DE69500046T2 - Baugruppe mit verbesserten thermischen Charakteristiken - Google Patents

Baugruppe mit verbesserten thermischen Charakteristiken

Info

Publication number
DE69500046T2
DE69500046T2 DE69500046T DE69500046T DE69500046T2 DE 69500046 T2 DE69500046 T2 DE 69500046T2 DE 69500046 T DE69500046 T DE 69500046T DE 69500046 T DE69500046 T DE 69500046T DE 69500046 T2 DE69500046 T2 DE 69500046T2
Authority
DE
Germany
Prior art keywords
assembly
improved thermal
thermal characteristics
improved
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69500046T
Other languages
English (en)
Other versions
DE69500046D1 (de
Inventor
Uwe Effelsberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Deutschland GmbH
Original Assignee
Hewlett Packard GmbH Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard GmbH Germany filed Critical Hewlett Packard GmbH Germany
Publication of DE69500046D1 publication Critical patent/DE69500046D1/de
Application granted granted Critical
Publication of DE69500046T2 publication Critical patent/DE69500046T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
DE69500046T 1995-02-18 1995-02-18 Baugruppe mit verbesserten thermischen Charakteristiken Expired - Fee Related DE69500046T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP95102302A EP0727928B1 (de) 1995-02-18 1995-02-18 Baugruppe mit verbesserten thermischen Charakteristiken

Publications (2)

Publication Number Publication Date
DE69500046D1 DE69500046D1 (de) 1996-10-31
DE69500046T2 true DE69500046T2 (de) 1997-01-30

Family

ID=8218998

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69500046T Expired - Fee Related DE69500046T2 (de) 1995-02-18 1995-02-18 Baugruppe mit verbesserten thermischen Charakteristiken

Country Status (5)

Country Link
US (1) US5900649A (de)
EP (1) EP0727928B1 (de)
JP (1) JPH08250822A (de)
DE (1) DE69500046T2 (de)
ES (1) ES2092413T3 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006031539A1 (de) * 2006-07-07 2008-01-17 Infineon Technologies Austria Ag Integrierter Halbleiterchip mit lateraler Wärmedämmung
DE102011107316A1 (de) * 2011-07-06 2013-06-06 Abb Ag Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Steuerungssystems

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US6303411B1 (en) * 1999-05-03 2001-10-16 Vortek Industries Ltd. Spatially resolved temperature measurement and irradiance control
US6696643B2 (en) 2000-08-01 2004-02-24 Mitsubishi Denki Kabushiki Kaisha Electronic apparatus
US6677570B1 (en) * 2000-09-22 2004-01-13 Nortel Networks Limited Wide dynamic range optical power detector
WO2002074480A1 (en) * 2001-03-16 2002-09-26 Laser Machining, Inc. Laser ablation technique
DE10162404A1 (de) * 2001-12-19 2003-07-03 Hella Kg Hueck & Co Schaltungsanordnung für die Ansteuerung mindestens einer Leuchtdiode
CN101324470B (zh) * 2001-12-26 2011-03-30 加拿大马特森技术有限公司 测量温度和热处理的方法及系统
US6822325B2 (en) * 2002-08-01 2004-11-23 Altera Corporation Isolating temperature sensitive components from heat sources in integrated circuits
WO2004057650A1 (en) 2002-12-20 2004-07-08 Mattson Technology Canada, Inc. Methods and systems for supporting a workpiece and for heat-treating the workpiece
JP2004223815A (ja) * 2003-01-21 2004-08-12 Fuji Photo Film Co Ltd 記録紙側端縁検出装置及びプリンタ
US7129640B2 (en) 2003-06-03 2006-10-31 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device
JP5630935B2 (ja) * 2003-12-19 2014-11-26 マトソン テクノロジー、インコーポレイテッド 工作物の熱誘起運動を抑制する機器及び装置
DE102004025448B4 (de) * 2004-05-19 2007-03-29 Bruker Optik Gmbh Verfahren zum Messen eines Spektrums einer Messprobe mittels eines Infrarot-Spektrometers und derartiges Infrarot-Spektrometer
CN100505278C (zh) * 2004-10-07 2009-06-24 株式会社岛津制作所 摄像元件及使用它的摄像装置、及制造摄像元件的制造方法
WO2008058397A1 (en) * 2006-11-15 2008-05-22 Mattson Technology Canada, Inc. Systems and methods for supporting a workpiece during heat-treating
DE112008003664T5 (de) * 2008-01-31 2010-12-30 Hewlett-Packard Development Co., L.P., Houston Isolierende Öffnung in Leiterplatten
JP2009260205A (ja) * 2008-03-17 2009-11-05 Ricoh Co Ltd 光源装置、光走査装置及び画像形成装置
WO2009137940A1 (en) 2008-05-16 2009-11-19 Mattson Technology Canada, Inc. Workpiece breakage prevention method and apparatus
WO2011096218A1 (ja) * 2010-02-04 2011-08-11 パナソニック株式会社 放熱装置およびそれを用いた電子機器
JP5623184B2 (ja) * 2010-08-26 2014-11-12 京セラ株式会社 配線基板および撮像装置
WO2012095798A1 (en) 2011-01-14 2012-07-19 Koninklijke Philips Electronics N.V. Lighting device
JP2012204775A (ja) * 2011-03-28 2012-10-22 Mitsubishi Electric Corp プリント配線板、そのプリント配線板を用いた回路基板、および回路基板の製造方法
FR2984072B1 (fr) * 2011-12-13 2015-10-16 Thales Sa Systeme de regulation thermique d'un ensemble de composants electroniques ou de recuperation de l'energie thermique dissipee par un ensemble de composants electroniques
TW201415967A (zh) * 2012-10-05 2014-04-16 Au Optronics Corp 電路板結構
FR3004057B1 (fr) * 2013-03-26 2017-02-17 Valeo Systemes Thermiques Module de commande d'un appareil electrique
JP2016524820A (ja) * 2014-06-23 2016-08-18 ▲ホア▼▲ウェイ▼技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． チップ放熱構造体および端末装置
JP6252873B2 (ja) * 2015-03-27 2017-12-27 株式会社オートネットワーク技術研究所 車載配電基板、電気接続箱および充放電コントローラ
KR20180081272A (ko) * 2017-01-06 2018-07-16 삼성전자주식회사 방열 구조 및 그를 포함하는 전자 장치
CN114158180B (zh) * 2021-10-08 2023-09-05 中国安全生产科学研究院 具有散热功能的驱动器及应用驱动器的红外探测器
WO2023203750A1 (ja) * 2022-04-22 2023-10-26 日立Astemo株式会社 電子制御装置

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US4215275A (en) * 1977-12-07 1980-07-29 Luxtron Corporation Optical temperature measurement technique utilizing phosphors
FR2557728B1 (fr) * 1984-01-03 1986-10-17 Thomson Csf Procede de compensation en temperature d'un detecteur photoconducteur
DE8625150U1 (de) * 1986-09-19 1986-11-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
US4841170A (en) * 1986-12-08 1989-06-20 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly
US4816634A (en) * 1987-10-23 1989-03-28 Lentz Ronald R Method and apparatus for measuring strong microwave electric field strengths
US5030488A (en) * 1988-11-23 1991-07-09 Chemical And Polymer Technology, Inc. Laminates, panels and means for joining them
CH684971A5 (de) * 1989-03-16 1995-02-15 Landis & Gyr Tech Innovat Ultraviolettlicht-Sensor.
US5182624A (en) * 1990-08-08 1993-01-26 Minnesota Mining And Manufacturing Company Solid state electromagnetic radiation detector fet array
US5282121A (en) * 1991-04-30 1994-01-25 Vari-Lite, Inc. High intensity lighting projectors
US5459348A (en) * 1991-05-24 1995-10-17 Astec International, Ltd. Heat sink and electromagnetic interference shield assembly
US5247183A (en) * 1991-11-18 1993-09-21 Raytheon Company Cryogenic signal coupler having imaging lens within a thermal barrier region for optoelectronic coupling
US5551283A (en) * 1993-08-10 1996-09-03 Ricoh Seiki Company, Ltd. Atmosphere measuring device and flow sensor
US5600143A (en) * 1994-12-02 1997-02-04 Litton Systems, Inc. Sensor including an array of sensor elements and circuitry for individually adapting the sensor elements

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006031539A1 (de) * 2006-07-07 2008-01-17 Infineon Technologies Austria Ag Integrierter Halbleiterchip mit lateraler Wärmedämmung
US7781828B2 (en) 2006-07-07 2010-08-24 Infineon Technologies Austria Ag Integrated semiconductor chip with lateral thermal insulation
DE102006031539B4 (de) * 2006-07-07 2011-09-29 Infineon Technologies Austria Ag Integrierter Halbleiterchip mit lateraler Wärmedämmung und Substratkontakt
DE102011107316A1 (de) * 2011-07-06 2013-06-06 Abb Ag Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Steuerungssystems
US9485852B2 (en) 2011-07-06 2016-11-01 Abb Ag Arrangement for cooling subassemblies of an automation or control system

Also Published As

Publication number Publication date
JPH08250822A (ja) 1996-09-27
DE69500046D1 (de) 1996-10-31
ES2092413T3 (es) 1996-11-16
EP0727928A1 (de) 1996-08-21
US5900649A (en) 1999-05-04
EP0727928B1 (de) 1996-09-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES DEUTSCHLAND GMBH, 71034 BOEBL

8339 Ceased/non-payment of the annual fee