DE69315744T2 - Akustische Oberflächenwellenanordnung - Google Patents

Akustische Oberflächenwellenanordnung

Info

Publication number
DE69315744T2
DE69315744T2 DE69315744T DE69315744T DE69315744T2 DE 69315744 T2 DE69315744 T2 DE 69315744T2 DE 69315744 T DE69315744 T DE 69315744T DE 69315744 T DE69315744 T DE 69315744T DE 69315744 T2 DE69315744 T2 DE 69315744T2
Authority
DE
Germany
Prior art keywords
acoustic wave
surface acoustic
wave arrangement
arrangement
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69315744T
Other languages
English (en)
Other versions
DE69315744D1 (de
Inventor
Hiromi Yatsuda
Yoshihiko Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Radio Co Ltd
Original Assignee
Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Radio Co Ltd filed Critical Japan Radio Co Ltd
Application granted granted Critical
Publication of DE69315744D1 publication Critical patent/DE69315744D1/de
Publication of DE69315744T2 publication Critical patent/DE69315744T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE69315744T 1992-05-27 1993-05-25 Akustische Oberflächenwellenanordnung Expired - Lifetime DE69315744T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4135271A JPH05327394A (ja) 1992-05-27 1992-05-27 弾性表面波素子のフェースダウン実装用パッケージ

Publications (2)

Publication Number Publication Date
DE69315744D1 DE69315744D1 (de) 1998-01-29
DE69315744T2 true DE69315744T2 (de) 1998-06-04

Family

ID=15147805

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69315744T Expired - Lifetime DE69315744T2 (de) 1992-05-27 1993-05-25 Akustische Oberflächenwellenanordnung

Country Status (5)

Country Link
US (1) US5523641A (de)
EP (1) EP0572215B1 (de)
JP (1) JPH05327394A (de)
CA (1) CA2096996C (de)
DE (1) DE69315744T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3301262B2 (ja) * 1995-03-28 2002-07-15 松下電器産業株式会社 弾性表面波装置
ATE522039T1 (de) * 2000-01-21 2011-09-15 Sony Computer Entertainment Inc Vorrichtung und verfahren zur verarbeitung von verschlüsselten daten
JP2001267881A (ja) * 2000-03-17 2001-09-28 Fujitsu Media Device Kk 弾性表面波デバイス及びこれを用いた通信装置、並びにアンテナデュプレクサ
JP4177182B2 (ja) * 2003-06-13 2008-11-05 富士通メディアデバイス株式会社 弾性表面波デバイス、そのパッケージ及びその製造方法
KR100541084B1 (ko) * 2003-08-20 2006-01-11 삼성전기주식회사 표면 탄성파 필터 패키지 제조방법 및 그에 사용되는패키지 시트

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62173814A (ja) * 1986-01-28 1987-07-30 Alps Electric Co Ltd 弾性表面波素子搭載ユニツト
JPS6437132U (de) * 1987-08-31 1989-03-06
JP2673993B2 (ja) * 1990-07-02 1997-11-05 日本無線株式会社 表面弾性波装置
US5205032A (en) * 1990-09-28 1993-04-27 Kabushiki Kaisha Toshiba Electronic parts mounting apparatus
JPH04170811A (ja) * 1990-11-05 1992-06-18 Fujitsu Ltd 弾性表面波デバイス

Also Published As

Publication number Publication date
US5523641A (en) 1996-06-04
CA2096996C (en) 1996-11-05
JPH05327394A (ja) 1993-12-10
EP0572215A1 (de) 1993-12-01
EP0572215B1 (de) 1997-12-17
DE69315744D1 (de) 1998-01-29
CA2096996A1 (en) 1993-11-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition