JP2013534060A - 2重エッチングフリップチップコネクタ又は多重エッチングフリップチップコネクタを有する超小型電子パッケージ及び対応する製造方法 - Google Patents
2重エッチングフリップチップコネクタ又は多重エッチングフリップチップコネクタを有する超小型電子パッケージ及び対応する製造方法 Download PDFInfo
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Abstract
【選択図】図30
Description
本出願は、2010年7月8日に出願された「Microelectronic Packages with Dual or Multiple-Etched Flip-Chip Connectors」という発明の名称の特許出願第12/832,376号の利益を主張し、その特許出願の開示は参照することにより本明細書の一部をなすものとする。
ここで図1A〜図1Cが参照され、それらの図は図2に示されるパッケージ化された超小型電子アセンブリ100の構成要素の断面図を示す。図に示されるように、パッケージ化された超小型電子アセンブリ100は、基板102と、下向き又はフリップチップ位置にある超小型電子素子104と、基板と超小型電子素子とを接合する導電性カラム106とを含む。導電性カラムは導電性バンプ又はポスト108を含み、導電性バンプ又はポストは基板102の面105の上方に突出し、超小型電子素子104の面107の上方に突出する導電性バンプ又はポスト110と位置合わせされる。導電性カラム106は、スタンドオフ、すなわち超小型電子素子104と基板102との垂直距離を長くし、それと同時に導電性カラム106間の中心間水平距離すなわちピッチPを短くできるようにすることによって、チップ・オン・サブストレートパッケージングの高さの増大をもたらす。後に更に詳細に論じられるように、基板102と超小型電子素子104との間の距離を長くできることによって、導電性カラムにおける応力を低減するのを助けることができ、アンダーフィル材料112(図2Aを参照)を被着するのを容易にするのを助けることができ、使用されるアンダーフィルの種類を増やすのを可能にすることができる。
Claims (47)
- パッケージ化された超小型電子素子であって、
前面と、該前面から離れるように延在する複数の固体金属ポストとを有する超小型電子素子と、
主面と、該主面において露出する複数の導電性素子とを有する基板であって、該導電性素子は前記固体金属ポストに接合される、基板と、
を備え、
各固体金属ポストは、前記超小型電子素子に隣接するベース領域と、前記超小型電子素子から離れた先端領域とを含み、該ベース領域及び該先端領域はそれぞれ凹形の外周面を有し、
各固体金属ポストは水平寸法を有し、該水平寸法は、前記ベース領域内の垂直位置の第1の関数であり且つ前記先端領域内の垂直位置の第2の関数である、
パッケージ化された超小型電子素子。 - 各固体金属ポストは、前記ベース領域と前記先端領域との間に位置する少なくとも1つの中間領域を更に含み、該中間領域は凹形の外周面を有し、各固体金属ポストの前記水平寸法は、前記中間領域内の垂直位置の第3の関数である、請求項1に記載のパッケージ化された超小型電子。
- 各固体金属ポストは、前記前面の方向における幅と、前記前面から延在する高さとを有し、前記高さは前記幅の少なくとも半分である、請求項1に記載のパッケージ化された超小型電子素子。
- 前記固体金属ポストは可融金属を用いて前記導電性素子に接合される、請求項1に記載のパッケージ化された超小型電子素子。
- 前記可融金属はハンダを含み、該ハンダは各固体金属ポストのエッジ面の少なくとも一部を覆う、請求項4に記載のパッケージ化された超小型電子素子。
- 前記前面に位置する複数の導電性パッドを更に備え、各固体金属ポストは、前記複数の導電性パッドの個々のパッドから延在し、前記ハンダは、前記複数の導電性パッドの少なくとも1つと接触しない、請求項5に記載のパッケージ化された超小型電子素子。
- 前記ハンダは、いずれの固体金属ポストの前記ベース領域とも接触しない、請求項5に記載のパッケージ化された超小型電子素子。
- 前記可融金属はハンダを含み、該ハンダは、各固体金属ポストの上面のみと接触する、請求項4に記載のパッケージ化された超小型電子素子。
- 各固体金属ポストの高さは、前記超小型電子素子の前面と、前記基板の主面との間の距離の25%〜50%である、請求項1に記載のパッケージ化された超小型電子素子。
- 各固体金属ポストの高さは、前記超小型電子素子の前面と、前記基板の主面との間の距離の少なくとも40%である、請求項1に記載のパッケージ化された超小型電子素子。
- 前記固体金属ポスト及び前記導電性素子は、互いに拡散結合される、請求項1に記載のパッケージ化された超小型電子素子。
- 前記第1の関数及び前記第2の関数は、著しく異なる、請求項1に記載のパッケージ化された超小型電子素子。
- 垂直位置に対する水平寸法の傾きは、前記固体金属ポストの前記ベース領域と前記先端領域との間の境界において急激に変化する、請求項1に記載のパッケージ化された超小型電子素子。
- 前記固体金属ポスト及び前記導電性素子は本質的に銅からなる、請求項1に記載のパッケージ化された超小型電子素子。
- 前記導電性素子は、導電性パッドを含み、該パッドは、前記固体金属ポストに接合される、請求項1に記載のパッケージ化された超小型電子素子。
- 前記固体金属ポストは、第1の固体金属ポストであり、前記導電性素子は、前記主面の上方に延在し且つ前記第1の固体金属ポストに接合される複数の第2の固体金属ポストを含み、前記第2の固体金属ポストは、前記基板の主面から離れた上面と、該上面から大きな角度を成して離れるように延在するエッジ面とを有する、請求項1に記載のパッケージ化された超小型電子素子。
- 前記第1の固体金属ポストは、可融金属を用いて前記第2の固体金属ポストに接合される、請求項16に記載のパッケージ化された超小型電子素子。
- 前記可融金属はハンダを含み、該ハンダは、各固体金属ポストのエッジ面の少なくとも一部を覆う、請求項17に記載のパッケージ化された超小型電子素子。
- 前記前面に位置する複数の導電性パッドを更に備え、各第1の固体金属ポストは、前記複数の導電性パッドの個々のパッドから延在し、前記ハンダは、前記複数の導電性パッドの少なくとも1つと接触しない、請求項18に記載のパッケージ化された超小型電子素子。
- 前記可融金属はハンダを含み、前記ハンダは、各固体金属ポストの上面のみと接触する、請求項17に記載のパッケージ化された超小型電子素子。
- 前記第1の固体金属ポスト及び前記第2の固体金属ポストは、互いに拡散結合される、請求項16に記載のパッケージ化された超小型電子素子。
- 各第2の固体金属ポストは、前記基板に隣接するベース領域と、前記基板から離れた先端領域とを含み、各第2の固体金属ポストの前記ベース領域及び前記先端領域はそれぞれ凹形の外周面を有し、各第2の固体金属ポストは、前記ベース領域内の垂直位置の第3の関数であり且つ前記先端領域内の垂直位置の第4の関数である水平寸法を有する、請求項16に記載のパッケージ化された超小型電子素子。
- 各第2の固体金属ポストは、前記主面の方向における幅と、前記主面から延在する高さとを有し、前記高さは、前記幅の少なくとも半分である、請求項22に記載のパッケージ化された超小型電子素子。
- 前記第1の固体金属ポストは、可融金属を用いて前記第2の固体金属ポストに接合される、請求項22に記載のパッケージ化された超小型電子素子。
- 前記可融金属はハンダを含み、該ハンダは、各固体金属ポストのエッジ面の少なくとも一部を覆う、請求項24に記載のパッケージ化された超小型電子素子。
- 前記前面に位置する複数の導電性パッドを更に備え、各第1の固体金属ポストは前記複数の導電性パッドの個々のパッドから延在し、前記ハンダは、前記複数の導電性パッドの少なくとも1つと接触しない、請求項25に記載のパッケージ化された超小型電子素子。
- 前記ハンダは、いずれの固体金属ポストの前記ベース領域とも接触しない、請求項25に記載のパッケージ化された超小型電子素子。
- 前記可融金属はハンダを含み、該ハンダは、各固体金属ポストの上面のみと接触する、請求項24に記載のパッケージ化された超小型電子素子。
- 前記第1の固体金属ポスト及び前記第2の固体金属ポストは、互いに拡散結合される、請求項22に記載のパッケージ化された超小型電子素子。
- 前記第1の関数は、前記第3の関数と同じであり、前記第2の関数は、前記第4の関数と同じである、請求項22に記載のパッケージ化された超小型電子素子。
- パッケージ化された超小型電子素子であって、
前面と、該前面の上方に突出する複数の第1の固体金属ポストとを有する超小型電子素子であって、前記第1の固体金属ポストは、前記前面から離れた上面と、該前面から大きな角度を成して離れるように延在するエッジ面とを有する、超小型電子素子と、
主面と、該主面から延在し、かつ前記第1の固体金属ポストに接合される複数の第2の固体金属ポストとを有する基板と、
を備え、
各第2の固体金属ポストは、前記超小型電子素子に隣接するベース領域と、前記超小型電子素子から離れた先端領域とを含み、該ベース領域及び該先端領域は、それぞれ凹形の外周面を有し、
各第2の固体金属ポストは水平寸法を有し、該水平寸法は、前記ベース領域内の垂直位置の第1の関数であり、かつ前記先端領域内の垂直位置の第2の関数である、パッケージ化された超小型電子素子。 - 各第1の固体金属ポストは切頭円錐形状を有する、請求項31に記載のパッケージ化された超小型電子素子。
- 各第2の固体金属ポストは、前記主面の方向における幅と、前記主面から延在する高さとを有し、該高さは前記幅の少なくとも半分である、請求項31に記載のパッケージ化された超小型電子素子。
- 前記第1の固体金属ポストは、可融金属を用いて前記第2の固体金属ポストに接合される、請求項31に記載のパッケージ化された超小型電子素子。
- 前記可融金属はハンダを含み、該ハンダは、各固体金属ポストのエッジ面の少なくとも一部を覆う、請求項34に記載のパッケージ化された超小型電子素子。
- 前記前面に位置する複数の導電性パッドを更に備え、各第1の固体金属ポストは、前記複数の導電性パッドの個々のパッドから延在し、前記ハンダは、前記複数の導電性パッドの少なくとも1つと接触しない、請求項35に記載のパッケージ化された超小型電子素子。
- 前記可融金属はハンダを含み、該ハンダは、各固体金属ポストの上面のみと接触する、請求項34に記載のパッケージ化された超小型電子素子。
- 前記第1の固体金属ポスト及び前記第2の固体金属ポストは、互いに拡散結合される、請求項31に記載のパッケージ化された超小型電子素子。
- パッケージ化された超小型電子素子を組み立てる方法であって、
(a)前面と、該前面の垂直方向上方に突出する複数の固体金属ポストとを有する超小型電子素子を配設するステップであって、各固体金属ポストは、該前面に隣接するベース領域と、該前面から離れた先端領域とを含み、該ベース領域及び該先端領域は、それぞれ凹形の外周面を有し、各固体金属ポストは水平寸法を有し、該水平寸法は、前記ベース領域内の垂直位置の第1の関数であり、かつ前記先端領域内の垂直位置の第2の関数である、配設するステップと、
(b)前記複数の固体金属ポストを、基板の主面において露出する複数の導電性素子と少なくとも実質的に位置合わせするステップと、
(c)前記超小型電子素子の前記固体金属ポストを、前記基板の導電性素子と接合するステップと、
を含む、方法。 - 前記ステップ(c)は、可融金属を融解温度まで加熱することを含み、前記可融金属は、前記固体金属ポストのエッジ面の露出した部分に流れ出す、請求項39に記載の方法。
- 前記可融金属はハンダを含み、該ハンダは、各固体金属ポストのエッジ面の少なくとも一部を覆う、請求項40に記載の方法。
- 前記前面に位置する複数の導電性パッドを更に備え、各固体金属ポストは前記複数の導電性パッドの個々のパッドから延在し、前記ハンダは、前記複数の導電性パッドの少なくとも1つと接触しない、請求項41に記載の方法。
- 前記ハンダは、任意の固体金属ポストの前記ベース領域と接触しない、請求項41に記載の方法。
- 前記可融金属はハンダを含み、該ハンダは、各固体金属ポストの上面のみと接触する、請求項40に記載の方法。
- 各固体金属ポストの高さは、前記超小型電子素子の前面と、前記基板の主面との間の距離の25%〜50%である、請求項39に記載の方法。
- 各固体金属ポストの高さは、前記超小型電子素子の前面と、前記基板の主面との間の距離の少なくとも40%である、請求項39に記載の方法。
- パッシベーション層及びアンダーバンプメタライゼーション層が、前記超小型電子素子上に堆積される、請求項39に記載の方法。
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- 2011-07-07 JP JP2013518822A patent/JP2013534060A/ja active Pending
- 2011-07-07 CN CN2011800428536A patent/CN103201835A/zh active Pending
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Also Published As
Publication number | Publication date |
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US8330272B2 (en) | 2012-12-11 |
US20130099376A1 (en) | 2013-04-25 |
US20120007232A1 (en) | 2012-01-12 |
US8723318B2 (en) | 2014-05-13 |
KR101865234B1 (ko) | 2018-06-07 |
CN103201835A (zh) | 2013-07-10 |
WO2012006403A1 (en) | 2012-01-12 |
EP2591501A1 (en) | 2013-05-15 |
KR20130130685A (ko) | 2013-12-02 |
TW201208024A (en) | 2012-02-16 |
TWI456717B (zh) | 2014-10-11 |
JP2017022408A (ja) | 2017-01-26 |
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