CN1729554B - 用来支撑工件和用来热处理工件的方法和系统 - Google Patents
用来支撑工件和用来热处理工件的方法和系统 Download PDFInfo
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- CN1729554B CN1729554B CN200380106950.2A CN200380106950A CN1729554B CN 1729554 B CN1729554 B CN 1729554B CN 200380106950 A CN200380106950 A CN 200380106950A CN 1729554 B CN1729554 B CN 1729554B
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Claims (313)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43467002P | 2002-12-20 | 2002-12-20 | |
US60/434,670 | 2002-12-20 | ||
US46865903P | 2003-05-08 | 2003-05-08 | |
US60/468,659 | 2003-05-08 | ||
PCT/CA2003/001959 WO2004057650A1 (en) | 2002-12-20 | 2003-12-19 | Methods and systems for supporting a workpiece and for heat-treating the workpiece |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1729554A CN1729554A (zh) | 2006-02-01 |
CN1729554B true CN1729554B (zh) | 2014-05-07 |
Family
ID=32685329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200380106950.2A Expired - Fee Related CN1729554B (zh) | 2002-12-20 | 2003-12-19 | 用来支撑工件和用来热处理工件的方法和系统 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9627244B2 (zh) |
JP (1) | JP4988202B2 (zh) |
KR (2) | KR101163682B1 (zh) |
CN (1) | CN1729554B (zh) |
AU (1) | AU2003287837A1 (zh) |
DE (1) | DE10393962B4 (zh) |
WO (1) | WO2004057650A1 (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10393962B4 (de) | 2002-12-20 | 2019-03-14 | Mattson Technology Inc. | Verfahren und Vorrichtung zum Stützen eines Werkstücks und zur Wärmebehandlung des Werkstücks |
JP5630935B2 (ja) * | 2003-12-19 | 2014-11-26 | マトソン テクノロジー、インコーポレイテッド | 工作物の熱誘起運動を抑制する機器及び装置 |
US7781947B2 (en) * | 2004-02-12 | 2010-08-24 | Mattson Technology Canada, Inc. | Apparatus and methods for producing electromagnetic radiation |
US7642205B2 (en) | 2005-04-08 | 2010-01-05 | Mattson Technology, Inc. | Rapid thermal processing using energy transfer layers |
WO2006130573A2 (en) * | 2005-06-01 | 2006-12-07 | Mattson Technology, Inc. | Optimizing the thermal budget during a pulsed heating process |
US9482468B2 (en) * | 2005-09-14 | 2016-11-01 | Mattson Technology, Inc. | Repeatable heat-treating methods and apparatus |
US7184657B1 (en) * | 2005-09-17 | 2007-02-27 | Mattson Technology, Inc. | Enhanced rapid thermal processing apparatus and method |
US20080105201A1 (en) * | 2006-11-03 | 2008-05-08 | Applied Materials, Inc. | Substrate support components having quartz contact tips |
WO2008058397A1 (en) * | 2006-11-15 | 2008-05-22 | Mattson Technology Canada, Inc. | Systems and methods for supporting a workpiece during heat-treating |
CN101702950B (zh) | 2007-05-01 | 2012-05-30 | 加拿大马特森技术有限公司 | 辐照脉冲热处理方法和设备 |
US9070590B2 (en) * | 2008-05-16 | 2015-06-30 | Mattson Technology, Inc. | Workpiece breakage prevention method and apparatus |
US8186661B2 (en) * | 2008-09-16 | 2012-05-29 | Memc Electronic Materials, Inc. | Wafer holder for supporting a semiconductor wafer during a thermal treatment process |
JP5543123B2 (ja) * | 2009-03-30 | 2014-07-09 | 大日本スクリーン製造株式会社 | 熱処理用サセプタおよび熱処理装置 |
JP5545090B2 (ja) * | 2010-07-13 | 2014-07-09 | 株式会社Sumco | ウェーハ支持治具及び軸状部材並びにシリコンウェーハの熱処理方法 |
US9279727B2 (en) | 2010-10-15 | 2016-03-08 | Mattson Technology, Inc. | Methods, apparatus and media for determining a shape of an irradiance pulse to which a workpiece is to be exposed |
JP2014093420A (ja) * | 2012-11-02 | 2014-05-19 | Toyota Motor Corp | ウェハを支持ディスクに接着する治具、および、それを用いた半導体装置の製造方法 |
JP5475900B1 (ja) * | 2013-03-01 | 2014-04-16 | 坂口電熱株式会社 | 加熱装置 |
US9497803B2 (en) * | 2014-02-03 | 2016-11-15 | Plansee Se | Supporting system for a heating element and heating system |
JP6369297B2 (ja) * | 2014-11-12 | 2018-08-08 | 株式会社Sumco | 半導体ウェーハの支持方法及びその支持装置 |
KR102365819B1 (ko) | 2015-07-17 | 2022-02-21 | 삼성전자주식회사 | 웨이퍼 클램핑 장치 |
US10790181B2 (en) | 2015-08-14 | 2020-09-29 | M Cubed Technologies, Inc. | Wafer chuck featuring reduced friction support surface |
US20170140975A1 (en) * | 2015-11-17 | 2017-05-18 | Semes Co., Ltd. | Spin head, apparatus and method for treating a substrate including the spin head |
CN108352343B (zh) * | 2015-12-30 | 2022-04-08 | 玛特森技术公司 | 毫秒退火系统中的衬底支承件 |
US20170361380A1 (en) * | 2016-06-17 | 2017-12-21 | Baker Hughes Incorporated | Tail stock for a long vertically suspended workpiece that will experience heat expansion |
DE112018004200T5 (de) | 2017-08-16 | 2020-07-09 | Beijing E-Town Semiconductor Technology, Co., Ltd | Thermische bearbeitung geschlossenförmiger werkstücke |
DE102018102766B4 (de) * | 2018-02-07 | 2019-10-31 | Uwe Beier | Trägervorrichtung für ein flaches Substrat und Anordnung aus einer Handhabungsvorrichtung und einer solchen Trägervorrichtung |
WO2019182940A1 (en) | 2018-03-20 | 2019-09-26 | Mattson Technology, Inc. | Support plate for localized heating in thermal processing systems |
CN113471046B (zh) | 2020-12-14 | 2023-06-20 | 北京屹唐半导体科技股份有限公司 | 具有等离子体处理系统和热处理系统的工件处理装置 |
JP2023044180A (ja) | 2021-09-17 | 2023-03-30 | 株式会社Screenホールディングス | 熱処理用サセプタ、および、熱処理装置 |
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US6315878B1 (en) * | 1998-05-21 | 2001-11-13 | Applied Materials, Inc. | Substrate support and lift apparatus and method |
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- 2003-12-19 KR KR1020057011663A patent/KR101163682B1/ko active IP Right Grant
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- 2003-12-19 AU AU2003287837A patent/AU2003287837A1/en not_active Abandoned
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Also Published As
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WO2004057650A1 (en) | 2004-07-08 |
US8434341B2 (en) | 2013-05-07 |
DE10393962B4 (de) | 2019-03-14 |
KR20120045040A (ko) | 2012-05-08 |
US20040178553A1 (en) | 2004-09-16 |
DE10393962T5 (de) | 2006-03-02 |
JP4988202B2 (ja) | 2012-08-01 |
KR20050085856A (ko) | 2005-08-29 |
JP2006511970A (ja) | 2006-04-06 |
AU2003287837A1 (en) | 2004-07-14 |
US9627244B2 (en) | 2017-04-18 |
CN1729554A (zh) | 2006-02-01 |
US20120118867A1 (en) | 2012-05-17 |
KR101163682B1 (ko) | 2012-07-09 |
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