ATE463537T1 - Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung - Google Patents

Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung

Info

Publication number
ATE463537T1
ATE463537T1 AT04773343T AT04773343T ATE463537T1 AT E463537 T1 ATE463537 T1 AT E463537T1 AT 04773343 T AT04773343 T AT 04773343T AT 04773343 T AT04773343 T AT 04773343T AT E463537 T1 ATE463537 T1 AT E463537T1
Authority
AT
Austria
Prior art keywords
semiconductor device
per molecule
aryl group
group per
organopolysiloxane
Prior art date
Application number
AT04773343T
Other languages
English (en)
Inventor
Yoshitsugu Morita
Masayoshi Terada
Hiroji Enami
Tomoko Kato
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34419307&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE463537(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE463537T1 publication Critical patent/ATE463537T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Silicon Polymers (AREA)
AT04773343T 2003-10-01 2004-09-14 Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung ATE463537T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003343622A JP4908736B2 (ja) 2003-10-01 2003-10-01 硬化性オルガノポリシロキサン組成物および半導体装置
PCT/JP2004/013724 WO2005033207A1 (en) 2003-10-01 2004-09-14 Curable organopolysiloxane composition and semiconductor device

Publications (1)

Publication Number Publication Date
ATE463537T1 true ATE463537T1 (de) 2010-04-15

Family

ID=34419307

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04773343T ATE463537T1 (de) 2003-10-01 2004-09-14 Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung

Country Status (9)

Country Link
US (1) US7527871B2 (de)
EP (1) EP1670863B1 (de)
JP (1) JP4908736B2 (de)
KR (3) KR101499709B1 (de)
CN (1) CN100378172C (de)
AT (1) ATE463537T1 (de)
DE (1) DE602004026456D1 (de)
TW (1) TWI341857B (de)
WO (1) WO2005033207A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9593277B2 (en) 2014-02-04 2017-03-14 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product therefrom, and optical semiconductor device
US9909007B2 (en) 2013-08-29 2018-03-06 Dow Corning Corporation Curable silicone composition, cured product thereof, and optical semiconductor device
US9944759B2 (en) 2014-02-04 2018-04-17 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product therefrom, and optical semiconductor device

Families Citing this family (126)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7192795B2 (en) * 2004-11-18 2007-03-20 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US7314770B2 (en) * 2004-11-18 2008-01-01 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
WO2006127100A1 (en) * 2005-05-26 2006-11-30 Dow Corning Corporation Process and silicone encapsulant composition for molding small shapes
JP5247979B2 (ja) * 2005-06-01 2013-07-24 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 透明な硬化物を与えるポリオルガノシロキサン組成物
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP2007063538A (ja) * 2005-08-03 2007-03-15 Shin Etsu Chem Co Ltd 発光ダイオード用付加硬化型シリコーン樹脂組成物
EP1749861B1 (de) * 2005-08-03 2014-08-20 Shin-Etsu Chemical Co., Ltd. Additionsvernetzendes Silkonharz für Leuchtdioden (LED)
US8187726B2 (en) * 2005-08-09 2012-05-29 Sony Corporation Nanoparticle-resin composite material, light emitting device assembly, and filling material for the light-emitting device assembly
US20070092737A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US20070092736A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US7595515B2 (en) * 2005-10-24 2009-09-29 3M Innovative Properties Company Method of making light emitting device having a molded encapsulant
CN101297411B (zh) * 2005-10-24 2010-05-19 3M创新有限公司 发光器件的制造方法及发光器件
KR101302277B1 (ko) 2005-10-28 2013-09-02 스미토모 오사카 세멘토 가부시키가이샤 무기산화물 투명 분산액과 무기산화물 입자 함유 수지조성물, 발광소자 밀봉용 조성물 및 발광소자,하드코트막과 광학 기능막 및 광학 부품, 그리고무기산화물 입자 함유 수지 조성물의 제조 방법
EP1973963B1 (de) 2006-01-17 2013-06-19 Dow Corning Corporation Thermisch stabile transparente silikonharzzusammensetzungen und verfahren zu ihrer herstellung und verwendung
KR101394101B1 (ko) * 2006-02-01 2014-05-14 다우 코닝 코포레이션 내충격성 광학 도파관 및 이의 제조방법
JP2009527622A (ja) * 2006-02-24 2009-07-30 ダウ・コーニング・コーポレイション シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物
JP5060074B2 (ja) 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
US20070269586A1 (en) * 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
US7655486B2 (en) * 2006-05-17 2010-02-02 3M Innovative Properties Company Method of making light emitting device with multilayer silicon-containing encapsulant
JP5202822B2 (ja) * 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
US8092735B2 (en) * 2006-08-17 2012-01-10 3M Innovative Properties Company Method of making a light emitting device having a molded encapsulant
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
ATE536558T1 (de) 2006-08-28 2011-12-15 Dow Corning Optische bauelemente und silikonzusammensetzungen sowie verfahren zur herstellung der optischen bauelemente
TWI361205B (en) * 2006-10-16 2012-04-01 Rohm & Haas Heat stable aryl polysiloxane compositions
US9944031B2 (en) * 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
EP2111651A4 (de) * 2007-02-13 2011-08-17 3M Innovative Properties Co Led mit linsen und verfahren zu ihrer herstellung
TWI434890B (zh) * 2007-04-06 2014-04-21 Shinetsu Chemical Co 加成可硬化聚矽氧樹脂組成物及使用彼之聚矽氧鏡片
US7960192B2 (en) * 2007-09-14 2011-06-14 3M Innovative Properties Company Light emitting device having silicon-containing composition and method of making same
WO2009111190A1 (en) * 2008-03-04 2009-09-11 Dow Corning Corporation Silicone composition, silicone adhesive, coated and laminated substrates
JP5972512B2 (ja) * 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2010013503A (ja) * 2008-07-01 2010-01-21 Showa Highpolymer Co Ltd 硬化性樹脂組成物およびオプトデバイス
JP5469874B2 (ja) 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
JP5769622B2 (ja) * 2008-10-31 2015-08-26 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
JP4862032B2 (ja) * 2008-12-05 2012-01-25 信越化学工業株式会社 高屈折率を有する硬化物を与える付加硬化型シリコーン組成物、及び該組成物からなる光学素子封止材
JP5526823B2 (ja) * 2009-02-24 2014-06-18 信越化学工業株式会社 シリコーン樹脂で封止された光半導体装置
KR101705262B1 (ko) 2009-05-29 2017-02-09 다우 코닝 코포레이션 투명 실리콘 재료 및 광학 기기를 제조하기 위한 실리콘 조성물
KR101030019B1 (ko) 2009-12-31 2011-04-20 제일모직주식회사 봉지재용 투광성 수지 및 이를 포함하는 전자 소자
WO2011090361A2 (ko) * 2010-01-25 2011-07-28 (주)Lg화학 경화성 조성물
US9410018B2 (en) 2010-01-25 2016-08-09 Lg Chem, Ltd. Curable composition
DE202011110489U1 (de) * 2010-01-25 2014-04-17 Lg Chem, Ltd. Härtbare Zusammensetzung
CN102712756B (zh) * 2010-01-25 2017-05-03 Lg化学株式会社 有机硅树脂
US9299896B2 (en) 2010-01-25 2016-03-29 Lg Chem, Ltd. Curable composition
EP2554601A4 (de) * 2010-03-31 2013-10-09 Sekisui Chemical Co Ltd Dichtungsmittel für optische halbleiter und optisches halbleiterbauelement
JP5377401B2 (ja) * 2010-04-20 2013-12-25 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物
JP2012007136A (ja) * 2010-05-21 2012-01-12 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置
JP5368379B2 (ja) * 2010-06-07 2013-12-18 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物及びそれを用いた半導体装置
JP5640476B2 (ja) * 2010-06-08 2014-12-17 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び発光装置
WO2011162294A1 (ja) * 2010-06-24 2011-12-29 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
WO2012014560A1 (ja) * 2010-07-27 2012-02-02 株式会社Adeka 半導体封止用硬化性組成物
TWI483995B (zh) 2010-08-18 2015-05-11 Cheil Ind Inc 聚有機矽氧烷與由該聚有機矽氧烷獲得之封裝材料以及包含該封裝材料之電子元件
WO2012053301A1 (ja) * 2010-10-19 2012-04-26 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP2012097225A (ja) * 2010-11-04 2012-05-24 Daicel Corp 硬化性樹脂組成物及び硬化物
JP2012111875A (ja) * 2010-11-25 2012-06-14 Daicel Corp 硬化性樹脂組成物及び硬化物
JP5690571B2 (ja) * 2010-12-07 2015-03-25 株式会社ダイセル 硬化性樹脂組成物
JP5323037B2 (ja) * 2010-12-14 2013-10-23 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
TWI435914B (zh) 2010-12-31 2014-05-01 Eternal Chemical Co Ltd 可固化之有機聚矽氧烷組合物及其製法
US8895662B2 (en) 2010-12-31 2014-11-25 Eternal Chemical Co., Ltd. Curable composition and method for manufacturing the same
US9045639B2 (en) 2010-12-31 2015-06-02 Eternal Materials Co., Ltd. Curable composition and method for manufacturing the same
KR20120078606A (ko) * 2010-12-31 2012-07-10 제일모직주식회사 봉지재 및 상기 봉지재를 포함하는 전자 소자
KR101539486B1 (ko) * 2011-01-06 2015-07-24 주식회사 엘지화학 경화성 조성물
JP5348147B2 (ja) * 2011-01-11 2013-11-20 信越化学工業株式会社 仮接着材組成物、及び薄型ウエハの製造方法
DE102011004789A1 (de) * 2011-02-25 2012-08-30 Wacker Chemie Ag Selbsthaftende, zu Elastomeren vernetzbare Siliconzusammensetzungen
JP5522111B2 (ja) 2011-04-08 2014-06-18 信越化学工業株式会社 シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
EP2706095B1 (de) * 2011-05-04 2021-03-03 LG Chem, Ltd. Härtbare zusammensetzung
JP5760664B2 (ja) * 2011-05-10 2015-08-12 三菱化学株式会社 シリコーン系封止材組成物及び半導体発光装置
JP5603837B2 (ja) * 2011-06-30 2014-10-08 信越化学工業株式会社 付加硬化型シリコーン組成物及び光学素子
WO2013008842A1 (ja) * 2011-07-14 2013-01-17 積水化学工業株式会社 光半導体装置用封止剤及び光半導体装置
KR101136888B1 (ko) * 2011-07-27 2012-04-20 (주)에버텍엔터프라이즈 발광 다이오드용 폴리유기실리콘 조성물
CN103748171B (zh) * 2011-08-10 2016-03-16 株式会社艾迪科 含硅固化性组合物及其固化物
JP5893874B2 (ja) 2011-09-02 2016-03-23 信越化学工業株式会社 光半導体装置
JP5937798B2 (ja) * 2011-09-07 2016-06-22 株式会社ダイセル ラダー型シルセスキオキサン及びその製造方法、並びに、硬化性樹脂組成物及びその硬化物
EP2784123B1 (de) * 2011-11-25 2019-09-04 LG Chem, Ltd. Härtbare zusammensetzung
TWI473839B (zh) * 2011-11-25 2015-02-21 Lg Chemical Ltd 可固化組成物
TWI498356B (zh) * 2011-11-25 2015-09-01 Lg Chemical Ltd 有機聚矽氧烷
EP2784127B1 (de) 2011-11-25 2019-03-27 LG Chem, Ltd. Härtbare zusammensetzung
TWI480335B (zh) * 2011-11-25 2015-04-11 Lg Chemical Ltd 可固化組成物
TWI473842B (zh) * 2011-11-25 2015-02-21 Lg Chemical Ltd 可固化之組成物
CN104066771B (zh) * 2011-11-25 2016-12-28 Lg化学株式会社 制备有机聚硅氧烷的方法
DE102012200335A1 (de) * 2012-01-11 2013-07-11 Wacker Chemie Ag Hitzestabilisierte Siliconmischung
JP5575820B2 (ja) 2012-01-31 2014-08-20 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物、光学素子封止材および光学素子
JP5660145B2 (ja) * 2012-04-03 2015-01-28 Jsr株式会社 硬化性組成物、硬化物および光半導体装置
CN104583278B (zh) 2012-05-14 2018-04-10 莫门蒂夫性能材料股份有限公司 高折射率材料
CN104508048B (zh) * 2012-07-27 2017-08-25 Lg化学株式会社 可固化组合物
KR101560046B1 (ko) * 2012-07-27 2015-10-15 주식회사 엘지화학 경화성 조성물
TWI519604B (zh) 2012-07-27 2016-02-01 Ｌｇ化學股份有限公司 可固化組成物
US9346954B2 (en) * 2012-09-14 2016-05-24 The Yokohama Rubber Co., Ltd. Curable resin composition
US9660155B2 (en) 2012-11-28 2017-05-23 Lg Chem, Ltd. Light emitting diode
JP6006632B2 (ja) 2012-12-18 2016-10-12 信越化学工業株式会社 付加硬化型シリコーン組成物及び光学素子
JP6096087B2 (ja) 2012-12-21 2017-03-15 信越化学工業株式会社 硬化性シリコーン樹脂組成物、その硬化物及び光半導体デバイス
JP5985981B2 (ja) * 2012-12-28 2016-09-06 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP5819866B2 (ja) 2013-01-10 2015-11-24 信越化学工業株式会社 付加硬化型シリコーン組成物、光学素子封止材および光学素子
WO2014163439A1 (ko) * 2013-04-04 2014-10-09 주식회사 엘지화학 경화성 조성물
JP6237880B2 (ja) * 2013-04-04 2017-11-29 エルジー・ケム・リミテッド 硬化性組成物
CN103525095A (zh) * 2013-09-30 2014-01-22 瑞金市瑞谷科技发展有限公司 一种可固化的有机基聚硅氧烷组合物
CN103724939A (zh) * 2013-12-26 2014-04-16 东莞市广海大橡塑科技有限公司 一种封装二极管
WO2015111409A1 (en) * 2014-01-27 2015-07-30 Dow Corning Toray Co., Ltd. Silicone gel composition
WO2015115811A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
TWI558772B (zh) 2014-01-28 2016-11-21 Ｌｇ化學股份有限公司 固化產物
KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
JP6100717B2 (ja) 2014-03-05 2017-03-22 信越化学工業株式会社 付加硬化型シリコーン組成物及び光学素子
TWI506058B (zh) * 2014-03-18 2015-11-01 Benq Materials Corp 可固化矽樹脂組成物
WO2015194159A1 (ja) * 2014-06-20 2015-12-23 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびその製造方法
JP6325471B2 (ja) * 2015-03-02 2018-05-16 株式会社東芝 光結合装置および絶縁装置
US9416273B1 (en) 2015-04-30 2016-08-16 Eternal Materials Co., Ltd. Curable composition and method for manufacturing the same
CN106317895B (zh) * 2015-06-30 2019-09-06 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
KR101720220B1 (ko) 2015-08-21 2017-03-28 주식회사 케이씨씨 오르가노 폴리실록산 조성물
DE102015225921A1 (de) 2015-12-18 2017-06-22 Wacker Chemie Ag Siloxanharzzusammensetzungen
DE102015225906A1 (de) 2015-12-18 2017-06-22 Wacker Chemie Ag Siloxanharzzusammensetzungen
WO2017126199A1 (ja) * 2016-01-19 2017-07-27 セントラル硝子株式会社 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置
JP6481647B2 (ja) 2016-03-22 2019-03-13 信越化学工業株式会社 紫外線硬化性シリコーン組成物、その硬化物、及び該組成物からなる光学素子封止材、並びに該光学素子封止材により封止された光学素子
KR102165826B1 (ko) * 2016-08-12 2020-10-15 와커 헤미 아게 경화성 오르가노폴리실록산 조성물, 캡슐화제 및 반도체 장치
JP6754317B2 (ja) * 2017-04-27 2020-09-09 信越化学工業株式会社 付加硬化型シリコーン組成物、該組成物の製造方法、シリコーン硬化物、及び光学素子
CN107541075B (zh) * 2017-09-28 2021-07-23 广州慧谷化学有限公司 热熔型有机聚硅氧烷组合物、荧光体片材及半导体器件
US11549039B2 (en) * 2017-10-19 2023-01-10 Dow Silicones Corporation Pressure sensitive adhesive composition and methods for its preparation and use in flexible organic light emitting diode applications
TW201917173A (zh) * 2017-10-20 2019-05-01 日商道康寧東麗股份有限公司 固化性矽組合物以及光半導體裝置
KR102690829B1 (ko) 2018-01-11 2024-08-02 바스프 에스이 C₂-c₃-알케닐-치환된 릴렌 이미드 염료, 및 경화성 실리콘 수지 조성물 및 c₂-c₃-알케닐-치환된 릴렌 이미드 염료의 경화 생성물
TWI787444B (zh) * 2018-02-07 2022-12-21 日商陶氏東麗股份有限公司 可固化聚矽氧組成物、其固化產物、及光學半導體裝置
TWI798343B (zh) * 2018-03-12 2023-04-11 美商陶氏有機矽公司 可固化聚矽氧組成物及其經固化產物
JP2020007537A (ja) 2018-06-29 2020-01-16 信越化学工業株式会社 硬化性有機ケイ素樹脂組成物及び半導体装置
CN111819254B (zh) * 2018-08-31 2022-06-10 瓦克化学股份公司 可固化的有机聚硅氧烷组合物、密封剂和半导体器件
TWI844552B (zh) 2018-09-10 2024-06-11 美商陶氏有機矽公司 用於生產光學聚矽氧總成之方法、及藉其生產之光學聚矽氧總成
JP7021046B2 (ja) * 2018-10-22 2022-02-16 信越化学工業株式会社 付加硬化型シリコーン組成物、シリコーン硬化物、及び、光学素子
JP7099355B2 (ja) 2019-02-18 2022-07-12 信越化学工業株式会社 熱硬化性シリコーン組成物およびその硬化物
KR102475013B1 (ko) 2019-08-06 2022-12-07 다우 실리콘즈 코포레이션 이중 경화 조성물
JP7556522B2 (ja) * 2020-08-14 2024-09-26 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止材、および光半導体装置
TW202428780A (zh) * 2022-12-05 2024-07-16 美商陶氏有機矽公司 Ｕｖ可固化聚矽氧組成物

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3996195A (en) * 1974-11-15 1976-12-07 Shinetsu Chemical Company Curable organosilicon compositions
US3944519A (en) * 1975-03-13 1976-03-16 Dow Corning Corporation Curable organopolysiloxane compositions
US4234713A (en) * 1979-05-29 1980-11-18 Dow Corning Corporation Curable solventless organopolysiloxane compositions
HU203712B (en) * 1985-09-02 1991-09-30 Sarkadi Cukorgyar Soil-improving and fertilizer-producing process with composting slams of sugar-mills
US5272013A (en) * 1992-08-21 1993-12-21 General Electric Company Articles made of high refractive index phenol-modified siloxanes
JP3574226B2 (ja) 1994-10-28 2004-10-06 東レ・ダウコーニング・シリコーン株式会社 硬化性シリコーン組成物およびその硬化物
JP3618446B2 (ja) * 1995-10-18 2005-02-09 東レ・ダウコーニング・シリコーン株式会社 電子部品含浸用オルガノポリシロキサン組成物および電子部品
JP3638746B2 (ja) * 1997-01-30 2005-04-13 東レ・ダウコーニング・シリコーン株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3983333B2 (ja) * 1997-02-20 2007-09-26 信越化学工業株式会社 付加反応硬化型オルガノポリシロキサン組成物
JP3344286B2 (ja) 1997-06-12 2002-11-11 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
JP3765444B2 (ja) * 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3482115B2 (ja) * 1997-10-13 2003-12-22 東レ・ダウコーニング・シリコーン株式会社 硬化性シリコーン組成物および電子部品
JP3523098B2 (ja) * 1998-12-28 2004-04-26 信越化学工業株式会社 付加硬化型シリコーン組成物
US6432137B1 (en) * 1999-09-08 2002-08-13 Medennium, Inc. High refractive index silicone for use in intraocular lenses
JP4040858B2 (ja) 2001-10-19 2008-01-30 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2004186168A (ja) * 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
EP1644989B9 (de) * 2003-07-07 2012-04-04 Dow Corning Corporation Einkapselung für solarzellen
DE10359705A1 (de) * 2003-12-18 2005-07-14 Wacker-Chemie Gmbh Additionsvernetzende Siliconharzzusammensetzungen

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9909007B2 (en) 2013-08-29 2018-03-06 Dow Corning Corporation Curable silicone composition, cured product thereof, and optical semiconductor device
US9593277B2 (en) 2014-02-04 2017-03-14 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product therefrom, and optical semiconductor device
US9944759B2 (en) 2014-02-04 2018-04-17 Dow Corning Toray Co., Ltd. Curable silicone composition, cured product therefrom, and optical semiconductor device

Also Published As

Publication number Publication date
JP2005105217A (ja) 2005-04-21
US20070112147A1 (en) 2007-05-17
KR101499709B1 (ko) 2015-03-06
DE602004026456D1 (de) 2010-05-20
KR20140064931A (ko) 2014-05-28
WO2005033207A1 (en) 2005-04-14
EP1670863B1 (de) 2010-04-07
JP4908736B2 (ja) 2012-04-04
US7527871B2 (en) 2009-05-05
TWI341857B (en) 2011-05-11
KR20150006490A (ko) 2015-01-16
CN1863875A (zh) 2006-11-15
EP1670863A1 (de) 2006-06-21
KR20060096429A (ko) 2006-09-11
KR101699383B1 (ko) 2017-01-24
TW200524987A (en) 2005-08-01
CN100378172C (zh) 2008-04-02

Similar Documents

Publication Publication Date Title
ATE463537T1 (de) Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
DE602007003724D1 (de) Härtbare organopolysiloxan-zusammensetzung und halbleiterbauelement
KR101913869B1 (ko) 경화성 실리콘 수지 조성물
JP4933179B2 (ja) 硬化性シリコーンゴム組成物及びその硬化物
HK1116208A1 (en) Silicone composition for encapsulating luminescent element and luminescent device
DE602007004235D1 (de) Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
TWI397558B (zh) A method for producing a composite molded product of a hardened silicone rubber composition and a liquid crystal polymer and a silicone rubber
TWI475074B (zh) 可固化之有機聚矽氧烷組合物及其固化產品
JP4644129B2 (ja) 硬化性シリコーンゴム組成物及びその硬化物
JP5279197B2 (ja) 硬化性有機ケイ素組成物およびその硬化物
DE602004026452D1 (de) Silikonelastomerklebefolie
TW200734403A (en) Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
TW200617104A (en) Self-adhesive addition reaction-curable silicone composition
CA2477970A1 (en) High fracture toughness hydrosilyation cured silicone resin
TW200609282A (en) Heat-conductive silicone rubber composition and molded article
TW200708566A (en) Curable silicone composition and electronic device produced therefrom
TW200621897A (en) Room temperature curable organic polysiloxane composition
WO2014104389A3 (en) Curable silicone composition, cured product thereof, and optical semiconductor device
TW201843239A (zh) 加成硬化型聚矽氧組成物、該組成物之製造方法、聚矽氧硬化物及光學元件
KR930016518A (ko) 조절 제거형 실리콘 감압 접착제
JPH07216232A (ja) 紫外線硬化型オルガノポリシロキサン組成物
MY155700A (en) Organopolysiloxane, method of manufacturing thereof, curable silicone composition, and cured product thereof
TW201906977A (zh) 固晶用矽氧樹脂組成物、固晶材料及光半導體裝置
JPWO2018061754A1 (ja) 架橋性オルガノポリシロキサン組成物、その硬化物及びｌｅｄ装置
JP7347388B2 (ja) 紫外線硬化型有機変性シリコーン組成物および硬化物

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties