CN103201835A - 具有双重或多重蚀刻倒装芯片连接体的微电子封装和相应的制造方法 - Google Patents

具有双重或多重蚀刻倒装芯片连接体的微电子封装和相应的制造方法 Download PDF

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Publication number
CN103201835A
CN103201835A CN2011800428536A CN201180042853A CN103201835A CN 103201835 A CN103201835 A CN 103201835A CN 2011800428536 A CN2011800428536 A CN 2011800428536A CN 201180042853 A CN201180042853 A CN 201180042853A CN 103201835 A CN103201835 A CN 103201835A
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solid metal
microelectronic element
protruded stigma
studs
conductive
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CN2011800428536A
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Chinese (zh)
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贝勒卡西姆·哈巴
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Adeia Semiconductor Solutions LLC
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Tessera LLC
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CN2011800428536A 2010-07-08 2011-07-07 具有双重或多重蚀刻倒装芯片连接体的微电子封装和相应的制造方法 Pending CN103201835A (zh)

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US12/832,376 US8330272B2 (en) 2010-07-08 2010-07-08 Microelectronic packages with dual or multiple-etched flip-chip connectors
PCT/US2011/043152 WO2012006403A1 (en) 2010-07-08 2011-07-07 Microelectronic package with dual or multiple - etched flip -chip connectors and corresponding manufacturing method

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CN105895604A (zh) * 2015-02-17 2016-08-24 南茂科技股份有限公司 半导体装置
CN106057685A (zh) * 2016-07-28 2016-10-26 合肥矽迈微电子科技有限公司 封装方法及倒装芯片封装结构
CN106409793A (zh) * 2015-07-29 2017-02-15 乾坤科技股份有限公司 具有电磁屏蔽结构的电子模组及其制造方法
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