JP2006211612A - Sawデバイス、通信モジュール及びsawデバイスの製造方法 - Google Patents
Sawデバイス、通信モジュール及びsawデバイスの製造方法 Download PDFInfo
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Abstract
【解決手段】 圧電基板3の表面(活性面)には、IDT電極4aと反射器電極4bを含む表面弾性波の振動部分4を囲むように、ポリイミド等の樹脂で出来た高さ20μm程度の壁(又は土手)10を設ける。このポリイミド等の樹脂でできた高さ20μm程度の壁10は、SAW圧電体素子3と配線基板9の間に形成された、上記表面弾性波の振動部分4を含む空間を、SAW圧電体素子2の天井高さHを超えないように封止するための封止樹脂11を堰き止める。
【選択図】 図1
Description
Claims (6)
- 熱可塑性樹脂材料よりなる配線基板と、
上記配線基板上にフリップ・チップ実装される表面弾性波(SAW)圧電体素子と、
上記SAW圧電体素子と上記配線基板の間に形成された活性面上の空間を、上記SAW圧電体素子の天井高さを超えないように封止するための封止樹脂と、
上記封止樹脂が上記SAW圧電体素子の活性面上の表面弾性波の振動部分に付着するのを防止するため、上記SAW圧電体素子の活性面上に上記封止樹脂の流れを堰き止めるために設ける堰き止め手段と
を備えることを特徴とするSAWデバイス。 - 上記SAW圧電体素子の活性面を表面とするときの裏面にあたる非活性面に、高周波雑音からの電気的・磁気的な遮蔽手段を有することを特徴とする請求項1記載のSAWデバイス。
- 絶縁体材料として熱硬化性樹脂を用いた熱硬化性樹脂層と、上記熱硬化性樹脂層よりも吸水率及び水分透過性の低い熱可塑性樹脂材料を用いた熱可塑性樹脂層とを積層した多層構造の配線基板を用いる通信モジュールであって、
上記熱硬化性樹脂層に半導体集積回路のベアチップを内蔵し、かつ上記熱硬化性樹脂層上に積層した上記熱可塑性樹脂層上には、当該熱可塑性樹脂層を配線基板とし、上記配線基板上にフリップ・チップ実装される表面弾性波(SAW)圧電体素子とを実装し、
上記SAW圧電体素子と上記配線基板の間に形成された活性面上の空間を、上記SAW圧電体素子の天井高さを超えないように封止樹脂により封止し、
さらに上記封止樹脂が上記SAW圧電体素子の活性面上の表面弾性波の振動部分に付着するのを防止するため、上記SAW圧電体素子の活性面上に上記封止樹脂の流れを堰き止めるための堰き止め手段を有する
ことを特徴とする通信モジュール。 - 上記SAW圧電体素子の活性面を表面とするときの裏面にあたる非活性面に、高周波雑音からの電気的・磁気的な遮蔽手段を有することを特徴とする請求項3記載の通信モジュール。
- 熱可塑性樹脂材料よりなる配線基板と、この配線基板上にフリップ・チップ実装される表面弾性波(SAW)圧電体素子とを備えるSAWデバイスの製造方法において、
上記SAW圧電体素子を形成するために圧電基板上にIDT電極、反射器電極及びパッド電極を活性面を構成するように形成する電極形成工程と、
上記SAW圧電体素子と上記配線基板とを接合するときに、上記SAW圧電体素子と上記配線基板の間に形成された活性面上の空間を、上記SAW圧電体素子の天井高さを超えないように封止するための封止樹脂が、上記電極形成工程により上記各電極が形成された活性面上の表面弾性波の振動部分に付着しないように、上記SAW圧電体素子の活性面上に上記封止樹脂の流れを堰き止めるための堰き止め手段を形成する堰き止め手段形成工程と
を備えることを特徴とするSAWデバイスの製造方法。 - 上記SAW圧電体素子の活性面を表面とするときの裏面にあたる非活性面に、高周波雑音からの電気的・磁気的な遮蔽手段を形成する遮蔽手段形成工程をさらに備えることを特徴とする請求項5記載のSAWデバイスの製造方法。
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100798599B1 (ko) | 2005-09-13 | 2008-01-28 | 세이코 엡슨 가부시키가이샤 | 탄성 표면파 디바이스 및 그 제조방법 |
JP2008135594A (ja) * | 2006-11-29 | 2008-06-12 | Kyocera Corp | 微小電子機械部品封止用基板及び複数個取り形態の微小電子機械部品封止用基板、並びに微小電子機械装置及び微小電子機械装置の製造方法 |
EP2235747A1 (en) * | 2007-12-26 | 2010-10-06 | Skyworks Solutions, Inc. | In-situ cavity integrated circuit package |
JP2012186761A (ja) * | 2011-03-08 | 2012-09-27 | Murata Mfg Co Ltd | 電子部品およびその製造方法 |
WO2014050450A1 (ja) * | 2012-09-28 | 2014-04-03 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
JP2018014717A (ja) * | 2016-07-18 | 2018-01-25 | スカイワークスフィルターソリューションズジャパン株式会社 | Sawベースの電子素子とフィルタデバイス |
CN109037430A (zh) * | 2018-08-10 | 2018-12-18 | 付伟 | 带有双围堰及外移通孔的芯片封装结构及其制作方法 |
CN109065509A (zh) * | 2018-08-10 | 2018-12-21 | 付伟 | 带有单围堰及外移通孔的芯片封装结构及其制作方法 |
US10938436B2 (en) | 2019-01-21 | 2021-03-02 | Murata Manufacturing Co., Ltd. | Front-end module and communication apparatus |
JP2022028566A (ja) * | 2020-08-03 | 2022-02-16 | 三安ジャパンテクノロジー株式会社 | 弾性波デバイス |
JP2022051613A (ja) * | 2020-09-21 | 2022-04-01 | 三安ジャパンテクノロジー株式会社 | 弾性波デバイス |
US11508652B2 (en) | 2020-05-20 | 2022-11-22 | Samsung Electronics Co., Ltd. | Semiconductor package |
JP2023028624A (ja) * | 2021-08-19 | 2023-03-03 | 三安ジャパンテクノロジー株式会社 | モジュール |
JP2023094494A (ja) * | 2021-12-23 | 2023-07-05 | 三安ジャパンテクノロジー株式会社 | モジュールおよびモジュールの製造方法 |
JP7457417B2 (ja) | 2018-12-20 | 2024-03-28 | 三安ジャパンテクノロジー株式会社 | 弾性波デバイスを含むモジュール |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100798599B1 (ko) | 2005-09-13 | 2008-01-28 | 세이코 엡슨 가부시키가이샤 | 탄성 표면파 디바이스 및 그 제조방법 |
JP2008135594A (ja) * | 2006-11-29 | 2008-06-12 | Kyocera Corp | 微小電子機械部品封止用基板及び複数個取り形態の微小電子機械部品封止用基板、並びに微小電子機械装置及び微小電子機械装置の製造方法 |
EP2235747A1 (en) * | 2007-12-26 | 2010-10-06 | Skyworks Solutions, Inc. | In-situ cavity integrated circuit package |
EP2235747A4 (en) * | 2007-12-26 | 2013-07-03 | Skyworks Solutions Inc | INTEGRATED CIRCUIT CAPACITY WITH IN-SITU-RESONATOR |
US8900931B2 (en) | 2007-12-26 | 2014-12-02 | Skyworks Solutions, Inc. | In-situ cavity integrated circuit package |
US9153551B2 (en) | 2007-12-26 | 2015-10-06 | Skyworks Solutions, Inc. | Integrated circuit package including in-situ formed cavity |
JP2012186761A (ja) * | 2011-03-08 | 2012-09-27 | Murata Mfg Co Ltd | 電子部品およびその製造方法 |
US9426897B2 (en) | 2011-03-08 | 2016-08-23 | Murata Manufacturing Co., Ltd. | Electronic component and method for manufacturing electronic component |
WO2014050450A1 (ja) * | 2012-09-28 | 2014-04-03 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
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