DE60310907T2 - Vorrichtung zum aufbringen von vielschichtlagen auf ein substrat - Google Patents

Vorrichtung zum aufbringen von vielschichtlagen auf ein substrat Download PDF

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Publication number
DE60310907T2
DE60310907T2 DE60310907T DE60310907T DE60310907T2 DE 60310907 T2 DE60310907 T2 DE 60310907T2 DE 60310907 T DE60310907 T DE 60310907T DE 60310907 T DE60310907 T DE 60310907T DE 60310907 T2 DE60310907 T2 DE 60310907T2
Authority
DE
Germany
Prior art keywords
substrate
deposition
tool
organic layer
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60310907T
Other languages
German (de)
English (en)
Other versions
DE60310907D1 (de
Inventor
Chris John Santa Clara PAGANO
Jeffrey Kenneth Sunnyvale NELSON
E. Paul Kennewick BURROWS
Edward Mark Pasco GROSS
R. Mac Kennewick ZUMHOFF
Maclyn Peter Kennewick MARTIN
C. Charles Richland BONHAM
Lee Gordon West Richland GRAFF
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
Original Assignee
Vitex Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitex Systems Inc filed Critical Vitex Systems Inc
Publication of DE60310907D1 publication Critical patent/DE60310907D1/de
Application granted granted Critical
Publication of DE60310907T2 publication Critical patent/DE60310907T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
DE60310907T 2002-04-15 2003-04-14 Vorrichtung zum aufbringen von vielschichtlagen auf ein substrat Expired - Lifetime DE60310907T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37255902P 2002-04-15 2002-04-15
US372559P 2002-04-15
US412133 2003-04-11
US10/412,133 US8808457B2 (en) 2002-04-15 2003-04-11 Apparatus for depositing a multilayer coating on discrete sheets
PCT/US2003/011480 WO2003090260A2 (en) 2002-04-15 2003-04-14 Apparatus for depositing a multilayer coating on discrete sheets

Publications (2)

Publication Number Publication Date
DE60310907D1 DE60310907D1 (de) 2007-02-15
DE60310907T2 true DE60310907T2 (de) 2007-10-25

Family

ID=29254493

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60310907T Expired - Lifetime DE60310907T2 (de) 2002-04-15 2003-04-14 Vorrichtung zum aufbringen von vielschichtlagen auf ein substrat

Country Status (9)

Country Link
US (2) US8808457B2 (https=)
EP (2) EP1497853B1 (https=)
JP (1) JP4677644B2 (https=)
KR (1) KR100934544B1 (https=)
CN (2) CN100358091C (https=)
AU (1) AU2003228522A1 (https=)
DE (1) DE60310907T2 (https=)
TW (1) TWI319626B (https=)
WO (1) WO2003090260A2 (https=)

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US8808457B2 (en) 2014-08-19
CN100358091C (zh) 2007-12-26
TWI319626B (en) 2010-01-11
JP4677644B2 (ja) 2011-04-27
TW200402152A (en) 2004-02-01
KR20040101479A (ko) 2004-12-02
EP1758181A3 (en) 2009-04-01
CN1647247A (zh) 2005-07-27
WO2003090260A2 (en) 2003-10-30
WO2003090260A3 (en) 2004-04-01
EP1497853A2 (en) 2005-01-19
JP2005522891A (ja) 2005-07-28
US20040018305A1 (en) 2004-01-29
CN101231974B (zh) 2010-06-02
AU2003228522A1 (en) 2003-11-03
EP1497853B1 (en) 2007-01-03
US9839940B2 (en) 2017-12-12
EP1758181A2 (en) 2007-02-28
KR100934544B1 (ko) 2009-12-29
US20140037845A1 (en) 2014-02-06
DE60310907D1 (de) 2007-02-15
AU2003228522A8 (en) 2003-11-03
CN101231974A (zh) 2008-07-30

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