Signal processing device and measuring method |
US9106223B2 (en) | 2013-05-20 | 2015-08-11 | Semiconductor Energy Laboratory Co., Ltd. | Signal processing device |
US9893088B2 (en) * | 2013-05-29 | 2018-02-13 | Joled Inc. | Thin film transistor device, method for manufacturing same and display device |
TWI633650B (zh) * | 2013-06-21 | 2018-08-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
JP6352070B2 (ja) | 2013-07-05 | 2018-07-04 | 株式会社半導体エネルギー研究所 | 半導体装置 |
WO2015060318A1 (en) | 2013-10-22 | 2015-04-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of the same |
JP6483402B2 (ja) | 2013-11-01 | 2019-03-13 | 株式会社半導体エネルギー研究所 | 記憶装置、及び記憶装置を有する電子機器 |
JP6478562B2 (ja) | 2013-11-07 | 2019-03-06 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9385054B2 (en) | 2013-11-08 | 2016-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Data processing device and manufacturing method thereof |
JP6393590B2 (ja) * | 2013-11-22 | 2018-09-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI637484B (zh) | 2013-12-26 | 2018-10-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
US9349418B2 (en) | 2013-12-27 | 2016-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for driving the same |
US9300292B2 (en) | 2014-01-10 | 2016-03-29 | Semiconductor Energy Laboratory Co., Ltd. | Circuit including transistor |
US9379713B2 (en) | 2014-01-17 | 2016-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Data processing device and driving method thereof |
US9721968B2 (en) | 2014-02-06 | 2017-08-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, electronic component, and electronic appliance |
US9869716B2 (en) | 2014-02-07 | 2018-01-16 | Semiconductor Energy Laboratory Co., Ltd. | Device comprising programmable logic element |
JP6541360B2 (ja) | 2014-02-07 | 2019-07-10 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2015165226A (ja) | 2014-02-07 | 2015-09-17 | 株式会社半導体エネルギー研究所 | 装置 |
DE112015000705T5 (de) | 2014-02-07 | 2016-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Vorrichtung |
US9294096B2 (en) | 2014-02-28 | 2016-03-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US9419622B2 (en) | 2014-03-07 | 2016-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP6677449B2 (ja) | 2014-03-13 | 2020-04-08 | 株式会社半導体エネルギー研究所 | 半導体装置の駆動方法 |
JP6541376B2 (ja) | 2014-03-13 | 2019-07-10 | 株式会社半導体エネルギー研究所 | プログラマブルロジックデバイスの動作方法 |
TWI643457B (zh) * | 2014-04-25 | 2018-12-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
JP6580863B2 (ja) * | 2014-05-22 | 2019-09-25 | 株式会社半導体エネルギー研究所 | 半導体装置、健康管理システム |
US9401364B2 (en) * | 2014-09-19 | 2016-07-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, electronic component, and electronic device |
JP6689062B2 (ja) | 2014-12-10 | 2020-04-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI688211B (zh) * | 2015-01-29 | 2020-03-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置、電子組件及電子裝置 |
US9954531B2 (en) | 2015-03-03 | 2018-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
WO2016166631A1 (en) | 2015-04-13 | 2016-10-20 | Semiconductor Energy Laboratory Co., Ltd. | Decoder, receiver, and electronic device |
US9768174B2 (en) | 2015-07-21 | 2017-09-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
SG10201608814YA (en) * | 2015-10-29 | 2017-05-30 | Semiconductor Energy Lab Co Ltd | Semiconductor device and method for manufacturing the semiconductor device |
US10038402B2 (en) | 2015-10-30 | 2018-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
KR102643895B1 (ko) | 2015-10-30 | 2024-03-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 전자 부품, 및 전자 기기 |
CN108352837A (zh) | 2015-11-13 | 2018-07-31 | 株式会社半导体能源研究所 | 半导体装置、电子构件及电子设备 |
KR20170061602A (ko) | 2015-11-26 | 2017-06-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 전자 기기 |
JP6917168B2 (ja) | 2016-04-01 | 2021-08-11 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9934826B2 (en) | 2016-04-14 | 2018-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US10008502B2 (en) | 2016-05-04 | 2018-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Memory device |
US10504204B2 (en) | 2016-07-13 | 2019-12-10 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
WO2018033834A1 (en) | 2016-08-19 | 2018-02-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for controlling power supply in semiconductor device |
WO2018069787A1 (en) | 2016-10-14 | 2018-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, broadcasting system, and electronic device |
JP6298144B2 (ja) * | 2016-12-23 | 2018-03-20 | 株式会社半導体エネルギー研究所 | 半導体装置 |
CN113660439A (zh) * | 2016-12-27 | 2021-11-16 | 株式会社半导体能源研究所 | 摄像装置及电子设备 |
JP7073090B2 (ja) | 2016-12-28 | 2022-05-23 | 株式会社半導体エネルギー研究所 | ニューラルネットワークを利用したデータ処理装置、電子部品、および電子機器 |
US11264506B2 (en) | 2018-10-31 | 2022-03-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
US11107805B2 (en) * | 2019-04-15 | 2021-08-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit |
CN118763123A (zh) * | 2019-09-24 | 2024-10-11 | 乐金显示有限公司 | 薄膜晶体管及其基板及包括该薄膜晶体管的显示设备 |
KR20210035694A (ko) * | 2019-09-24 | 2021-04-01 | 엘지디스플레이 주식회사 | 박막 트랜지스터, 박막 트랜지스터의 제조방법 및 이를 포함하는 표시장치 |
CN110675790B (zh) * | 2019-11-13 | 2023-04-18 | 京东方科技集团股份有限公司 | 切割点腐蚀防护电路、栅极驱动电路及显示装置 |
TWI774083B (zh) * | 2020-10-13 | 2022-08-11 | 瑞昱半導體股份有限公司 | 開關電路 |
Family Cites Families (178)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2466700B1 (fr) | 1979-10-05 | 1985-10-04 | Crouzet Sa | Bloc de commande pneumatique pour securite bi-manuelle |
JPS5855215A (ja) | 1981-09-30 | 1983-04-01 | Hitachi Ltd | 金属インサ−トを含む耐熱性樹脂成形品 |
JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
JPS60198851A (ja) | 1984-03-23 | 1985-10-08 | Hitachi Ltd | 半導体用高耐食高硬度ボール付アルミニウム合金ワイヤ |
JPS60174333U (ja) * | 1984-04-27 | 1985-11-19 | 横河電機株式会社 | アナログスイツチ |
US4896296A (en) * | 1985-03-04 | 1990-01-23 | Lattice Semiconductor Corporation | Programmable logic device configurable input/output cell |
JPH0731908B2 (ja) * | 1985-10-09 | 1995-04-10 | 株式会社東芝 | 半導体記憶装置 |
JPS63151115A (ja) | 1986-12-15 | 1988-06-23 | Canon Inc | 論理回路装置 |
JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
US4885719A (en) * | 1987-08-19 | 1989-12-05 | Ict International Cmos Technology, Inc. | Improved logic cell array using CMOS E2 PROM cells |
JPH01130390A (ja) | 1987-11-17 | 1989-05-23 | Hitachi Ltd | 配線スイッチ回路 |
JPH02291720A (ja) | 1989-05-01 | 1990-12-03 | Kawasaki Steel Corp | プログラム可能な論理デバイス |
JPH0654873B2 (ja) | 1989-09-04 | 1994-07-20 | 株式会社東芝 | プログラマブル型論理装置 |
JPH04278720A (ja) | 1991-03-07 | 1992-10-05 | Kawasaki Steel Corp | プログラマブルロジックデバイス |
JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
US5482967A (en) | 1992-09-04 | 1996-01-09 | Takeda Chemical Industries, Ltd. | Condensed heterocyclic compounds, their production and use |
EP0689712A4 (en) * | 1993-03-17 | 1997-05-28 | Zycad Corp | CONFIGURABLE FIELDS WITH DIRECT ACCESS MEMORY ARRANGEMENT |
JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
WO1997006554A2 (en) | 1995-08-03 | 1997-02-20 | Philips Electronics N.V. | Semiconductor device provided with transparent switching element |
JPH0974351A (ja) | 1995-09-05 | 1997-03-18 | Nippon Telegr & Teleph Corp <Ntt> | プログラマブル回路装置 |
JP2871551B2 (ja) * | 1995-09-07 | 1999-03-17 | 日本電気株式会社 | 信号レベル変換回路 |
US5789942A (en) | 1995-09-07 | 1998-08-04 | Nec Corporation | High speed signal level converting circuit having a reduced consumed electric power |
JP3625598B2 (ja) * | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
JP4103968B2 (ja) * | 1996-09-18 | 2008-06-18 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置 |
JP3106998B2 (ja) * | 1997-04-11 | 2000-11-06 | 日本電気株式会社 | メモリ付加型プログラマブルロジックlsi |
US6057707A (en) * | 1997-06-20 | 2000-05-02 | Altera Corporation | Programmable logic device incorporating a memory efficient interconnection device |
US6097212A (en) * | 1997-10-09 | 2000-08-01 | Lattice Semiconductor Corporation | Variable grain architecture for FPGA integrated circuits |
JP3185727B2 (ja) * | 1997-10-15 | 2001-07-11 | 日本電気株式会社 | プログラマブル機能ブロック |
JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
JP4493741B2 (ja) * | 1998-09-04 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2000150861A (ja) * | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
US6351076B1 (en) | 1999-10-06 | 2002-02-26 | Tohoku Pioneer Corporation | Luminescent display panel drive unit and drive method thereof |
KR100516693B1 (ko) * | 2003-04-02 | 2005-09-22 | 주식회사 하이닉스반도체 | 불휘발성 프로그래머블 로직 회로 |
KR100317331B1 (ko) * | 1999-11-11 | 2001-12-24 | 박종섭 | 불휘발성 강유전체 메모리 소자 및 그 제조방법 |
US6384628B1 (en) * | 2000-03-31 | 2002-05-07 | Cypress Semiconductor Corp. | Multiple voltage supply programmable logic device |
EP1160794B1 (en) * | 2000-05-31 | 2008-07-23 | STMicroelectronics S.r.l. | Circuit structure for programming data in reference cells of a multibit non-volatile memory device |
TW463393B (en) * | 2000-08-25 | 2001-11-11 | Ind Tech Res Inst | Structure of organic light emitting diode display |
JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
KR20020038482A (ko) * | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
JP3997731B2 (ja) * | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
KR100394574B1 (ko) * | 2001-04-10 | 2003-08-14 | 삼성전자주식회사 | 워드라인 결함 체크회로를 구비한 불휘발성 반도체메모리장치 |
JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
US7061014B2 (en) * | 2001-11-05 | 2006-06-13 | Japan Science And Technology Agency | Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
US6924663B2 (en) * | 2001-12-28 | 2005-08-02 | Fujitsu Limited | Programmable logic device with ferroelectric configuration memories |
JP4083486B2 (ja) * | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
CN1445821A (zh) * | 2002-03-15 | 2003-10-01 | 三洋电机株式会社 | ZnO膜和ZnO半导体层的形成方法、半导体元件及其制造方法 |
JP3933591B2 (ja) * | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
JP2004022625A (ja) * | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
US7105868B2 (en) * | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
US7067843B2 (en) * | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
JP2005005611A (ja) * | 2003-06-13 | 2005-01-06 | Matsushita Electric Ind Co Ltd | 半導体集積回路 |
JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
US6891769B2 (en) * | 2003-07-17 | 2005-05-10 | Actel Corporation | Flash/dynamic random access memory field programmable gate array |
US7262463B2 (en) * | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
US6756632B1 (en) * | 2003-08-15 | 2004-06-29 | Silicon Storage Technology, Inc. | Integrated circuit with a reprogrammable nonvolatile switch for selectively connecting a source for a signal to a circuit |
US6834009B1 (en) * | 2003-08-15 | 2004-12-21 | Silicon Storage Technology, Inc. | Integrated circuit with a three transistor reprogrammable nonvolatile switch for selectively connecting a source for a signal to a circuit |
US6809425B1 (en) * | 2003-08-15 | 2004-10-26 | Silicon Storage Technology, Inc. | Integrated circuit with a reprogrammable nonvolatile switch having a dynamic threshold voltage (VTH) for selectively connecting a source for a signal to a circuit |
US7221580B1 (en) * | 2003-08-27 | 2007-05-22 | Analog Devices, Inc. | Memory gain cell |
US6940307B1 (en) | 2003-10-22 | 2005-09-06 | Altera Corporation | Integrated circuits with reduced standby power consumption |
JP2005157620A (ja) | 2003-11-25 | 2005-06-16 | Matsushita Electric Ind Co Ltd | 半導体集積回路 |
JP4620046B2 (ja) | 2004-03-12 | 2011-01-26 | 独立行政法人科学技術振興機構 | 薄膜トランジスタ及びその製造方法 |
US7145174B2 (en) * | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
US7297977B2 (en) * | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
US7282782B2 (en) * | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
JP2005346819A (ja) * | 2004-06-02 | 2005-12-15 | Renesas Technology Corp | 半導体装置 |
US7211825B2 (en) * | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
JP2006100760A (ja) * | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
US7285501B2 (en) * | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
US7298084B2 (en) * | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
WO2006051995A1 (en) * | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Field effect transistor employing an amorphous oxide |
CA2708335A1 (en) * | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
US7791072B2 (en) * | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
US7863611B2 (en) * | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
JP5053537B2 (ja) * | 2004-11-10 | 2012-10-17 | キヤノン株式会社 | 非晶質酸化物を利用した半導体デバイス |
AU2005302963B2 (en) * | 2004-11-10 | 2009-07-02 | Cannon Kabushiki Kaisha | Light-emitting device |
US7453065B2 (en) * | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
US7829444B2 (en) * | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
US7579224B2 (en) * | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
US7608531B2 (en) * | 2005-01-28 | 2009-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, electronic device, and method of manufacturing semiconductor device |
TWI562380B (en) * | 2005-01-28 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device, electronic device, and method of manufacturing semiconductor device |
US7858451B2 (en) * | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
US7948171B2 (en) * | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
JP4713901B2 (ja) * | 2005-02-24 | 2011-06-29 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
US20060197092A1 (en) * | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
JP2006293344A (ja) | 2005-03-18 | 2006-10-26 | Semiconductor Energy Lab Co Ltd | 半導体装置、表示装置及びその駆動方法並びに電子機器 |
US8681077B2 (en) * | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
WO2006105077A2 (en) * | 2005-03-28 | 2006-10-05 | Massachusetts Institute Of Technology | Low voltage thin film transistor with high-k dielectric material |
US7645478B2 (en) * | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
US8300031B2 (en) * | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
JP2006313999A (ja) | 2005-05-09 | 2006-11-16 | Renesas Technology Corp | 半導体装置 |
JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
US7402506B2 (en) * | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
KR100711890B1 (ko) * | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
US7548091B1 (en) * | 2005-07-29 | 2009-06-16 | Altera Corporation | Method and apparatus to power down unused configuration random access memory cells |
JP2007059128A (ja) * | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
JP2007073705A (ja) * | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
JP5116225B2 (ja) * | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
JP4560502B2 (ja) | 2005-09-06 | 2010-10-13 | キヤノン株式会社 | 電界効果型トランジスタ |
JP4280736B2 (ja) * | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
JP5078246B2 (ja) | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
EP3614442A3 (en) * | 2005-09-29 | 2020-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having oxide semiconductor layer and manufactoring method thereof |
JP5064747B2 (ja) | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
JP5037808B2 (ja) * | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
KR101117948B1 (ko) * | 2005-11-15 | 2012-02-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 액정 디스플레이 장치 제조 방법 |
CN101313470B (zh) | 2005-11-25 | 2010-09-22 | 松下电器产业株式会社 | 逻辑块控制系统及逻辑块控制方法 |
TWI292281B (en) * | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
US7867636B2 (en) * | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
JP4977478B2 (ja) * | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
US7576394B2 (en) * | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
US7977169B2 (en) * | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
US7486111B2 (en) * | 2006-03-08 | 2009-02-03 | Tier Logic, Inc. | Programmable logic devices comprising time multiplexed programmable interconnect |
WO2007105778A1 (en) | 2006-03-10 | 2007-09-20 | Canon Kabushiki Kaisha | Driving circuit of display element and image display apparatus |
JP5016953B2 (ja) | 2006-03-10 | 2012-09-05 | キヤノン株式会社 | 表示素子の駆動回路及び画像表示装置 |
JP2007280505A (ja) * | 2006-04-06 | 2007-10-25 | Toshiba Corp | 半導体記憶装置 |
KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
JP4999400B2 (ja) * | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
JP4609797B2 (ja) * | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
JP4332545B2 (ja) * | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
JP2008085085A (ja) * | 2006-09-27 | 2008-04-10 | Fujitsu Ltd | 半導体集積回路の電源制御回路、および制御方法 |
JP4274219B2 (ja) * | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
JP5164357B2 (ja) * | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
US7622371B2 (en) * | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
JP5099739B2 (ja) | 2006-10-12 | 2012-12-19 | 財団法人高知県産業振興センター | 薄膜トランジスタ及びその製法 |
US7772021B2 (en) * | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
JP2008140684A (ja) * | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
JP2008164794A (ja) * | 2006-12-27 | 2008-07-17 | Semiconductor Energy Lab Co Ltd | 表示装置及び表示システム |
KR101303578B1 (ko) * | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
US7800400B2 (en) * | 2007-01-12 | 2010-09-21 | Altera Corporation | Configuration random access memory |
US8207063B2 (en) * | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
JP5196870B2 (ja) | 2007-05-23 | 2013-05-15 | キヤノン株式会社 | 酸化物半導体を用いた電子素子及びその製造方法 |
JP4544251B2 (ja) | 2007-02-27 | 2010-09-15 | ソニー株式会社 | 液晶表示素子および表示装置 |
JP4910779B2 (ja) * | 2007-03-02 | 2012-04-04 | 凸版印刷株式会社 | 有機elディスプレイおよびその製造方法 |
KR100851215B1 (ko) * | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
US7620926B1 (en) * | 2007-03-20 | 2009-11-17 | Xilinx, Inc. | Methods and structures for flexible power management in integrated circuits |
JP2008235704A (ja) | 2007-03-22 | 2008-10-02 | Toshiba Corp | 半導体素子および半導体集積回路 |
JP5197058B2 (ja) * | 2007-04-09 | 2013-05-15 | キヤノン株式会社 | 発光装置とその作製方法 |
WO2008126879A1 (en) | 2007-04-09 | 2008-10-23 | Canon Kabushiki Kaisha | Light-emitting apparatus and production method thereof |
US7795613B2 (en) * | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
KR101325053B1 (ko) * | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
KR20080094300A (ko) * | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
KR101334181B1 (ko) * | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
WO2008133345A1 (en) * | 2007-04-25 | 2008-11-06 | Canon Kabushiki Kaisha | Oxynitride semiconductor |
JP5294651B2 (ja) | 2007-05-18 | 2013-09-18 | キヤノン株式会社 | インバータの作製方法及びインバータ |
KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
JP5414161B2 (ja) | 2007-08-10 | 2014-02-12 | キヤノン株式会社 | 薄膜トランジスタ回路、発光表示装置と及びそれらの駆動方法 |
TWI453915B (zh) | 2007-09-10 | 2014-09-21 | Idemitsu Kosan Co | Thin film transistor |
JP2009099847A (ja) * | 2007-10-18 | 2009-05-07 | Canon Inc | 薄膜トランジスタとその製造方法及び表示装置 |
WO2009063584A1 (ja) * | 2007-11-13 | 2009-05-22 | Panasonic Corporation | プログラマブルデバイス、デバイス制御方法及び情報処理システム |
JP5430846B2 (ja) * | 2007-12-03 | 2014-03-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP5215158B2 (ja) * | 2007-12-17 | 2013-06-19 | 富士フイルム株式会社 | 無機結晶性配向膜及びその製造方法、半導体デバイス |
US7652502B2 (en) | 2007-12-29 | 2010-01-26 | Unity Semiconductor Corporation | Field programmable gate arrays using resistivity sensitive memories |
US7816947B1 (en) | 2008-03-31 | 2010-10-19 | Man Wang | Method and apparatus for providing a non-volatile programmable transistor |
WO2010019441A1 (en) * | 2008-08-14 | 2010-02-18 | Nantero, Inc. | Nonvolatile nanotube programmable logic devices and field programmable gate array |
JP4623179B2 (ja) * | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
JP5451280B2 (ja) * | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
JP5781720B2 (ja) * | 2008-12-15 | 2015-09-24 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
CN110061144A (zh) * | 2009-10-16 | 2019-07-26 | 株式会社半导体能源研究所 | 逻辑电路和半导体器件 |
CN103794612B (zh) * | 2009-10-21 | 2018-09-07 | 株式会社半导体能源研究所 | 半导体装置 |
WO2011052396A1 (en) * | 2009-10-29 | 2011-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR101745749B1 (ko) | 2010-01-20 | 2017-06-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
-
2010
- 2010-12-14 KR KR1020127021277A patent/KR101745749B1/ko active IP Right Grant
- 2010-12-14 SG SG10201500353WA patent/SG10201500353WA/en unknown
- 2010-12-14 KR KR1020187021205A patent/KR101978106B1/ko active IP Right Grant
- 2010-12-14 IN IN5920DEN2012 patent/IN2012DN05920A/en unknown
- 2010-12-14 EP EP10843972.0A patent/EP2526622B1/en not_active Not-in-force
- 2010-12-14 CN CN201080062032.4A patent/CN102714496B/zh not_active Expired - Fee Related
- 2010-12-14 MY MYPI2016001387A patent/MY187143A/en unknown
- 2010-12-14 KR KR1020177014541A patent/KR101789975B1/ko active IP Right Grant
- 2010-12-14 WO PCT/JP2010/072839 patent/WO2011089808A1/en active Application Filing
- 2010-12-14 MY MYPI2012700442A patent/MY160598A/en unknown
- 2010-12-14 SG SG2012046207A patent/SG182272A1/en unknown
- 2010-12-14 KR KR1020177029955A patent/KR101851517B1/ko active IP Right Grant
- 2010-12-14 KR KR1020187010615A patent/KR101883629B1/ko active IP Right Grant
- 2010-12-29 TW TW099146609A patent/TWI512899B/zh not_active IP Right Cessation
- 2010-12-29 TW TW105119958A patent/TWI593060B/zh not_active IP Right Cessation
- 2010-12-29 TW TW104131800A patent/TWI550775B/zh not_active IP Right Cessation
- 2010-12-29 TW TW107109871A patent/TWI684247B/zh not_active IP Right Cessation
- 2010-12-29 TW TW106114991A patent/TWI667738B/zh not_active IP Right Cessation
-
2011
- 2011-01-13 US US13/005,557 patent/US8547753B2/en active Active
- 2011-01-19 JP JP2011008357A patent/JP5660902B2/ja not_active Expired - Fee Related
-
2013
- 2013-09-23 US US14/033,924 patent/US8760931B2/en not_active Expired - Fee Related
-
2014
- 2014-05-19 US US14/280,950 patent/US9614097B2/en active Active
- 2014-12-02 JP JP2014243897A patent/JP5855215B2/ja active Active
-
2015
- 2015-12-08 JP JP2015239187A patent/JP6232038B2/ja active Active
-
2017
- 2017-02-28 US US15/444,696 patent/US10454475B2/en active Active
- 2017-10-20 JP JP2017203152A patent/JP6491722B2/ja active Active
-
2019
- 2019-03-01 JP JP2019037171A patent/JP6765466B2/ja active Active
-
2020
- 2020-09-15 JP JP2020154467A patent/JP2021002849A/ja not_active Withdrawn
-
2022
- 2022-03-09 JP JP2022035974A patent/JP2022081601A/ja not_active Withdrawn
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IN2012DN05920A (ja) | ||
IN2012DN01823A (ja) | ||
EP2517355A4 (en) | STORAGE DEVICE, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | |
IN2012DN03080A (ja) | ||
JP2014007386A5 (ja) | 半導体装置 | |
JP2013214296A5 (ja) | ||
EP2526619A4 (en) | SIGNAL PROCESSING CIRCUIT AND ITS CONTROL METHOD | |
JP2013242858A5 (ja) | 電源回路 | |
MX338194B (es) | Un dispositivo de control electrico programable. | |
JP2011172214A5 (ja) | ||
JP2011119671A5 (ja) | ||
MY163862A (en) | Logic circuit and semiconductor device | |
WO2014014939A3 (en) | Semiconductor electronic components with integrated current limiters | |
MX358377B (es) | Dispositivo de control multimodal. | |
IN2012DN05057A (ja) | ||
JP2011100532A5 (ja) | ||
EP2624429A3 (en) | Method of forming a switched mode power supply controller device with an off mode and structure therefor | |
WO2008147801A3 (en) | Half-bridge circuits employing normally on switches and methods of preventing unintended current flow therein | |
JP2013008432A5 (ja) | 記憶回路及び信号処理回路 | |
JP2012009832A5 (ja) | 半導体装置 | |
JP2013008352A5 (ja) | 加算器及び全加算器 | |
JP2011059709A5 (ja) | ||
JP2013131286A5 (ja) | 記憶装置 | |
JP2013232885A5 (ja) | 半導体装置 | |
IN2014CN02460A (ja) |