DE602007004235D1 - Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung - Google Patents
Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtungInfo
- Publication number
- DE602007004235D1 DE602007004235D1 DE602007004235T DE602007004235T DE602007004235D1 DE 602007004235 D1 DE602007004235 D1 DE 602007004235D1 DE 602007004235 T DE602007004235 T DE 602007004235T DE 602007004235 T DE602007004235 T DE 602007004235T DE 602007004235 D1 DE602007004235 D1 DE 602007004235D1
- Authority
- DE
- Germany
- Prior art keywords
- organopolysiloxane composition
- silicon
- organopolysiloxane
- semiconductor device
- average
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920001296 polysiloxane Polymers 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 239000007809 chemical reaction catalyst Substances 0.000 abstract 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 238000006459 hydrosilylation reaction Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Silicon Polymers (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006229551A JP5148088B2 (ja) | 2006-08-25 | 2006-08-25 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
PCT/JP2007/064843 WO2008023537A1 (en) | 2006-08-25 | 2007-07-24 | Curable orgnopolysiloxane composition and semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602007004235D1 true DE602007004235D1 (de) | 2010-02-25 |
Family
ID=38596765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602007004235T Active DE602007004235D1 (de) | 2006-08-25 | 2007-07-24 | Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung |
Country Status (10)
Country | Link |
---|---|
US (1) | US8217388B2 (de) |
EP (1) | EP2061840B1 (de) |
JP (1) | JP5148088B2 (de) |
KR (1) | KR101408711B1 (de) |
CN (1) | CN101506309B (de) |
AT (1) | ATE454430T1 (de) |
DE (1) | DE602007004235D1 (de) |
MY (1) | MY145422A (de) |
TW (1) | TWI398488B (de) |
WO (1) | WO2008023537A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9593277B2 (en) | 2014-02-04 | 2017-03-14 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
US9944759B2 (en) | 2014-02-04 | 2018-04-17 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
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JP4895879B2 (ja) | 2007-03-19 | 2012-03-14 | サンユレック株式会社 | 発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法 |
JP5000566B2 (ja) * | 2008-03-27 | 2012-08-15 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置 |
US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
US12064979B2 (en) | 2008-06-13 | 2024-08-20 | Kateeva, Inc. | Low-particle gas enclosure systems and methods |
JP2010013503A (ja) * | 2008-07-01 | 2010-01-21 | Showa Highpolymer Co Ltd | 硬化性樹脂組成物およびオプトデバイス |
JP5469874B2 (ja) * | 2008-09-05 | 2014-04-16 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 |
JP5414337B2 (ja) * | 2009-04-17 | 2014-02-12 | 信越化学工業株式会社 | 光半導体装置の封止方法 |
CN102414275A (zh) * | 2009-05-29 | 2012-04-11 | 道康宁公司 | 用于产生透明硅氧烷材料和光学器件的硅氧烷组合物 |
JP2011155187A (ja) * | 2010-01-28 | 2011-08-11 | Konica Minolta Opto Inc | 発光ダイオードユニットの製造方法 |
JP2011155188A (ja) * | 2010-01-28 | 2011-08-11 | Konica Minolta Opto Inc | 発光ダイオードユニットの製造方法 |
JP5621272B2 (ja) * | 2010-02-15 | 2014-11-12 | 横浜ゴム株式会社 | シリコーン樹脂組成物、およびこれを用いる光半導体封止体 |
EP2599836B1 (de) * | 2010-07-27 | 2015-03-25 | Adeka Corporation | Härtbare zusammensetzung zur halbleitereinkapselung |
JP5971835B2 (ja) * | 2010-08-23 | 2016-08-17 | 信越化学工業株式会社 | 硬化性シリコーン樹脂組成物及びそれを用いた発光ダイオード装置 |
JP5674948B2 (ja) | 2010-09-22 | 2015-02-25 | ダウ コーニング コーポレーションDow Corning Corporation | 樹脂−直鎖状オルガノシロキサンブロックコポリマーを含有する高屈折率組成物 |
CN103314056B (zh) * | 2010-10-19 | 2015-06-17 | 爱博斯迪科化学(上海)有限公司 | 用于发光装置的杂化聚硅氧烷组合物 |
JP5549554B2 (ja) * | 2010-11-15 | 2014-07-16 | 信越化学工業株式会社 | 熱硬化性フルオロポリエーテル系接着剤組成物及びその接着方法 |
EP2657301B1 (de) * | 2010-12-22 | 2015-03-11 | Momentive Performance Materials Japan LLC | Uv-härtbare silikonharzzusammensetzung und bildanzeigevorrichtung damit |
EP2657300B1 (de) | 2010-12-22 | 2015-12-02 | Momentive Performance Materials Japan LLC | Wärmehärtbare polyorganosiloxanzusammensetzung und ihre verwendung |
JP5522111B2 (ja) | 2011-04-08 | 2014-06-18 | 信越化学工業株式会社 | シリコーン樹脂組成物及び当該組成物を使用した光半導体装置 |
KR20140035368A (ko) | 2011-05-11 | 2014-03-21 | 헨켈 차이나 컴퍼니 리미티드 | 개선된 장벽 특성을 갖는 실리콘 수지 |
WO2012157330A1 (ja) * | 2011-05-17 | 2012-11-22 | 積水化学工業株式会社 | 光半導体装置用封止剤及び光半導体装置 |
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JP4908736B2 (ja) * | 2003-10-01 | 2012-04-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP2005162859A (ja) * | 2003-12-02 | 2005-06-23 | Dow Corning Toray Silicone Co Ltd | 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材 |
JP4801320B2 (ja) * | 2003-12-19 | 2011-10-26 | 東レ・ダウコーニング株式会社 | 付加反応硬化型オルガノポリシロキサン樹脂組成物 |
JP2006063092A (ja) | 2004-07-29 | 2006-03-09 | Dow Corning Toray Co Ltd | 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤 |
EP1674495A1 (de) * | 2004-12-22 | 2006-06-28 | Huntsman Advanced Materials (Switzerland) GmbH | Beschichtungssystem |
JP4636242B2 (ja) * | 2005-04-21 | 2011-02-23 | 信越化学工業株式会社 | 光半導体素子封止材及び光半導体素子 |
US20090146175A1 (en) * | 2006-01-17 | 2009-06-11 | Maneesh Bahadur | Thermal stable transparent silicone resin compositions and methods for their preparation and use |
JP5202822B2 (ja) * | 2006-06-23 | 2013-06-05 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
-
2006
- 2006-08-25 JP JP2006229551A patent/JP5148088B2/ja active Active
-
2007
- 2007-07-13 TW TW096125678A patent/TWI398488B/zh active
- 2007-07-24 MY MYPI20090723A patent/MY145422A/en unknown
- 2007-07-24 EP EP07791537A patent/EP2061840B1/de active Active
- 2007-07-24 KR KR1020097003829A patent/KR101408711B1/ko active IP Right Grant
- 2007-07-24 AT AT07791537T patent/ATE454430T1/de not_active IP Right Cessation
- 2007-07-24 CN CN2007800316498A patent/CN101506309B/zh active Active
- 2007-07-24 DE DE602007004235T patent/DE602007004235D1/de active Active
- 2007-07-24 WO PCT/JP2007/064843 patent/WO2008023537A1/en active Application Filing
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9593277B2 (en) | 2014-02-04 | 2017-03-14 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
US9944759B2 (en) | 2014-02-04 | 2018-04-17 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product therefrom, and optical semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
CN101506309B (zh) | 2012-03-21 |
EP2061840B1 (de) | 2010-01-06 |
KR101408711B1 (ko) | 2014-06-17 |
US8217388B2 (en) | 2012-07-10 |
TWI398488B (zh) | 2013-06-11 |
CN101506309A (zh) | 2009-08-12 |
US20100301377A1 (en) | 2010-12-02 |
MY145422A (en) | 2012-02-15 |
EP2061840A1 (de) | 2009-05-27 |
KR20090054429A (ko) | 2009-05-29 |
ATE454430T1 (de) | 2010-01-15 |
TW200811244A (en) | 2008-03-01 |
WO2008023537A1 (en) | 2008-02-28 |
JP2008050494A (ja) | 2008-03-06 |
JP5148088B2 (ja) | 2013-02-20 |
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