DE69706983T2 - Anlage zum behandeln von substraten mit einem plasmastrahl - Google Patents
Anlage zum behandeln von substraten mit einem plasmastrahlInfo
- Publication number
- DE69706983T2 DE69706983T2 DE69706983T DE69706983T DE69706983T2 DE 69706983 T2 DE69706983 T2 DE 69706983T2 DE 69706983 T DE69706983 T DE 69706983T DE 69706983 T DE69706983 T DE 69706983T DE 69706983 T2 DE69706983 T2 DE 69706983T2
- Authority
- DE
- Germany
- Prior art keywords
- plasma jet
- treating substrates
- substrates
- treating
- jet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1858796P | 1996-05-31 | 1996-05-31 | |
PCT/US1997/009234 WO1997045857A1 (en) | 1996-05-31 | 1997-05-30 | Apparatus for plasma jet treatment of substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69706983D1 DE69706983D1 (de) | 2001-10-31 |
DE69706983T2 true DE69706983T2 (de) | 2002-05-29 |
Family
ID=21788714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69706983T Expired - Fee Related DE69706983T2 (de) | 1996-05-31 | 1997-05-30 | Anlage zum behandeln von substraten mit einem plasmastrahl |
Country Status (6)
Country | Link |
---|---|
US (1) | US6105534A (de) |
EP (1) | EP0902962B1 (de) |
JP (1) | JP2000511357A (de) |
KR (1) | KR20000016139A (de) |
DE (1) | DE69706983T2 (de) |
WO (1) | WO1997045857A1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6139678A (en) | 1997-11-20 | 2000-10-31 | Trusi Technologies, Llc | Plasma processing methods and apparatus |
US6287976B1 (en) * | 1999-05-19 | 2001-09-11 | Tru-Si Technologies, Inc. | Plasma processing methods and apparatus |
US6749764B1 (en) | 2000-11-14 | 2004-06-15 | Tru-Si Technologies, Inc. | Plasma processing comprising three rotational motions of an article being processed |
US7591957B2 (en) * | 2001-01-30 | 2009-09-22 | Rapt Industries, Inc. | Method for atmospheric pressure reactive atom plasma processing for surface modification |
US7510664B2 (en) | 2001-01-30 | 2009-03-31 | Rapt Industries, Inc. | Apparatus and method for atmospheric pressure reactive atom plasma processing for shaping of damage free surfaces |
US6546938B2 (en) * | 2001-03-12 | 2003-04-15 | The Regents Of The University Of California | Combined plasma/liquid cleaning of substrates |
US6660177B2 (en) * | 2001-11-07 | 2003-12-09 | Rapt Industries Inc. | Apparatus and method for reactive atom plasma processing for material deposition |
DE10156615B4 (de) * | 2001-11-17 | 2004-10-07 | Forschungszentrum Karlsruhe Gmbh | Einrichtung zur Erzeugung eines örtlich variierbaren Elektron-Zyklotron-Resonanz-Mikrowellen-Niederdruckplasmas |
US7371992B2 (en) | 2003-03-07 | 2008-05-13 | Rapt Industries, Inc. | Method for non-contact cleaning of a surface |
US20040173316A1 (en) * | 2003-03-07 | 2004-09-09 | Carr Jeffrey W. | Apparatus and method using a microwave source for reactive atom plasma processing |
US7304263B2 (en) * | 2003-08-14 | 2007-12-04 | Rapt Industries, Inc. | Systems and methods utilizing an aperture with a reactive atom plasma torch |
US20060131276A1 (en) * | 2004-12-17 | 2006-06-22 | Johnston Steven W | Uniformity in batch spray processing using independent cassette rotation |
TW200814170A (en) * | 2006-09-13 | 2008-03-16 | Ind Tech Res Inst | Method of adjusting surface characteristic of a substrate |
EP2274763B1 (de) * | 2008-04-22 | 2018-10-03 | Oerlikon Surface Solutions AG, Pfäffikon | Verfahren zur herstellung von arbeitsstücken mit ionengeätzter oberfläche |
TW201134969A (en) * | 2010-04-09 | 2011-10-16 | Hon Hai Prec Ind Co Ltd | Coating bracket and coating device using same |
DE102010016792A1 (de) * | 2010-05-05 | 2011-11-10 | Aixtron Ag | Bevorratungsmagazin einer CVD-Anlage |
US20140134849A1 (en) * | 2012-11-09 | 2014-05-15 | Intermolecular Inc. | Combinatorial Site Isolated Plasma Assisted Deposition |
CN103820769B (zh) * | 2012-11-16 | 2016-08-31 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种反应腔室和mocvd设备 |
US9752223B2 (en) * | 2014-03-10 | 2017-09-05 | United Technologies Corporation | Equipment for plasma spray with liquid injection |
US11898248B2 (en) * | 2019-12-18 | 2024-02-13 | Jiangsu Favored Nanotechnology Co., Ltd. | Coating apparatus and coating method |
US11862490B2 (en) | 2021-07-28 | 2024-01-02 | Changxin Memory Technologies, Inc. | Diffusion furnace |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5882165A (en) * | 1986-12-19 | 1999-03-16 | Applied Materials, Inc. | Multiple chamber integrated process system |
US5186594A (en) * | 1990-04-19 | 1993-02-16 | Applied Materials, Inc. | Dual cassette load lock |
JPH05804A (ja) * | 1990-08-01 | 1993-01-08 | Sumitomo Electric Ind Ltd | 大面積複合酸化物超電導薄膜の成膜装置 |
US5154730A (en) * | 1991-05-17 | 1992-10-13 | Materials Research Corporation | Semiconductor wafer processing module having an inclined rotating wafer handling turret and a method of using the module |
RU2030811C1 (ru) * | 1991-05-24 | 1995-03-10 | Инженерный центр "Плазмодинамика" | Установка для плазменной обработки твердого тела |
US5697749A (en) * | 1992-07-17 | 1997-12-16 | Tokyo Electron Kabushiki Kaisha | Wafer processing apparatus |
US5527390A (en) * | 1993-03-19 | 1996-06-18 | Tokyo Electron Kabushiki | Treatment system including a plurality of treatment apparatus |
RU2075135C1 (ru) * | 1995-01-13 | 1997-03-10 | Акционерное общество Научно-производственная фирма "А3" | Установка для плазмоструйной обработки пластин |
WO1996032742A1 (fr) * | 1995-04-11 | 1996-10-17 | Zakrytoe Aktsionernoe Obschestvo Nauchno-Proizvodstvennaya Firma 'az' | Installation destinee au traitement par flux plasmiques de plaques |
-
1997
- 1997-05-30 EP EP97927849A patent/EP0902962B1/de not_active Expired - Lifetime
- 1997-05-30 DE DE69706983T patent/DE69706983T2/de not_active Expired - Fee Related
- 1997-05-30 WO PCT/US1997/009234 patent/WO1997045857A1/en not_active Application Discontinuation
- 1997-05-30 JP JP09542968A patent/JP2000511357A/ja active Pending
- 1997-05-30 US US09/194,247 patent/US6105534A/en not_active Expired - Fee Related
- 1997-05-30 KR KR1019980709707A patent/KR20000016139A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0902962B1 (de) | 2001-09-26 |
EP0902962A1 (de) | 1999-03-24 |
US6105534A (en) | 2000-08-22 |
KR20000016139A (ko) | 2000-03-25 |
DE69706983D1 (de) | 2001-10-31 |
WO1997045857A1 (en) | 1997-12-04 |
JP2000511357A (ja) | 2000-08-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |