US5744898A
(en)
*
|
1992-05-14 |
1998-04-28 |
Duke University |
Ultrasound transducer array with transmitter/receiver integrated circuitry
|
US5939817A
(en)
*
|
1994-09-22 |
1999-08-17 |
Nippon Electric Co |
Surface acoustic wave device
|
JP3171043B2
(ja)
*
|
1995-01-11 |
2001-05-28 |
株式会社村田製作所 |
弾性表面波装置
|
JPH08204497A
(ja)
*
|
1995-01-26 |
1996-08-09 |
Murata Mfg Co Ltd |
弾性表面波装置
|
US5629578A
(en)
*
|
1995-03-20 |
1997-05-13 |
Martin Marietta Corp. |
Integrated composite acoustic transducer array
|
JP3301262B2
(ja)
*
|
1995-03-28 |
2002-07-15 |
松下電器産業株式会社 |
弾性表面波装置
|
JPH08288787A
(ja)
*
|
1995-04-10 |
1996-11-01 |
Canon Inc |
弾性表面波素子装置、スペクトラム拡散通信装置およびこれを用いたシステム
|
JP3308759B2
(ja)
*
|
1995-04-10 |
2002-07-29 |
日本電気株式会社 |
弾性表面波装置
|
US6262513B1
(en)
*
|
1995-06-30 |
2001-07-17 |
Kabushiki Kaisha Toshiba |
Electronic component and method of production thereof
|
US6242842B1
(en)
|
1996-12-16 |
2001-06-05 |
Siemens Matsushita Components Gmbh & Co. Kg |
Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production
|
DE19548050A1
(de)
*
|
1995-12-21 |
1997-06-26 |
Siemens Matsushita Components |
Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement -
|
JPH09232904A
(ja)
*
|
1996-02-28 |
1997-09-05 |
Oki Electric Ind Co Ltd |
Sawフィルタ用セラミックパッケージ
|
EP0794616B1
(de)
*
|
1996-03-08 |
2003-01-29 |
Matsushita Electric Industrial Co., Ltd. |
Elektronisches Bauteil und Herstellungsverfahren
|
US5654693A
(en)
*
|
1996-04-10 |
1997-08-05 |
X-Cyte, Inc. |
Layered structure for a transponder tag
|
US5761053A
(en)
*
|
1996-05-08 |
1998-06-02 |
W. L. Gore & Associates, Inc. |
Faraday cage
|
US5880553A
(en)
*
|
1996-05-15 |
1999-03-09 |
Murata Manufacturing Co.,Ltd. |
Electronic component and method of producing same
|
CN1149688C
(zh)
*
|
1996-05-15 |
2004-05-12 |
Nec东金株式会社 |
压电变压器
|
WO1997045955A1
(de)
*
|
1996-05-24 |
1997-12-04 |
Siemens Matsushita Components Gmbh & Co. Kg |
Elektronisches bauelement, insbesondere mit akustischen oberflächenwellen arbeitendes bauelement - ofw-bauelement
|
KR100658230B1
(ko)
*
|
1996-05-24 |
2007-05-14 |
지멘스 마츠시타 컴포넌츠 게엠베하 운트 콤파니 카게 |
표면탄성파를사용하는전자부품
|
US6137380A
(en)
*
|
1996-08-14 |
2000-10-24 |
Murata Manufacturing, Co., Ltd |
Surface acoustic wave filter utilizing a particularly placed spurious component of a parallel resonator
|
JPH10150341A
(ja)
*
|
1996-09-19 |
1998-06-02 |
Murata Mfg Co Ltd |
1ポート型弾性表面波装置
|
JPH10163268A
(ja)
*
|
1996-12-03 |
1998-06-19 |
Seiko Epson Corp |
半導体装置の実装構造、およびそれを用いた通信装置
|
US6119920A
(en)
*
|
1996-12-20 |
2000-09-19 |
Rf Monolithics, Inc. |
Method of forming an electronic package with a solder seal
|
US6037705A
(en)
*
|
1997-02-26 |
2000-03-14 |
Murata Manufacturing Co., Ltd. |
Piezoelectric transformer including resilient adhesive support
|
JP3176307B2
(ja)
*
|
1997-03-03 |
2001-06-18 |
日本電気株式会社 |
集積回路装置の実装構造およびその製造方法
|
JP3982876B2
(ja)
*
|
1997-06-30 |
2007-09-26 |
沖電気工業株式会社 |
弾性表面波装置
|
JP3336913B2
(ja)
*
|
1997-06-30 |
2002-10-21 |
株式会社村田製作所 |
電子部品のパッケージ構造
|
JP3196693B2
(ja)
*
|
1997-08-05 |
2001-08-06 |
日本電気株式会社 |
表面弾性波装置およびその製造方法
|
US5939784A
(en)
*
|
1997-09-09 |
1999-08-17 |
Amkor Technology, Inc. |
Shielded surface acoustical wave package
|
JPH11112280A
(ja)
*
|
1997-10-03 |
1999-04-23 |
Murata Mfg Co Ltd |
電子部品およびラダーフィルタ
|
JPH11127055A
(ja)
*
|
1997-10-23 |
1999-05-11 |
Murata Mfg Co Ltd |
複合電子部品
|
US5896275A
(en)
*
|
1997-12-01 |
1999-04-20 |
Lucent Technologies Inc. |
Ground and shield for a surface acoustic wave filter package
|
US6222299B1
(en)
*
|
1998-02-09 |
2001-04-24 |
Lucent Technologies Inc. |
Surface acoustic wave devices comprising large-grained diamonds and methods for making
|
DE19806818C1
(de)
*
|
1998-02-18 |
1999-11-04 |
Siemens Matsushita Components |
Verfahren zur Herstellung eines elektronischen Bauelements, insbesondere eines mit akustischen Oberflächenwllen arbeitenden OFW-Bauelements
|
JPH11239037A
(ja)
*
|
1998-02-20 |
1999-08-31 |
Nec Corp |
弾性表面波装置
|
JP3514361B2
(ja)
*
|
1998-02-27 |
2004-03-31 |
Tdk株式会社 |
チップ素子及びチップ素子の製造方法
|
US5969461A
(en)
*
|
1998-04-08 |
1999-10-19 |
Cts Corporation |
Surface acoustic wave device package and method
|
DE19818824B4
(de)
*
|
1998-04-27 |
2008-07-31 |
Epcos Ag |
Elektronisches Bauelement und Verfahren zu dessen Herstellung
|
DE19822794C1
(de)
|
1998-05-20 |
2000-03-09 |
Siemens Matsushita Components |
Mehrfachnutzen für elektronische Bauelemente, insbesondere akustische Oberflächenwellen-Bauelemente
|
EP0961404B1
(de)
*
|
1998-05-29 |
2008-07-02 |
Fujitsu Limited |
Akustisches Oberflächenwellenfilter mit verbesserter Unterdrückung ausserhalb eines Durchlassbereichs
|
US6937113B2
(en)
*
|
1998-06-09 |
2005-08-30 |
Oki Electric Industry Co., Ltd. |
Branching filter package
|
JP4124867B2
(ja)
*
|
1998-07-14 |
2008-07-23 |
松下電器産業株式会社 |
変換装置
|
JP2000058593A
(ja)
|
1998-08-03 |
2000-02-25 |
Nec Corp |
表面弾性波素子の実装構造及びその実装方法
|
JP3303791B2
(ja)
*
|
1998-09-02 |
2002-07-22 |
株式会社村田製作所 |
電子部品の製造方法
|
JP4204150B2
(ja)
*
|
1998-10-16 |
2009-01-07 |
パナソニック株式会社 |
多層回路基板
|
JP2000165085A
(ja)
*
|
1998-11-24 |
2000-06-16 |
Nec Corp |
フレキシブルボード及びその不要輻射防止方法並びに携帯 電話機
|
JP3678148B2
(ja)
*
|
1998-12-02 |
2005-08-03 |
セイコーエプソン株式会社 |
圧電デバイス
|
FR2786959B1
(fr)
*
|
1998-12-08 |
2001-05-11 |
Thomson Csf |
Composant a ondes de surface encapsule et procede de fabrication collective
|
KR100418550B1
(ko)
*
|
1998-12-29 |
2004-02-11 |
가부시끼가이샤 도시바 |
탄성표면파 장치
|
JP3296356B2
(ja)
|
1999-02-08 |
2002-06-24 |
松下電器産業株式会社 |
弾性表面波デバイスとその製造方法
|
JP2000307452A
(ja)
*
|
1999-02-16 |
2000-11-02 |
Murata Mfg Co Ltd |
高周波複合部品及びそれを用いた携帯無線機
|
JP3339450B2
(ja)
*
|
1999-03-02 |
2002-10-28 |
株式会社村田製作所 |
表面波装置の製造方法
|
JP3726998B2
(ja)
|
1999-04-01 |
2005-12-14 |
株式会社村田製作所 |
表面波装置
|
JP2001053178A
(ja)
*
|
1999-06-02 |
2001-02-23 |
Japan Radio Co Ltd |
電子回路装置が封止され回路基板に実装される電子部品及びその製造方法
|
FR2799883B1
(fr)
*
|
1999-10-15 |
2003-05-30 |
Thomson Csf |
Procede d'encapsulation de composants electroniques
|
US6404100B1
(en)
*
|
1999-10-18 |
2002-06-11 |
Kabushiki Kaisha Toshiba |
Surface acoustic wave apparatus and method of manufacturing the same
|
US6456172B1
(en)
*
|
1999-10-21 |
2002-09-24 |
Matsushita Electric Industrial Co., Ltd. |
Multilayered ceramic RF device
|
DE10063265A1
(de)
*
|
1999-12-20 |
2001-07-05 |
Murata Manufacturing Co |
Äußeres Überzugsubstrat für ein elektronisches Bauteil und ein piezoelektrisches Resonanzbauteil
|
JP3438689B2
(ja)
*
|
1999-12-20 |
2003-08-18 |
株式会社村田製作所 |
圧電共振子及び圧電発振子
|
US6384353B1
(en)
|
2000-02-01 |
2002-05-07 |
Motorola, Inc. |
Micro-electromechanical system device
|
JP3654116B2
(ja)
*
|
2000-03-10 |
2005-06-02 |
セイコーエプソン株式会社 |
半導体装置及びその製造方法、回路基板並びに電子機器
|
EP1267438A4
(de)
*
|
2000-03-15 |
2004-03-31 |
Matsushita Electric Ind Co Ltd |
Mehrschichtiges elektronisches bauteil, mehr-schichtiger antennenduplexer und kommunikations-vorrichtung
|
JP4567986B2
(ja)
*
|
2000-03-17 |
2010-10-27 |
パナソニック株式会社 |
電気素子内蔵モジュール及びその製造方法
|
JP3467454B2
(ja)
*
|
2000-06-05 |
2003-11-17 |
Necエレクトロニクス株式会社 |
半導体装置の製造方法
|
CN1551720A
(zh)
*
|
2000-06-27 |
2004-12-01 |
���µ�����ҵ��ʽ���� |
陶瓷叠层器件
|
JP4023076B2
(ja)
*
|
2000-07-27 |
2007-12-19 |
富士通株式会社 |
表裏導通基板及びその製造方法
|
JP3386043B2
(ja)
*
|
2000-08-09 |
2003-03-10 |
株式会社村田製作所 |
弾性表面波デバイス
|
JP2002141771A
(ja)
*
|
2000-08-21 |
2002-05-17 |
Murata Mfg Co Ltd |
弾性表面波フィルタ装置
|
JP4049239B2
(ja)
*
|
2000-08-30 |
2008-02-20 |
Tdk株式会社 |
表面弾性波素子を含む高周波モジュール部品の製造方法
|
JP3438711B2
(ja)
*
|
2000-09-06 |
2003-08-18 |
セイコーエプソン株式会社 |
圧電デバイス及びその製造方法
|
US6710682B2
(en)
*
|
2000-10-04 |
2004-03-23 |
Matsushita Electric Industrial Co., Ltd. |
Surface acoustic wave device, method for producing the same, and circuit module using the same
|
JP2002118486A
(ja)
*
|
2000-10-06 |
2002-04-19 |
Matsushita Electric Ind Co Ltd |
高周波複合スイッチモジュール
|
JP2002203999A
(ja)
*
|
2000-11-06 |
2002-07-19 |
Denso Corp |
積層型圧電体素子とその製造方法
|
US7439616B2
(en)
*
|
2000-11-28 |
2008-10-21 |
Knowles Electronics, Llc |
Miniature silicon condenser microphone
|
US7434305B2
(en)
|
2000-11-28 |
2008-10-14 |
Knowles Electronics, Llc. |
Method of manufacturing a microphone
|
US7166910B2
(en)
*
|
2000-11-28 |
2007-01-23 |
Knowles Electronics Llc |
Miniature silicon condenser microphone
|
US8617934B1
(en)
|
2000-11-28 |
2013-12-31 |
Knowles Electronics, Llc |
Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages
|
US6930395B2
(en)
*
|
2000-12-05 |
2005-08-16 |
Matsushita Electric Industrial Co., Ltd. |
Circuit substrate having improved connection reliability and a method for manufacturing the same
|
TW511405B
(en)
*
|
2000-12-27 |
2002-11-21 |
Matsushita Electric Ind Co Ltd |
Device built-in module and manufacturing method thereof
|
EP1361657B1
(de)
*
|
2001-02-06 |
2013-07-24 |
Panasonic Corporation |
Oberflächenwellenbauelement
|
JP3855679B2
(ja)
*
|
2001-05-01 |
2006-12-13 |
株式会社村田製作所 |
表面実装型電子部品
|
JP3800504B2
(ja)
|
2001-05-15 |
2006-07-26 |
Tdk株式会社 |
フロントエンドモジュール
|
CN1287516C
(zh)
*
|
2001-06-21 |
2006-11-29 |
松下电器产业株式会社 |
弹性表面波装置及其制造方法和使用该装置的电子器件
|
DE60229821D1
(de)
*
|
2001-09-25 |
2008-12-24 |
Tdk Corp |
Gehäuse für integrierte Schaltung
|
JP2003124595A
(ja)
*
|
2001-10-11 |
2003-04-25 |
Alps Electric Co Ltd |
電子回路ユニット
|
TWI315607B
(en)
*
|
2001-10-29 |
2009-10-01 |
Panasonic Corp |
Surface acoustic wave filter element, surface acoustic wave filter and communication device using the same
|
US6750546B1
(en)
*
|
2001-11-05 |
2004-06-15 |
Skyworks Solutions, Inc. |
Flip-chip leadframe package
|
US7310039B1
(en)
|
2001-11-30 |
2007-12-18 |
Silicon Laboratories Inc. |
Surface inductor
|
KR100431180B1
(ko)
*
|
2001-12-07 |
2004-05-12 |
삼성전기주식회사 |
표면 탄성파 필터 패키지 제조방법
|
JP2003249840A
(ja)
*
|
2001-12-18 |
2003-09-05 |
Murata Mfg Co Ltd |
弾性表面波装置
|
WO2003063561A1
(fr)
*
|
2002-01-24 |
2003-07-31 |
Mitsubishi Materials Corporation |
Carte de circuit imprime, partie electronique a structure blindee et appareil de communications radio
|
JP5024317B2
(ja)
*
|
2002-03-25 |
2012-09-12 |
セイコーエプソン株式会社 |
電子部品および電子部品の製造方法
|
DE10228328A1
(de)
*
|
2002-06-25 |
2004-01-22 |
Epcos Ag |
Elektronisches Bauelement mit einem Mehrlagensubstrat und Herstellungsverfahren
|
JP2004031651A
(ja)
|
2002-06-26 |
2004-01-29 |
Sony Corp |
素子実装基板及びその製造方法
|
KR20040003890A
(ko)
*
|
2002-07-04 |
2004-01-13 |
(주)에이엔티테크놀러지 |
라디오주파수 모듈
|
US7154206B2
(en)
*
|
2002-07-31 |
2006-12-26 |
Kyocera Corporation |
Surface acoustic wave device and method for manufacturing same
|
US7141883B2
(en)
*
|
2002-10-15 |
2006-11-28 |
Silicon Laboratories Inc. |
Integrated circuit package configuration incorporating shielded circuit element structure
|
TWI221664B
(en)
*
|
2002-11-07 |
2004-10-01 |
Via Tech Inc |
Structure of chip package and process thereof
|
US6965072B2
(en)
*
|
2003-02-07 |
2005-11-15 |
Nokia Corporation |
Shielding arrangement
|
US7501703B2
(en)
*
|
2003-02-28 |
2009-03-10 |
Knowles Electronics, Llc |
Acoustic transducer module
|
US7382048B2
(en)
*
|
2003-02-28 |
2008-06-03 |
Knowles Electronics, Llc |
Acoustic transducer module
|
TWI273680B
(en)
*
|
2003-03-27 |
2007-02-11 |
Siliconware Precision Industries Co Ltd |
Semiconductor package with embedded heat spreader abstract of the disclosure
|
JP3865712B2
(ja)
|
2003-05-26 |
2007-01-10 |
富士通メディアデバイス株式会社 |
弾性表面波デバイス
|
KR100541079B1
(ko)
*
|
2003-06-10 |
2006-01-10 |
삼성전기주식회사 |
세라믹 패키지 및 그 제조방법
|
JP4177182B2
(ja)
*
|
2003-06-13 |
2008-11-05 |
富士通メディアデバイス株式会社 |
弾性表面波デバイス、そのパッケージ及びその製造方法
|
JP4180982B2
(ja)
*
|
2003-06-16 |
2008-11-12 |
富士通メディアデバイス株式会社 |
弾性表面波デバイス、そのパッケージ及びその製造方法
|
US20050011672A1
(en)
*
|
2003-07-17 |
2005-01-20 |
Alawani Ashish D. |
Overmolded MCM with increased surface mount component reliability
|
US8222721B2
(en)
*
|
2003-09-15 |
2012-07-17 |
Silicon Laboratories Inc. |
Integrated circuit suitable for use in radio receivers
|
TW200520201A
(en)
*
|
2003-10-08 |
2005-06-16 |
Kyocera Corp |
High-frequency module and communication apparatus
|
JP2005129610A
(ja)
*
|
2003-10-22 |
2005-05-19 |
Tdk Corp |
電子部品
|
JP2005167969A
(ja)
*
|
2003-11-14 |
2005-06-23 |
Fujitsu Media Device Kk |
弾性波素子および弾性波素子の製造方法
|
US7710002B2
(en)
*
|
2006-06-21 |
2010-05-04 |
Epson Toyocom Corporation |
Piezoelectric resonator for oscillator and surface mount type piezoelectric oscillator
|
JP4251070B2
(ja)
*
|
2003-12-10 |
2009-04-08 |
エプソントヨコム株式会社 |
圧電発振器、電子部品、及び圧電発振器の製造方法
|
DE102004005668B4
(de)
*
|
2004-02-05 |
2021-09-16 |
Snaptrack, Inc. |
Elektrisches Bauelement und Herstellungsverfahren
|
JP4576849B2
(ja)
*
|
2004-03-01 |
2010-11-10 |
パナソニック株式会社 |
集積回路装置
|
WO2005107350A1
(ja)
*
|
2004-04-28 |
2005-11-10 |
Ibiden Co., Ltd. |
多層プリント配線板
|
CN101592499B
(zh)
*
|
2004-05-10 |
2011-11-09 |
株式会社藤仓 |
静电电容传感器
|
US7375411B2
(en)
*
|
2004-06-03 |
2008-05-20 |
Silicon Laboratories Inc. |
Method and structure for forming relatively dense conductive layers
|
JP4244865B2
(ja)
*
|
2004-06-03 |
2009-03-25 |
セイコーエプソン株式会社 |
圧電発振器および電子機器
|
JP4587732B2
(ja)
*
|
2004-07-28 |
2010-11-24 |
京セラ株式会社 |
弾性表面波装置
|
JP4513596B2
(ja)
*
|
2004-08-25 |
2010-07-28 |
株式会社デンソー |
超音波センサ
|
JP2006067530A
(ja)
*
|
2004-08-30 |
2006-03-09 |
Fujitsu Media Device Kk |
弾性表面波デバイス及びその製造方法
|
JP2006211612A
(ja)
*
|
2005-01-31 |
2006-08-10 |
Sony Corp |
Sawデバイス、通信モジュール及びsawデバイスの製造方法
|
DE102005008511B4
(de)
|
2005-02-24 |
2019-09-12 |
Tdk Corporation |
MEMS-Mikrofon
|
DE102005008512B4
(de)
|
2005-02-24 |
2016-06-23 |
Epcos Ag |
Elektrisches Modul mit einem MEMS-Mikrofon
|
JP2006238014A
(ja)
*
|
2005-02-24 |
2006-09-07 |
Kyocera Corp |
弾性表面波素子実装基板及びそれを用いた高周波モジュール、通信機器
|
US7362038B1
(en)
*
|
2005-04-18 |
2008-04-22 |
Amkor Technology, Inc. |
Surface acoustic wave (SAW) device package and method for packaging a SAW device
|
US20060238274A1
(en)
*
|
2005-04-22 |
2006-10-26 |
Ycl Electronics Co., Ltd. |
Surface acoustic wave device
|
US7038321B1
(en)
*
|
2005-04-29 |
2006-05-02 |
Delphi Technologies, Inc. |
Method of attaching a flip chip device and circuit assembly formed thereby
|
JP4227152B2
(ja)
|
2005-08-02 |
2009-02-18 |
三星電機株式会社 |
Cmosイメージセンサの能動ピクセルアレイ
|
US8959762B2
(en)
|
2005-08-08 |
2015-02-24 |
Rf Micro Devices, Inc. |
Method of manufacturing an electronic module
|
US8053872B1
(en)
|
2007-06-25 |
2011-11-08 |
Rf Micro Devices, Inc. |
Integrated shield for a no-lead semiconductor device package
|
US8062930B1
(en)
|
2005-08-08 |
2011-11-22 |
Rf Micro Devices, Inc. |
Sub-module conformal electromagnetic interference shield
|
US8434220B2
(en)
*
|
2007-06-27 |
2013-05-07 |
Rf Micro Devices, Inc. |
Heat sink formed with conformal shield
|
US7501924B2
(en)
*
|
2005-09-30 |
2009-03-10 |
Silicon Laboratories Inc. |
Self-shielding inductor
|
DE102005053765B4
(de)
|
2005-11-10 |
2016-04-14 |
Epcos Ag |
MEMS-Package und Verfahren zur Herstellung
|
DE102005053767B4
(de)
|
2005-11-10 |
2014-10-30 |
Epcos Ag |
MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
|
JP2007184691A
(ja)
*
|
2006-01-05 |
2007-07-19 |
Matsushita Electric Ind Co Ltd |
複合rf部品
|
JP4412286B2
(ja)
*
|
2006-01-20 |
2010-02-10 |
セイコーエプソン株式会社 |
弾性表面波素子の製造方法
|
US20070188054A1
(en)
*
|
2006-02-13 |
2007-08-16 |
Honeywell International Inc. |
Surface acoustic wave packages and methods of forming same
|
US20070215962A1
(en)
*
|
2006-03-20 |
2007-09-20 |
Knowles Elecronics, Llc |
Microelectromechanical system assembly and method for manufacturing thereof
|
US20070246805A1
(en)
*
|
2006-04-25 |
2007-10-25 |
Ligang Zhang |
Multi-die inductor
|
KR20080023996A
(ko)
*
|
2006-09-12 |
2008-03-17 |
주식회사 하이닉스반도체 |
반도체 패키지
|
US7570493B2
(en)
*
|
2006-11-16 |
2009-08-04 |
Sony Ericsson Mobile Communications |
Printed circuit board with embedded circuit component
|
JP2010519769A
(ja)
|
2007-02-21 |
2010-06-03 |
ラムバス・インコーポレーテッド |
高速メモリパッケージ
|
JP4952781B2
(ja)
*
|
2007-02-28 |
2012-06-13 |
株式会社村田製作所 |
分波器及びその製造方法
|
DE102007012049B4
(de)
*
|
2007-03-13 |
2017-10-12 |
Epcos Ag |
Elektrisches Bauelement
|
JP4858985B2
(ja)
*
|
2007-06-07 |
2012-01-18 |
ラピスセミコンダクタ株式会社 |
弾性表面波フィルタパッケージ
|
US8031034B1
(en)
|
2007-08-27 |
2011-10-04 |
Triquint Semiconductor, Inc. |
Surface acoustic wave filter and method for improved rejection
|
JP4582352B2
(ja)
*
|
2007-10-26 |
2010-11-17 |
Tdk株式会社 |
表面弾性波素子を含む高周波モジュール部品及びその集合体
|
JP2009200675A
(ja)
*
|
2008-02-20 |
2009-09-03 |
Epson Toyocom Corp |
圧電デバイス及び圧電デバイスの製造方法
|
JP4730426B2
(ja)
*
|
2008-11-19 |
2011-07-20 |
ソニー株式会社 |
実装基板及び半導体モジュール
|
US8368214B2
(en)
*
|
2008-12-09 |
2013-02-05 |
Marvell World Trade Ltd. |
Alpha shielding techniques and configurations
|
JP4762333B2
(ja)
*
|
2009-07-27 |
2011-08-31 |
京セラ株式会社 |
弾性表面波装置
|
JP5056885B2
(ja)
*
|
2010-03-29 |
2012-10-24 |
パナソニック株式会社 |
集積回路装置
|
US9137934B2
(en)
|
2010-08-18 |
2015-09-15 |
Rf Micro Devices, Inc. |
Compartmentalized shielding of selected components
|
US9545043B1
(en)
*
|
2010-09-28 |
2017-01-10 |
Rockwell Collins, Inc. |
Shielding encapsulation for electrical circuitry
|
US8835226B2
(en)
|
2011-02-25 |
2014-09-16 |
Rf Micro Devices, Inc. |
Connection using conductive vias
|
US9627230B2
(en)
|
2011-02-28 |
2017-04-18 |
Qorvo Us, Inc. |
Methods of forming a microshield on standard QFN package
|
JP5799641B2
(ja)
*
|
2011-07-29 |
2015-10-28 |
株式会社村田製作所 |
弾性波装置
|
JP5429649B2
(ja)
*
|
2011-09-20 |
2014-02-26 |
日立金属株式会社 |
インダクタ内蔵部品及びこれを用いたdc−dcコンバータ
|
US8648664B2
(en)
|
2011-09-30 |
2014-02-11 |
Silicon Laboratories Inc. |
Mutual inductance circuits
|
EP2774390A4
(de)
|
2011-11-04 |
2015-07-22 |
Knowles Electronics Llc |
Eingebettetes dielektrikum als barriere bei einer akustischen vorrichtung und herstellungsverfahren
|
US9078063B2
(en)
|
2012-08-10 |
2015-07-07 |
Knowles Electronics, Llc |
Microphone assembly with barrier to prevent contaminant infiltration
|
US9812350B2
(en)
|
2013-03-06 |
2017-11-07 |
Qorvo Us, Inc. |
Method of manufacture for a silicon-on-plastic semiconductor device with interfacial adhesion layer
|
US9583414B2
(en)
|
2013-10-31 |
2017-02-28 |
Qorvo Us, Inc. |
Silicon-on-plastic semiconductor device and method of making the same
|
US9807890B2
(en)
|
2013-05-31 |
2017-10-31 |
Qorvo Us, Inc. |
Electronic modules having grounded electromagnetic shields
|
DE102013106353B4
(de)
*
|
2013-06-18 |
2018-06-28 |
Tdk Corporation |
Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
|
US9627346B2
(en)
*
|
2013-12-11 |
2017-04-18 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Underfill pattern with gap
|
CN109616455A
(zh)
*
|
2014-08-26 |
2019-04-12 |
三菱电机株式会社 |
高频模块
|
JP6738588B2
(ja)
*
|
2014-09-02 |
2020-08-12 |
セイコーエプソン株式会社 |
発振器、電子機器、および移動体
|
TWI582847B
(zh)
|
2014-09-12 |
2017-05-11 |
Rf微型儀器公司 |
包含具有聚合物基板之半導體裝置的印刷電路模組及其製造方法
|
US10085352B2
(en)
|
2014-10-01 |
2018-09-25 |
Qorvo Us, Inc. |
Method for manufacturing an integrated circuit package
|
US9530709B2
(en)
|
2014-11-03 |
2016-12-27 |
Qorvo Us, Inc. |
Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
|
JP6508920B2
(ja)
|
2014-11-13 |
2019-05-08 |
太陽誘電株式会社 |
弾性波デバイスおよび送受信デバイス
|
CN107113967B
(zh)
*
|
2015-01-16 |
2019-08-06 |
株式会社村田制作所 |
基板、基板的制造方法以及弹性波装置
|
US9960145B2
(en)
|
2015-03-25 |
2018-05-01 |
Qorvo Us, Inc. |
Flip chip module with enhanced properties
|
US9613831B2
(en)
|
2015-03-25 |
2017-04-04 |
Qorvo Us, Inc. |
Encapsulated dies with enhanced thermal performance
|
EP3093267B1
(de)
*
|
2015-05-12 |
2019-08-07 |
Airbus Defence and Space GmbH |
Elektronisches hochfrequenz bauelement
|
US20160343604A1
(en)
|
2015-05-22 |
2016-11-24 |
Rf Micro Devices, Inc. |
Substrate structure with embedded layer for post-processing silicon handle elimination
|
US9794661B2
(en)
|
2015-08-07 |
2017-10-17 |
Knowles Electronics, Llc |
Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
|
KR102117468B1
(ko)
|
2015-09-11 |
2020-06-01 |
삼성전기주식회사 |
음향 공진기 및 이를 포함하는 필터
|
US10276495B2
(en)
|
2015-09-11 |
2019-04-30 |
Qorvo Us, Inc. |
Backside semiconductor die trimming
|
US10020405B2
(en)
|
2016-01-19 |
2018-07-10 |
Qorvo Us, Inc. |
Microelectronics package with integrated sensors
|
KR102653201B1
(ko)
*
|
2016-03-30 |
2024-04-01 |
삼성전기주식회사 |
음향파 디바이스 및 그 제조방법
|
US10090262B2
(en)
|
2016-05-09 |
2018-10-02 |
Qorvo Us, Inc. |
Microelectronics package with inductive element and magnetically enhanced mold compound component
|
US10773952B2
(en)
|
2016-05-20 |
2020-09-15 |
Qorvo Us, Inc. |
Wafer-level package with enhanced performance
|
US10784149B2
(en)
|
2016-05-20 |
2020-09-22 |
Qorvo Us, Inc. |
Air-cavity module with enhanced device isolation
|
US10103080B2
(en)
|
2016-06-10 |
2018-10-16 |
Qorvo Us, Inc. |
Thermally enhanced semiconductor package with thermal additive and process for making the same
|
CN106098570B
(zh)
*
|
2016-06-23 |
2019-01-01 |
江阴芯智联电子科技有限公司 |
空腔式塑料封装模块结构及其制造方法
|
US10079196B2
(en)
|
2016-07-18 |
2018-09-18 |
Qorvo Us, Inc. |
Thermally enhanced semiconductor package having field effect transistors with back-gate feature
|
JP7022112B2
(ja)
|
2016-08-12 |
2022-02-17 |
コーボ ユーエス,インコーポレイティド |
性能を向上させたウェーハレベルパッケージ
|
JP7037544B2
(ja)
|
2016-08-12 |
2022-03-16 |
コーボ ユーエス,インコーポレイティド |
性能を向上させたウエハレベルパッケージ
|
CN109844937B
(zh)
|
2016-08-12 |
2023-06-27 |
Qorvo美国公司 |
具有增强性能的晶片级封装
|
US10109502B2
(en)
|
2016-09-12 |
2018-10-23 |
Qorvo Us, Inc. |
Semiconductor package with reduced parasitic coupling effects and process for making the same
|
US10090339B2
(en)
|
2016-10-21 |
2018-10-02 |
Qorvo Us, Inc. |
Radio frequency (RF) switch
|
US20180123561A1
(en)
*
|
2016-10-31 |
2018-05-03 |
Samsung Electro-Mechanics Co., Ltd. |
Filter
|
US10749518B2
(en)
|
2016-11-18 |
2020-08-18 |
Qorvo Us, Inc. |
Stacked field-effect transistor switch
|
US10068831B2
(en)
|
2016-12-09 |
2018-09-04 |
Qorvo Us, Inc. |
Thermally enhanced semiconductor package and process for making the same
|
US10605785B2
(en)
|
2017-06-07 |
2020-03-31 |
General Electric Company |
Sensor system and method
|
US11079359B2
(en)
|
2017-06-07 |
2021-08-03 |
General Electric Company |
Sensor system and method
|
US10490471B2
(en)
|
2017-07-06 |
2019-11-26 |
Qorvo Us, Inc. |
Wafer-level packaging for enhanced performance
|
US10366972B2
(en)
|
2017-09-05 |
2019-07-30 |
Qorvo Us, Inc. |
Microelectronics package with self-aligned stacked-die assembly
|
US10784233B2
(en)
|
2017-09-05 |
2020-09-22 |
Qorvo Us, Inc. |
Microelectronics package with self-aligned stacked-die assembly
|
EP3732784A4
(de)
*
|
2017-12-28 |
2021-08-11 |
INTEL Corporation |
Frontendsystem mit einem akustischen wellenresonator (awr) auf einem zwischensubstrat
|
WO2019132925A1
(en)
*
|
2017-12-28 |
2019-07-04 |
Intel Corporation |
Rf front end system with co-integrated acoustic wave resonator
|
US11152363B2
(en)
|
2018-03-28 |
2021-10-19 |
Qorvo Us, Inc. |
Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process
|
CN108735890A
(zh)
*
|
2018-05-25 |
2018-11-02 |
张琴 |
准气密性声表面波元件封装结构及制作方法
|
US11127689B2
(en)
|
2018-06-01 |
2021-09-21 |
Qorvo Us, Inc. |
Segmented shielding using wirebonds
|
US10804246B2
(en)
|
2018-06-11 |
2020-10-13 |
Qorvo Us, Inc. |
Microelectronics package with vertically stacked dies
|
US11219144B2
(en)
|
2018-06-28 |
2022-01-04 |
Qorvo Us, Inc. |
Electromagnetic shields for sub-modules
|
US10964554B2
(en)
|
2018-10-10 |
2021-03-30 |
Qorvo Us, Inc. |
Wafer-level fan-out package with enhanced performance
|
US11069590B2
(en)
|
2018-10-10 |
2021-07-20 |
Qorvo Us, Inc. |
Wafer-level fan-out package with enhanced performance
|
US11646242B2
(en)
|
2018-11-29 |
2023-05-09 |
Qorvo Us, Inc. |
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
|
US11114363B2
(en)
|
2018-12-20 |
2021-09-07 |
Qorvo Us, Inc. |
Electronic package arrangements and related methods
|
US20200235066A1
(en)
|
2019-01-23 |
2020-07-23 |
Qorvo Us, Inc. |
Rf devices with enhanced performance and methods of forming the same
|
US20200235040A1
(en)
|
2019-01-23 |
2020-07-23 |
Qorvo Us, Inc. |
Rf devices with enhanced performance and methods of forming the same
|
US11387157B2
(en)
|
2019-01-23 |
2022-07-12 |
Qorvo Us, Inc. |
RF devices with enhanced performance and methods of forming the same
|
US11923313B2
(en)
|
2019-01-23 |
2024-03-05 |
Qorvo Us, Inc. |
RF device without silicon handle substrate for enhanced thermal and electrical performance and methods of forming the same
|
US11515282B2
(en)
|
2019-05-21 |
2022-11-29 |
Qorvo Us, Inc. |
Electromagnetic shields with bonding wires for sub-modules
|
US11244876B2
(en)
|
2019-10-09 |
2022-02-08 |
Microchip Technology Inc. |
Packaged semiconductor die with micro-cavity
|
US11646289B2
(en)
|
2019-12-02 |
2023-05-09 |
Qorvo Us, Inc. |
RF devices with enhanced performance and methods of forming the same
|
US11923238B2
(en)
|
2019-12-12 |
2024-03-05 |
Qorvo Us, Inc. |
Method of forming RF devices with enhanced performance including attaching a wafer to a support carrier by a bonding technique without any polymer adhesive
|