CN103724939A - 一种封装二极管 - Google Patents
一种封装二极管 Download PDFInfo
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- CN103724939A CN103724939A CN201310730149.0A CN201310730149A CN103724939A CN 103724939 A CN103724939 A CN 103724939A CN 201310730149 A CN201310730149 A CN 201310730149A CN 103724939 A CN103724939 A CN 103724939A
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- silane
- resin
- stir
- diode
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Priority Applications (1)
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CN201310730149.0A CN103724939A (zh) | 2013-12-26 | 2013-12-26 | 一种封装二极管 |
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CN201310730149.0A CN103724939A (zh) | 2013-12-26 | 2013-12-26 | 一种封装二极管 |
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CN103724939A true CN103724939A (zh) | 2014-04-16 |
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CN201310730149.0A Pending CN103724939A (zh) | 2013-12-26 | 2013-12-26 | 一种封装二极管 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040178509A1 (en) * | 2003-03-12 | 2004-09-16 | Shin-Etsu Chemical Co., Ltd. | Light-emitting semiconductor potting composition and light-emitting semiconductor device |
US20050006794A1 (en) * | 2003-07-09 | 2005-01-13 | Tsutomu Kashiwagi | Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device |
CN1863875A (zh) * | 2003-10-01 | 2006-11-15 | 陶氏康宁东丽株式会社 | 可固化的有机聚硅氧烷组合物和半导体器件 |
US20060270808A1 (en) * | 2005-05-24 | 2006-11-30 | Shin-Etsu Chemical Co., Ltd. | Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device |
CN101508882A (zh) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | 一种应用于发光二极管的封装材料及其制备方法 |
CN101636450A (zh) * | 2007-03-19 | 2010-01-27 | 三友瑞克株式会社 | 发光元件封装用有机硅树脂组合物和通过使用其的浇注方式进行的光半导体电子部件的制造方法 |
CN101872832A (zh) * | 2010-06-13 | 2010-10-27 | 汕头市骏码凯撒有限公司 | 一种应用于发光二极管的封装材料及其制备方法和使用方法 |
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2013
- 2013-12-26 CN CN201310730149.0A patent/CN103724939A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040178509A1 (en) * | 2003-03-12 | 2004-09-16 | Shin-Etsu Chemical Co., Ltd. | Light-emitting semiconductor potting composition and light-emitting semiconductor device |
US20050006794A1 (en) * | 2003-07-09 | 2005-01-13 | Tsutomu Kashiwagi | Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device |
CN1863875A (zh) * | 2003-10-01 | 2006-11-15 | 陶氏康宁东丽株式会社 | 可固化的有机聚硅氧烷组合物和半导体器件 |
US20060270808A1 (en) * | 2005-05-24 | 2006-11-30 | Shin-Etsu Chemical Co., Ltd. | Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device |
CN101636450A (zh) * | 2007-03-19 | 2010-01-27 | 三友瑞克株式会社 | 发光元件封装用有机硅树脂组合物和通过使用其的浇注方式进行的光半导体电子部件的制造方法 |
CN101508882A (zh) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | 一种应用于发光二极管的封装材料及其制备方法 |
CN101872832A (zh) * | 2010-06-13 | 2010-10-27 | 汕头市骏码凯撒有限公司 | 一种应用于发光二极管的封装材料及其制备方法和使用方法 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 523000 Guangdong Province, Dongguan City Zhangmutou town Baiguo cave village Baida Industrial Street Panlong Road No. 8 Applicant after: DONGGUAN GRAND-HI INDUSTRY CO., LTD. Address before: 523000 Guangdong Province, Dongguan City Zhangmutou town Baiguo cave village Baida Industrial Street Panlong Road No. 8 Applicant before: Dongguan Guanghaida Rubber & Plastic Co., Ltd. |
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COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: DONGGUAN GUANGHAIDA RUBBER + PLASTIC CO., LTD. TO: GUANGDONG GUANGHAIDA INDUSTRIAL CO., LTD. |
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C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20140416 |