WO2018155131A1 - 硬化性オルガノポリシロキサン組成物および半導体装置 - Google Patents

硬化性オルガノポリシロキサン組成物および半導体装置 Download PDF

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WO2018155131A1
WO2018155131A1 PCT/JP2018/003534 JP2018003534W WO2018155131A1 WO 2018155131 A1 WO2018155131 A1 WO 2018155131A1 JP 2018003534 W JP2018003534 W JP 2018003534W WO 2018155131 A1 WO2018155131 A1 WO 2018155131A1
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group
sio
component
formula
mass
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PCT/JP2018/003534
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English (en)
French (fr)
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亮介 山▲崎▼
一裕 西嶋
智浩 飯村
須藤　学
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東レ・ダウコーニング株式会社
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Priority to JP2019501179A priority Critical patent/JP6884458B2/ja
Priority to US16/488,291 priority patent/US10927278B2/en
Priority to KR1020197024797A priority patent/KR102226981B1/ko
Priority to EP18758425.5A priority patent/EP3587498B1/en
Priority to CN201880013366.9A priority patent/CN110382625B/zh
Publication of WO2018155131A1 publication Critical patent/WO2018155131A1/ja

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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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Definitions

  • the present invention relates to a curable organopolysiloxane composition and a semiconductor device formed by bonding a semiconductor element with a cured product of the composition.
  • a curable organopolysiloxane composition is used for bonding the semiconductor element.
  • a curable organopolysiloxane composition for example, in Patent Documents 1 and 2, a substantially linear or cyclic alkenyl group-containing organopolysiloxane, a branched alkenyl group-containing organopolysiloxane, Linear organopolysiloxane having a hydrogen atom bonded to a silicon atom in a molecular chain, branched organopolysiloxane having a silicon atom-bonded hydrogen atom, specifically, an average unit formula: [H (CH 3 ) 2 SiO 1/2 ] 0.67 (SiO 4/2 ) Organopolysiloxane resin represented by 0.33 and average unit formula: [H (CH 3 ) 2 SiO 1/2 ] 0.50 [
  • Polysiloxane, branched organopolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule specifically, average unit formula: [H (CH 3 ) 2 SiO 1/2 ] 0.44
  • Organopolysiloxane resin represented by (SiO 4/2 ) 0.56 average unit formula: [H (CH 3 ) 2 SiO 1/2 ] 0.25 [(CH 3 ) 3 SiO 1/2 ] 0.5 25 (SiO 4/2 ) 0.50 organopolysiloxane resin, or average unit formula: [(CH 3 ) 3 SiO 1/2 ] 0.20 [H (CH 3 ) SiO 2/2 ] 0 represented by .40 (SiO 4/2) 0.40
  • Organopolysiloxane resins, and curable organopolysiloxane composition consisting of a hydrosilylation reaction catalyst have been proposed.
  • the organopolysiloxane resin having silicon-bonded hydrogen atoms is blended in order to adjust the mechanical strength and hardness of the resulting cured product.
  • the functional organopolysiloxane composition has a problem that adhesiveness to a semiconductor element is not sufficient, or bubbles are generated in the cured product, resulting in a decrease in adhesive strength.
  • An object of the present invention is to provide a curable organopolysiloxane composition that forms a cured product having excellent adhesion to a semiconductor element and few bubbles. Furthermore, another object of the present invention is to provide a semiconductor device having excellent reliability.
  • the curable organopolysiloxane composition of the present invention comprises (A) an organopolysiloxane having at least two alkenyl groups in one molecule; (B) Average unit formula: (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 2 SiO 3/2 ) c (SiO 4/2 ) d (In the formula, R 1 is the same or different, and is a monovalent hydrocarbon group or hydrogen atom having no aliphatic unsaturated carbon bond, provided that at least two R 1 in one molecule are hydrogen atoms.
  • R 2 is a monovalent hydrocarbon group having no aliphatic unsaturated bond
  • a, b, and c are 0 ⁇ a ⁇ 1, 0 ⁇ b ⁇ 1, 0 ⁇ c ⁇ 0.2, 0, respectively.
  • ⁇ D ⁇ 1, provided that 0.6 ⁇ a / d ⁇ 1.5, 1.5 ⁇ b / d ⁇ 3, and a + b + c + d 1.
  • the present composition contains (D) 1 to 20 parts by mass of fumed silica having a BET specific surface area of 20 to 200 m 2 / g with respect to a total of 100 parts by mass of the components (A) to (C). It is preferable.
  • the present composition preferably contains 0.001 to 5 parts by mass of (E) the hydrosilylation reaction inhibitor with respect to a total of 100 parts by mass of the components (A) to (C).
  • the present composition preferably contains 0.01 to 10 parts by mass of (F) an adhesion promoter with respect to 100 parts by mass in total of the components (A) to (C).
  • the composition comprises (G) an average formula: R 3 R 4 2 SiO (R 4 2 SiO) m (R 4 HSiO) n SiR 4 2 R 3
  • R 3 is the same or different monovalent hydrocarbon group or hydrogen atom having no aliphatic unsaturated carbon bond
  • R 4 is the same or different having an aliphatic unsaturated carbon bond.
  • No monovalent hydrocarbon group m is a number from 0 to 50
  • n is a number from 0 to 50, provided that when n is 0, R 3 is a hydrogen atom.
  • Such a composition is preferably cured to form a cured product having a type D durometer hardness of 30 to 70 as defined in JIS K 6253.
  • this composition is suitable as an adhesive for semiconductor elements.
  • the semiconductor device of the present invention is characterized in that a semiconductor element is bonded by a cured product of the above curable organopolysiloxane composition.
  • the curable organopolysiloxane composition of the present invention is characterized by excellent adhesion to semiconductor elements and forming a cured product with few bubbles.
  • the semiconductor device of the present invention is characterized by excellent reliability.
  • FIG. 1 is a cross-sectional view of a surface mounted light emitting diode (LED) device that is an example of a semiconductor device of the present invention.
  • LED surface mounted light emitting diode
  • (A) component is an organopolysiloxane having at least two alkenyl groups in one molecule.
  • alkenyl group in the component (A) the vinyl group, allyl group, butenyl group, pentenyl group, hexenyl group, heptenyl group, octenyl group, nonenyl group, decenyl group, undecenyl group, dodecenyl group, etc. Twelve alkenyl groups are exemplified, and a vinyl group is preferable.
  • Examples of the group bonded to the silicon atom other than the alkenyl group in the component (A) include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a pentyl group, a neopentyl group, Alkyl groups having 1 to 12 carbon atoms such as hexyl group, cyclohexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group and dodecyl group; carbon such as phenyl group, tolyl group, xylyl group and naphthyl group An aryl group having 6 to 20 carbon atoms; an aralkyl group having 7 to 20 carbon atoms such as a benzyl group, a phenethyl group, and a phenylpropy
  • the molecular structure of the component (A) is not particularly limited, and examples thereof include a straight chain, a partially branched straight chain, a branched chain, a ring, or a three-dimensional network structure.
  • the component (A) may be a single organopolysiloxane having these molecular structures or a mixture of two or more organopolysiloxanes having these molecular structures.
  • Linear, partially branched, or cyclic organopolysiloxanes have an average unit formula: (R 5 3 SiO 1/2 ) e (R 5 2 SiO 2/2 ) f (R 5 SiO 3/2 ) g (SiO 4/2 ) h (HO 1/2 ) i It is represented by
  • R 5 is the same or different monovalent hydrocarbon group, specifically, methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, neopentyl group
  • Alkyl groups having 1 to 12 carbon atoms such as a group, hexyl group, cyclohexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group; vinyl group, allyl group, butenyl group, pentenyl group, An alkenyl group having 2 to 12 carbon atoms such as a hexenyl group, a heptenyl group, an octenyl group, a nonenyl group, a decenyl group, an undecenyl group and a dodecenyl group; -20 aryl
  • the organopolysiloxane is preferably liquid at 25 ° C., specifically, the viscosity at 25 ° C.
  • the viscosity is in the range of 3 to 100,000 mPa ⁇ s, or in the range of 5 to 5,000 mPa ⁇ s. It is preferable that This is because the mechanical strength of the resulting cured product is improved when the viscosity is equal to or higher than the lower limit of the above range. On the other hand, when the viscosity is equal to or lower than the upper limit of the above range, handling workability of the resulting composition is improved. It is because it improves.
  • organopolysiloxane examples include organopolysiloxanes represented by the following average unit formula.
  • Vi represents a vinyl group
  • Me represents a methyl group
  • Ph represents a phenyl group.
  • organopolysiloxane represented by the following average formula is also illustrated.
  • Vi and Me are the same as described above.
  • an organopolysiloxane having a branched or three-dimensional network structure has an average unit formula: (R 5 3 SiO 1/2 ) j (R 5 2 SiO 2/2 ) k (R 5 SiO 3/2 ) l (SiO 4/2 ) p (HO 1/2 ) q It is represented by
  • R 5 is the same or different monovalent hydrocarbon group, the same groups as those exemplified. However, at least 2 R 5 in one molecule is the alkenyl group, preferably a vinyl group.
  • the property at 25 ° C. is not particularly limited, and may be liquid or solid as long as it is compatible with the above-described chain, partially branched linear or cyclic organopolysiloxane.
  • an organopolysiloxane represented by the following average composition formula is exemplified.
  • Vi, Me, and Ph are the same as described above.
  • ViMePhSiO 1/2 ) 0.10 (Me 3 SiO 1/2 ) 0.45 (SiO 4/2 ) 0.45 (HO 1/2 ) 0.03
  • Component (A) is composed of 15 to 100% by mass of the above-mentioned linear, partially branched or cyclic organopolysiloxane, and the branched or three-dimensional network structure organopolysiloxane of 0 to 85% by weight. % Is preferable. This is because when the content of the former organopolysiloxane is not less than the lower limit of the above range, sufficient flexibility can be imparted to the resulting cured product.
  • Such component (A) is preferably liquid at 25 ° C. because it has good handling workability.
  • the viscosity at 25 ° C. is in the range of 100 to 5,000,000 mPa ⁇ s. Or within a range of 500 to 100,000 mPa ⁇ s.
  • Component (B) is an average unit formula: (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 2 SiO 3/2 ) c (SiO 4/2 ) d It is the organopolysiloxane resin represented by these.
  • R 1 is the same or different, a monovalent hydrocarbon group or a hydrogen atom having no aliphatic unsaturated carbon bond.
  • the monovalent hydrocarbon group for R 1 include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, cyclohexyl group, heptyl group, octyl group.
  • Alkyl groups having 1 to 12 carbon atoms such as a group, nonyl group, decyl group, undecyl group, dodecyl group; aryl groups having 6 to 20 carbon atoms, such as phenyl group, tolyl group, xylyl group, naphthyl group; Aralkyl groups having 7 to 20 carbon atoms such as benzyl group, phenethyl group and phenylpropyl group; groups in which part or all of hydrogen atoms of these groups are substituted with halogen atoms such as fluorine atom, chlorine atom or bromine atom Is exemplified. However, at least 2 R 1 in one molecule is a hydrogen atom.
  • R 2 is a monovalent hydrocarbon group having no aliphatic unsaturated bond, and examples thereof include the same groups as R 1 .
  • the weight average molecular weight (Mw) of the component (B) is preferably 6,000 or more, 8,000 or more, and more preferably 10,000 or more. This is because when the weight average molecular weight of the component (B) is not less than the above lower limit, the adhesive strength of the obtained cured product is good, and the generation of bubbles in the cured product is suppressed.
  • the content of the component (B) is such that the silicon-bonded hydrogen atoms in the component (B) are in the range of 0.5 to 5 moles with respect to a total of 1 mole of alkenyl groups in the component (A).
  • the amount is preferably in the range of 0.5 to 3 mol, or in the range of 0.5 to 2 mol. Is the amount.
  • Component (C) is a hydrosilylation reaction catalyst for accelerating the hydrosilylation reaction of the composition.
  • a component (C) is preferably a platinum group element catalyst or a platinum group element compound catalyst, such as a platinum-based catalyst, a rhodium-based catalyst, or a palladium-based catalyst, and preferably a platinum-based catalyst.
  • Platinum-based catalysts include platinum fine powder, platinum black, chloroplatinic acid, alcohol-modified chloroplatinic acid, chloroplatinic acid and diolefin complexes, platinum-olefin complexes, platinum bis (acetoacetate), platinum bis (acetyl) Platinum-carbonyl complexes such as acetonate), chloroplatinic acid / divinyltetramethyldisiloxane complexes, chloroplatinic acid / alkenylsiloxane complexes such as chloroplatinic acid / tetravinyltetramethylcyclotetrasiloxane complexes, platinum / divinyltetramethyldisiloxane Complexes, platinum / alkenylsiloxane complexes such as platinum / tetravinyltetramethylcyclotetrasiloxane complexes, and complexes of chloroplatinic acid and acetylene alcohols are exe
  • alkenylsiloxane examples include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, Examples thereof include alkenyl siloxane oligomers in which part of the methyl groups of these alkenyl siloxanes are substituted with ethyl groups, phenyl groups, and the like, and alkenyl siloxane oligomers in which the vinyl groups of these alanyl siloxanes are substituted with allyl groups, hexenyl groups, and the like.
  • 1,3-divinyl-1,1,3,3-tetramethyldisiloxane is preferred because the resulting platinum-alkenylsiloxane complex has good stability.
  • platinum-alkenylsiloxane complexes are converted to 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and 1,3-diallyl-1 1,3,3-tetramethyldisiloxane, 1,3-divinyl-1,3-dimethyl-1,3-diphenyldisiloxane, 1,3-divinyl-1,1,3,3-tetraphenyldisiloxane It is preferably dissolved in an alkenylsiloxane oligomer such as 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane or an organosiloxane oligomer such as dimethylsiloxane oligomer. It is preferably dissolved in the alkenylsiloxane oligomer.
  • the content of the component (C) is not limited as long as it is an amount that promotes the curing of the composition.
  • the platinum group metal atom in the component particularly a platinum atom, with respect to the composition. Is preferably in an amount in the range of 0.01 to 500 ppm, an amount in the range of 0.01 to 100 ppm, or an amount in the range of 0.1 to 50 ppm.
  • the content of the component (C) is at least the lower limit of the above range, the resulting composition has good curability, and when it is below the upper limit of the above range, the resulting cured product is colored, etc. This is because it becomes difficult to cause this problem.
  • the composition preferably contains (D) fumed silica having a BET specific surface area of 20 to 200 m 2 / g for the purpose of improving handling workability and adhesiveness.
  • the content of the component (D) is not limited, but since the mechanical properties of the resulting cured product are good, 1 to 20 parts by mass with respect to 100 parts by mass in total of the components (A) to (C). It is preferable to be within the range.
  • the composition preferably contains (E) a hydrosilylation reaction inhibitor in order to extend the pot life at room temperature and improve the storage stability.
  • E 1-ethynylcyclohexane-1-ol, 2-methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol, 2-phenyl-3-butyne- Alkyne alcohols such as 2-ol; Enyne compounds such as 3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexen-1-yne; 1,3,5,7-tetramethyl-1 Methylalkenylsiloxane oligomers such as 1,3,5,7-tetravinylcyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane; dimethylbis (3-methyl Alkynooxysilanes such as -1-butyne-3-oxy) silane
  • the content of the component (E) is not limited, and is an amount sufficient to suppress gelation or curing during mixing of the component (A), the component (B), and the component (C), and is sufficient for the present composition. Since the pot life is given, it is within the range of 0.0001 to 5 parts by mass, within the range of 0.01 to 5 parts by mass, or 0 with respect to 100 parts by mass in total of the components (A) to (C). It is preferably in the range of 0.01 to 3 parts by mass.
  • the composition preferably contains (F) an adhesion promoter in order to further improve the adhesion to the substrate that is in contact with the curing process.
  • adhesion promoter known ones that can be added to a curable organopolysiloxane composition that cures by a hydrosilylation reaction can be used.
  • trialkoxysiloxy group for example, trimethoxysiloxy group, triethoxysiloxy group
  • trialkoxysilylalkyl group for example, trimethoxysilylethyl group, triethoxysilylethyl group
  • Organosilane having hydrosilyl group or alkenyl group for example, vinyl group, allyl group
  • trialkoxysiloxy group or trisilane An organosilane having an alkoxysilylalkyl group and a methacryloxyalkyl group (for example, 3-methacryloxypropyl group), or an organosiloxane oligomer having a linear structure, a branched structure or a cyclic structure having about 4 to 20 silicon atoms;
  • the content of the component (F) is not limited, but it does not promote curing characteristics or discoloration of the cured product. Therefore, the content of component (A) to component (C) is 0.01 to It is preferably in the range of 10 parts by mass or in the range of 0.01 to 5 parts by mass.
  • organopolysiloxane which has a silicon atom bond hydrogen atom other than the said (B) component as needed.
  • the organopolysiloxane represented by these is illustrated.
  • R 3 is the same or different monovalent hydrocarbon group or hydrogen atom having no aliphatic unsaturated carbon bond.
  • Examples of the monovalent hydrocarbon group for R 3 include the same monovalent hydrocarbon groups as those for R 1 .
  • R 4 is the same or different monovalent hydrocarbon group having no aliphatic unsaturated carbon bond, and the same monovalent hydrocarbon group as R 1 is exemplified.
  • n is a number from 0 to 50, provided that when n is 0, R 3 is a hydrogen atom.
  • organopolysiloxane examples include organopolysiloxanes having the following average structural formula.
  • Me and Ph are the same as described above.
  • the silicon-bonded hydrogen atom in the component (G) is (A)
  • the amount is preferably 0.5 mol at most, or 0.3 mol at most with respect to 1 mol of the total of alkenyl groups in the component.
  • the present composition includes, as other optional components, inorganic fillers such as silica, glass, alumina and zinc oxide other than the component (D); silicone rubber powder; silicone resin, polymethacrylate Resin powder such as resin; heat-resistant agent, dye, pigment, flame retardant, solvent and the like may be blended.
  • inorganic fillers such as silica, glass, alumina and zinc oxide other than the component (D)
  • silicone rubber powder silicone resin, polymethacrylate Resin powder such as resin
  • heat-resistant agent, dye, pigment, flame retardant, solvent and the like may be blended.
  • the composition is preferably liquid at 25 ° C. from the viewpoint of handling workability, and the viscosity at 25 ° C. is preferably in the range of 10 to 1,000,000 mPa ⁇ s.
  • the viscosity at 25 ° C. is preferably in the range of 1,000 to 500,000 mPa ⁇ s.
  • the composition is cured by standing at room temperature or by heating, but it is preferably heated for rapid curing.
  • the heating temperature is preferably in the range of 50 to 200 ° C.
  • Such a composition includes a metal such as steel, stainless steel, aluminum, copper, silver, titanium, and a titanium alloy; a semiconductor element such as a silicon semiconductor, a gallium phosphide semiconductor, a gallium arsenide semiconductor, and a gallium nitride semiconductor; Excellent initial adhesion and adhesion durability to ceramic, glass, thermosetting resin, thermoplastic resin having a polar group, etc., especially adhesion durability when subjected to a cooling / heating cycle.
  • a metal such as steel, stainless steel, aluminum, copper, silver, titanium, and a titanium alloy
  • a semiconductor element such as a silicon semiconductor, a gallium phosphide semiconductor, a gallium arsenide semiconductor, and a gallium nitride semiconductor
  • This composition is preferably cured to form a cured product having a type D durometer hardness of 30 to 70 as defined in JIS K 6253. This is because if the hardness is less than the lower limit of the above range, the cohesive force is poor and sufficient strength and adhesiveness can not be obtained, while if the upper limit of the above range is exceeded, the cured product becomes brittle, This is because sufficient adhesiveness cannot be obtained.
  • the semiconductor device of the present invention is characterized in that the semiconductor element in the housing is bonded by a cured product of an adhesive made of the above composition.
  • the semiconductor element include a light emitting diode (LED), a semiconductor laser, a photodiode, a phototransistor, a solid-state imaging, a photocoupler light emitter and a light receiver, and particularly a light emitting diode (LED). It is preferable.
  • the substrate on which the optical semiconductor element is mounted is no exception.
  • This substrate includes conductive metals such as silver, gold and copper; non-conductive metals such as aluminum and nickel; thermoplastic resins mixed with white pigments such as PPA and LCP; epoxy resins, BT resins, polyimide resins, Examples thereof include thermosetting resins containing white pigments such as silicone resins; ceramics such as alumina and alumina nitride. Since this composition has favorable adhesiveness with respect to an optical semiconductor element and a board
  • FIG. 1 is a cross-sectional view of a single surface-mounted light emitting diode (LED) device, which is a typical example of a semiconductor device.
  • LED light emitting diode
  • a light emitting diode (LED) chip 5 is bonded to a die pad 3 in a polyphthalamide (PPA) resin casing 1 by an adhesive 4.
  • PPA polyphthalamide
  • 5 and the inner lead 2 are wire-bonded by a bonding wire 6 and sealed together with an inner wall of the housing by a sealing material 7.
  • the curable organopolysiloxane composition of the present invention is used as a composition for forming the adhesive 4.
  • the viscosity in an Example and a comparative example is a value in 25 degreeC
  • Vi represents a vinyl group
  • Me represents a methyl group
  • the ratio of SiH / Vi is the ratio of component (b-1) to component (b-6) with respect to a total of 1 mol of vinyl groups of component (a-1) to component (a-7) in the composition.
  • the value represents the total number of moles of silicon-bonded hydrogen atoms of the component.
  • Component 1-ethynylcyclohexane-1-ol
  • Component Condensation reaction product of methyl vinyl siloxane oligomer with blocked silanol groups at both ends of a molecular chain having a viscosity of 30 mPa ⁇ s at 25 ° C. and 3-glycidoxypropyltrimethoxysilane
  • the hardness, die shear strength, and the number of bubbles in the cured products obtained by curing the curable organopolysiloxane compositions in the examples and comparative examples were measured as follows.
  • a sheet-like cured product was produced by press-molding the curable organopolysiloxane composition at 150 ° C. for 1 hour. The hardness of the sheet-like cured product was measured with a type D durometer defined in JIS K 6253.
  • the curable organopolysiloxane composition of the present invention is useful as an adhesive for semiconductor elements such as light emitting diodes (LEDs), semiconductor lasers, photodiodes, phototransistors, solid-state imaging, and light emitters and photoreceptors for photocouplers. Further, since the semiconductor device of the present invention has excellent reliability, it is useful as an optical semiconductor device such as an optical device, an optical device, a lighting device, and a lighting device.

Abstract

本発明は、（Ａ）一分子中に少なくとも２個のアルケニル基を有するオルガノポリシロキサン、（Ｂ）平均単位式：(Ｒ１ ３ＳｉＯ１/２)ａ(Ｒ１ ２ＳｉＯ２/２)ｂ(Ｒ２ＳｉＯ３/２)ｃ(ＳｉＯ４/２)ｄ（式中、Ｒ１は同じか又は異なる、脂肪族不飽和炭素結合を有さない一価炭化水素基もしくは水素原子であり、但し、一分子中、少なくとも２個のＲ１は水素原子であり、Ｒ２は脂肪族不飽和結合を有さない一価炭化水素基であり、ａ、ｂ、ｃはそれぞれ、０＜ａ＜１、０＜ｂ＜１、０≦ｃ＜０.２、０＜ｄ＜１、但し、０.６≦ａ／ｄ≦１.５、１.５≦ｂ／ｄ≦３、かつａ＋ｂ＋ｃ＋ｄ＝１を満たす数である。）で表されるオルガノポリシロキサンレジン、および(Ｃ)ヒドロシリル化反応用触媒から少なくともなる硬化性オルガノポリシロキサン組成物に関する。本組成物は、半導体素子に対する接着性が優れ、気泡の発生の少ない硬化物を形成することができる。

Description

硬化性オルガノポリシロキサン組成物および半導体装置
　本発明は、硬化性オルガノポリシロキサン組成物、および該組成物の硬化物により半導体素子を接着してなる半導体装置に関する。
　フォトカプラー、発光ダイオード、固体撮像素子等の半導体素子を有する半導体装置において、該半導体素子を接着するために硬化性オルガノポリシロキサン組成物が用いられている。このような硬化性オルガノポリシロキサン組成物としては、例えば、特許文献１および２には、実質的に直鎖状あるいは環状のアルケニル基含有オルガノポリシロキサン、分岐鎖状のアルケニル基含有オルガノポリシロキサン、分子鎖中のケイ素原子に結合する水素原子を有する直鎖状のオルガノポリシロキサン、ケイ素原子結合水素原子を有する分岐鎖状のオルガノポリシロキサン、具体的には、平均単位式：[Ｈ(ＣＨ３)２ＳｉＯ１/２]０.６７(ＳｉＯ４/２)０.３３で表されるオルガノポリシロキサンレジンや平均単位式：[Ｈ(ＣＨ３)２ＳｉＯ１/２]０.５０[(ＣＨ３)３ＳｉＯ１/２]０.１７(ＳｉＯ４/２)０.３３で表されるオルガノポリシロキサンレジン、およびヒドロシリル化反応用触媒からなる硬化性オルガノポリシロキサン組成物が提案され、特許文献３には、一分子中に少なくとも２個のアルケニル基を有する直鎖状のオルガノポリシロキサン、一分子中に少なくとも２個のアルケニル基を有する分岐鎖状のオルガノポリシロキサン、一分子中に少なくとも２個のケイ素原子結合水素原子を有する分岐鎖状のオルガノポリシロキサン、具体的には、平均単位式：[Ｈ(ＣＨ３)２ＳｉＯ１/２]０.４４(ＳｉＯ４/２)０.５６で表されるオルガノポリシロキサンレジン、平均単位式：[Ｈ(ＣＨ３)２ＳｉＯ１/２]０.２５[(ＣＨ３)３ＳｉＯ１/２]０.２５(ＳｉＯ４/２)０.５０で表されるオルガノポリシロキサンレジン、あるいは平均単位式：[(ＣＨ３)３ＳｉＯ１/２]０.２０[Ｈ(ＣＨ３)ＳｉＯ２/２]０.４０(ＳｉＯ４/２)０.４０で表されるオルガノポリシロキサンレジン、およびヒドロシリル化反応用触媒からなる硬化性オルガノポリシロキサン組成物が提案されている。
　上記の硬化性オルガノポリシロキサン組成物において、ケイ素原子結合水素原子を有するオルガノポリシロキサンレジンは、得られる硬化物の機械的強度や硬さを調整するために配合されているが、このような硬化性オルガノポリシロキサン組成物は、半導体素子に対する接着性が十分でなかったり、また、その硬化物中に気泡が生じて、接着力が低下するという課題がある。
特開２０１２－０１２４３３号公報 特開２０１２－０１２４３４号公報 特開２０１６－１５５９６７号公報
　本発明の目的は、半導体素子に対する接着性が優れ、気泡が少ない硬化物を形成する硬化性オルガノポリシロキサン組成物を提供することにある。さらに、本発明の他の目的は、信頼性に優れる半導体装置を提供することにある。
　本発明の硬化性オルガノポリシロキサン組成物は、
（Ａ）一分子中に少なくとも２個のアルケニル基を有するオルガノポリシロキサン、
（Ｂ）平均単位式：
(Ｒ１ ３ＳｉＯ１/２)ａ(Ｒ１ ２ＳｉＯ２/２)ｂ(Ｒ２ＳｉＯ３/２)ｃ(ＳｉＯ４/２)ｄ
（式中、Ｒ１は同じか又は異なる、脂肪族不飽和炭素結合を有さない一価炭化水素基もしくは水素原子であり、但し、一分子中、少なくとも２個のＲ１は水素原子であり、Ｒ２は脂肪族不飽和結合を有さない一価炭化水素基であり、ａ、ｂ、ｃはそれぞれ、０＜ａ＜１、０＜ｂ＜１、０≦ｃ＜０.２、０＜ｄ＜１、但し、０.６≦ａ／ｄ≦１.５、１.５≦ｂ／ｄ≦３、かつａ＋ｂ＋ｃ＋ｄ＝１を満たす数である。）
で表されるオルガノポリシロキサンレジン｛（Ａ）成分中のアルケニル基に対する（Ｂ）成分中のケイ素原子結合水素原子のモル比が０.５～５となる量｝、
および
(Ｃ)ヒドロシリル化反応用触媒（本組成物を硬化させるのに十分な量）
から少なくともなる。
　さらに、本組成物は、（Ｄ）ＢＥＴ比表面積が２０～２００ｍ２/ｇであるフュームドシリカを、（Ａ）～（Ｃ）成分の合計１００質量部に対して１～２０質量部含有することが好ましい。
　さらに、本組成物は、（Ｅ）ヒドロシリル化反応抑制剤を、（Ａ）～（Ｃ）成分の合計１００質量部に対して０.００１～５質量部含有することが好ましい。
　さらに、本組成物は、（Ｆ）接着促進剤を、（Ａ）～（Ｃ）成分の合計１００質量部に対して０.０１～１０質量部含有することが好ましい。
　さらに、本組成物は、（Ｇ）平均式：
Ｒ３Ｒ４ ２ＳｉＯ(Ｒ４ ２ＳｉＯ)ｍ(Ｒ４ＨＳｉＯ)ｎＳｉＲ４ ２Ｒ３
（式中、Ｒ３は同じか又は異なる、脂肪族不飽和炭素結合を有さない一価炭化水素基もしくは水素原子であり、Ｒ４は同じか又は異なる、脂肪族不飽和炭素結合を有さない一価炭化水素基であり、ｍは０～５０の数、ｎは０～５０の数であり、但し、ｎが０であるとき、Ｒ３は水素原子である。）
で表されるオルガノポリシロキサンを、（Ａ）成分中のアルケニル基に対して（Ｇ）成分中のケイ素原子結合水素原子のモル比が多くとも０.３となる量含有してもよい。
　このような本組成物は、硬化して、ＪＩＳ　Ｋ　６２５３に規定されるタイプＤデュロメータ硬さが３０～７０である硬化物を形成するものであることが好ましい。
　また、本組成物は、半導体素子の接着剤として好適である。
　また、本発明の半導体装置は、半導体素子が上記の硬化性オルガノポリシロキサン組成物の硬化物により接着されていることを特徴とする。
　本発明の硬化性オルガノポリシロキサン組成物は、半導体素子に対する接着性が優れ、気泡の少ない硬化物を形成するという特徴がある。また、本発明の半導体装置は、信頼性が優れるという特徴がある。
本発明の半導体装置の一例である表面実装型発光ダイオード（ＬＥＤ）装置の断面図である。
　（Ａ）成分は、一分子中に少なくとも２個のアルケニル基を有するオルガノポリシロキサンである。（Ａ）成分中のアルケニル基としては、ビニル基、アリル基、ブテニル基、ペンテニル基、ヘキセニル基、ヘプテニル基、オクテニル基、ノネニル基、デセニル基、ウンデセニル基、ドデセニル基等の炭素数が２～１２個のアルケニル基が例示され、好ましくは、ビニル基である。また、（Ａ）成分中のアルケニル基以外のケイ素原子に結合する基としては、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、ｔｅｒｔ－ブチル基、ペンチル基、ネオペンチル基、ヘキシル基、シクロヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基等の炭素数が１～１２個のアルキル基；フェニル基、トリル基、キシリル基、ナフチル基等の炭素数が６～２０個のアリール基；ベンジル基、フェネチル基、フェニルプロピル基等の炭素数が７～２０個のアラルキル基；これらの基の水素原子の一部または全部をフッ素原子、塩素原子、臭素原子等のハロゲン原子で置換した基が例示される。なお、（Ａ）成分中のケイ素原子には、本発明の目的を損なわない範囲で、少量の水酸基やメトキシ基、エトキシ基等のアルコキシ基を有していてもよい。
　（Ａ）成分の分子構造は特に限定されないが、例えば、直鎖状、一部分岐を有する直鎖状、分岐鎖状、環状、または三次元網状構造が挙げられる。（Ａ）成分は、これらの分子構造を有する単独のオルガノポリシロキサン、あるいはこれらの分子構造を有する二種以上のオルガノポリシロキサンの混合物であってもよい。
　直鎖状、一部分岐を有する直鎖状、あるいは環状のオルガノポリシロキサンは、平均単位式：
(Ｒ５ ３ＳｉＯ１/２)ｅ(Ｒ５ ２ＳｉＯ２/２)ｆ(Ｒ５ＳｉＯ３/２)ｇ(ＳｉＯ４/２)ｈ(ＨＯ１/２)ｉ
で表される。
　式中、Ｒ５は同じか又は異なる一価炭化水素基であり、具体的には、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、ｔｅｒｔ－ブチル基、ペンチル基、ネオペンチル基、ヘキシル基、シクロヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基等の炭素数が１～１２個のアルキル基；ビニル基、アリル基、ブテニル基、ペンテニル基、ヘキセニル基、ヘプテニル基、オクテニル基、ノネニル基、デセニル基、ウンデセニル基、ドデセニル基等の炭素数が２～１２個のアルケニル基；フェニル基、トリル基、キシリル基、ナフチル基等の炭素数が６～２０個のアリール基；ベンジル基、フェネチル基、フェニルプロピル基等の炭素数が７～２０個のアラルキル基；これらの基の水素原子の一部または全部をフッ素原子、塩素原子、臭素原子等のハロゲン原子で置換した基が例示される。但し、一分子中の少なくとも２個のＲ５は前記アルケニル基であり、好ましくは、ビニル基である。
　また、式中、ｅ、ｆ、ｇ、ｈ、およびｉはシロキサン構造単位の比率および水酸基の比率を表す数であり、０≦ｅ≦０.０５、０.９≦ｆ≦１、０≦ｇ≦０.０３、０≦ｈ≦０.０３、０≦ｉ≦０.２、かつ、ｅ＋ｆ＋ｇ＋ｈ＝１を満たす数である。これは、ｅが上記範囲の上限を超えると、このオルガノポリシロキサンの粘度が低くなりすぎて、得られる組成物の取扱作業性が低下したり、硬化物の硬さが低下するからである。また、ｇおよびｈが上記範囲の上限を超えると、このオルガノポリシロキサンの粘度が高くなりすぎて、得られる組成物の取扱作業性が低下したり、得られる硬化物が脆くなるからである。ｆの範囲は、ｅ、ｇ、およびｈにより決まるが、ｆが上記範囲の下限未満であると、得られる組成物に適度な粘度を付与できなかったり、硬化物に適度な硬さや機械的強度を付与できないからである。また、このオルガノポリシロキサンは２５℃で液状であることが好ましく、具体的には、２５℃の粘度が３～１００,０００ｍＰa・ｓの範囲内、あるいは、５～５,０００ｍＰa・ｓの範囲内であることが好ましい。これは、この粘度が上記範囲の下限以上であると、得られる硬化物の機械的強度が向上するからであり、一方、上記範囲の上限以下であると、得られる組成物の取扱作業性が向上するからである。
　このようなオルガノポリシロキサンとしては、下記の平均単位式で表されるオルガノポリシロキサンが例示される。なお、式中、Ｖｉはビニル基を表し、Ｍｅはメチル基を表し、Ｐｈはフェニル基を表している。
(ＶｉＭｅ２ＳｉＯ１/２)０.０１２(Ｍｅ２ＳｉＯ２/２)０.９８８
(ＶｉＭｅ２ＳｉＯ１/２)０.００７(Ｍｅ２ＳｉＯ２/２)０.９９３
(Ｍｅ３ＳｉＯ１/２)０.００７(Ｍｅ２ＳｉＯ２/２)０.９８３(ＭｅＶｉＳｉＯ２/２)０.０１０
(Ｍｅ３ＳｉＯ１/２)０.０１(ＭｅＶｉＳｉＯ１/２)０.０１(Ｍｅ２ＳｉＯ２/２)０.９６(ＭｅＳｉＯ３/２)０.０２
(ＶｉＭｅ２ＳｉＯ１/２)０.００５(Ｍｅ２ＳｉＯ２/２)０.８９５(ＭｅＰｈＳｉＯ２/２)０.１００
　さらに、下記の平均式で表されるオルガノポリシロキサンも例示される。なお、式中、ＶｉおよびＭｅは前記と同様である。
(ＭｅＶｉＳｉＯ２/２)３
(ＭｅＶｉＳｉＯ２/２)４
(ＭｅＶｉＳｉＯ２/２)５
　一方、分岐鎖状、あるいは三次元網状構造のオルガノポリシロキサンは、平均単位式：
(Ｒ５ ３ＳｉＯ１/２)ｊ(Ｒ５ ２ＳｉＯ２/２)ｋ(Ｒ５ＳｉＯ３/２)ｌ(ＳｉＯ４/２)ｐ(ＨＯ１/２)ｑ
で表される。
　式中、Ｒ５は同じか又は異なる一価炭化水素基であり、前記と同様の基が例示される。但し、一分子中の少なくとも２個のＲ５は前記アルケニル基であり、好ましくは、ビニル基である。
　また、式中、ｊ、ｋ、ｌ、ｐ、およびｑはシロキサン構造単位の比率と水酸基の比率を表す数であり、０.４≦ｊ≦０.６、０≦ｋ≦０.０５、０≦ｌ≦０.０５、０.４≦ｐ≦０.６、０≦ｑ≦０.０５、かつ、ｊ＋ｋ＋ｌ＋ｐ＝１を満たす数である。これは、ｊが上記範囲の下限未満であると、硬化物の機械的強度が低下するからであり、一方、上記範囲の上限を超えると、硬化物に十分な硬さを付与できなくなるからである。また、ｋが上記範囲の上限を超えると、硬化物に十分な硬さを付与できなくなるからである。また、ｌが上記範囲の上限を超えると、硬化物の機械的強度が低下するからである。また、ｐが上記範囲の下限未満であると、硬化物に十分な硬さを付与できなくなるからであり、一方、上記範囲の上限を超えると、得られる組成物中への分散性が低下し、硬化物に十分な機械的強度を付与できなくなるからである。この２５℃における性状は特に限定されず、上記の鎖状、一部分岐を有する直鎖状、あるいは環状のオルガノポリシロキサンと相溶性があれば、液体であっても固体であってもよい。
　このようなオルガノポリシロキサンとしては、下記の平均組成式で表されるオルガノポリシロキサンが例示される。なお、式中、Ｖｉ、Ｍｅ、およびＰｈは前記と同様である。
(ＶｉＭｅ２ＳｉＯ１/２)０.１０(Ｍｅ３ＳｉＯ１/２)０.３３(ＳｉＯ４/２)０.５７(ＨＯ１/２)０.０３
(ＶｉＭｅ２ＳｉＯ１/２)０.１３(Ｍｅ３ＳｉＯ１/２)０.３５(ＳｉＯ４/２)０.５２(ＨＯ１/２)０.０２
(ＶｉＭｅＰｈＳｉＯ１/２)０.１０(Ｍｅ３ＳｉＯ１/２)０.４５(ＳｉＯ４/２)０.４５(ＨＯ１/２)０.０３
(ＶｉＭｅ２ＳｉＯ１/２)０.０９(Ｍｅ３ＳｉＯ１/２)０.３１(ＳｉＯ４/２)０.６０(ＨＯ１/２)０.０４
(ＶｉＭｅ２ＳｉＯ１/２)０.１０(Ｍｅ３ＳｉＯ１/２)０.４０(ＳｉＯ４/２)０.５０(ＨＯ１/２)０.０３
　（Ａ）成分は、上記の鎖状、一部分岐を有する直鎖状、あるいは環状のオルガノポリシロキサン　１５～１００質量％および上記の分岐鎖状、あるいは三次元網状構造のオルガノポリシロキサン　０～８５重量％からなることが好ましい。これは、前者のオルガノポリシロキサンの含有量が上記範囲の下限以上であると、得られる硬化物に十分な可とう性を付与できるからである。
　このような（Ａ）成分は、取扱作業性が良好であることから、２５℃で液状であることが好ましく、具体的には、２５℃の粘度が１００～５,０００,０００ｍＰa・ｓの範囲内、あるいは５００～１００,０００ｍＰa・ｓの範囲内であることが好ましい。
　(Ｂ)成分は、平均単位式：
(Ｒ１ ３ＳｉＯ１/２)ａ(Ｒ１ ２ＳｉＯ２/２)ｂ(Ｒ２ＳｉＯ３/２)ｃ(ＳｉＯ４/２)ｄ
で表されるオルガノポリシロキサンレジンである。
　式中、Ｒ１は同じか又は異なる、脂肪族不飽和炭素結合を有さない一価炭化水素基もしくは水素原子である。Ｒ１の一価炭化水素基としては、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、ｔｅｒｔ－ブチル基、ペンチル基、ネオペンチル基、ヘキシル基、シクロヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基等の炭素数が１～１２個のアルキル基；フェニル基、トリル基、キシリル基、ナフチル基等の炭素数が６～２０個のアリール基；ベンジル基、フェネチル基、フェニルプロピル基等の炭素数が７～２０個のアラルキル基；これらの基の水素原子の一部または全部をフッ素原子、塩素原子、臭素原子等のハロゲン原子で置換した基が例示される。但し、一分子中の少なくとも２個のＲ１は水素原子である。
　また、式中、Ｒ２は脂肪族不飽和結合を有さない一価炭化水素基であり、前記Ｒ１と同様の基が例示される。
　また、式中、ａ、ｂ、ｃはそれぞれ、０＜ａ＜１、０＜ｂ＜１、０≦ｃ＜０.２、０＜ｄ＜１、但し、０.６≦ａ／ｄ≦１.５、１.５≦ｂ／ｄ≦３、かつａ＋ｂ＋ｃ＋ｄ＝１を満たす数であり、好ましくは、０.７≦ａ／ｄ≦１.５、１.５≦ｂ／ｄ≦２.５を満たす数、０.７≦ａ／ｄ≦１.４、１.６≦ｂ／ｄ≦２.５を満たす数、あるいは０.８≦ａ／ｄ≦１.４、１.６≦ｂ／ｄ≦２を満たす数である。これは、ａ／ｄの値が上記範囲の下限以上であると、得られる組成物の粘度が上がりすぎないからであり、一方、上記範囲の上限以下であると、得られる硬化物の接着特性が良好となるからである。また、ｂ／ｄの値が上記範囲内であると、得られる硬化物の接着特性が良好となるからである。
　このような（Ｂ）成分の重量平均分子量（Ｍｗ）は６,０００以上、８,０００以上、さらには１０,０００以上であることが好ましい。これは、（Ｂ）成分の重量平均分子量が上記の下限以上であると、得られる硬化物の接着力が良好であり、また、硬化物中の気泡の発生が抑制されるからである。
　このような（Ｂ）成分としては、平均単位式：
(Ｍｅ３ＳｉＯ１/２)０.２３(ＭｅＨＳｉＯ２/２)０.５１(ＳｉＯ４/２)０.２６
で表されるオルガノポリシロキサン、平均単位式：
(Ｍｅ３ＳｉＯ１/２)０.２４(ＭｅＨＳｉＯ２/２)０.４９(ＳｉＯ４/２)０.２７
で表されるオルガノポリシロキサン、平均単位式：
(Ｍｅ３ＳｉＯ１/２)０.２４(Ｍｅ２ＳｉＯ２/２)０.１０(ＭｅＨＳｉＯ２/２)０.４０(ＳｉＯ４/２)０.２６
で表されるオルガノポリシロキサンが例示される。
　（Ｂ）成分の含有量は、（Ｂ）成分中のケイ素原子結合水素原子が、（Ａ）成分中のアルケニル基の合計１モルに対して０.５～５モルの範囲内となる量であり、得られる硬化物の硬さ、機械特性、および接着性が良好であることから、好ましくは、０.５～３モルの範囲内となる量、あるいは０.５～２モルの範囲内となる量である。
　（Ｃ）成分は、本組成物のヒドロシリル化反応を促進するためのヒドロシリル化反応用触媒である。このような（Ｃ）成分は、白金族元素触媒、白金族元素化合物触媒が好ましく、白金系触媒、ロジウム系触媒、パラジウム系触媒が例示され、好ましくは、白金系触媒である。白金系触媒としては、白金微粉末、白金黒、塩化白金酸、塩化白金酸のアルコール変性物、塩化白金酸とジオレフィンの錯体、白金－オレフィン錯体、白金ビス（アセトアセテート）、白金ビス（アセチルアセトネート）等の白金－カルボニル錯体、塩化白金酸・ジビニルテトラメチルジシロキサン錯体、塩化白金酸・テトラビニルテトラメチルシクロテトラシロキサン錯体等の塩化白金酸・アルケニルシロキサン錯体、白金・ジビニルテトラメチルジシロキサン錯体、白金・テトラビニルテトラメチルシクロテトラシロキサン錯体等の白金・アルケニルシロキサン錯体、塩化白金酸とアセチレンアルコール類との錯体が例示され、特に、ヒドロシリル化反応性能が良好であることから、白金－アルケニルシロキサン錯体が好ましい。
　このアルケニルシロキサンとしては、１,３－ジビニル－１,１,３,３－テトラメチルジシロキサン、１,３,５,７－テトラメチル－１,３,５,７－テトラビニルシクロテトラシロキサン、これらのアルケニルシロキサンのメチル基の一部をエチル基、フェニル基等で置換したアルケニルシロキサンオリゴマー、これらのアルニルシロキサンのビニル基をアリル基、ヘキセニル基等で置換したアルケニルシロキサンオリゴマーが例示される。特に、生成する白金－アルケニルシロキサン錯体の安定性が良好であることから、１,３－ジビニル－１,１,３,３－テトラメチルジシロキサンが好ましい。
　また、白金－アルケニルシロキサン錯体の安定性を向上させるため、これらの白金－アルケニルシロキサン錯体を、１,３－ジビニル－１,１,３,３－テトラメチルジシロキサン、１,３－ジアリル－１,１,３,３－テトラメチルジシロキサン、１,３－ジビニル－１,３－ジメチル－１,３－ジフェニルジシロキサン、１,３－ジビニル－１,１,３,３－テトラフェニルジシロキサン、１,３,５,７－テトラメチル－１,３,５,７－テトラビニルシクロテトラシロキサン等のアルケニルシロキサンオリゴマーやジメチルシロキサンオリゴマー等のオルガノシロキサンオリゴマーに溶解していることが好ましく、特に、アルケニルシロキサンオリゴマーに溶解していることが好ましい。
　（Ｃ）成分の含有量は、本組成物の硬化を促進する量であれば限定されず、具体的には、本組成物に対して、本成分中の白金族金属原子、特には白金原子が、質量単位で０.０１～５００ｐｐｍの範囲内となる量、０.０１～１００ｐｐｍの範囲内となる量、あるいは、０.１～５０ｐｐｍの範囲内となる量であることが好ましい。これは、（Ｃ）成分の含有量が上記範囲の下限以上であると、得られる組成物の硬化性が良好であり、一方、上記範囲の上限以下であると、得られる硬化物に着色等の問題を生じにくくなるからである。
　本組成物には、取扱作業性および接着性を向上する目的で、（Ｄ）ＢＥＴ比表面積が２０～２００ｍ２/ｇであるフュームドシリカを含有することが好ましい。（Ｄ）成分の含有量は限定されないが、得られる硬化物の機械的特性が良好となることから、上記（Ａ）～（Ｃ）成分の合計１００質量部に対して１～２０質量部の範囲内であることが好ましい。
　本組成物には、常温での可使時間を延長し、保存安定性を向上させるため、（Ｅ）ヒドロシリル化反応抑制剤を含有することが好ましい。（Ｅ）成分としては、１－エチニルシクロヘキサン－１－オール、２－メチル－３－ブチン－２－オール、３,５－ジメチル－１－ヘキシン－３－オール、２－フェニル－３－ブチン－２－オール等のアルキンアルコール；３－メチル－３－ペンテン－１－イン、３,５－ジメチル－３－ヘキセン－１－イン等のエンイン化合物；１,３,５,７－テトラメチル－１,３,５,７－テトラビニルシクロテトラシロキサン、１,３,５,７－テトラメチル－１,３,５,７－テトラヘキセニルシクロテトラシロキサン等のメチルアルケニルシロキサンオリゴマー；ジメチルビス（３－メチル－１－ブチン－３－オキシ）シラン、メチルビニルビス（３－メチル－１－ブチン－３－オキシ）シラン等のアルキンオキシシラン；メチルトリス(１－メチル－１－フェニル－プロピンオキシ)シラン、ジメチルビス(１－メチル－１－フェニル－プロピンオキシ)シラン、メチルトリス(１,１－ジメチル－プロピンオキシ)シラン、ジメチルビス(１,１－ジメチル－プロピンオキシ)シラン等のアルキンオキシシラン化合物；その他、ベンゾトリアゾールが例示される。
　（Ｅ）成分の含有量は限定されず、（Ａ）成分と（Ｂ）成分と（Ｃ）成分の混合時にゲル化ないし硬化を抑制するのに十分な量であり、本組成物に十分なポットライフを与えることから、（Ａ）成分～（Ｃ）成分の合計１００質量部に対して、０.０００１～５質量部の範囲内、０.０１～５質量部の範囲内、あるいは、０.０１～３質量部の範囲内であることが好ましい。
　また、本組成物には、硬化途上で接触している基材への接着性を更に向上させるために（Ｆ）接着促進剤を含有することが好ましい。この接着促進剤としては、ヒドロシリル化反応により硬化する硬化性オルガノポリシロキサン組成物に添加し得る公知のものを用いることができる。
　このような（Ｆ）成分としては、トリアルコキシシロキシ基（例えば、トリメトキシシロキシ基、トリエトキシシロキシ基）もしくはトリアルコキシシリルアルキル基（例えば、トリメトキシシリルエチル基、トリエトキシシリルエチル基）と、ヒドロシリル基もしくはアルケニル基（例えば、ビニル基、アリル基）を有するオルガノシラン、またはケイ素原子数４～２０程度の直鎖状構造、分岐状構造又は環状構造のオルガノシロキサンオリゴマー；トリアルコキシシロキシ基もしくはトリアルコキシシリルアルキル基とメタクリロキシアルキル基（例えば、３－メタクリロキシプロピル基）を有するオルガノシラン、またはケイ素原子数４～２０程度の直鎖状構造、分岐状構造又は環状構造のオルガノシロキサンオリゴマー；トリアルコキシシロキシ基もしくはトリアルコキシシリルアルキル基とエポキシ基結合アルキル基（例えば、３－グリシドキシプロピル基、４－グリシドキシブチル基、２－(３,４－エポキシシクロヘキシル)エチル基、３－(３,４－エポキシシクロヘキシル)プロピル基）を有するオルガノシランまたはケイ素原子数４～２０程度の直鎖状構造、分岐状構造又は環状構造のオルガノシロキサンオリゴマー；アミノアルキルトリアルコキシシランとエポキシ基結合アルキルトリアルコキシシランの反応物、エポキシ基含有エチルポリシリケートが挙げられ、具体的には、ビニルトリメトキシシラン、アリルトリメトキシシラン、アリルトリエトキシシラン、ハイドロジェントリエトキシシラン、３－グリシドキシプロピルトリメトキシシラン、３－グリシドキシプロピルトリエトキシシラン、２－(３,４－エポキシシクロヘキシル)エチルトリメトキシシラン、３－メタクリロキシプロピルトリメトキシシラン、３－メタクリロキシプロピルトリエトキシシラン、３－グリシドキシプロピルトリエトキシシランと３－アミノプロピルトリエトキシシランの反応物、シラノール基封鎖メチルビニルシロキサンオリゴマーと３－グリシドキシプロピルトリメトキシシランの縮合反応物、シラノール基封鎖メチルビニルシロキサンオリゴマーと３－メタクリロキシプロピルトリエトキシシランの縮合反応物、トリス（３－トリメトキシシリルプロピル）イソシアヌレートが挙げられる。
　このような（Ｆ）成分の含有量は限定されないが、硬化特性や硬化物の変色を促進しないことから、（Ａ）成分～（Ｃ）成分の合計１００質量部に対して、０.０１～１０質量部の範囲内、あるいは、０.０１～５質量部の範囲内であることが好ましい。
　本組成物には、上記（Ｂ）成分以外のケイ素原子結合水素原子を有するオルガノポリシロキサンを必要に応じて含有してもよい。このようなオルガノポリシロキサンとしては、（Ｇ）平均式：
Ｒ３Ｒ４ ２ＳｉＯ(Ｒ４ ２ＳｉＯ)ｍ(Ｒ４ＨＳｉＯ)ｎＳｉＲ４ ２Ｒ３
で表されるオルガノポリシロキサンが例示される。
　式中、Ｒ３は同じか又は異なる、脂肪族不飽和炭素結合を有さない一価炭化水素基もしくは水素原子である。Ｒ３の一価炭化水素基としては、前記Ｒ１と同様の一価炭化水素基が例示される。
　また、式中、Ｒ４は同じか又は異なる、脂肪族不飽和炭素結合を有さない一価炭化水素基であり、前記Ｒ１と同様の一価炭化水素基が例示される。
　また、式中、ｍは０～５０の数、ｎは０～５０の数であり、但し、ｎが０であるとき、Ｒ３は水素原子である。
　このようなオルガノポリシロキサンとしては、下記の平均構造式を有するオルガノポリシロキサンが例示される。なお、式中、ＭｅおよびＰｈは前記と同様である。
Ｍｅ３ＳｉＯ(ＭｅＨＳｉＯ)１０ＳｉＭｅ３
ＨＭｅ２ＳｉＯ(Ｍｅ２ＳｉＯ)１０ＳｉＭｅ２Ｈ
Ｍｅ３ＳｉＯ(ＭｅＨＳｉＯ)８０ＳｉＭｅ３
Ｍｅ３ＳｉＯ(Ｍｅ２ＳｉＯ)３０(ＭｅＨＳｉＯ)３０ＳｉＭｅ３
Ｍｅ２ＰｈＳｉＯ(ＭｅＨＳｉＯ)３５ＳｉＭｅ２Ｐｈ
　このようなオルガノポリシロキサンの含有量は限定されないが、接着性が良好で、気泡の発生しにくい硬化物を得ることができることから、（Ｇ）成分中のケイ素原子結合水素原子が、（Ａ）成分中のアルケニル基の合計１モルに対して、多くとも０.５モルとなる量、あるいは多くとも０.３モルとなる量であることが好ましい。
　本組成物には、本発明の目的を損なわない限り、その他任意の成分として、(Ｄ)成分以外のシリカ、ガラス、アルミナ、酸化亜鉛等の無機質充填剤；シリコーンゴム粉末；シリコーン樹脂、ポリメタクリレート樹脂等の樹脂粉末；耐熱剤、染料、顔料、難燃性付与剤、溶剤等を配合してもよい。
　本組成物は、取扱作業性の点から、２５℃において液状であることが好ましく、２５℃の粘度は１０～１,０００,０００ｍＰa・ｓの範囲内であることが好ましい。本組成物を半導体素子の接着剤として用いる場合には、２５℃の粘度が１,０００～５００,０００ｍＰa・ｓの範囲内であることが好ましい。
　本組成物は、室温放置や、加熱により硬化が進行するが、迅速に硬化させるためには加熱することが好ましい。加熱温度は、５０～２００℃の範囲内であることが好ましい。
　このような本組成物は、スチール、ステンレススチール、アルミニウム、銅、銀、チタン、チタン合金等の金属；シリコン半導体、ガリウムリン系半導体、ガリウム砒素系半導体、ガリウムナイトライド系半導体等の半導体素子；セラミック、ガラス、熱硬化性樹脂、極性基を有する熱可塑性樹脂等に対する初期接着性、接着耐久性、特には冷熱サイクルを受けたときの接着耐久性が優れている。
　本組成物は、硬化して、ＪＩＳ　Ｋ　６２５３に規定されるタイプＤデュロメータ硬さが３０～７０である硬化物を形成することが好ましい。これは、硬さが上記範囲の下限未満であると、凝集力が乏しく、十分な強度と接着性が得られなくなるからであり、一方、上記範囲の上限を超えると、硬化物が脆くなり、十分な接着性が得られなくなるからである。
　次に、本発明の半導体装置について詳細に説明する。
　本発明の半導体装置は、筺体内の半導体素子が上記組成物からなる接着剤の硬化物により接着されていることを特徴とする。この半導体素子としては、具体的には、発光ダイオード（ＬＥＤ）、半導体レーザ、フォトダイオード、フォトトランジスタ、固体撮像、フォトカプラー用発光体と受光体が例示され、特に、発光ダイオード（ＬＥＤ）であることが好ましい。
　発光ダイオード（ＬＥＤ）では、半導体の上下左右から発光が起きるので、装置を構成する部品は、光を吸収するものは好ましくなく、光透過率が高いか、反射率の高い材料が選ばれる。光半導体素子が搭載される基板もその例外でない。この基板としては、銀、金、銅等の導電性金属；アルミニウム、ニッケル等の非導電性の金属；ＰＰＡやＬＣＰ等の白色顔料を混合した熱可塑性樹脂；エポキシ樹脂、ＢＴ樹脂、ポリイミド樹脂やシリコーン樹脂等の白色顔料を含有する熱硬化性樹脂；アルミナ、窒化アルミナ等のセラミックスが例示される。本組成物は、光半導体素子および基板に対して接着性が良好であるので、得られる光半導体装置の信頼性を向上することができる。
　本発明の半導体装置を図１により詳細に説明する。図１は半導体装置の代表例である単体の表面実装型発光ダイオード（ＬＥＤ）装置の断面図である。図１の発光ダイオード（ＬＥＤ）装置は、ポリフタルアミド（ＰＰＡ）樹脂製筐体１内のダイパッド３上に発光ダイオード（ＬＥＤ）チップ５が接着材４により接着され、この発光ダイオード（ＬＥＤ）チップ５とインナーリード２とがボンディングワイヤ６によりワイヤボンディングされ、封止材７により該筐体内壁とともに封止されている。本発明の半導体装置において、接着材４を形成する組成物として、本発明の硬化性オルガノポリシロキサン組成物が使用される。
　本発明の硬化性オルガノポリシロキサン組成物および半導体装置を実施例と比較例により詳細に説明する。なお、実施例・比較例中の粘度は２５℃における値であり、また、実施例・比較例中の硬化性オルガノポリシロキサン組成物を調製するため、次の成分を用いた。なお、式中、Ｖｉはビニル基を表し、Ｍｅはメチル基を表す。また、表中、ＳｉＨ／Ｖｉの比率は、組成物中、(ａ－１)成分～(ａ－７)成分のビニル基の合計１モルに対する、(ｂ－１)成分～(ｂ－６)成分のケイ素原子結合水素原子の合計モル数の値を表す。
(ａ－１)成分：平均単位式：
(Ｍｅ２ＶｉＳｉＯ１/２)０.０４２(Ｍｅ２ＳｉＯ２/２)０.９５８
で表される、粘度６０ｍＰa・ｓのオルガノポリシロキサン（ビニル基の含有量＝１.５３質量％）
(ａ－２)成分：平均単位式：
(Ｍｅ２ＶｉＳｉＯ１/２)０.０１２(Ｍｅ２ＳｉＯ２/２)０.９８８
で表される、粘度５５０ｍＰa・ｓのオルガノポリシロキサン（ビニル基の含有量＝０.４５質量％）
(ａ－３)成分：平均式：
(ＭｅＶｉＳiＯ)４
で表される、粘度４ｍＰa・ｓの環状メチルビニルポリシロキサン（ビニル基の含有量＝３０質量％）
(ａ－４)成分：平均式：
ＨＯ(ＭｅＶｉＳｉＯ)２０Ｈ
で表される、粘度３０ｍＰa・ｓのメチルビニルポリシロキサン（ビニル基の含有量＝３０質量％）
(ａ－５)成分：平均単位式：
(Ｍｅ２ＶｉＳｉＯ１/２)０.５５(Ｍｅ３ＳｉＯ１/２)０.０５(ＳｉＯ４/２)０.４０
で表される、室温で固体のオルガノポリシロキサン（ビニル基の含有量＝１９.０質量％）
(ａ－６)成分：平均単位式：
(Ｍｅ２ＶｉＳｉＯ１/２)０.０９(Ｍｅ３ＳｉＯ１/２)０.４３(ＳｉＯ４/２)０.４８(ＨＯ１/２)０.０３
で表される、室温で固体のオルガノポリシロキサン（ビニル基の含有量＝３.０質量％）
(ａ－７)成分：平均単位式：
(Ｍｅ２ＶｉＳｉＯ１/２)０.１０(Ｍｅ３ＳｉＯ１/２)０.４５(ＳｉＯ４/２)０.４５(ＨＯ１/２)０.０２
で表される、室温で固体のオルガノポリシロキサン（ビニル基の含有量＝３.０質量％）
(ｂ－１)成分：粘度が２０００ｍＰa・ｓであり、平均単位式：
(Ｍｅ３ＳｉＯ１/２)０.２３(ＭｅＨＳｉＯ２/２)０.５１(ＳｉＯ４/２)０.２６
で表されるオルガノポリシロサキン（重量平均分子量＝１８０００、ケイ素原子結合水素原子の含有量＝０.７８質量％）
(ｂ－２)成分：粘度が５１０ｍＰa・ｓであり、平均単位式：
(Ｍｅ３ＳｉＯ１/２)０.２４(ＭｅＨＳｉＯ２/２)０.４９(ＳｉＯ４/２)０.２７
で表されるオルガノポリシロサキン（重量平均分子量＝１６３００、ケイ素原子結合水素原子の含有量＝０.７５質量％）
(ｂ－３)成分：粘度が６４０ｍＰa・ｓであり、平均単位式：
(Ｍｅ３ＳｉＯ１/２)０.２４(Ｍｅ２ＳｉＯ２/２)０.１０(ＭｅＨＳｉＯ２/２)０.４０(ＳｉＯ４/２)０.２６
で表されるオルガノポリシロサキン（重量平均分子量＝１５４００、ケイ素原子結合水素原子の含有量＝０.７８質量％）
(ｂ－４)成分：粘度が２３０ｍＰa・ｓであり、平均単位式：
(ＨＭｅ２ＳｉＯ１/２)０.５１(Ｍｅ２ＳｉＯ２/２)０.１５(ＳｉＯ４/２)０.３４(ＨＯ１/２)０.０３
で表されるオルガノポリシロサキン（重量平均分子量＝２１００、ケイ素原子結合水素原子の含有量＝０.８０質量％）
(ｂ－５)成分：粘度が１２０ｍＰa・ｓであり、平均単位式：
(ＨＭｅ２ＳｉＯ１/２)０.６７(ＳｉＯ４/２)０.３３
で表されるオルガノポリシロキサン（重量平均分子量＝１３１０、ケイ素原子結合水素原子の含有量＝０.９５質量％）
(ｂ－６)成分：粘度が１０ｍＰa・ｓであり、平均式：
Ｍｅ３ＳｉＯ(ＭｅＨＳｉＯ)１０ＳｉＭｅ３
で表されるオルガノポリシロキサン（重量平均分子量＝８８００、ケイ素原子結合水素原子の含有量＝１.６質量％）
(ｃ)成分：白金金属の含有量が約４重量％である、白金の１,３－ジビニル－１,１,３,３－テトラメチルジシロキサン錯体の１,３－ジビニル－１,１,３,３－テトラメチルジシロキサン溶液
(ｄ)成分：ＢＥＴ比表面積が１１５～１６５ｍ２/ｇであり、その表面がヘキサメチルジシラザンで疎水化処理されたフュームドシリカ（日本アエロジル社製の商品名：ＲＸ２００）
(ｅ)成分：１－エチニルシクロヘキサン－１－オール
(ｆ)成分：２５℃における粘度が３０ｍＰa・ｓである分子鎖両末端シラノール基封鎖メチルビニルシロキサンオリゴマーと３－グリシドキシプロピルトリメトキシシランの縮合反応物
　また、実施例・比較例中の硬化性オルガノポリシロキサン組成物を硬化して得られる硬化物の硬さ、ダイシェア強度および硬化物中の気泡の数を次のようにして測定した。
［硬化物の硬さ］
　硬化性オルガノポリシロキサン組成物を１５０℃で１時間プレス成形することによりシート状硬化物を作製した。このシート状硬化物の硬さをＪＩＳ　Ｋ　６２５３に規定されるタイプＤデュロメータにより測定した。
［ダイシェア強度］
　２５ｍｍ×７５ｍｍの銀めっきした鋼板上に、硬化性オルガノポリシロキサン組成物をディスペンサーにより約３００ｍｇづつを５ヶ所に塗布した。次に、この組成物に厚さ１ｍｍの１０ｍｍ角のガラス製チップを被せ、１ｋｇの板により圧着した状態で、１５０℃で２時間加熱して硬化させた。その後、室温に冷却し、シェア強度測定装置（西進商事株式会社製のボンドテスターＳＳ－１００ＫＰ）によりダイシェア強度を測定した。
［硬化物内の気泡の数］
　前記方法により作製したダイシェア試験片内の気泡の数を目視により数えた。
［実施例１～６、比較例１～３］
　表１に示した混合比で硬化性オルガノポリシロキサン組成物を調製した。硬化物の諸特性を上記のようにして測定し、それらの結果を表１に示した。
Figure JPOXMLDOC01-appb-T000001
　本発明の硬化性オルガノポリシロキサン組成物は、発光ダイオード（ＬＥＤ）、半導体レーザ、フォトダイオード、フォトトランジスタ、固体撮像、フォトカプラー用発光体と受光体などの半導体素子の接着剤として有用である。また、本発明の半導体装置は、信頼性が優れるので、光学装置、光学機器、照明機器、照明装置などの光半導体装置として有用である。
　１　ポリフタルアミド（ＰＰＡ）樹脂製筐体
　２　インナーリード
　３　ダイパッド
　４　接着材
　５　発光ダイオード（ＬＥＤ）チップ
　６　ボンディングワイヤ
　７　封止材

Claims (8)

  1. （Ａ）一分子中に少なくとも２個のアルケニル基を有するオルガノポリシロキサン、
    （Ｂ）平均単位式：
    (Ｒ１ ３ＳｉＯ１/２)ａ(Ｒ１ ２ＳｉＯ２/２)ｂ(Ｒ２ＳｉＯ３/２)ｃ(ＳｉＯ４/２)ｄ
    （式中、Ｒ１は同じか又は異なる、脂肪族不飽和炭素結合を有さない一価炭化水素基もしくは水素原子であり、但し、一分子中、少なくとも２個のＲ１は水素原子であり、Ｒ２は脂肪族不飽和結合を有さない一価炭化水素基であり、ａ、ｂ、ｃはそれぞれ、０＜ａ＜１、０＜ｂ＜１、０≦ｃ＜０.２、０＜ｄ＜１、但し、０.６≦ａ／ｄ≦１.５、１.５≦ｂ／ｄ≦３、かつａ＋ｂ＋ｃ＋ｄ＝１を満たす数である。）
    で表されるオルガノポリシロキサンレジン｛（Ａ）成分中のアルケニル基に対する（Ｂ）成分中のケイ素原子結合水素原子のモル比が０.５～５となる量｝、
    および
    (Ｃ)ヒドロシリル化反応用触媒（本組成物を硬化させるのに十分な量）
    から少なくともなる硬化性オルガノポリシロキサン組成物。
  2. 　さらに、（Ｄ）ＢＥＴ比表面積が２０～２００ｍ２/ｇであるフュームドシリカを、（Ａ）～（Ｃ）成分の合計１００質量部に対して１～２０質量部含有する、請求項１に記載の硬化性オルガノポリシロキサン組成物。
  3. 　さらに、（Ｅ）ヒドロシリル化反応抑制剤を、（Ａ）～（Ｃ）成分の合計１００質量部に対して０.００１～５質量部含有する、請求項１または請求項２に記載の硬化性オルガノポリシロキサン組成物。
  4. 　さらに、（Ｆ）接着促進剤を、（Ａ）～（Ｃ）成分の合計１００質量部に対して０.０１～１０質量部含有する、請求項１乃至３のいずれか１項に記載の硬化性オルガノポリシロキサン組成物。
  5. 　さらに、（Ｇ）平均式：
    Ｒ３Ｒ４ ２ＳｉＯ(Ｒ４ ２ＳｉＯ)ｍ(Ｒ４ＨＳｉＯ)ｎＳｉＲ４ ２Ｒ３
    （式中、Ｒ３は同じか又は異なる、脂肪族不飽和炭素結合を有さない一価炭化水素基もしくは水素原子であり、Ｒ４は同じか又は異なる、脂肪族不飽和炭素結合を有さない一価炭化水素基であり、ｍは０～５０の数、ｎは０～５０の数であり、但し、ｎが０であるとき、Ｒ３は水素原子である。）
    で表されるオルガノポリシロキサンを、（Ａ）成分中のアルケニル基に対して（Ｇ）成分中のケイ素原子結合水素原子のモル比が多くとも０.５となる量含有する、請求項１乃至４のいずれか１項に記載の硬化性オルガノポリシロキサン組成物。
  6. 　硬化して、ＪＩＳ　Ｋ　６２５３に規定されるタイプＤデュロメータ硬さが３０～７０である硬化物を形成する、請求項１乃至５のいずれか１項に記載の硬化性オルガノポリシロキサン組成物。
  7. 　半導体素子の接着剤である、請求項１乃至６のいずれか１項に記載の硬化性オルガノポリシロキサン組成物。
  8. 　半導体素子が請求項１乃至６のいずれか１項に記載の硬化性オルガノポリシロキサン組成物の硬化物により接着されていることを特徴とする半導体装置。
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