DE69217309D1 - Akustische Oberflächenwellenanordnung - Google Patents

Akustische Oberflächenwellenanordnung

Info

Publication number
DE69217309D1
DE69217309D1 DE69217309T DE69217309T DE69217309D1 DE 69217309 D1 DE69217309 D1 DE 69217309D1 DE 69217309 T DE69217309 T DE 69217309T DE 69217309 T DE69217309 T DE 69217309T DE 69217309 D1 DE69217309 D1 DE 69217309D1
Authority
DE
Germany
Prior art keywords
acoustic wave
surface acoustic
wave arrangement
arrangement
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69217309T
Other languages
English (en)
Other versions
DE69217309T2 (de
Inventor
Shinichi Shikata
Hideaki Nakahata
Akihiro Hachigo
Naoji Fujimori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69217309D1 publication Critical patent/DE69217309D1/de
Publication of DE69217309T2 publication Critical patent/DE69217309T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE69217309T 1991-09-27 1992-09-11 Akustische Oberflächenwellenanordnung Expired - Lifetime DE69217309T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3249747A JPH0590872A (ja) 1991-09-27 1991-09-27 表面弾性波素子

Publications (2)

Publication Number Publication Date
DE69217309D1 true DE69217309D1 (de) 1997-03-20
DE69217309T2 DE69217309T2 (de) 1997-05-22

Family

ID=17197618

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69217309T Expired - Lifetime DE69217309T2 (de) 1991-09-27 1992-09-11 Akustische Oberflächenwellenanordnung

Country Status (4)

Country Link
US (1) US5390401A (de)
EP (1) EP0534251B1 (de)
JP (1) JPH0590872A (de)
DE (1) DE69217309T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5459368A (en) * 1993-08-06 1995-10-17 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device mounted module
JP3295921B2 (ja) * 1994-06-20 2002-06-24 住友電気工業株式会社 表面弾性波素子用ダイヤモンド基材及び素子
DE19548046C2 (de) * 1995-12-21 1998-01-15 Siemens Matsushita Components Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen
US6242842B1 (en) * 1996-12-16 2001-06-05 Siemens Matsushita Components Gmbh & Co. Kg Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production
DE19548048C2 (de) * 1995-12-21 1998-01-15 Siemens Matsushita Components Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement (OFW-Bauelement)
EP0794616B1 (de) * 1996-03-08 2003-01-29 Matsushita Electric Industrial Co., Ltd. Elektronisches Bauteil und Herstellungsverfahren
WO1997045955A1 (de) * 1996-05-24 1997-12-04 Siemens Matsushita Components Gmbh & Co. Kg Elektronisches bauelement, insbesondere mit akustischen oberflächenwellen arbeitendes bauelement - ofw-bauelement
KR100658230B1 (ko) * 1996-05-24 2007-05-14 지멘스 마츠시타 컴포넌츠 게엠베하 운트 콤파니 카게 표면탄성파를사용하는전자부품
US5907768A (en) * 1996-08-16 1999-05-25 Kobe Steel Usa Inc. Methods for fabricating microelectronic structures including semiconductor islands
US5969461A (en) * 1998-04-08 1999-10-19 Cts Corporation Surface acoustic wave device package and method
DE19818824B4 (de) * 1998-04-27 2008-07-31 Epcos Ag Elektronisches Bauelement und Verfahren zu dessen Herstellung
US6329739B1 (en) * 1998-06-16 2001-12-11 Oki Electric Industry Co., Ltd. Surface-acoustic-wave device package and method for fabricating the same
JP3317274B2 (ja) * 1999-05-26 2002-08-26 株式会社村田製作所 弾性表面波装置及び弾性表面波装置の製造方法
JP3432472B2 (ja) * 1999-12-09 2003-08-04 沖電気工業株式会社 弾性表面波装置の製造方法
JP3435639B2 (ja) * 2000-04-13 2003-08-11 株式会社村田製作所 弾性表面波装置の製造方法及び弾性表面波装置
JP3376994B2 (ja) * 2000-06-27 2003-02-17 株式会社村田製作所 弾性表面波装置及びその製造方法
US6814130B2 (en) * 2000-10-13 2004-11-09 Chien-Min Sung Methods of making diamond tools using reverse casting of chemical vapor deposition
US7132309B2 (en) * 2003-04-22 2006-11-07 Chien-Min Sung Semiconductor-on-diamond devices and methods of forming
US7011134B2 (en) * 2000-10-13 2006-03-14 Chien-Min Sung Casting method for producing surface acoustic wave devices
US6659161B1 (en) 2000-10-13 2003-12-09 Chien-Min Sung Molding process for making diamond tools
US8617934B1 (en) 2000-11-28 2013-12-31 Knowles Electronics, Llc Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
JP3925366B2 (ja) * 2001-10-17 2007-06-06 株式会社村田製作所 弾性表面波装置およびその製造方法
JP3841053B2 (ja) * 2002-07-24 2006-11-01 株式会社村田製作所 弾性表面波装置及びその製造方法
US7299528B2 (en) * 2002-11-05 2007-11-27 Lee David M Method for forming a multi-frequency surface acoustic wave device
JP2006287881A (ja) * 2005-04-05 2006-10-19 Alps Electric Co Ltd 表面弾性波ディバイスの製造方法
WO2008018452A1 (fr) * 2006-08-07 2008-02-14 Kyocera Corporation Procédé de fabrication d'un dispositif à ondes acoustiques de surface
US7846767B1 (en) 2007-09-06 2010-12-07 Chien-Min Sung Semiconductor-on-diamond devices and associated methods
WO2012127979A1 (ja) * 2011-03-22 2012-09-27 株式会社村田製作所 電子部品モジュールの製造方法及び電子部品モジュール
EP2774390A4 (de) 2011-11-04 2015-07-22 Knowles Electronics Llc Eingebettetes dielektrikum als barriere bei einer akustischen vorrichtung und herstellungsverfahren
WO2014021079A1 (ja) * 2012-08-01 2014-02-06 株式会社村田製作所 電子部品及び電子部品モジュール
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
TWI578700B (zh) * 2015-09-10 2017-04-11 穩懋半導體股份有限公司 聲波元件保護結構及其製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1512593A (en) * 1975-03-13 1978-06-01 Murata Manufacturing Co Elastic surface wave filter
JPS5438874A (en) * 1977-08-30 1979-03-24 Jirou Miyai Ornament made by processing white of egg
JPS55112019A (en) * 1979-02-22 1980-08-29 Murata Mfg Co Ltd Elastic surface wave device
GB2100521B (en) * 1981-05-13 1984-09-12 Plessey Co Plc Electrical device package
EP0157938A3 (de) * 1984-03-23 1987-05-13 Siemens Aktiengesellschaft Gehäuse für elektrische Bauelemente
US4845397A (en) * 1984-12-19 1989-07-04 Tektronix, Inc. Constraining mount system for surface acoustic wave devices
JPS6297418A (ja) * 1985-10-23 1987-05-06 Clarion Co Ltd 弾性表面波装置のパツケ−ジ方法
JPS6462911A (en) * 1987-09-03 1989-03-09 Sumitomo Electric Industries Surface acoustic wave element
US5162822A (en) * 1988-10-31 1992-11-10 Hitachi, Ltd. Saw filter chip mounted on a substrate with shielded conductors on opposite surfaces
US4952832A (en) * 1989-10-24 1990-08-28 Sumitomo Electric Industries, Ltd. Surface acoustic wave device

Also Published As

Publication number Publication date
EP0534251A1 (de) 1993-03-31
DE69217309T2 (de) 1997-05-22
JPH0590872A (ja) 1993-04-09
US5390401A (en) 1995-02-21
EP0534251B1 (de) 1997-02-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN

8327 Change in the person/name/address of the patent owner

Owner name: SEIKO EPSON CORP., TOKIO/TOKYO, JP

8328 Change in the person/name/address of the agent

Representative=s name: GROSSE, SCHUMACHER, KNAUER, VON HIRSCHHAUSEN, 8033

R071 Expiry of right

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