JP4121929B2 - 熱処理方法および熱処理装置 - Google Patents
熱処理方法および熱処理装置 Download PDFInfo
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- JP4121929B2 JP4121929B2 JP2003349695A JP2003349695A JP4121929B2 JP 4121929 B2 JP4121929 B2 JP 4121929B2 JP 2003349695 A JP2003349695 A JP 2003349695A JP 2003349695 A JP2003349695 A JP 2003349695A JP 4121929 B2 JP4121929 B2 JP 4121929B2
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- Prior art keywords
- susceptor
- substrate
- semiconductor wafer
- heat treatment
- flash
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- 238000010438 heat treatment Methods 0.000 title claims description 100
- 238000000034 method Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims description 81
- 230000001678 irradiating effect Effects 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 7
- 230000003028 elevating effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 122
- 150000002500 ions Chemical class 0.000 description 22
- 239000007789 gas Substances 0.000 description 13
- 229910052724 xenon Inorganic materials 0.000 description 11
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 11
- 238000001994 activation Methods 0.000 description 8
- 230000004913 activation Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000005336 cracking Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000010453 quartz Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Images
Description
6 ランプ電源
10 コントローラ
11 CPU
40 モータ
61 透光板
65 チャンバー
69 フラッシュランプ
70 支持ピン
71 リフレクタ
73 サセプタ
W 半導体ウェハー
Claims (4)
- 基板に対して閃光を照射することによって該基板を加熱する熱処理方法であって、
サセプタの上方に基板を略水平姿勢にて保持する保持工程と、
前記サセプタと前記基板とを相対的に昇降移動させて前記サセプタの上面に前記基板を載置する載置工程と、
前記基板が前記サセプタの上面に載置された後、前記サセプタの上面と前記基板との間に気体層が挟み込まれて前記基板が浮遊している間にフラッシュランプから前記基板に向けて閃光を照射する照射工程と、
を備えることを特徴とする熱処理方法。 - 請求項1記載の熱処理方法において、
前記基板が前記サセプタの上面に載置された後70秒以内に前記フラッシュランプから前記基板に向けて閃光を照射することを特徴とする熱処理方法。 - 基板に対して閃光を照射することによって該基板を加熱する熱処理装置であって、
フラッシュランプを有する光源と、
前記光源の下方に設けられたチャンバーと、
前記チャンバー内にて基板を略水平姿勢にて保持するサセプタと、
前記サセプタに対して挿通自在とされ、上端部が前記サセプタの上面から突き出たときに基板を載置可能な支持ピンと、
前記支持ピンの上端部が前記サセプタの上面よりも低くなる位置と、前記サセプタの上面よりも突き出て前記サセプタに保持された基板を支持する位置との間にて、前記支持ピンを前記サセプタに対して相対的に昇降させる昇降機構と、
前記昇降機構によって前記サセプタと前記支持ピンに載置された基板とを相対的に昇降移動させて前記サセプタの上面に前記基板を載置した後、前記サセプタの上面と前記基板との間に気体層が挟み込まれて前記基板が浮遊している間に前記フラッシュランプから前記基板に向けて閃光を照射するように前記光源を制御する照射制御手段と、
を備えることを特徴とする熱処理装置。 - 請求項3記載の熱処理装置において、
前記照射制御手段は、前記基板が前記サセプタの上面に載置された後70秒以内に前記フラッシュランプから前記基板に向けて閃光を照射するように前記光源を制御することを特徴とする熱処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003349695A JP4121929B2 (ja) | 2003-10-08 | 2003-10-08 | 熱処理方法および熱処理装置 |
KR1020030082889A KR100549452B1 (ko) | 2002-12-05 | 2003-11-21 | 광조사형 열처리장치 및 방법 |
US10/729,460 US6859616B2 (en) | 2002-12-05 | 2003-12-05 | Apparatus for and method of heat treatment by light irradiation |
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JP2003349695A JP4121929B2 (ja) | 2003-10-08 | 2003-10-08 | 熱処理方法および熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005116812A JP2005116812A (ja) | 2005-04-28 |
JP4121929B2 true JP4121929B2 (ja) | 2008-07-23 |
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JP2003349695A Expired - Fee Related JP4121929B2 (ja) | 2002-12-05 | 2003-10-08 | 熱処理方法および熱処理装置 |
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JP (1) | JP4121929B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10393962B4 (de) | 2002-12-20 | 2019-03-14 | Mattson Technology Inc. | Verfahren und Vorrichtung zum Stützen eines Werkstücks und zur Wärmebehandlung des Werkstücks |
JP4862280B2 (ja) * | 2005-05-18 | 2012-01-25 | ウシオ電機株式会社 | 半導体ウエハ急速加熱装置 |
WO2009137940A1 (en) | 2008-05-16 | 2009-11-19 | Mattson Technology Canada, Inc. | Workpiece breakage prevention method and apparatus |
JP2010073787A (ja) * | 2008-09-17 | 2010-04-02 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
KR101272751B1 (ko) * | 2010-11-02 | 2013-06-10 | (주) 예스티 | 기판처리모듈을 이용한 기판처리방법 |
KR101049897B1 (ko) * | 2010-11-02 | 2011-07-15 | (주) 예스티 | 기판처리모듈 |
JP5346982B2 (ja) * | 2011-04-28 | 2013-11-20 | 大日本スクリーン製造株式会社 | 熱処理装置 |
JP5944131B2 (ja) * | 2011-09-27 | 2016-07-05 | 株式会社Screenホールディングス | 熱処理方法 |
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- 2003-10-08 JP JP2003349695A patent/JP4121929B2/ja not_active Expired - Fee Related
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