ATE454430T1 - Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung - Google Patents
Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtungInfo
- Publication number
- ATE454430T1 ATE454430T1 AT07791537T AT07791537T ATE454430T1 AT E454430 T1 ATE454430 T1 AT E454430T1 AT 07791537 T AT07791537 T AT 07791537T AT 07791537 T AT07791537 T AT 07791537T AT E454430 T1 ATE454430 T1 AT E454430T1
- Authority
- AT
- Austria
- Prior art keywords
- organopolysiloxane composition
- curable organopolysiloxane
- silicon
- organopolysiloxane
- semiconductor device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006229551A JP5148088B2 (ja) | 2006-08-25 | 2006-08-25 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
PCT/JP2007/064843 WO2008023537A1 (en) | 2006-08-25 | 2007-07-24 | Curable orgnopolysiloxane composition and semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE454430T1 true ATE454430T1 (de) | 2010-01-15 |
Family
ID=38596765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07791537T ATE454430T1 (de) | 2006-08-25 | 2007-07-24 | Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung |
Country Status (10)
Country | Link |
---|---|
US (1) | US8217388B2 (de) |
EP (1) | EP2061840B1 (de) |
JP (1) | JP5148088B2 (de) |
KR (1) | KR101408711B1 (de) |
CN (1) | CN101506309B (de) |
AT (1) | ATE454430T1 (de) |
DE (1) | DE602007004235D1 (de) |
MY (1) | MY145422A (de) |
TW (1) | TWI398488B (de) |
WO (1) | WO2008023537A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9593277B2 (en) | 2014-02-04 | 2017-03-14 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
US9944759B2 (en) | 2014-02-04 | 2018-04-17 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4895879B2 (ja) | 2007-03-19 | 2012-03-14 | サンユレック株式会社 | 発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法 |
JP5000566B2 (ja) * | 2008-03-27 | 2012-08-15 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置 |
US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
JP2010013503A (ja) * | 2008-07-01 | 2010-01-21 | Showa Highpolymer Co Ltd | 硬化性樹脂組成物およびオプトデバイス |
JP5469874B2 (ja) * | 2008-09-05 | 2014-04-16 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 |
JP5414337B2 (ja) * | 2009-04-17 | 2014-02-12 | 信越化学工業株式会社 | 光半導体装置の封止方法 |
KR101705262B1 (ko) * | 2009-05-29 | 2017-02-09 | 다우 코닝 코포레이션 | 투명 실리콘 재료 및 광학 기기를 제조하기 위한 실리콘 조성물 |
JP2011155188A (ja) * | 2010-01-28 | 2011-08-11 | Konica Minolta Opto Inc | 発光ダイオードユニットの製造方法 |
JP2011155187A (ja) * | 2010-01-28 | 2011-08-11 | Konica Minolta Opto Inc | 発光ダイオードユニットの製造方法 |
JP5621272B2 (ja) * | 2010-02-15 | 2014-11-12 | 横浜ゴム株式会社 | シリコーン樹脂組成物、およびこれを用いる光半導体封止体 |
JP5801208B2 (ja) * | 2010-07-27 | 2015-10-28 | 株式会社Adeka | 半導体封止用硬化性組成物 |
JP5971835B2 (ja) * | 2010-08-23 | 2016-08-17 | 信越化学工業株式会社 | 硬化性シリコーン樹脂組成物及びそれを用いた発光ダイオード装置 |
KR101477609B1 (ko) | 2010-09-22 | 2014-12-31 | 다우 코닝 코포레이션 | 수지-선형 유기실록산 블록 공중합체를 함유하는 고굴절률 조성물 |
JP2013543030A (ja) * | 2010-10-19 | 2013-11-28 | エイブルスティック・(シャンハイ)・リミテッド | 発光デバイス用ハイブリッドシリコーン組成物 |
JP5549554B2 (ja) * | 2010-11-15 | 2014-07-16 | 信越化学工業株式会社 | 熱硬化性フルオロポリエーテル系接着剤組成物及びその接着方法 |
CN103189451B (zh) * | 2010-12-22 | 2015-04-29 | 迈图高新材料日本合同公司 | 紫外线固化型有机硅树脂组合物及使用其的图像显示装置 |
KR101790820B1 (ko) | 2010-12-22 | 2017-10-26 | 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 | 열경화형 폴리오르가노실록산 조성물 및 그 사용 |
JP5522111B2 (ja) | 2011-04-08 | 2014-06-18 | 信越化学工業株式会社 | シリコーン樹脂組成物及び当該組成物を使用した光半導体装置 |
WO2012151747A1 (en) | 2011-05-11 | 2012-11-15 | Henkel (China) Company Limited | Silicone resin with improved barrier properties |
WO2012157330A1 (ja) * | 2011-05-17 | 2012-11-22 | 積水化学工業株式会社 | 光半導体装置用封止剤及び光半導体装置 |
JP5287935B2 (ja) * | 2011-06-16 | 2013-09-11 | 東レ株式会社 | 蛍光体含有シート、それを用いたled発光装置およびその製造方法 |
JP5992666B2 (ja) * | 2011-06-16 | 2016-09-14 | 東レ・ダウコーニング株式会社 | 架橋性シリコーン組成物及びその架橋物 |
KR20140048240A (ko) * | 2011-07-07 | 2014-04-23 | 다우 코닝 도레이 캄파니 리미티드 | 오르가노폴리실록산 및 그 제조 방법 |
JP5893874B2 (ja) | 2011-09-02 | 2016-03-23 | 信越化学工業株式会社 | 光半導体装置 |
JP5912600B2 (ja) * | 2011-09-16 | 2016-04-27 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
KR101865922B1 (ko) | 2011-09-30 | 2018-06-11 | 롬엔드하스전자재료코리아유한회사 | 유기실록산 중합체를 포함하는 저온 경화성 수지 조성물 |
JP5921154B2 (ja) * | 2011-11-09 | 2016-05-24 | 日東電工株式会社 | 光学フィルム、画像表示装置および画像表示装置の製造方法 |
TWI471381B (zh) * | 2011-11-25 | 2015-02-01 | Lg Chemical Ltd | 可固化組成物 |
JP2013139547A (ja) * | 2011-12-05 | 2013-07-18 | Jsr Corp | 硬化性組成物、硬化物および光半導体装置 |
JP5621819B2 (ja) * | 2011-12-20 | 2014-11-12 | Jsr株式会社 | 硬化性組成物、硬化物および光半導体装置 |
JP5652387B2 (ja) * | 2011-12-22 | 2015-01-14 | 信越化学工業株式会社 | 高信頼性硬化性シリコーン樹脂組成物及びそれを使用した光半導体装置 |
JP5575820B2 (ja) * | 2012-01-31 | 2014-08-20 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物、光学素子封止材および光学素子 |
CN104583278B (zh) | 2012-05-14 | 2018-04-10 | 莫门蒂夫性能材料股份有限公司 | 高折射率材料 |
JP5819787B2 (ja) * | 2012-07-19 | 2015-11-24 | 信越化学工業株式会社 | 硬化性シリコーン樹脂組成物 |
JP2014031394A (ja) * | 2012-08-01 | 2014-02-20 | Shin Etsu Chem Co Ltd | 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置 |
CN104662068A (zh) | 2012-08-02 | 2015-05-27 | 汉高股份有限公司 | 聚碳硅烷和包含其的用于led封装剂的可固化组合物 |
EP2880095B1 (de) | 2012-08-02 | 2017-03-29 | Henkel AG & Co. KGaA | Härtbare zusammensetzungen für led-verkapselungen mit einem polycarbosilan und hydrosilicium |
DE102012220954A1 (de) * | 2012-11-16 | 2014-05-22 | Wacker Chemie Ag | Schleifbare Siliconelastomerzusammensetzung und deren Verwendung |
WO2014084624A1 (ko) * | 2012-11-30 | 2014-06-05 | 코오롱생명과학 주식회사 | 광디바이스용 경화형 투명 실리콘 조성물 |
KR101667839B1 (ko) * | 2013-04-04 | 2016-10-19 | 주식회사 엘지화학 | 경화성 조성물 |
CN103525095A (zh) * | 2013-09-30 | 2014-01-22 | 瑞金市瑞谷科技发展有限公司 | 一种可固化的有机基聚硅氧烷组合物 |
US10468279B2 (en) | 2013-12-26 | 2019-11-05 | Kateeva, Inc. | Apparatus and techniques for thermal treatment of electronic devices |
US9343678B2 (en) * | 2014-01-21 | 2016-05-17 | Kateeva, Inc. | Apparatus and techniques for electronic device encapsulation |
EP3624175B1 (de) | 2014-01-21 | 2021-12-22 | Kateeva, Inc. | Verfahren zur verkapselung einer elektronischen vorrichtung |
EP3099746B1 (de) | 2014-01-27 | 2021-05-05 | Dow Toray Co., Ltd. | Silikongelzusammensetzung |
KR20150097947A (ko) * | 2014-02-19 | 2015-08-27 | 다우 코닝 코포레이션 | 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물 |
JP6323086B2 (ja) * | 2014-03-12 | 2018-05-16 | Jnc株式会社 | 熱硬化性樹脂組成物及びそれを用いた物品 |
CN105038253B (zh) * | 2014-04-30 | 2018-07-13 | 长兴材料工业股份有限公司 | 可固化组合物及其制法 |
KR102390045B1 (ko) | 2014-04-30 | 2022-04-22 | 카티바, 인크. | 가스 쿠션 장비 및 기판 코팅 기술 |
CN105199397B (zh) * | 2014-06-17 | 2018-05-08 | 广州慧谷化学有限公司 | 一种可固化的有机聚硅氧烷组合物及半导体器件 |
WO2016006773A1 (ko) * | 2014-07-10 | 2016-01-14 | 삼성에스디아이 주식회사 | 경화형 폴리오르가노실록산 조성물, 봉지재, 및 광학기기 |
CN106660031A (zh) * | 2014-08-12 | 2017-05-10 | 国立大学法人九州大学 | 氢化硅烷化反应催化剂 |
TW201800491A (zh) * | 2016-03-07 | 2018-01-01 | 道康寧公司 | 光可固化聚矽氧組成物及其經固化產物 |
CN105694047B (zh) * | 2016-04-26 | 2018-09-25 | 烟台德邦先进硅材料有限公司 | 主链含环状结构改性有机硅聚合物及其制备方法 |
US11248091B2 (en) | 2016-09-29 | 2022-02-15 | Dow Toray Co., Ltd. | Curable silicone composition, cured product thereof, and optical semiconductor device |
WO2018155131A1 (ja) * | 2017-02-27 | 2018-08-30 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
TWI627777B (zh) * | 2017-07-26 | 2018-06-21 | 財團法人工業技術研究院 | 光學補償結構 |
CN107541076A (zh) * | 2017-09-28 | 2018-01-05 | 广州慧谷化学有限公司 | 高耐热的有机聚硅氧烷组合物及半导体器件 |
JP6905486B2 (ja) * | 2018-03-13 | 2021-07-21 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物、シリコーン硬化物、及び半導体装置 |
JP6966381B2 (ja) * | 2018-05-09 | 2021-11-17 | 信越化学工業株式会社 | プライマー組成物及びこれを用いた光半導体装置 |
CN110982346A (zh) * | 2019-12-12 | 2020-04-10 | 浙江福斯特新材料研究院有限公司 | 墨水组合物、封装结构及半导体器件 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3899134B2 (ja) * | 1993-12-29 | 2007-03-28 | 東レ・ダウコーニング株式会社 | 加熱硬化性シリコーン組成物 |
JP3574226B2 (ja) | 1994-10-28 | 2004-10-06 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性シリコーン組成物およびその硬化物 |
JP3344286B2 (ja) | 1997-06-12 | 2002-11-11 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物 |
JP4875251B2 (ja) * | 2001-04-26 | 2012-02-15 | 東レ・ダウコーニング株式会社 | シリコーンゲル組成物 |
JP4040858B2 (ja) * | 2001-10-19 | 2008-01-30 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP4663969B2 (ja) * | 2002-07-09 | 2011-04-06 | 東レ・ダウコーニング株式会社 | 硬化性シリコーンレジン組成物およびその硬化物 |
JP4409160B2 (ja) * | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP4908736B2 (ja) * | 2003-10-01 | 2012-04-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP2005162859A (ja) * | 2003-12-02 | 2005-06-23 | Dow Corning Toray Silicone Co Ltd | 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材 |
JP4801320B2 (ja) * | 2003-12-19 | 2011-10-26 | 東レ・ダウコーニング株式会社 | 付加反応硬化型オルガノポリシロキサン樹脂組成物 |
JP2006063092A (ja) * | 2004-07-29 | 2006-03-09 | Dow Corning Toray Co Ltd | 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤 |
EP1674495A1 (de) * | 2004-12-22 | 2006-06-28 | Huntsman Advanced Materials (Switzerland) GmbH | Beschichtungssystem |
JP4636242B2 (ja) * | 2005-04-21 | 2011-02-23 | 信越化学工業株式会社 | 光半導体素子封止材及び光半導体素子 |
EP1973963B1 (de) * | 2006-01-17 | 2013-06-19 | Dow Corning Corporation | Thermisch stabile transparente silikonharzzusammensetzungen und verfahren zu ihrer herstellung und verwendung |
JP5202822B2 (ja) * | 2006-06-23 | 2013-06-05 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
-
2006
- 2006-08-25 JP JP2006229551A patent/JP5148088B2/ja active Active
-
2007
- 2007-07-13 TW TW096125678A patent/TWI398488B/zh active
- 2007-07-24 US US12/438,658 patent/US8217388B2/en active Active
- 2007-07-24 KR KR1020097003829A patent/KR101408711B1/ko active IP Right Grant
- 2007-07-24 EP EP07791537A patent/EP2061840B1/de active Active
- 2007-07-24 MY MYPI20090723A patent/MY145422A/en unknown
- 2007-07-24 WO PCT/JP2007/064843 patent/WO2008023537A1/en active Application Filing
- 2007-07-24 DE DE602007004235T patent/DE602007004235D1/de active Active
- 2007-07-24 AT AT07791537T patent/ATE454430T1/de not_active IP Right Cessation
- 2007-07-24 CN CN2007800316498A patent/CN101506309B/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9593277B2 (en) | 2014-02-04 | 2017-03-14 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
US9944759B2 (en) | 2014-02-04 | 2018-04-17 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
US20100301377A1 (en) | 2010-12-02 |
EP2061840A1 (de) | 2009-05-27 |
DE602007004235D1 (de) | 2010-02-25 |
CN101506309A (zh) | 2009-08-12 |
US8217388B2 (en) | 2012-07-10 |
WO2008023537A1 (en) | 2008-02-28 |
EP2061840B1 (de) | 2010-01-06 |
TWI398488B (zh) | 2013-06-11 |
KR20090054429A (ko) | 2009-05-29 |
TW200811244A (en) | 2008-03-01 |
MY145422A (en) | 2012-02-15 |
CN101506309B (zh) | 2012-03-21 |
JP2008050494A (ja) | 2008-03-06 |
JP5148088B2 (ja) | 2013-02-20 |
KR101408711B1 (ko) | 2014-06-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE454430T1 (de) | Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung | |
DE602007003724D1 (de) | Härtbare organopolysiloxan-zusammensetzung und halbleiterbauelement | |
MY156257A (en) | Curable organopolysiloxane composition and semiconductor device | |
MY158361A (en) | Curable organopolysiloxane composition and semiconductor device | |
ATE463537T1 (de) | Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung | |
ATE463536T1 (de) | Silikonelastomerklebefolie | |
MY159882A (en) | Curable silicone composition | |
TW200728404A (en) | Thermally stable transparent silicone resin compositions and methods for their preparation and use | |
GB2444189A (en) | Silicone compositions, methods of manufacture, and articles formed therefrom | |
ES2577431T3 (es) | Composición de caucho de silicona termo-endurecible para laminados de caucho | |
MY156714A (en) | Curable silicone composition that provides a highly transparent cured silicone material | |
TW200700502A (en) | Curable resin composition for sealing led element | |
MY134509A (en) | Curable organopolysiloxane composition and a semiconductor device made with the use of this composition | |
JP2012017470A5 (de) | ||
MY142540A (en) | Curable silicon composition | |
TW200738828A (en) | Curable silicone rubber compositions and cured products thereof | |
TW200621897A (en) | Room temperature curable organic polysiloxane composition | |
WO2008153002A1 (ja) | 硬化性含フッ素ポリマー組成物 | |
TW200609282A (en) | Heat-conductive silicone rubber composition and molded article | |
IN2012DN00942A (de) | ||
DE602006003433D1 (de) | Härtbare organopolysiloxanzusammensetzung | |
TW200734403A (en) | Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element | |
DE602007002402D1 (de) | Haftvermittler, härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung | |
TW200513499A (en) | Silicones having improved surface properties and curable silicone compositions for preparing the silicones | |
MY156784A (en) | Curable silicone composition that provides a highly transparent cured silicone material |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |