US20160243619A1 - Methods and systems for printing 3d object by inkjet - Google Patents

Methods and systems for printing 3d object by inkjet Download PDF

Info

Publication number
US20160243619A1
US20160243619A1 US15/029,815 US201415029815A US2016243619A1 US 20160243619 A1 US20160243619 A1 US 20160243619A1 US 201415029815 A US201415029815 A US 201415029815A US 2016243619 A1 US2016243619 A1 US 2016243619A1
Authority
US
United States
Prior art keywords
layer
printing
dispersant
temperature
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
US15/029,815
Other languages
English (en)
Inventor
Hanan Gothait
Eli Kritchman
Axel Benichou
Timofey Shmal
Guy Eytan
Wael Salalha
Yohai DAYAGI
Oleg KODINETS
Lior Lavid
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xjet Ltd
Original Assignee
Xjet Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xjet Ltd filed Critical Xjet Ltd
Priority to US15/029,815 priority Critical patent/US20160243619A1/en
Publication of US20160243619A1 publication Critical patent/US20160243619A1/en
Pending legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • B22F3/1055
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/188Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control
    • B29C64/194Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control during lay-up
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10Formation of a green body
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10Formation of a green body
    • B22F10/14Formation of a green body by jetting of binder onto a bed of metal powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20Direct sintering or melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00Producing shaped prefabricated articles from the material
    • B28B1/001Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B17/00Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
    • B28B17/0063Control arrangements
    • B28B17/0081Process control
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/40Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling
    • B33Y40/20Post-treatment, e.g. curing, coating or polishing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00Materials specially adapted for additive manufacturing
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G41/00Compounds of tungsten
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G51/00Compounds of cobalt
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • C09D11/32Inkjet printing inks characterised by colouring agents
    • C09D11/322Pigment inks
    • AHUMAN NECESSITIES
    • A43FOOTWEAR
    • A43DMACHINES, TOOLS, EQUIPMENT OR METHODS FOR MANUFACTURING OR REPAIRING FOOTWEAR
    • A43D2200/00Machines or methods characterised by special features
    • A43D2200/60Computer aided manufacture of footwear, e.g. CAD or CAM
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00Products made by additive manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Definitions

  • the present invention generally relates to 3D (three-dimensional) printing.
  • 3D printing or additive manufacturing is any of various processes for making a 3D object of almost any shape from a 3D model or other electronic data source primarily through additive processes in which successive layers of material are laid down under computer control.
  • a 3D printer is a type of industrial robot.
  • Conventional processes include stereo lithography employing UV lasers to cure photopolymers, inkjet printers utilizing UV lamps to cure photopolymers, metal sintering (such as selective laser sintering and direct metal laser sintering), plastic extrusion technology, and deposition of liquid binder on powder.
  • 3D printing is used in applications such as product development, data visualization, rapid prototyping, specialized manufacturing, and production (job production, mass production, and distributed manufacturing).
  • Fields of use are many, including architecture, construction (AEC), industrial design, automotive, aerospace, military, engineering, dental and medical industries, biotech (human tissue replacement), fashion, footwear, jewelry, eyewear, education, geographic information systems, food, and many other fields.
  • the printing is via at least one printing head jetting the at least one ink.
  • at least one of the printing heads is modulated according to a content of the first layer.
  • the carrier is a liquid
  • the particles are a material used to construct the object and dispersed in the carrier liquid
  • the dispersant is dissolved in the carrier liquid, adhere to the particles' surface, and inhibit agglomeration of the particles to each other.
  • the dispersant binds the particles to each other after the carrier is evaporated.
  • the dispersant inhibits sintering of the particles to each other after the carrier is evaporated.
  • the printing is selective, printing to areas that are part of the first layer of the object.
  • the object is printed on a tray made of a thermal isolation material.
  • a temperature of the upper surface (TS) of the object is at least 4% higher than the carrier boiling point temperature T 1 , thereby creating a porous structure in the object's printed lattice.
  • the lower-bound ([T 1 ]) includes 20% less than the carrier boiling point temperature (T 1 ) in degrees Kelvin.
  • the upper-bound ([T 2 ]) is 20% more or less than the dispersant boiling point temperature (T 2 ) in degrees Kelvin.
  • the step of maintaining is via use of a source selected from the group consisting of: a heated tray; an electro-magnetic (EM) radiation source above the object; and a hot gas.
  • a source selected from the group consisting of: a heated tray; an electro-magnetic (EM) radiation source above the object; and a hot gas.
  • EM electro-magnetic
  • the printing is selective, printing to areas that are part of the first layer of the object and the EM radiation source is non-selective, irradiating an entire area on which the object is being printed.
  • the step of evaporating the dispersant is via use of an EM radiation source selected from the group consisting of: a heating lamp; a laser; focused linear laser beam; a scanned focused pencil laser beam; focused light from a linear incandescent bulb; focused light from a gas discharge lamp bulb; a flash light; an ultra-violet (UV) light source; a visible light source; and an infrared (IR) light source.
  • an EM radiation source selected from the group consisting of: a heating lamp; a laser; focused linear laser beam; a scanned focused pencil laser beam; focused light from a linear incandescent bulb; focused light from a gas discharge lamp bulb; a flash light; an ultra-violet (UV) light source; a visible light source; and an infrared (IR) light source.
  • the printing is selective, printing to areas that are part of the first layer of the object and the EM radiation source is non-selective, irradiating an entire area on which the object is being printed.
  • the scanned laser beam is modulated according to a content of the layer.
  • At least two inks are printed, each of the at least two inks including particles of different types, and a local proportion of each of the at least two inks is determined by the first layer's specification.
  • the particles are selected from a group consisting of: metal; metal oxides; metal carbides; metal alloys; inorganic salts; polymeric particles; Polyolefin; and poly (4-methyl 1-pentene).
  • a catalyst is added to the first layer.
  • the catalyst is added via a technique selected from the group consisting of: including the catalyst in at least one of the inks; jetting the catalyst in gaseous form from above the first layer; jetting the catalyst in liquid form from above the first layer; spraying the catalyst in gaseous form from above the first layer; and spraying the catalyst in liquid form from above the first layer.
  • the catalyst is selected from the group consisting of: a halide compound; and a copper chloride compound.
  • a system for printing an object including: at least one printing head configured to print a first layer of at least one ink, each of the at least one ink including: a carrier having a carrier boiling point temperature (T 1 ); a dispersant having a dispersant boiling point temperature (T 2 ); and particles having a particle sintering temperature (T 3 ), a controller configured to maintain a temperature of the first layer (TL) in a pre-defined range of temperatures, wherein the pre-defined range of temperatures is above a lower-bound ([T 1 ]) of the carrier boiling point temperature and below an upper-bound ([T 2 ]) of the dispersant boiling point temperature ([T 1 ] ⁇ TL ⁇ [T 2 ]), thus evaporating the carrier while the dispersant remains in the first layer.
  • T 1 carrier boiling point temperature
  • T 2 dispersant boiling point temperature
  • T 3 particles having a particle sintering temperature
  • a system for printing an object including: at least one printing head configured to print a first layer of at least one ink, each of the at least one ink including: a carrier having a carrier boiling point temperature (T 1 ); a dispersant having a dispersant boiling point temperature (T 2 ); and particles having a particle sintering temperature (T 3 ), a controller configured for: evaporating at least a portion of the dispersant; and subsequent operation selected from the group consisting of at least partially sintering the first layer; and repeating step (a) by printing a subsequent layer of the at least one ink on the first layer.
  • T 1 carrier having a carrier boiling point temperature
  • T 2 dispersant boiling point temperature
  • T 3 particles having a particle sintering temperature
  • At least one of the printing heads is an ink-jet head configured to print the at least one ink via jetting. In another optional embodiment, at least one of the printing heads is modulated according to a content of the first layer.
  • the carrier is a liquid; the particles are a material used to construct the object and dispersed in the carrier liquid; and the dispersant is dissolved in the carrier liquid, adhere to the particles' surface, and inhibit agglomeration of the particles to each other.
  • the printing is selective, printing to areas that are part of the first layer of the object.
  • the object is printed on a tray made of a thermal isolation material.
  • the lower-bound ([T 1 ]) includes 20% less than the carrier boiling point temperature (T 1 ) in degrees Kelvin.
  • the upper-bound ([T 2 ]) is 20% more or less than the dispersant boiling point temperature (T 2 ) in degrees Kelvin.
  • the step of maintaining is via use of a source selected from the group consisting of: a heated tray; an electro-magnetic (EM) radiation source above the object; and a hot gas.
  • a source selected from the group consisting of: a heated tray; an electro-magnetic (EM) radiation source above the object; and a hot gas.
  • EM electro-magnetic
  • the printing is selective, printing to areas that are part of the first layer of the object and the EM radiation source is non-selective, irradiating an entire area on which the object is being printed.
  • the step of evaporating the dispersant is via use of an EM radiation source selected from the group consisting of: a heating lamp; laser; a focused linear laser beam; a scanned focused pencil laser beam; focused light from a linear incandescent bulb; focused light from a gas discharge lamp bulb; a flash light; an ultra-violet (UV) light source; a visible light source; and an infrared (IR) light source.
  • an EM radiation source selected from the group consisting of: a heating lamp; laser; a focused linear laser beam; a scanned focused pencil laser beam; focused light from a linear incandescent bulb; focused light from a gas discharge lamp bulb; a flash light; an ultra-violet (UV) light source; a visible light source; and an infrared (IR) light source.
  • each of the at least two inks including particles of different types, and a local proportion of each of the at least two inks is determined by the first layer's specification.
  • the horizontal roller is mounted on a horizontal axis with respect to a plane of the first layer.
  • the horizontal roller is selected from the group consisting of: grinding roller having an abrasive surface; a cutting roller having discrete blades; a cutting roller having spiral blades; and a cutting roller having discrete blades of steel and/or Tungsten Carbide.
  • particle waste produced from leveling is removed from the first layer via use of a technique selected from the group consisting of: suction; and suction via a pipe through a dust filter.
  • the horizontal roller is heated to a roller temperature higher than a layer temperature of the first layer, using a heating source selected from the group consisting of: a heat source external to the roller; a heat source internal to the roller; and a static internal heat source.
  • a heating source selected from the group consisting of: a heat source external to the roller; a heat source internal to the roller; and a static internal heat source.
  • a system for printing an object including: at least one printing head configured to print a first layer of at least one ink; a horizontal roller having a rotation generally perpendicular to a plane of the first layer; and a controller configured for at least partially hardening the first layer; and leveling the first layer using the horizontal roller.
  • the horizontal roller is mounted on a horizontal axis with respect to a plane of the first layer.
  • the roller is selected from the group consisting of: a grinding roller having an abrasive surface; a cutting roller having discrete blades; a cutting roller having spiral blades; and a cutting roller having discrete blades of steel and Tungsten Carbide.
  • the first and second carriers are liquids.
  • the second particles are selected from a group consisting of miscible in water; at least partially soluble in water; inorganic solid; organic; polymer; particles having a hardness less than the hardness of the first particles; salt; Metal oxides; Silica (SiO 2 ); Calcium sulfate; and tungsten carbide (WC).
  • further including removing the support using a technique on the object with support the technique selected from the group consisting of: firing; immersing to dissolve the support; immersing in water to dissolve the support; immersing in acid; sand blasting; and water jetting.
  • the particles are selected from a group consisting of: metal; metal oxides; metal carbides; metal alloys; inorganic salts; polymeric particles; Polyolefin; and poly (4-methyl 1-pentene).
  • a system for printing an object with support including: at least one printing head a controller configured for: printing, via the at least one printing head, an object portion of a first layer using at least a first ink, the first ink including: a first carrier; and first particles used to construct the object and dispersed in the first carrier, printing, via the at least one printing head, a support portion of the first layer using at least a second ink, the second ink including: a second carrier; and second particles used to construct the support and dispersed in the second carrier.
  • the second carrier is the first carrier.
  • the second particles are other than the first particles.
  • the printing a support portion is additionally with the first ink.
  • the printing an object portion is via at least a first printing head jetting the first ink and the printing a support portion is via at least a second printing head jetting the second ink.
  • at least one of the printing heads is modulated according to a content of the first layer.
  • a computer program that can be loaded onto a server connected to a network, so that the server running the computer program constitutes a controller in a system implementing any one of the above system claims.
  • FIG. 1 is a simplified diagram of 3D printing an individual layer.
  • FIG. 2A is a simplified diagram of leveling apparatus.
  • FIG. 2B is a simplified diagram of leveling apparatus with warming sources.
  • FIG. 3A is a simplified exemplary system for 3D printing.
  • FIG. 3B is a diagram of a lamp as an exemplary radiation source.
  • FIG. 3C is a diagram of a lamp as an exemplary radiation source.
  • FIG. 4A is a simplified diagram of a system for removing fumes during printing.
  • FIG. 5 is a simplified diagram of a system for removing fumes during printing using an alternative radiation source.
  • FIG. 6A is a diagram of solid particles with small edges.
  • FIG. 6B is a diagram of solid particles with bridged sintering by smaller particles.
  • FIG. 7 is a diagram of partial sintering.
  • FIG. 8A is a diagram of dispensing catalyst material.
  • FIG. 9 is a diagram of using a liquid pump roller.
  • FIG. 10A is a diagram of objects built with different materials.
  • FIG. 10B is a diagram of objects built with a mix of materials.
  • FIG. 11A is a diagram of support when building a 3D object.
  • FIG. 11B is a diagram of printing support portions and object portions of layers.
  • FIG. 11C is a diagram of using reinforcing support columns.
  • FIG. 12 is a diagram of an exemplary carousel machine for production of 3D objects.
  • FIG. 13 is a high-level partial block diagram of an exemplary system configured to implement a controller for the present invention.
  • a present invention is a system and method for 3D (three-dimensional) printing by dispensing ink including particles of any chosen material.
  • the particles in the dispensed ink are micro or nano particles.
  • the particles combine to each other (i.e. sinter) to form solid or porous solid material.
  • the system facilitates:
  • object generally refers to an item that a user desires to produce, in particular via 3D printing.
  • object refers to an item to be produced by the 3D printing process.
  • object can refer to an incomplete or partially generated item.
  • burn out or “burn off”, “fire-off”, or “firing-off” refer to evaporating or disintegrating and evaporating a component of the ink.
  • printing liquid and “ink” refer in general to a material used for printing, and includes, but is not limited to homogeneous and non-homogenous materials, for example a carrier liquid containing a dissolved material such as metal particles to be deposited via the printing process.
  • dispersion generally refers to particles distributed and suspended in a liquid or gas and/or distributed evenly throughout a medium.
  • pencil laser beam generally refers to a laser beam that can be focused to a point
  • linear laser beam refers to a laser beam that can be focused to a line
  • liquid-ejection nozzles of a liquid-ejection mechanism such as nozzle dispensers.
  • Liquid-ejection nozzles are also referred to as dispensing heads.
  • a preferred embodiment is using inkjet printing heads for dispensing ink.
  • Another option is to use spray nozzles.
  • inkjet printing provides increased speed, finer object dimensions, and increased quality of finished objects as compared to spray nozzles.
  • the inkjet heads normally dispense the ink layer-by-layer, dispensing subsequent layers on previously dispensed layers. Typically, each layer is hardened before dispensing the succeeding layer.
  • the inkjet heads dispense each layer according to the image content of that layer.
  • the inkjet heads “blindly” dispense the layer, and a hardening tool (e.g. a scanning laser beam) hardens the layer according to the layer's specific image content.
  • a hardening tool e.g. a scanning laser beam
  • a printing system will include more than one type of ink.
  • Inks include object ink and support ink.
  • Object ink is used to produce the desired object, and support ink is used temporarily during printing, for example to support “negative” tilted walls of the object.
  • support ink is used temporarily during printing, for example to support “negative” tilted walls of the object.
  • inks typically include the following ingredients:
  • the ink includes a dispersion of solid particles of any required material, e.g. metals (iron, copper, silver, gold, titanium etc.), metal oxides, oxides (SiO 2 , TiO 2 , BiO2 etc.), metal carbides, carbides (WC, Al4C3, TiC), metal alloys (stainless steel, Titanium Ti64 etc.), inorganic salts, polymeric particles, etc., in volatile carrier liquid.
  • the particles are of micro (0.5 to 50 micrometer size) or nano (5 to 500 nanometer size) as required to maintain the required spatial resolution during printing, maintain the required material character (after sintering), or to satisfy limitations of a dispensing head.
  • the particle size should preferably be equal or smaller than 2 ⁇ .
  • the term “particles” generally refers to solid particles used to construct (print) the object and/or the “bulk material” of the object. The use of the term particles will be obvious from context.
  • the particles are dispersed in a carrier liquid, also referred to as a “carrier” or “solvent”.
  • a dispersing agent (often call dispersant) assist in dispersing the particles in the liquid.
  • the liquid should evaporate immediately after printing so that the succeeding layer is dispensed on solid material below.
  • the temperature of an upper layer of the object during printing should be comparable with the boiling temperature of the carrier.
  • the temperature of the upper printed layer is much higher than the boiling temperature of the liquid carrier, encouraging thereby the evaporation of other organic materials like dispersants or various additives in the carrier.
  • dispersants are readily available, such as polymeric dispersants such as Disperbyk 180, disperbyk 190, disperbyk 163, from Byk Chemie GMBH.
  • Conventional particle ink is readily available such as commercial SunTronic Jet Silver U6503, from Sun Chemicals Ltd. (485 Berkshire Av, Slough, UK).
  • At least part of a solid material to be used to construct (print) the object can be dissolved in the ink.
  • a dispersion of silver (Ag) particles which in addition to the Ag particles includes a fraction of Ag organic compound dissolved in the carrier liquid. After printing and during firing, the organic portion of the Ag organic compound fires off, leaving the metal silver atoms well spread.
  • This conventional ink is readily available such as Commercial DYAG100 Conductive Silver Printing Ink, from Dyesol Inc. (USA), 2020 Fifth Street #638, Davis Calif. 95617.
  • a dispersing agent also referred to as a dispersant
  • a dispersing agent is used in the ink.
  • Dispersants are known in the industry, and are often a kind of polymeric molecule.
  • the dispersing molecules adhere to the (solid) particle's surface (i.e. wrap the particles) and inhibit agglomeration of the particles to each other.
  • the dispersing agent should also be able to dissolve in the carrier liquid so that a stable dispersion can be formed.
  • the dispersant remains in the final object, typically at concentrations of about 10%. While having dispersant as part of a final 3D product may be acceptable for the construction of some objects, for other objects there is an essential need to remove substantially all of the dispersant. For example, to have the final concentration of dispersant be less than 0.1%. This is because:
  • FIG. 1 a simplified diagram of 3D printing an individual layer.
  • a printing head 100 is shown in a first position 100 A when preparing to print a first layer 104 of the object, and in a second position 100 B when preparing to print a subsequent layer of the object.
  • the printing head 100 (e.g. inkjet head) includes a nozzle array 102 that scans the layer 104 in an X direction substantially perpendicular to the longitudinal axis Y of the layer 104 .
  • the jetted droplet volume of different individual nozzles may be slightly different from each other individual nozzle (of the nozzle array 102 ) because of technology deficiency of the head 100 construction. Moreover, a nozzle can stop jetting as the nozzle can become clogged by aggregated ink particles or because of other reasons.
  • the head 100 is shifted along the Y-axis before every subsequent layer is printed.
  • the shift amount from layer to layer may be set random within a predetermined shift range.
  • the appropriate leveling apparatus includes a vertical grinding roller or cutting (machining) roller.
  • the appropriate leveling apparatus includes a horizontal (i.e. parallel to the printing surface) grinding roller or cutting (machining) roller.
  • FIG. 2A a simplified diagram of leveling apparatus
  • FIG. 3A a simplified exemplary system for 3D printing.
  • a 3D object 312 is typically constructed layer-by-layer on a substrate or tray.
  • the tray is typically heated, and a non-limiting example of a heated tray 318 is generally used in this description.
  • the object is printed in the plane of the X-Y axis, and a newly formed layer 310 (also referred to in the context of this document as the upper-layer) is built along the Z-axis during every printing pass.
  • Ink 322 is supplied or contained in a printing head 314 .
  • Optional cooling mask 316 , windshield 324 , thermal partition 320 are used to protect the printing head 314 from the other printing equipment and/or vice versa.
  • Optional radiation source 308 and/or cooling fan 326 can be used to assist with temperature control of the newly printed layer and/or 3D object body 312 .
  • Optional leveling roller 302 can be used during printing to smooth the surface of the newly formed layer 310 and/or the top surface (outermost surface along the Z-axis) of the 3D object body 312 .
  • An optional dust filter 306 can be used to suck the dust output of leveling.
  • Leveling apparatus are also known in the field as “leveling rollers” or simply “rollers”.
  • the leveling apparatus operates on a newly formed layer 310 of a 3D object 312 after or as the layer has/is being been printed (dispensed and solidified).
  • the leveling apparatus typically peels off between 5% and 30% of material of the most recently printed layer's height. In other words, shaving the top of the first layer (most recently printed layer).
  • the roller meets the ink after the carrier liquid ink has evaporated and the layer is at least partially dry and solid.
  • solid means “a piece of metal”, i.e. well sintered particles.
  • solid means a pile of particles adhered to each other by organic material or by some initial sintering.
  • the leveling roller 302 may be a grinding roller 202 including a metal cylinder 204 with an abrasive surface 206 , for example coated with hard grinding particles, e.g. WC (Tungsten carbide) or diamond “dust”.
  • the leveling roller 302 may be a cutting roller 212 (also referred to in the context of this document as a “bladed” roller) including a milling cutting tool 214 with sharp blades 216 .
  • Smooth and knurled rollers 202 are known in the art, for example smooth rollers as taught by Kritchman in U.S. Pat. No. 8,038,427 and knurled rollers as taught by Leyden in U.S. Pat. No. 6,660,209.
  • a smooth roller is typically used to meter a liquid layer of material, and acts like a delicate shaving pump.
  • a knurled roller typically adapted to meter soft wax surface, consists of a multitude of relatively small knurls, or particles, as compared to the size of the cylinder 204 and/or relative to the size of the object to be ground.
  • a typical cutting roller 212 features discrete blades 216 that can be relatively large compared to the size of the object to be ground.
  • smooth nor knurled rollers can be adapted to level dry solid material for many reasons.
  • the grinding roller is substantially constantly in contact with the object to be leveled.
  • a cutting roller 212 is intermittently in contact with the object to be ground—only when the edge of a blade 216 encounters the surface to be leveled.
  • a knurled roller can be adapted to level dry solid material, is the direction of force that the vertical roller applies onto the shaped surface.
  • the blade When a rotating blade touches the surface, the blade first cuts in by applying horizontal force, and second lifts the cut chip up by applying upward force.
  • the knurl touches the surface, the knurl first presses and pushes the material both downward and forward by applying downward and horizontal force, and second pushes the detached material up by applying forward and upward force.
  • the downward force may be harmful to delicate object features, since the downward force will easily break the fragile object features.
  • vertical milling or smoothing tools including multiple cutting blades or grinding disk (e.g. including diamond dust surface), are mounted to a vertical beam that is perpendicular to the plane of printing/plane of the upper surface of the object, and rotates about the beam. These vertical milling tools are used to level the upper-layer (most recently printed and at least partially solidified). The cutting or grinding surface of the vertical tools is parallel to the plane of printing, but the rotation vector points vertically upwards.
  • the leveling roller is mounted on a horizontal axis and rotates about a horizontal axis (horizontal to the plane of the upper layer of the object), thus providing a horizontal roller.
  • the grinding surface of a horizontal roller at the point of contact (touch) with the material is generally also horizontal (parallel to the plane of printing), but the rotation vector is horizontal (points horizontally, perpendicular to the sweep direction X).
  • the horizontal roller rotates about a horizontal axis 220 relative to the layer being ground. In other words, the outer surface of the roller (or the blade's tip) moves horizontally at the point of contact with the object's new layer.
  • the horizontal roller can be a grinding roller 202 , or preferably, the horizontal roller allows implementation with a cutting (bladed) roller 212 .
  • a feature of the horizontal roller as compared to the vertical tools is the feasibility to collect outcome dust (including shaved material). While a vertical tool ejects the dust to all directions pointing outward from the vertical axle (i.e. all around directions parallel to the printing surface), a horizontal roller lifts the dust upward in such manner that the dust can be more easily collected and pumped out, such as via into a dust filter 306 .
  • the vertical tool can be very sensitive to precise alignment, since the vertical tool touches the printing surface all over the vertical tool's horizontal surface.
  • a horizontal roller touches the printing surface substantially only at a line, and therefore there is no need to align a horizontal roller in the X-axis direction.
  • a substantial disadvantage of the grinding surface in comparison to the cutting bladed roller/tool is that the grinding surface is vulnerable to dust (shaved particles) sticking to the diamond dust (of the grinding surface) and disturb thereby proper grinding.
  • the cutting roller includes N blades and rotates at an F RPM (revolution per minute), and the relative sweep velocity between the roller and the object in X direction is V. For a given V, the smallest chip is obtained when N and F are set to maximum values.
  • using a spiral blade in comparison to using a straight blade has also positive influence on preventing harm to delicate details, since a spiral blade cuts only a relatively small spot (as compared to a straight blade) in the shaved surface at a time, while the spot's neighboring area holds the spot from breaking.
  • orientation of a horizontal roller is described as being perpendicular to the direction of sweep during printing.
  • orientation does not have to be (can be other than) strictly perpendicular and may be at an angle (non-zero) to the sweep direction.
  • the rotation direction 222 of the cutting roller 212 vs. the relative sweep direction between the roller and the object can be either in the “cutting and lifting” direction (for example, clockwise in FIG. 2A and FIG. 2B ), or in the “dig and push” direction (counter clockwise in FIG. 2A and FIG. 2B ).
  • the direction of the relative object shift vs. roller during leveling is not definite (undefined/not pre-defined), and can be different in different applications. Based on this description, one skilled in the art will be able to determined specific details, attributes of the printed material, and other considerations of the printing machine for implementing a specific application depending on the.
  • particle waste can be generated.
  • the particle waste can include shaved particles and/or dust of the solid particles from the printing ink. Techniques to prevent the particle waste from being scattered over the printing surface, and to remove the waste from the roller blades, should be applied.
  • the horizontal roller facilitates implementation of techniques for preventing scattering of particle waste, for example by adding a shield around the roller (half-arch shield 303 ) and applying sucking force via pipe 304 during “rolling”. The particle waste is sucked off the surface of the object and the blades, optionally through a filter 306 . [Eli: Added half-arch shield 303 to FIG. 3A .]
  • the roller may be installed before or preferably after a radiation source 308 such as incandescent or discharge lamp (shown), coherent beam (laser), or ultra-violet (UV), visible, or infrared (IR) radiation source, etc.
  • a radiation source 308 such as incandescent or discharge lamp (shown), coherent beam (laser), or ultra-violet (UV), visible, or infrared (IR) radiation source, etc.
  • FIG. 2B a simplified diagram of leveling apparatus with warming sources.
  • the ink particles may stick to the roller blades or grinding particles and thereby disturb proper leveling. This might be a consequence of insufficient drying of the ink or insufficient firing the organic elements.
  • the layer can be further dried by elevating the layer temperature. This technique of elevating the layer temperature might be unacceptable in some cases because of other aspects of the printing process, e.g. deformation of the printed object.
  • the roller can be warmed to high enough temperature in which the problem of stickiness of the ink is avoided.
  • the roller may be set 100 degrees Celsius (° C.) or even higher than the layer's temperature.
  • Warming the roller may be done by heating the roller's outer surface by an external heat source (i.e. located outside the roller) or by an inner heat source located in the roller.
  • Inner heat sources preferably include static (non-rotating) warming element, such as a halogen lamp or a heat rode 230 .
  • a mask refers to a plate that partially covers an orifice plate and has an opening to facilitate printing from nozzles to a print area.
  • Masks are also referred to as “cooling masks” and can be used as a “thermal buffer”.
  • the printing heads 314 (such as printing head 100 ) that scan the upper layer in close vicinity (0.5-3 mm between the printing head 314 and object 312 ) must be protected from the heat and fumes emerging from the newly formed layer 310 (dispensed layer).
  • a cooling mask 316 maintained at a relatively low temperature compared to the temperature of the object while being printed e.g. from 10 to 40° C. is installed as a buffer between the printing head 314 and the printed object 312 .
  • the printed object should preferably be maintained substantially at uniform and constant temperature throughout printing.
  • the upper surface of the object body keeps losing heat to the surrounding atmosphere during printing, and also supplies heat to the newly dispensed layer, since the dispensed ink is usually colder than the object, and since heat is consumed by the evaporation of the liquid carrier of the new layer.
  • the heat source is only below the object (for example, a heated tray 318 )
  • the heat constantly flows up to the upper layer, and because of the heat-flow resistance of the material, a temperature gradient is built, high temperature at the bottom of the object and low at the upper surface of the object (along the Z-axis).
  • the heat should also (or merely) be supplied directly to the upper surface or layer.
  • the temperature of the upper layer should be the same during the printing (though may be higher than the temperature of the bulk), because drying and possibly evaporating the organics and partial sintering occur in that layer, processes that strongly depend on the layer temperature.
  • the term “printing surface” 328 typically includes the most recently printed finished layer, prior to printing of the current, newly formed layer 310 .
  • the printing surface 328 is the upper surface or upper layer, most recently previously printed along the Z-axis, and is the surface upon which the newly formed layer 310 is printed.
  • the printing surface is the substrate, for example the heated tray 318 .
  • the printing surface is typically the upper surface of the object body, plus supporting material, as appropriate.
  • heat is supplied to the upper surface by an electromagnetic (EM) energy source through the surrounding gas or vacuum.
  • the EM energy source is one non-limiting example of a radiation source 308 .
  • the radiation source 308 is located above the upper layer/object being printed.
  • the direct heating by the EM source can assure constant temperature of the upper layer.
  • the temperature of the tray 318 on which the object is printed
  • An alternative supply of heat to the upper surface is a stream of hot air blown on the upper printed layer.
  • hot air is not only for increasing the temperature of the upper layer but also, or rather for encouraging, the evaporation of liquid carrier (and in some cases the dispersing agent and other organic material) from the upper surface.
  • a combination of EM radiation, hot air, and warm tray (or any combination thereof) can be used to maximize the heating and/or evaporation performance.
  • the substrate's surface on which printing is accomplished presents intimate touch with the object and therefore should be at the same temperature of the object.
  • the substrate i.e. tray
  • the substrate is thermally conductive, e.g. made of metal, warming the tray to the required object temperature can be essential for producing correctly a desired object.
  • the tray may include thermally insulating material, e.g. wood, plastic, or insulating ceramics. In this case, the substrate keeps the object's temperature, while heating of the object is accomplished by heat radiation from above.
  • high enough heat conductance generally means that the temperature gradient (which is given by the product of heat conductance per length multiplied by the height Z) is small, e.g. smaller than 1% of the object temperature during printing, measured in Celsius.
  • the heat conductance is comparable to that of fully sintered metals (100 W/(C ⁇ m))
  • the condition on the temperature gradient can be met up to a relatively small printing height of 10 mm. This, however, is not always the case.
  • the object can be high, e.g. higher than 10 mm in the current example, and can be made of poor material heat conductance (e.g.
  • heating from the upper side of the object is essential. Heating from the upper side can be done in few different methods, including heat conductance and convection by the air above the object, flowing hot air from an air knife element on the upper layer, EM energy source, etc.
  • a preferred embodiment is the EM energy source, as is described below.
  • the EM energy source is typically positioned aside the printing head 314 , and can be of a UV, visible or IR radiation type.
  • a radiation source 308 is installed after, or preferably before, the leveling roller 302 .
  • the radiation source 308 can be used for one or more tasks, including:
  • UV radiation has the potential to disintegrate dispersing molecules that are attached to the particles by breaking molecular connections. At the same time, the UV also heats up the layer, assisting thereby the evaporation of the dispersant material or the dispersant material's fragments.
  • the boiling temperature of a carrier liquid is T 1 .
  • the temperature of the upper surface is preferably maintained at TS, which is substantially comparable to or higher than T 1 (e.g. higher than 0.8 ⁇ T 1 in Kelvin) so that after jetting the ink, the temperature of the new layer (TL) abruptly increases to TS, and carrier liquid evaporates immediately.
  • T 1 e.g. higher than 0.8 ⁇ T 1 in Kelvin
  • TL new layer
  • carrier liquid evaporates immediately.
  • the temperature of the whole object during printing can be maintained at TS as well.
  • higher temperature of the upper (new) layer TL may be required.
  • Substantial increase of the temperature of printing surface TS above T 1 e.g. by 30° C.
  • the landing ink droplets on such a hot surface would explode rather than attach to the surface, like when water droplets land on a surface of 120° C. (the explosion effect can be exploited in a special embodiment which will be described later).
  • the rest of the object is not required to maintain at such high temperature (TL), but just maintain at a constant and uniform temperature TS.
  • the layer When a newly formed first layer is dispensed, the layer is typically exposed to air (the environment of the printing machine), and thus organics in the ink have the chance to evaporate, prior to this first layer being covered by a subsequent printed layer.
  • heating the new layer can be accomplished by a radiation source 308 typically from above the object. If lower layers under the upper layer are at a lower temperature than the upper layer, maximizing the heat irradiance (i.e. irradiated power per surface area of the new layer) is important in order to get an instant higher temperature of the layer, before the heat dissipates to the preceding (previously printed) layers by conduction or dissipates to the air above by conduction and convection. Therefore, given a heating lamp 308 A (as radiation source 308 ), the lamp should be as close to the body 312 surface and reflector aperture as narrow as possible.
  • a lamp housing 332 typically includes a metal envelop covered with an insulation material to prevent heating adjacent elements.
  • a polished aluminum reflector 334 is typically required especially to protect the reflector and housing from overheating.
  • the polished aluminum reflector 334 typically reflects 97% of heat.
  • a transparent glass window 336 is typically high transparency (i.e. small radiation absorbance is required especially to protect the window from overheating).
  • the window 336 is made of a material appropriate for the specific application (e.g. Pyrex or quartz).
  • An aperture 338 (ex.: 9 mm) is used for a given radiation power.
  • a relatively small lamp's aperture assures high irradiation power (i.e. high radiation power per unit area of the printed layer).
  • focused radiation enables much higher irradiance ( FIG. 3C ).
  • the layer's structure is continuously solid, and then the relevant thermal conductivity is that cited for the metal (e.g. 430 W/(C ⁇ m for silver), and the temperature rise ⁇ T is as calculated in the table above (much less the 1° C.).
  • the layer's structure is like a pile of particles. Measurements show that nearly only half the printed volume is occupied by solid particles, while the rest is mostly air. Thus, in each direction (X, Y, Z) only 80% of the layer is occupied by solid particle (since 0.8 ⁇ 0.8 ⁇ 0.8 ⁇ 0.5), and the rest of the volume of the non- or partially-sintered object is air. Thus, every layer is equivalent to a layer that includes in height of the layer 80% metal and 20% air. Since air conductivity (0.04 W/(C ⁇ m)) is substantially lower than metal conductivity (for example WC: 84 W/(C ⁇ m)) the air layer portion dominants the conductivity of the layer.
  • a linear laser beam which includes a focused line
  • flash radiation wherein high power radiation is absorbed at very short time (see typical example below)
  • thermal conductivity is typically between 0.5 to 5 W/(C ⁇ m) (see Table 2). If after warming the upper layer, the upper layer does not become sintered (remains un-sintered), the air layer portion conductivity is still lower than oxide layer conductivity and the air dominants the conductivity of the layer as in the case of metal particles. If the layer becomes sintered (under the flash radiation), because of the high irradiation power Ir and despite of the high thermal conductivity, the temperature rise ⁇ T of the layer will go up to 70 to 700° C. (see the fourth row of Table 2).
  • a fan for example cooling fan 326
  • a fan may be required to lower the temperature back to a lower object temperature.
  • the upper surface of the body will dissipate to the surrounding air roughly 3 W/cm ⁇ 2 at a temperature of 400° C. Therefore the lamp above should supply this much power to the upper layer in order to maintaining the object body's temperature constant and even, and even larger power is required in order to compensate for the material evaporation and sintering heat consumption.
  • focused radiation may be used to obtain an instant temperature of the upper layer higher than the body temperature.
  • a layer of dry particles is evenly spread on the preceding layer, and then focused radiation (for example, a scanning focused point (i.e. spot) laser beam) scans the layer and selectively solidifies the required portion of the layer according to a layer map.
  • focused radiation for example, a scanning focused point (i.e. spot) laser beam
  • the particles used to construct the current layer are not evenly spread (unevenly distributed) on the preceding layer, but the particles (layer) is selectively dispensed according to a layer map. This facilitates use of non-selective radiation to create a newly formed layer only where the particles have been selectively dispensed.
  • Embodiments can include one or more of the following techniques:
  • a first embodiment is a hot radiating lamp 350 , including a linear bulb (discussed above), including a linear radiating filament 352 enclosed a quartz transparent pipe 356 , coupled with a focusing reflective surface having elliptic transection 358 , enclosed in a transparent window 354 (for example, protective glass).
  • the filament is located in one focal point 360 F 1 of the elliptic curvature, while the filament's hot image is obtained in the other focal point 360 F 2 , on the upper surface of the body being printed.
  • the width of the image can be comparable to the length of the filament perimeter (but never smaller).
  • the filament perimeter is equal to 1 mm
  • the width of the image of the filament on the 3D upper surface is 3 mm
  • the radiated power is 50 W/(cm length).
  • a second embodiment includes a linear coherent beam 370 .
  • a third embodiment includes a spot (point) coherent beam with a scanning apparatus (e.g. rotating mirror polygon).
  • a scanning apparatus e.g. rotating mirror polygon
  • the beam in the current embodiment can be “dumb” (although the beam can also be modulated according to the image, at least for saving energy).
  • This “dumb” beam scans a line in the Y direction, while the object body moves in X direction.
  • a typical laser power is 500 W, and focal spot of 50 ⁇ diameter.
  • Such irradiation power can warm the layer much above the sintering temperature of all metals and ceramic material.
  • FIG. 3A and FIG. 4A a simplified diagram of a system for removing fumes during printing
  • FIG. 5 a simplified diagram of a system for removing fumes during printing using an alternative radiation source.
  • the fumes maybe harmful to the printer parts since they can condense on relatively colder surfaces (as compared to the temperature of the 3D object 312 during printing) including surfaces such as electronic boards and parts.
  • the fumes are collected by sucking pipe(s) 404 providing sucking 414 located adjacent to the printing head 314 and/or near the spot where the layer is further heated by the radiation source 308 .
  • glue is often added to the particle ink (e.g. photo-polymer, thermo-plastic polymer etc).
  • This glue material assists sustaining the 3D structure during printing, a time before subsequent hardening process (i.e. sintering) of the entire object in a high temperature oven.
  • a powder dispenser spreads solid (dry) particles over the entire tray (tray on which the object is being printed/constructed, such as heated tray 318 ), and a printing head subsequently dispenses liquid glue on the particles spread according to the desired content of the layer being printed. This process repeats layer by layer until the printing finishes. Later, the loose particles are removed, and the glued object is transferred from the printer to an oven.
  • the object In the oven, the object is heated to a high temperature for accomplishing sintering. During the sintering process a majority of the glue fires off, however typically a portion of the glue remains. The remaining glue interferes and/or interrupts sintering if the glue does not completely evaporate in the oven. In addition, the presence of glue in an object's structure may be undesirable, as described elsewhere in this document.
  • a technique for avoiding problems with glue is to do sintering during printing on a layer basis, and therefore glue is not required.
  • a powder dispenser spreads particles over the entire tray, and a subsequent focused laser beam scans the spread particles according to the content of the layer. Every spot that is illuminated by the beam heats up sufficiently to sinter the powder at the illuminated location.
  • the dispersant remains in the bulk material during printing.
  • the organic material which plays the role of a binder
  • the object is referred to as a “green object”.
  • an extra stage of initial heating is performed usually in an oven.
  • the organic material whether disintegrates or not
  • This initial heating is done before elevating the firing temperature to a temperature where full sintering occurs.
  • a desirable feature is to prevent complete sintering of the object particles during the stage of organics extraction. This is desirable for reasons including:
  • Preventing complete sintering in the stage of organics evaporation can be done by adjusting the particles' characteristic temperature T 3 of sintering (depending on particles material and size) or by choosing the organics (dispersant and additives) with appropriate burn out temperature T 2 , so that T 3 >T 2 .
  • Partial sintering during printing can strengthen the newly formed layer before leveling, or (as explained above) strengthen the object before removing the object from the substrate, and/or prior to firing the object (in an oven).
  • partial sintering generally refers to particles melting to each other only partially, that is at one or more locations on the surface of each particle without the complete surface of the particles contacting surrounding particle surfaces.
  • partial sintering of an object body is obtained during printing of the object. Partial sintering can allow subsequent firing and removing dispersant, even when firing of the dispersant is done after completing printing the object, because the open porous structure is still there.
  • complete sintering of an object body is obtained during printing of the object. Since the dispersant can inhibit sintering, this method includes first evaporating the dispersant during the layer formation at temperature T 2 , and afterwards complete sintering takes place temperature T 3 , wherein T 3 >T 2 .
  • partial sintering 700 can be enough for holding the particles together and yet not introducing too large contraction force in the (newly formed) layer.
  • partial sintering facilitates maintaining a desired nature (shape) of the object during printing 710 .
  • Sintering temperature should be considered carefully for enabling partial sintering. At high enough temperature, the particles melt to each other and form a nearly or fully solid material (complete sintering).
  • the required sintering temperature substantially depends on the melting point of the particles' material and the size of the particles. For example, the melting point of silver is 960° C.; 1 ⁇ m (micrometer) silver particles sinter at 800° C., but 20 nm (nano-meter) silver particles sinter at 200° C.
  • the newly formed layer can be warmed for example to 500° C., a temperature in which the organics are fired off and partial sintering replaces the organic material to hold the object from being dismantled.
  • the dispersant (and possibly other additives in the ink) can interfere with the desired quality of sintering, and thus removing these materials (the dispersant and possibly other additives) can be important for obtaining sintering (but not necessarily sufficient for obtaining sintering).
  • references to dispersant can also refer to possibly other additives.
  • the innovative technique of complete sintering when printing a layer includes features such as:
  • Extra heating of the new layer by focused radiation or by a high power flash light can be used to accomplish evaporating of the disturbing materials (such as dispersant), and also heating the upper layer to as high temperature as required for sintering the layer.
  • the disturbing materials such as dispersant
  • the upper layer can be heated to as high temperature as required for sintering the layer.
  • the dispersant evaporates or disintegrates and evaporates, and later full or sufficient sintering takes place.
  • this technique is done by dispensing the new layer on a moderately warm preceding layer, such that the carrier liquid is evaporated before entering the extra heating device, reducing thereby the required energy in the device for evaporating both the carrier liquid and the dispersant, and accomplishing sintering.
  • Printing a layer can be accompanied by dispensing catalyst material, which accelerates sintering.
  • a preferred embodiment includes material that disintegrates the dispersant molecules, so that they evaporate out or at least do not disturb sintering. Furthermore, added heat can be used to evaporate out the disintegrated molecules.
  • the bare solid molecules left after removing the dispersant spontaneously sinter at this stage to each other, given that the temperature is high enough. For example, if the solid particles are silver particles of 20 nanometer diameter, a temperature as high as 200° C. is sufficient for complete sintering, given that the dispersant has removed.
  • the catalyst can be dispensed after or just before dispensing the model layer.
  • Dispensing the catalyst 802 can be done by a catalyst droplet jetting head 800 or by spray nozzle.
  • the catalyst can be dispensed selectively according to the object layer image, or “blindly” on the entire reserved area for the object.
  • the catalyst can come in liquid form or gas.
  • the catalyst can be dispensed by a roller that spreads the catalyst over or under the new layer being printed.
  • the catalyst can be included in the ink beforehand, and then heated with the layer heating after printed, when activation is desired.
  • An alternative embodiment of printing, leveling, and heating includes printing layer by layer while the temperature of the printed body is substantially smaller than the boiling temperature of the carrier liquid (e.g. 150° C. when the boiling temperature of the carrier liquid is 230° C.).
  • the layer is flattened (leveled) by a liquid pump roller (LPR) 900 .
  • LPR is typically a smooth roller with an axis parallel to Y-axis of the object, rotating in “reverse” (opposite the relative X-axis motion of the object).
  • the newly formed layer 310 is irradiated by a high irradiation power beam (for example laser 902 ) to at least evaporate the liquid and solidify the layer (e.g. warming the layer to a temperature of 230° C. or higher). Later on, before dispensing the next layer, the layer is cooled to the low object temperature (e.g. by a cooling fan 326 ).
  • a high irradiation power beam for example laser 902
  • the layer is cooled to the low object temperature (e.g. by a cooling fan 326 ).
  • the excess ink from the flattened layer attaches to the rotating roller surface of the LPR 900 , and is wiped by the roller wiper (for example by metal wiping knife 904 ), and flows into a collecting trough 906 , from which the excess collected ink is cycled back to an ink tank for re-delivery to the printing head 314 or pumped out to a waste tank.
  • the jetting nozzles are positioned close to the printed layer, e.g. 1 mm apart. Thus, the nozzles may heat up by the warm upper surface of the body being printed, and the jetting quality injured.
  • Techniques to prevent nozzle heating may include a cooled shell (see FIG. 3A , cooling mask 316 ) that behaves as a thermal buffer between the hot layer and jetting nozzles.
  • a cooled shell is described in patent International publication No WO2010/134072 A1 to Xjet Solar Corporation.
  • An innovative solution is differentiation between the body (object) temperature and the temperature of the new layer. This can be accomplished by the following steps:
  • FIG. 10A a diagram of objects built with different materials. Often the required object includes different materials in different parts of the object.
  • a special and important case is when the bulk material 1006 of a first object 1002 should be laminated (coated) with a coating material 1007 at an outer surface of the first object 1002 .
  • the bulk material 1006 of a second object 1004 can be laminated with a coating material 1007 at an outer surface of the second object 1004 .
  • third object 1010 includes a mix of two or more materials required either over the entire object or over part of the object.
  • third object 1010 includes a mix of a first material (material 1 1018 ) and a second material (material 2 1020 ).
  • first material material 1 1018
  • second material material 2 1020
  • each pixel 1016 is an alternating material.
  • One technique for printing an object with a mix of materials in a given location of a layer can be done by dispensing one material in certain pixels of the layer and another material in other pixels.
  • one layer is printed by one material and another layer by another material.
  • a special case is impregnation-like of a coating-like material 1008 at the outer surface of an object (for example, second object 1004 ).
  • the impregnation-like can include a gradual decrease of the proportion of impregnating material and bulk material as the distance from the object surface increases.
  • a plurality of inks and ink heads can be used to differentiate printing between object material and object support.
  • one ink can be used to build both the object and support structures (layer by layer), while another ink is dispensed only on the layer part that belongs to only one of the object or support, introducing thereby a difference in a mechanical attribute of both materials. This difference is used later when the support is removed from the object.
  • a first ink including Ag particles is used to print both object and support portions of a layer.
  • a mold is printed together with an object.
  • a mold is any auxiliary body that is attached to the object body 312 and can be removed from the object body.
  • a mold can be considered support for the object, as described below.
  • the mold can be printed by a different ink than the bulk in the same layer-by-layer printing. Printing an object and a mold facilitates the object including particles that do not adhere (are unattached or only lightly adhere) to each other until the body is fired and sintered in an oven (at typically 600 to 1500° C.).
  • the mold preferably includes material that holds tight at a low temperature and disintegrates at high temperature, or at least can be removed from the object.
  • the mold can also protect the object during printing.
  • the mold protects the delicate edges of the object 312 from breaking while the cutting roller 302 levels out the printed layer 310 . Even if the mold's material does not hold tighter (holds looser) than the object's material, yet the mold protects the object's edges while scarifying the mold's own edges through, for example, when leveling the new layer or transporting the object after printing to the firing oven.
  • the mold can be thin (e.g. 0.5 mm thick), and can get the shape of a skin around the object or part of the object.
  • the object (and simultaneously the mold) can be printed embedded in a mold, expanding the range of materials and processed available for creation of 3D objects.
  • An example of this technique is an object ink that includes particles of high hardness (e.g. WC) wrapped with a dispersant.
  • a dispersant behaves like a glue that holds the particles together.
  • medium temperature e.g. 400° C.
  • the dispersant evaporates and the 3D object may fall into a pile of particles. If the object is surrounded with a material that partially sinters at 400° C. but melts or disintegrates and evaporates at above 800° C. (e.g.
  • the mold stays solid at and above a medium temperature, allowing evaporation of the object's dispersant, until at higher temperature (e.g. 700° C.) partial sintering of the object takes place.
  • a positive or negative angle can be specified per every spot on the object's surface, as follows: If an object material is found just under the spot, the surface angle is specified positive. Otherwise, the surface angle at that point is specified negative (a negative angle or negative tilt of the object). In other words, a negative angle is an area of an object that while being built lacks a portion of the object immediately beneath the area being printed.
  • FIG. 11A a diagram of support when building a 3D object.
  • Supporting negative angles of the 3D object can be critical for 3D printing.
  • the support 1100 material should differ from the object 312 material in a way that the support material can be removed after printing or after following steps like sintering, without deteriorating the object.
  • the support may need to fulfill many additional requirements, including being easy to remove, hardly mixing with the model material at the touch interface line, low cost, self-sustained, and compatible with the printing technology (inkjet), etc.
  • the printer typically includes at least two printing nozzle groups (often two printing heads), one jetting object material, and one support material.
  • Each layer being printed may have zero, one, or multiple portions of the layer that are desired in the final object, referred to as “object portions” of the (current) layer.
  • object portions of the (current) layer.
  • support portions are generally used as support, molds, or other structures to assist during production of the object, but are removed and/or lacking in the final object.
  • references to support can also include reference to the ink used to create the support (support ink) and to the portion adjacent to the object (that either supports the object in the gravitational sense, or surrounds the object for any purposed, including to serve as a mold) (support portion).
  • the current description will use the current example of at least two printing heads. Based on this description, one skilled in the art will be able to apply the current methods to other implementations.
  • a side view 1120 shows the 3D object 312 and support 1100 during printing.
  • a corresponding top view 1122 shows the upper layer.
  • Each layer can include a support layer adjacent to an object layer.
  • the upper layer includes a portion that is support layer 1102 (building support for subsequent object layers), and a portion that is object layer 1104 (built on top of preceding object and/or support layers).
  • the support includes inorganic solid particles (e.g. high melting temperature particles like oxide, carbides, nitrides, metals, e.g. Tungsten) or organic particles (e.g. hard polymers) dispersed in a volatile carrier liquid.
  • the polymeric material should be hard because otherwise the polymeric material can be difficult or not possible to grind (to micro particle size).
  • the liquid carrier evaporates, leaving a solid laminate behind.
  • the object printing is finished, the object is supported or even wrapped by the support material. Considerations in choosing and preparing the inks take care of establishing a substantial difference in the adherence between the particles of the object (cohesiveness) and of the support.
  • This difference can show up just after printing, or later after partial or complete firing.
  • the difference can be a result of a difference in the dispersant attributes (e.g. different gluing characteristics between the solid particles), or a difference in the sintering tendency of the solid particles to each other.
  • the support structure should be softer or more brittle or more miscible in water or solvents then the object, and therefore ready for being removed from the printed object.
  • An ideal support is such that during firing the support disappears, e.g. by or disintegration and evaporation.
  • the support includes solid material dissolved in a volatile liquid. After the liquid evaporation, a solid laminate is left behind to form a solid support.
  • the solid support material after printing is soluble in a post treatment liquid.
  • the object and support can be immersed in the post treatment liquid such as water or light acid, to remove the support by dissolution.
  • the solid support material is such that the solid support material evaporates or is burned during the firing process.
  • An example is dissolved wax in an organic solvent, or dispersed particles of polymer in a dispersing liquid.
  • the solvent or dispersing liquid evaporates off layer by layer during printing (at, for example, 200° C.) and the wax or polymer hardens.
  • the object with the supporting body is fired in an oven, preferably in vacuum.
  • the wax evaporates and disappears, and the same thing with the polymer at 700° C.
  • An example of the second and third embodiments is using salt (e.g. NaCl—Sodium Chloride, also known as table salt) solution in water. After the water evaporates, a solid support is left behind. After completion of printing, the object can be immersed in water and the salt is dissolved away.
  • salt e.g. NaCl—Sodium Chloride, also known as table salt
  • strong acid e.g. HNO3
  • An alternative of the former example is a mix of oxide particles and dissolved salt in a carrier liquid. After printing (when the support dries), the object and support are immersing in water or acid liquid, the salt is dissolved by the liquid and the oxide particles stay as a pile of loose dust.
  • silica is a readily available and relatively inexpensive material. When the dispersion is dried, the remaining silica particles are only loosely attach to each other even after warming to 700° C., and therefore the supporting body of Silica can be removed from the object.
  • Silica dispersion is Aerodisp G1220 by EVONIK Industries, including SiO 2 particle of an average diameter of 12 nm, dispersed in ethylene glycol and Degbe (Di-ethylene Glycol Butyl Ether) solvents.
  • Calcium sulfate is common material used for many applications such as gypsum board, plaster, and even as a food additive. Calcium sulfate is an inorganic salt that is water miscible, enabling removal of this support material by washing in water after printing and/or firing. Calcium sulfate ink can be prepared by the following steps:
  • a side view 1130 shows the 3D object 312 and support columns 1110 during printing.
  • a corresponding top view 1132 shows the upper layer.
  • the view of the upper layer includes a portion that is support 1114 (building support for subsequent object layers), and a portion that is object layer 1104 (built on top of object and/or support layers).
  • reinforcement may be added, preferably by adding columns 1110 of object material.
  • a pedestal 1112 including support can be added even under the lower surface of the object.
  • the pedestal can include all support layers (either reinforced or not) that are lower than the lower object layer.
  • the pedestal 1112 can assist also obtaining proper and accurate Z-axis dimension of the 3D object. This is achieved at least in part by printing layers of support-pedestal to such a height (in Z-axis direction) wherein the leveling apparatus (such as roller 1116 , similar to leveling roller 302 ) completely touches the pedestal 1112 and flattens the pedestal. Subsequently, printing of object and supporting material takes place on top of the leveled pedestal.
  • This final (complete) sintering stage can include the following steps:
  • Part of the firing steps can include applying vacuum, applying pressure, adding inert gas to prevent oxidation, and adding other gases that may add desired molecular diffusion or chemical reaction with the body, as described elsewhere in this document.
  • FIG. 12 a diagram of an exemplary carousel machine for production of 3D objects.
  • 3D printing is typically characterized by low output because each object is typically constructed from thousands of printed layers.
  • a plurality of trays 1200 of a carousel production machine for 3D objects 1220 can be used to increase the production throughput of 3D objects (such as 3D object 312 )
  • a 3D production machine 1220 will preferably include a plurality of printing (preferably inkjet) heads 1214 and a plurality of trays 1200 so as to enable production of many objects in the same run by many printing (jetting) heads.
  • Multiple printing heads can be grouped into a group of printing heads ( 1206 A, 1206 B, 1206 C).
  • Many and different parts may be printed on each tray. Every object passes multiple times (cycles) through the printing section (under the printing heads), wherein each time adds one or a few layers. As each object is typically constructed from thousands of printed layers, typically thousands of cycles are necessary.
  • each cycle includes multiple printings from a plurality of printing heads
  • the number of cycles can be reduced from thousands to hundreds or less. Based on this description, one skilled in the art will be able to determine how many heads and cycles and trays 1200 are necessary for constructing specific plurality of objects.
  • the plurality of heads is arranged in the Y-axis direction and are shifted in Y direction from each other so that respective nozzles of the plurality of heads are staggered to fill completely a layer's surface in one pass. More printing heads than required for filling one layer can be used, e.g. to print more than one layer in a pass. Heads for different building material can be employed. For example, a first group of printing heads 1206 A is configured for printing a first material (material A) and a second group of printing heads 1206 B is configured for printing a second material (material B). Heads for support material can be employed. For example, a third group of printing heads 1206 C configured for printing support material.
  • a robotic arm 1204 can remove the completed tray 1200 from the carousel 1212 or remove object(s) 1202 from a tray 1200 , and send the object to further production steps (e.g. firing) without stopping the carousel rotation. Note that from layer to layer each tray shifts a little lower in Z direction, so as the last printed layer is brought to the height appropriate for the leveling apparatus to shave the upper surface of the dried layer. In a preferred case where the tray 1200 stays on the carousel 1212 , when all parts from a tray have been removed, the tray Z level (height) is controlled to an initial position, and the machine would start printing a succeeding group of parts.
  • FIG. 13 is a high-level partial block diagram of an exemplary system 1300 configured to implement a controller for the present invention.
  • System (processing system) 1300 includes a processor 1302 (one or more) and four exemplary memory devices: a RAM 1304 , a boot ROM 1306 , a mass storage device (hard disk) 1308 , and a flash memory 1310 , all communicating via a common bus 1312 .
  • processing and memory can include any computer readable medium storing software and/or firmware and/or any hardware element(s) including but not limited to field programmable logic array (FPLA) element(s), hard-wired logic element(s), field programmable gate array (FPGA) element(s), and application-specific integrated circuit (ASIC) element(s).
  • FPLA field programmable logic array
  • FPGA field programmable gate array
  • ASIC application-specific integrated circuit
  • Any instruction set architecture may be used in processor 1302 including but not limited to reduced instruction set computer (RISC) architecture and/or complex instruction set computer (CISC) architecture.
  • a module (processing module) 1314 is shown on mass storage 1308 , but as will be obvious to one skilled in the art, could be located on any of the memory devices.
  • Mass storage device 1308 is a non-limiting example of a computer-readable storage medium bearing computer-readable code for implementing the methods described herein.
  • Other examples of such computer-readable storage media include read-only memories such as CDs bearing such code.
  • Network connection 1320 provides communications to and from system 1300 .
  • a single network connection provides one or more links, including virtual connections, to other devices on local and/or remote networks.
  • system 1300 can include more than one network connection (not shown), each network connection providing one or more links to other devices and/or networks.
  • System 1300 can be implemented as a server or client respectively connected through a network to a client or server.
  • system 1300 can be implemented as an embedded controller.
  • a present embodiment is a system and method for printing an object.
  • the system facilitates evaporating a carrier liquid during printing while at least a portion of dispersant remains in the printed layer.
  • a feature of the current embodiment is bringing or maintaining the temperature (TL) of the (most recently/current) printed layer (upper surface of the body of the object) near or above the boiling point of the carrier T 1 (e.g. above 0.7 ⁇ T 1 in Celsius) and simultaneously below the boiling point of the dispersant.
  • T 1 the temperature of the carrier
  • the carrier liquid evaporates as the ink is printing, in contrast to conventional techniques of evaporating the carrier after printing, while at least a portion of the dispersant remains in the printed layer of the object.
  • the remaining dispersant serves to bind the solid particles together after the carrier liquid is evaporated.
  • other materials can be added to the ink to assist in binding of the solid particles together after the carrier liquid evaporates.
  • the exact carrier boiling point temperature Ti does not have to be used, but rather there is a known range even below the carrier boiling point temperature T 1 in which the carrier will evaporate. This range below the carrier boiling point temperature Ti is referred to in this document as a lower-bound ([T 1 ]) of the carrier boiling point temperature.
  • an exact dispersant boiling point temperature T 2 does not have to be used, but rather there is a known range around the dispersant boiling point temperature T 2 in which the dispersant will not evaporate (remains liquid). This range around the dispersant boiling point temperature T 2 is referred to in this document as an upper-bound ([T 2 ]) of the dispersant boiling point temperature.
  • the lower-bound and upper-bound are typically 20% more or less than the respective boiling point temperatures (typically measured in degrees Kelvin).
  • the lower-bound ([T 1 ]) can be 20% less than the carrier boiling point temperature (T 1 ) typically measured in degrees Kelvin.
  • the upper-bound ([T 2 ]) can be 20% more or less than the dispersant boiling point temperature (T 2 ) typically measured in degrees Kelvin.
  • a first layer is printed on a printing surface of the object.
  • the object part of the first layer is printed with at least one ink, typically from at least one corresponding inkjet printing head.
  • One or more of the printing heads typically all of the printing heads, can be modulated according to a content of the first layer.
  • Each of the at least one inks typically include a carrier having a carrier boiling point temperature (T 1 ), a dispersant having a dispersant boiling point temperature (T 2 ) and particles having a particle sintering temperature (T 3 ).
  • T 1 carrier boiling point temperature
  • T 2 dispersant boiling point temperature
  • T 3 particles having a particle sintering temperature
  • each of the at least two inks can include particles of different types, and a local proportion of each of the at last two inks is determined by the specification for the layer being printed (first layer's specification).
  • the local proportion of each of the inks varies from one printed layer to another printed layer, and from one point in a layer to another point in the same layer.
  • the layer also includes a support portion, the support is printed adjacent to the object layer, as described below.
  • the dispersant can be chosen to additionally and/or alternatively bind the particles to each other after the carrier is evaporated and/or inhibit sintering of the particles to each other after the carrier is evaporated.
  • a feature of inkjet printing is that the printing can be selective, in other words, printing to areas that are part of each layer being printed (such as the first layer of the object).
  • Each layer is typically printed based on a layer specification or layer content (description) including information on what portion of the current layer is the desired object.
  • the layer specification can include information on areas of the current layer not to be printed (to remain un-printed), to be printed with an alternate ink (second ink, third ink, etc.), support areas, and/or mold areas.
  • bringing to or maintaining a temperature of the upper layer (TL), evaporating of the dispersant, and/or sintering can be achieved via techniques such as use of a radiation source such as a heating lamp, an electro-magnetic (EM) radiation source above the object, a selective or non-selective laser, a focused linear laser beam, a scanned laser beam, a scanned focused pencil laser beam, focused light from a linear incandescent bulb, focused light from a gas discharge lamp bulb, a flash light, an ultra-violet (UV) light source, a visible light source, an infra-red (IR) light source, and substrate (tray) temperature control.
  • a radiation source such as a heating lamp, an electro-magnetic (EM) radiation source above the object, a selective or non-selective laser, a focused linear laser beam, a scanned laser beam, a scanned focused pencil laser beam, focused light from a linear incandescent bulb, focused light from a gas discharge lamp bulb,
  • the beam can be modulated according to the content of the layer (information on what portion of the current layer is the desired object).
  • the above-described techniques can be used to evaporate the dispersant via temporarily increasing a temperature of the first layer above a temperature of the object.
  • a non-selective laser can be used to irradiate an entire area on which the object is being printed (for example, using a line focused laser).
  • This technique of selective printing followed by non-selective use of a heating source, in particular using a non-selective laser can be used for heating the upper surface or for firing-off (evaporating) dispersant.
  • conventional techniques use non-selective printing (or simply providing to the printing area an ink or other substance from which to construct the 3D object) followed by a selective laser to sinter desired portions of the object.
  • the remaining dispersant or a portion of the dispersant can be evaporated, and then optionally the first (most recently printed) layer can be sintered.
  • a subsequent layer can be printed on top of the first layer after evaporating the carrier, after evaporating dispersant, or after sintering (the printed layer).
  • an object is built from hundreds or thousands of printed layers, so the method repeats by printing a subsequent layer (as a new “first layer”) on top of the previously printed (first) layer.
  • a catalyst can be added to the layer being printed (first layer).
  • Catalysts can be selected from compounds such as halides and copper chloride.
  • the catalyst can be added by a variety of techniques, for example:
  • the object is typically printed on a tray that is heated or made of thermal isolation material.
  • the liquid carrier in the newly dispensed layer abruptly boils (explodes like) when the ink lands on the upper surface, creating a sponge like layer including open plenty tiny inflations. This is because during the abrupt boiling, tiny segments of the dispensed ink inflate (by the carrier gas) and freeze (i.e. become dry), just before the gas makes an opening and “flies” out.
  • the resulting structure of the 3D object body is thus porous. Creating a porous object body may be desirable to allow the remaining dispersant to flow out of the structure of the object during subsequent heating in an oven. Subsequent heating can be used to remove (disintegrate and/or evaporate) remaining dispersant and/or other ink components such as organic material.
  • a present embodiment is a system and method for printing an object.
  • the system facilitates evaporating dispersant in a first layer prior to sintering the first layer and/or prior to printing a second layer.
  • a feature of the current embodiment is evaporating at least a portion of the dispersant during printing.
  • a method for printing an object starts with printing a first layer of at least one ink then evaporating at least a portion of the dispersant, typically substantially all the dispersant. After evaporating at least a portion of the dispersant, a subsequent operation is performed. Subsequent operations include:
  • the carrier prior to evaporating at least a portion of the dispersant, can be evaporated while the dispersant remains in the first layer.
  • a present embodiment is a system and method for printing an object.
  • the system facilitates leveling an upper-layer of a printed object using a horizontal roller.
  • printing can result in an upper-layer (most recently printed/first layer) that is not sufficiently flat (too rough) for subsequent processing.
  • leveling the top of the object is desired.
  • Conventional implementations use vertical milling or grinding disks rotating about vertical beam, or smooth or knurled rollers.
  • an innovative horizontal roller is used.
  • the horizontal roller is a cutting (bladed) roller.
  • a method for printing an object starts with printing a first layer of at least one ink and then at least partially hardening the first layer. Then the first layer is leveled using an innovative horizontal roller.
  • the horizontal roller can include one or more blades (or alternatively a cylindrical grinding surface) and rotation generally about an axis parallel to a plane of the first layer (typically the Y-axis).
  • leveling apparatus After leveling and optionally: cleaning, further hardening, evaporating at least a portion of the dispersant, and/or partial sintering, if the object is not yet complete (incomplete) a subsequent layer of at least one ink is printed on the first layer.
  • a present embodiment is a system and method for printing an object with support.
  • the system facilitates repeatedly printing layers according to a map, each layer with potentially both object and support portions, resulting in an object with support.
  • support for negative angles and molds are particularly preferred.
  • techniques for using support can facilitate using molds, support for negative angles, using reinforced support, and pedestals.
  • the object portion of the layer is printed with object ink, generally referred to as a first ink.
  • the support portion of the object is printed with support ink, generally referred to as a second ink.
  • a method for printing an object with support starts with printing an object portion of a first layer using at least a first ink, the first ink including:
  • a support portion of the first layer using at least a second ink is printed prior to, simultaneously with, or after the object portion is printed.
  • the second ink includes:
  • the second carrier is the first carrier.
  • the second particles are other than the first particles and the carriers are liquids.
  • the support portion can be printed with the second ink and additionally with the first ink.
  • printing is via at least a first printing head, typically two or more printing heads, each printing head jetting one type of ink and each printing head modulated according to a content (object, support, and empty portions) of the first layer.
  • a subsequent layer is printed on the first layer, the subsequent layer including respective object and support portions on the first layer.
  • the solid particles in the support ink can include particles that are: miscible in water; at least partially soluble in water, inorganic solid, organic, polymer, particles having a hardness less than the hardness of the first particles, salt, metal oxides (e.g. Zinc oxide), Silica (SiO 2 ), Calcium sulfate, and tungsten carbide (WC).
  • metal oxides e.g. Zinc oxide
  • Silica SiO 2
  • Calcium sulfate tungsten carbide
  • the particles used in the object and support portions depend on the specific application, requirements, and object properties.
  • Particles used can include metal, metal oxides, metal carbides, metal alloys, inorganic salts, polymeric particles, Polyolefin, and Polyolefin poly (4-methyl 1-pentene).
  • the support When printing of the object with support is complete, the support must be removed from the object either just after printing or after subsequent processing in an oven.
  • the support can be removed from the object using various techniques, the specific technique depending on the type of support. Techniques include firing, immersing to dissolve the support, immersing in water to dissolve the support, immersing in acid to dissolve the support, immersing in a light acid, immersing in a strong acid, immersing in HNO3, sand blasting, water jetting, etc.
  • Non-limiting examples include flexible metal or composite antennas and biological sensors.
  • 2D objects may be composed of a single layer, or relatively few layers. In these cases, the 2D object may have similar requirements as construction of a 3D object. For example, where an ink being used to print a 2D object includes a dispersant for printing but the dispersant must be removed in the completed object.
  • inks referred to in the current description are commercially available conventional inks. It is foreseen that alternative, additional, and new inks can be used with the current invention.
  • Modules are preferably implemented in software, but can also be implemented in hardware and firmware, on a single processor or distributed processors, at one or more locations.
  • the above-described module functions can be combined and implemented as fewer modules or separated into sub-functions and implemented as a larger number of modules. Based on the above description, one skilled in the art will be able to design an implementation for a specific application.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Powder Metallurgy (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Ink Jet (AREA)
  • Coating Apparatus (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
US15/029,815 2013-10-17 2014-10-17 Methods and systems for printing 3d object by inkjet Pending US20160243619A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/029,815 US20160243619A1 (en) 2013-10-17 2014-10-17 Methods and systems for printing 3d object by inkjet

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361891926P 2013-10-17 2013-10-17
PCT/IB2014/065400 WO2015056230A1 (fr) 2013-10-17 2014-10-17 Procédés et systèmes d'impression tridimensionnelle d'objets par jet d'encre
US15/029,815 US20160243619A1 (en) 2013-10-17 2014-10-17 Methods and systems for printing 3d object by inkjet

Related Parent Applications (3)

Application Number Title Priority Date Filing Date
US15/029,854 Continuation-In-Part US11000897B2 (en) 2013-10-17 2014-10-17 Support ink for three dimensional (3D) printing
PCT/IB2014/065400 A-371-Of-International WO2015056230A1 (fr) 2013-10-17 2014-10-17 Procédés et systèmes d'impression tridimensionnelle d'objets par jet d'encre
PCT/IB2014/065402 Continuation-In-Part WO2015056232A1 (fr) 2013-10-17 2014-10-17 Encre de support pour impression en trois dimensions (3d)

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/222,684 Continuation-In-Part US20210354365A1 (en) 2013-10-17 2021-04-05 3d particle printing

Publications (1)

Publication Number Publication Date
US20160243619A1 true US20160243619A1 (en) 2016-08-25

Family

ID=52827743

Family Applications (5)

Application Number Title Priority Date Filing Date
US15/029,815 Pending US20160243619A1 (en) 2013-10-17 2014-10-17 Methods and systems for printing 3d object by inkjet
US15/029,831 Active US10913112B2 (en) 2013-10-17 2014-10-17 Tungsten-Carbide/Cobalt ink composition for 3D inkjet printing
US15/029,854 Active 2036-05-14 US11000897B2 (en) 2013-10-17 2014-10-17 Support ink for three dimensional (3D) printing
US16/923,034 Active US11623280B2 (en) 2013-10-17 2020-07-07 Support ink for three dimensional (3D) printing
US17/144,262 Active US11577319B2 (en) 2013-10-17 2021-01-08 Tungsten-carbide/cobalt ink composition for 3D inkjet printing

Family Applications After (4)

Application Number Title Priority Date Filing Date
US15/029,831 Active US10913112B2 (en) 2013-10-17 2014-10-17 Tungsten-Carbide/Cobalt ink composition for 3D inkjet printing
US15/029,854 Active 2036-05-14 US11000897B2 (en) 2013-10-17 2014-10-17 Support ink for three dimensional (3D) printing
US16/923,034 Active US11623280B2 (en) 2013-10-17 2020-07-07 Support ink for three dimensional (3D) printing
US17/144,262 Active US11577319B2 (en) 2013-10-17 2021-01-08 Tungsten-carbide/cobalt ink composition for 3D inkjet printing

Country Status (9)

Country Link
US (5) US20160243619A1 (fr)
EP (5) EP3057777A4 (fr)
JP (5) JP6967348B2 (fr)
KR (1) KR20160091323A (fr)
CN (6) CN115723335A (fr)
BR (1) BR112016008376B1 (fr)
CA (1) CA2927249C (fr)
IL (5) IL294425B2 (fr)
WO (3) WO2015056230A1 (fr)

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150192919A1 (en) * 2015-03-24 2015-07-09 Caterpillar Inc. Support members for three dimensional object printing
US9776363B2 (en) 2013-11-15 2017-10-03 Kabushiki Kaisha Toshiba Three-dimensional modeling head and three-dimensional modeling device
US20170368832A1 (en) * 2016-06-28 2017-12-28 Seiko Epson Corporation Printer
DE102016015027A1 (de) * 2016-12-16 2018-01-11 Daimler Ag Verfahren zum Glätten einer Oberfläche
WO2018044399A1 (fr) * 2016-08-30 2018-03-08 Rize Inc. Procédé de fabrication d'un objet tridimensionnel à structure de support amovible
WO2018087476A1 (fr) * 2016-11-14 2018-05-17 Addup Installation de fabrication additive a base de poudre a dispositif de nettoyage par raclage
US10026617B2 (en) 2008-11-30 2018-07-17 Xjet Ltd Method and system for applying materials on a substrate
US10034392B2 (en) 2006-11-28 2018-07-24 Xjet Ltd Method and system for nozzle compensation in non-contact material deposition
US10035298B2 (en) 2016-12-02 2018-07-31 Markforged, Inc. Supports for sintering additively manufactured parts
WO2018164672A1 (fr) * 2017-03-07 2018-09-13 Nano-Dimension Technologies, Ltd. Fabrication de composant composite utilisant une impression à jet d'encre
US20180264731A1 (en) * 2017-03-15 2018-09-20 Xjet Ltd. System and method for delivering ink into a 3d printing apparatus
IT201700041694A1 (it) * 2017-04-13 2018-10-13 3D New Tech S R L Apparato di pre- e/o post-riscaldamento per polveri metalliche in un processo di additive manufacturing
US10232655B2 (en) 2009-05-18 2019-03-19 Xjet Ltd. Method and device for printing on heated substrates
US10245786B2 (en) * 2014-12-17 2019-04-02 Xerox Corporation System for planarizing objects in three-dimensional object printing systems with reduced debris
US20190105838A1 (en) * 2017-10-06 2019-04-11 International Business Machines Corporation Removing a printed item from a printer
US20190134896A1 (en) * 2016-07-20 2019-05-09 Hewlett-Packard Development Company, L.P. Forming microstructures in 3d printing
US10315427B2 (en) 2010-05-02 2019-06-11 Xjet Ltd. Printing system with self-purge sediment prevention and fumes removal arrangements
US10322964B2 (en) * 2014-11-24 2019-06-18 Heraeus Noblelight Gmbh Method for producing a reflector on a reflector base made of glass
US10464131B2 (en) 2016-12-02 2019-11-05 Markforged, Inc. Rapid debinding via internal fluid channels
US20190344347A1 (en) * 2015-06-16 2019-11-14 Seiko Epson Corporation Three-dimensional forming apparatus and three-dimensional forming method
US10479122B2 (en) 2010-07-22 2019-11-19 Xjet Ltd. Printing head nozzle evaluation
WO2019236236A1 (fr) 2018-06-07 2019-12-12 Keracel, Inc. Imprimante tridimensionnelle à plusieurs matériaux
WO2019241593A1 (fr) 2018-06-13 2019-12-19 Rize, Inc. Séparation de pièces fabriquées de forme quasi définitive à partir de structures de support
US20200047252A1 (en) * 2017-04-20 2020-02-13 Xjet Ltd. System and method of making printed articles
US10589464B2 (en) * 2016-03-17 2020-03-17 Hewlett-Packard Development Company, L.P. Spreader roller for additive manufacturing
US10611155B2 (en) 2010-10-18 2020-04-07 Xjet Ltd. Inkjet head storage and cleaning
WO2020071731A1 (fr) * 2018-10-02 2020-04-09 주식회사 엘지화학 Appareil de moulage et procédé pour la fabrication d'un objet moulé
CN111014677A (zh) * 2019-10-18 2020-04-17 南京钛陶智能系统有限责任公司 一种基于磁力搅拌的三维打印锻造方法
JP2020100885A (ja) * 2018-12-25 2020-07-02 エルジー・ケム・リミテッド 成形装置及び成形体の製造方法
US10800108B2 (en) 2016-12-02 2020-10-13 Markforged, Inc. Sinterable separation material in additive manufacturing
WO2021020668A1 (fr) * 2018-10-10 2021-02-04 주식회사 클리셀 Dispositif de prévention de photopolymérisation pour prévenir la photopolymérisation d'un biomatériau à l'intérieur d'une buse de pulvérisation et d'un distributeur, et bio-imprimante 3d comprenant celui-ci
US10913112B2 (en) 2013-10-17 2021-02-09 Xiet, Ltd. Tungsten-Carbide/Cobalt ink composition for 3D inkjet printing
US10981331B2 (en) * 2016-10-19 2021-04-20 Hewlett-Packard Development Company, L.P. Additive manufacturing
US20210229356A1 (en) * 2018-10-12 2021-07-29 Hewlett-Packard Development Company, L.P. Baffles to absorb reflected energy in reflectors
US20210245434A1 (en) * 2018-10-30 2021-08-12 Hewlett-Packard Development Company, L.P. Microwave energy emitters with tips
US20210283687A1 (en) * 2018-02-09 2021-09-16 Hewlett-Packard Development Company, L.P. Three-dimensional printing systems
WO2021202261A1 (fr) * 2020-03-30 2021-10-07 University Of Florida Research Foundation, Incorporated Systèmes, procédés et appareils permettant d'imprimer des pièces métalliques en 3d à partir de suspensions de poudre
US20210370598A1 (en) * 2018-04-30 2021-12-02 Hewlett-Packard Development Company, L.P. Build material heaters with baffles
US20220126513A1 (en) * 2020-10-27 2022-04-28 Seiko Epson Corporation Three-dimensional object printing apparatus and three-dimensional object printing method
US11400649B2 (en) * 2019-09-26 2022-08-02 Applied Materials, Inc. Air knife assembly for additive manufacturing
US11413817B2 (en) 2019-09-26 2022-08-16 Applied Materials, Inc. Air knife inlet and exhaust for additive manufacturing
US11712843B2 (en) * 2017-12-07 2023-08-01 General Electric Company Binder jetting apparatus and methods
US11813788B2 (en) 2016-09-15 2023-11-14 Mantle Inc. System and method for additive metal manufacturing

Families Citing this family (113)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10022889B2 (en) * 2013-03-14 2018-07-17 Stratasys, Inc. Ceramic support structure
WO2015100085A2 (fr) * 2013-12-23 2015-07-02 The Exone Company Procédés et systèmes d'impression en trois dimensions utilisant un fluide liant à particules éjecté
US9925440B2 (en) 2014-05-13 2018-03-27 Bauer Hockey, Llc Sporting goods including microlattice structures
JP6584101B2 (ja) * 2015-03-12 2019-10-02 キヤノン株式会社 立体物の製造方法およびその製造装置
WO2016171724A1 (fr) 2015-04-24 2016-10-27 Hewlett-Packard Development Company, L.P. Agent de détaillage pour impression en trois dimensions (3d)
JP6560756B2 (ja) * 2015-04-30 2019-08-14 ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. 多重構造3d物体の印刷
US9975182B2 (en) * 2015-05-13 2018-05-22 Kennametal Inc. Cutting tool made by additive manufacturing
GB2538289B (en) * 2015-05-14 2018-05-09 Dev Ltd Inkjet type additive manufacturing
US20180085993A1 (en) * 2015-05-22 2018-03-29 Luxexcel Holding B.V. Method for printing a three-dimensional structure and a system for printing a three-dimensional structure
DE102015211670A1 (de) 2015-06-24 2016-12-29 Airbus Operations Gmbh Verfahren und Vorrichtung zur Serienfertigung von Bauteilen aus einem faserverstärkten Verbundmaterial
CN104959594B (zh) * 2015-07-10 2017-02-22 北京科技大学 一种3d打印用高固相低粘度磁性合金粉的制备方法
US10668533B2 (en) 2015-07-17 2020-06-02 Applied Materials, Inc. Additive manufacturing with coolant system
KR102037558B1 (ko) * 2015-07-20 2019-10-28 주식회사 엘지화학 3d 프린팅 지지체용 잉크 조성물 및 이를 이용한 3d 프린팅 제조방법
JP2017025386A (ja) * 2015-07-24 2017-02-02 セイコーエプソン株式会社 3次元成形物および3次元成形方法
JP6661920B2 (ja) * 2015-08-26 2020-03-11 セイコーエプソン株式会社 3次元形成装置
EP3135459A1 (fr) 2015-08-31 2017-03-01 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Procédé et système pour la production de couches d'un objet tangible
JP6682782B2 (ja) * 2015-09-07 2020-04-15 日本電気株式会社 造形装置および造形方法
US10974495B2 (en) * 2015-09-14 2021-04-13 Xerox Corporation Thermal management methods and apparatus for producing uniform material deposition and curing for high speed three-dimensional printing
KR102071652B1 (ko) * 2015-09-25 2020-01-30 주식회사 엘지화학 3d 프린팅용 조성물
KR102619833B1 (ko) * 2015-10-09 2024-01-03 오씨폼 에이피에스 3d 인쇄를 위한 공급 원료 및 이의 용도
JP6901697B2 (ja) * 2015-10-15 2021-07-14 セイコーエプソン株式会社 流動性組成物セット及び流動性組成物
WO2017075575A1 (fr) 2015-10-30 2017-05-04 Polar 3D Llc Appareil et procédé pour la formation d'objets en 3d
JP6718132B2 (ja) 2015-11-06 2020-07-08 セイコーエプソン株式会社 三次元構造物の製造方法及びその製造装置
JP6669985B2 (ja) 2015-11-12 2020-03-18 セイコーエプソン株式会社 三次元造形物の製造方法
EP3389982A4 (fr) * 2015-12-16 2019-05-22 Desktop Metal, Inc. Procédés et systèmes destinés à la fabrication additive
EP3392309A4 (fr) * 2015-12-18 2018-12-05 Ricoh Company, Ltd. Matériau composite se désintégrant dans l'eau, et procédé de production d'un modèle tridimensionnel
JP6170994B2 (ja) * 2015-12-22 2017-07-26 株式会社フジミインコーポレーテッド 粉末積層造形に用いるための造形用材料
US10449713B2 (en) 2016-01-25 2019-10-22 Te Connectivity Corporation Article and method of forming an article
JP2017159475A (ja) 2016-03-07 2017-09-14 セイコーエプソン株式会社 三次元造形物の製造方法、三次元造形物製造装置および三次元造形物
JP2017159474A (ja) 2016-03-07 2017-09-14 セイコーエプソン株式会社 三次元造形物の製造方法、三次元造形物製造装置および三次元造形物
DE102016002777A1 (de) 2016-03-09 2017-09-14 Voxeljet Ag Verfahren und Vorrichtung zum Herstellen von 3D-Formteilen mit Baufeldwerkzeugen
KR102056100B1 (ko) * 2016-04-01 2019-12-17 주식회사 엘지화학 3d 프린팅 방법
US9833839B2 (en) 2016-04-14 2017-12-05 Desktop Metal, Inc. Fabricating an interface layer for removable support
WO2017178084A1 (fr) * 2016-04-15 2017-10-19 Sandvik Intellectual Property Ab Impression tridimensionnelle de cermet ou de carbure cémenté
US11465341B2 (en) 2016-04-28 2022-10-11 Hewlett-Packard Development Company, L.P. 3-dimensional printed parts
KR102179605B1 (ko) 2016-04-28 2020-11-17 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 광발광 물질 세트
GB2550338A (en) 2016-05-12 2017-11-22 Hewlett Packard Development Co Lp Reflector and additive manufacturing system
EP3243583B1 (fr) 2016-05-13 2019-05-08 SLM Solutions Group AG Appareil et procédé pour associer une position dans un ensemble de données de construction avec une position dans une section de construction de l'appareil
EP3263300A1 (fr) * 2016-06-27 2018-01-03 Siemens Aktiengesellschaft Mécanisme de revêtement et appareil de fabrication par méthode additive
DE102016112499A1 (de) * 2016-07-07 2018-01-11 Jens Reimann Fertigung kundenspezifischer lingualer Brackets
US11167478B2 (en) 2016-07-20 2021-11-09 Hewlett-Packard Development Company, L.P. Material sets
US10857727B2 (en) 2016-07-20 2020-12-08 Hewlett-Packard Development Company, L.P. Material sets
WO2018022024A1 (fr) * 2016-07-26 2018-02-01 Hewlett-Packard Development Company, L.P. Impression tridimensionnelle (3d)
KR20190058527A (ko) 2016-09-22 2019-05-29 스트라타시스 엘티디. 임의 형상 제작 방법 및 시스템
EP3515687B1 (fr) * 2016-09-22 2022-04-20 Stratasys Ltd. Procédé pour la fabrication d'une forme libre solide
JP6774020B2 (ja) * 2016-09-29 2020-10-21 セイコーエプソン株式会社 三次元造形物の製造装置及び三次元造形物の製造方法
KR102142378B1 (ko) * 2016-10-17 2020-08-10 와커 헤미 아게 향상된 인쇄 품질를 갖는 실리콘 탄성중합체 제품을 제조하기 위한 방법
KR102185463B1 (ko) 2016-10-25 2020-12-02 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 세슘텅스텐 산화물의 나노입자 및 쯔비터이온성 안정화제를 함유하는 분산액 및 분사가능 조성물
EP3532546B1 (fr) 2016-10-25 2022-07-13 Hewlett-Packard Development Company, L.P. Dispersion et composition pulvérisable contenant des nanoparticules d'oxyde métallique
BR112018015540B1 (pt) 2016-10-25 2022-02-01 Hewlett-Packard Development Company, L.P Método para adicionar cor a uma peça durante impressão tridimensional e método de impressão 3d
KR20230090376A (ko) * 2016-11-01 2023-06-21 더 나노스틸 컴퍼니, 인코포레이티드 분말 층 융합용 3d 인쇄 가능한 경질 철계 금속 합금
DE102016221889A1 (de) * 2016-11-08 2018-05-09 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg 3D-Druckvorrichtung und 3D-Druckverfahren
DE102016121594A1 (de) * 2016-11-10 2018-05-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur verbesserung der oberflächenqualität generativ hergestellter bauteile
FR3058354B1 (fr) * 2016-11-10 2020-01-31 Addup Dispositif porte-outil pour appareil de fabrication additive selective
WO2018102021A1 (fr) * 2016-12-02 2018-06-07 Markforged, Inc. Supports pour frittage de pièces fabriquées par fabrication additive
CA3043048A1 (fr) * 2016-12-02 2018-06-07 Markforged, Inc. Relaxation des contraintes dans des pieces fabriquees de maniere additive
JP6955658B2 (ja) * 2017-01-11 2021-10-27 Dic株式会社 液状組成物の組み合わせ
US20180236544A1 (en) * 2017-02-21 2018-08-23 Desktop Metal, Inc. Multi-phase sintering in binder jetting fabrication of metal objects
FR3063221B1 (fr) * 2017-02-24 2019-04-19 Mojito Procede de fabrication d'un element dentaire par impression tridimensionnelle
US10317881B2 (en) * 2017-03-01 2019-06-11 General Electric Company Parallelized CAD using multi laser additive printing
JP6855846B2 (ja) * 2017-03-06 2021-04-07 セイコーエプソン株式会社 ペースト及び三次元造形物の製造方法
CN106915084B (zh) * 2017-03-07 2019-04-02 杭州杭景模型有限公司 3d打印机及其打印平台
US11104076B2 (en) * 2017-03-17 2021-08-31 3D Systems, Inc. Method and calibrating an inkjet based three-dimensional printing system
CN107053653B (zh) * 2017-03-30 2019-04-09 大连理工大学 基于电场-热场复合的电喷射3d打印装置及方法
US9925726B1 (en) * 2017-04-03 2018-03-27 Xerox Corporation Apparatus for holding three-dimensional (3-D) objects during printing thereon
US20180290400A1 (en) * 2017-04-07 2018-10-11 Sony Corporation 3d printing device and method for 3d printing
WO2018194656A1 (fr) * 2017-04-21 2018-10-25 Hewlett-Packard Development Company, L.P. Flux de chaleur de machine de fabrication additive
WO2018194688A1 (fr) * 2017-04-21 2018-10-25 Hewlett-Packard Development Company, L.P. Rouleau de fabrication additive à l'intérieur d'une zone de transfert de chaleur rayonnante
EP3645245A1 (fr) * 2017-06-27 2020-05-06 SABIC Global Technologies B.V. Fabrication additive de matériaux multiples à l'aide d'une impression de suspension de nanoparticules
CN107538741A (zh) * 2017-08-12 2018-01-05 西安电子科技大学 非展开曲面导电图形的打印及光子固化一体系统及方法
JP2019055507A (ja) * 2017-09-20 2019-04-11 株式会社ミマキエンジニアリング 造形装置および回収装置
WO2019083515A1 (fr) * 2017-10-24 2019-05-02 Hewlett-Packard Development Company, L.P. Suspension de matériau de construction
CN111278627B (zh) * 2017-10-25 2023-02-03 惠普发展公司,有限责任合伙企业 用于由颗粒形成的3d特征的热支撑物
CN107839218A (zh) * 2017-11-07 2018-03-27 陕西百普生医疗科技发展有限公司 一种选区激光蒸发沉积方法及装置
CN108045105B (zh) * 2017-11-21 2020-10-09 西安电子科技大学 一种导电图形打印、线性扫描固化一体系统及方法
RU2669135C1 (ru) * 2017-12-11 2018-10-08 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный технологический университет "СТАНКИН" (ФГБОУ ВО "МГТУ "СТАНКИН") Способ изготовления изделий селективным лазерным плавлением порошковой композиции WC-Co
CN107825706A (zh) * 2017-12-15 2018-03-23 佛山三维二次方科技有限公司 热塑性高分子材料的3d打印工艺
EP3691817A4 (fr) * 2018-01-02 2021-04-07 Hewlett-Packard Development Company, L.P. Matériaux de lit de poudre
CN108126875A (zh) * 2018-01-25 2018-06-08 长春市漫思教育科技有限公司 一种3d打印零件表面处理装置及方法
US20210331243A1 (en) * 2018-02-28 2021-10-28 Hewlett-Packard Development Company, L.P. Three-dimensional printing
CN110315757B (zh) * 2018-03-28 2021-09-14 昆山市工研院智能制造技术有限公司 一种熔融沉积成形3d打印机的工件加热保温系统
ES2732766B2 (es) * 2018-05-24 2021-01-20 Consejo Superior Investigacion Procedimiento de obtención de una pieza por modelado por deposición de hilo fundido
WO2019231966A1 (fr) 2018-06-01 2019-12-05 Applied Materials, Inc. Lame d'air pour fabrication additive
CN108655407A (zh) * 2018-06-13 2018-10-16 沈阳精合数控科技开发有限公司 一种超细颗粒载液喷射微波烧结成形方法
WO2019245515A1 (fr) * 2018-06-17 2019-12-26 Hewlett-Packard Development Company, L.P. Fabrication additive
WO2020034093A1 (fr) * 2018-08-14 2020-02-20 西门子(中国)有限公司 Procédé d'impression 3d
AU2019330385A1 (en) * 2018-08-29 2021-04-15 Tritone Technologies Ltd. Hardening method and apparatus, particularly applicable to metal and/or ceramics
CN109111223B (zh) * 2018-09-18 2021-06-18 中国科学院宁波材料技术与工程研究所 3d直写打印用二氧化钛陶瓷组合物、浆料、制法及应用
ES2906273T3 (es) 2018-11-29 2022-04-18 Ivoclar Vivadent Ag Procedimiento y uso de barbotina para la fabricación de cuerpos moldeados cerámicos a partir de óxido de circonio mediante impresión por inyección de tinta 3D
EP3898186B1 (fr) * 2018-12-20 2023-06-07 Jabil Inc. Appareil, système et procédé de fabrication additive au moyen d'un matériau ultra-fin projeté
DE102018133705B4 (de) 2018-12-29 2022-05-05 Jens Reimann Computergestütztes Verfahren zum Entwurf einer orthodontischen Behandlungsapparatur und orthodontische Behandlungsapparatur
US11548304B2 (en) * 2019-02-25 2023-01-10 Green Dot Sign Incorporated Eco-friendly signage
CN110076997A (zh) * 2019-05-10 2019-08-02 黄春燕 三维增材打印机的气压调节式墨压控制装置
CA3140503C (fr) 2019-05-21 2022-06-14 Bauer Hockey Ltd. Casques comprenant des composants fabriques de maniere additive
CN110238395B (zh) * 2019-06-27 2020-04-24 南京工业大学 通过预制砂型增材制造打印金属零件的方法
CN114401832B (zh) * 2019-07-14 2023-05-23 三全音科技有限公司 模具制备和糊料填充
CN110303157B (zh) * 2019-08-02 2020-04-14 南京中科煜宸激光技术有限公司 预制砂型支撑增材制造打印金属零件的方法
DE102019130940A1 (de) * 2019-10-25 2021-04-29 Gühring KG Verfahren zur Herstellung einer Wendeschneidplatte sowie ein zerspanendes Werkzeug
JP6865803B2 (ja) * 2019-11-07 2021-04-28 株式会社Screenホールディングス 平坦化装置
CN110773737B (zh) * 2019-11-14 2021-11-23 安徽汇正电子科技有限公司 一种选择性激光熔化防翘曲形变的3d打印机
WO2021178376A1 (fr) * 2020-03-03 2021-09-10 University Of Kansas Procédés pour des objets d'impression par jet d'encre pour dispositifs microfluidiques
EP3875185A1 (fr) * 2020-03-05 2021-09-08 Evonik Operations GmbH Frittage superparamagnétique sélectif et encre appropriée associée
US11485089B2 (en) * 2020-03-12 2022-11-01 Xerox Corporation Method and system for operating a modular heater to improve layer bonding in a metal drop ejecting three-dimensional (3D) object printer
JP7367575B2 (ja) 2020-03-18 2023-10-24 株式会社リコー 立体造形物製造装置および立体造形物の製造方法
CN111873407B (zh) * 2020-07-27 2021-11-19 南通理工学院 一种3d打印方法及用于该方法的3d打印组件和3d打印平台
WO2022164866A1 (fr) * 2021-01-29 2022-08-04 Essentium, Inc. Matériau de support d'ablation pour la fabrication d'additifs de dépôt d'énergie dirigée
CN113591300B (zh) * 2021-07-29 2024-03-15 深圳市创想三维科技股份有限公司 3d打印文件的生成方法、装置、计算机设备和存储介质
WO2023086908A1 (fr) * 2021-11-10 2023-05-19 Brigham Young University Procédé et système de génération d'un objet tridimensionnel à définition de bord
WO2023101688A1 (fr) * 2021-12-03 2023-06-08 Hewlett-Packard Development Company, L.P. Kit pour impression en trois dimensions
US11718026B1 (en) * 2022-07-20 2023-08-08 General Electric Company Recoat assemblies for additive manufacturing systems and methods of using the same
JP2024047016A (ja) * 2022-09-26 2024-04-05 株式会社ミマキエンジニアリング 造形物の製造装置及び造形物の製造方法
CN115972572A (zh) * 2023-01-06 2023-04-18 华中科技大学 连续纤维复材层间增强的机器人辅助激光增材制造系统
CN116393715B (zh) * 2023-04-19 2023-09-19 安徽艾密克电联科技有限责任公司 一种3d金属粉末打印机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6305769B1 (en) * 1995-09-27 2001-10-23 3D Systems, Inc. Selective deposition modeling system and method
US20030001313A1 (en) * 2001-06-15 2003-01-02 Tobias Krause Process and a device for producing ceramic molds
WO2003026876A2 (fr) * 2001-09-27 2003-04-03 Z Corporation Imprimante a trois dimensions
DE102015108646A1 (de) * 2015-06-01 2016-12-01 Bundesrepublik Deutschland, Vertreten Durch Den Bundesminister Für Wirtschaft Und Energie, Dieser Vertreten Durch Den Präsidenten Der Bundesanstalt Für Materialforschung Und -Prüfung (Bam) Verfahren zur Herstellung keramischer Multilagen-Schaltungsträger auf Basis einer schlickerbasierten additiven Fertigung

Family Cites Families (139)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3451791A (en) * 1967-08-16 1969-06-24 Du Pont Cobalt-bonded tungsten carbide
US4376716A (en) * 1974-07-18 1983-03-15 The United States Of America As Represented By The Secretary Of The Air Force Preparation of stable sodium carbonate dispersions
DE2713891A1 (de) * 1977-03-29 1978-10-12 Schweizer Helgi Jon Dr Vorrichtung zur herstellung und anwendung rhythmischer reizstrukturen
US4364059A (en) 1979-12-17 1982-12-14 Ricoh Company, Ltd. Ink jet printing apparatus
US4472537A (en) * 1982-09-17 1984-09-18 Corning Glass Works Thermoplastic inks for decorating purposes
US4592252A (en) * 1984-07-23 1986-06-03 Cdp, Ltd. Rolling cutters for drill bits, and processes to produce same
US4554130A (en) * 1984-10-01 1985-11-19 Cdp, Ltd. Consolidation of a part from separate metallic components
US4630692A (en) * 1984-07-23 1986-12-23 Cdp, Ltd. Consolidation of a drilling element from separate metallic components
US4562892A (en) * 1984-07-23 1986-01-07 Cdp, Ltd. Rolling cutters for drill bits
EP0245544A3 (fr) * 1986-03-11 1988-03-23 Cellutane Co Ltd Procédé et dispositif pour produire en continu des articles plans à partir de déchets de matière synthétique
US4847636A (en) 1987-10-27 1989-07-11 International Business Machines Corporation Thermal drop-on-demand ink jet print head
US5136515A (en) * 1989-11-07 1992-08-04 Richard Helinski Method and means for constructing three-dimensional articles by particle deposition
JPH03184852A (ja) 1989-12-15 1991-08-12 Canon Inc インクジェット記録装置
JP2667277B2 (ja) 1990-03-14 1997-10-27 キヤノン株式会社 インクジェット記録装置
JPH04235054A (ja) 1991-01-09 1992-08-24 Seiko Epson Corp インクジェット記録装置
US5151377A (en) 1991-03-07 1992-09-29 Mobil Solar Energy Corporation Method for forming contacts
US5510823A (en) * 1991-03-07 1996-04-23 Fuji Xerox Co., Ltd. Paste for resistive element film
JPH0690014A (ja) 1992-07-22 1994-03-29 Mitsubishi Electric Corp 薄型太陽電池及びその製造方法,エッチング方法及び自動エッチング装置,並びに半導体装置の製造方法
US5385706A (en) * 1993-04-07 1995-01-31 The Proctor & Gamble Company Process of making a refastenable mechanical fastening system with substrate having protrusions
US5640183A (en) 1994-07-20 1997-06-17 Hewlett-Packard Company Redundant nozzle dot matrix printheads and method of use
JP3467716B2 (ja) 1995-05-25 2003-11-17 セイコーエプソン株式会社 インクジェット記録ヘッド用キャッピング装置
US6270335B2 (en) 1995-09-27 2001-08-07 3D Systems, Inc. Selective deposition modeling method and apparatus for forming three-dimensional objects and supports
US5812158A (en) 1996-01-18 1998-09-22 Lexmark International, Inc. Coated nozzle plate for ink jet printing
KR0182788B1 (ko) * 1996-02-02 1999-04-15 유규재 초미세 교질 탄산칼슘의 제조방법
JP4346684B2 (ja) 1996-04-17 2009-10-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 基板上への焼結体の製造方法
US6596224B1 (en) * 1996-05-24 2003-07-22 Massachusetts Institute Of Technology Jetting layers of powder and the formation of fine powder beds thereby
JPH10140209A (ja) 1996-11-05 1998-05-26 Toyo Kohan Co Ltd 射出成形による超硬合金の製造方法
DE19715582B4 (de) * 1997-04-15 2009-02-12 Ederer, Ingo, Dr. Verfahren und System zur Erzeugung dreidimensionaler Körper aus Computerdaten
JPH11342598A (ja) 1998-03-31 1999-12-14 Canon Inc 記録装置および記録ヘッド
US6283997B1 (en) * 1998-11-13 2001-09-04 The Trustees Of Princeton University Controlled architecture ceramic composites by stereolithography
JP2000310881A (ja) 1999-04-28 2000-11-07 Minolta Co Ltd トナージェット用トナー
US6328418B1 (en) 1999-08-11 2001-12-11 Hitachi Koki Co., Ltd Print head having array of printing elements for printer
US6514343B1 (en) 1999-10-01 2003-02-04 Tokyo Electron Limited Coating apparatus
US20050104241A1 (en) 2000-01-18 2005-05-19 Objet Geometried Ltd. Apparatus and method for three dimensional model printing
JP2001228320A (ja) 2000-02-21 2001-08-24 Canon Inc カラーフィルタの製造方法及び製造装置
US7300619B2 (en) * 2000-03-13 2007-11-27 Objet Geometries Ltd. Compositions and methods for use in three dimensional model printing
US6824603B1 (en) * 2000-04-20 2004-11-30 Parelec, Inc. Composition and method for printing resistors, capacitors and inductors
JP2001341319A (ja) 2000-06-02 2001-12-11 Canon Inc インクジェット記録装置、カラーフィルタ製造装置、及びこれらのワイピング方法
US20020015855A1 (en) 2000-06-16 2002-02-07 Talex Sajoto System and method for depositing high dielectric constant materials and compatible conductive materials
US6562269B2 (en) * 2001-01-05 2003-05-13 3D Systems, Inc. Layer normalizing device for selective deposition modeling
US7435426B2 (en) * 2001-03-22 2008-10-14 Church & Dwight Co., Inc. Micron sized bicarbonate particles and slurrys containing the same
AUPR399001A0 (en) 2001-03-27 2001-04-26 Silverbrook Research Pty. Ltd. An apparatus and method(ART104)
US6536853B2 (en) 2001-04-20 2003-03-25 Caterpillar Inc Arrangement for supporting a track chain of a track type work machine
US6656410B2 (en) * 2001-06-22 2003-12-02 3D Systems, Inc. Recoating system for using high viscosity build materials in solid freeform fabrication
JP3948247B2 (ja) 2001-10-29 2007-07-25 セイコーエプソン株式会社 膜パターンの形成方法
US6736484B2 (en) 2001-12-14 2004-05-18 Seiko Epson Corporation Liquid drop discharge method and discharge device; electro optical device, method of manufacture thereof, and device for manufacture thereof; color filter method of manufacture thereof, and device for manufacturing thereof; and device incorporating backing, method of manufacturing thereof, and device for manufacture thereof
JP2003184852A (ja) 2001-12-17 2003-07-03 Nippon Flex Kogyo Kk コントロールケーブル用内索
JP2003262646A (ja) 2002-03-08 2003-09-19 Ntn Corp ワイヤレス回転検出装置および無線スイッチ装置
JP4126996B2 (ja) 2002-03-13 2008-07-30 セイコーエプソン株式会社 デバイスの製造方法及びデバイス製造装置
US20040246294A1 (en) 2002-04-22 2004-12-09 Toyohiko Mitsuzawa Method of cleaning print head
KR100503790B1 (ko) 2002-05-24 2005-07-26 삼성전자주식회사 잉크젯 기록을 위한 금속산화물을 포함하는 액체조성물 및상기 액체조성물을 사용하는 잉크젯 기록 방법
JP2004042551A (ja) 2002-07-15 2004-02-12 Fuji Electric Holdings Co Ltd インクジェット記録装置
IL151354A (en) 2002-08-20 2005-11-20 Zach Moshe Multi-printhead digital printer
US7131722B2 (en) 2002-08-30 2006-11-07 Konica Corporation Ink jet printer and image recording method using a humidity detector to control the curing of an image
JP4440523B2 (ja) 2002-09-19 2010-03-24 大日本印刷株式会社 インクジェット法による有機el表示装置及びカラーフィルターの製造方法、製造装置
JP2004139838A (ja) * 2002-10-17 2004-05-13 Noritake Co Ltd 導体ペーストおよびその利用
JP3801158B2 (ja) 2002-11-19 2006-07-26 セイコーエプソン株式会社 多層配線基板の製造方法、多層配線基板、電子デバイス及び電子機器
US20040151978A1 (en) 2003-01-30 2004-08-05 Huang Wen C. Method and apparatus for direct-write of functional materials with a controlled orientation
JP4106282B2 (ja) 2003-01-31 2008-06-25 ホシデン株式会社 多接点入力装置
WO2004096556A2 (fr) 2003-04-28 2004-11-11 Matsushita Electric Industrial Co. Ltd. Tete a buses, tete d'impression de ligne comprenant cette tete a buses et imprimante a jet d'encre equipee de cette tete d'impression de ligne
DE602004008458T2 (de) 2003-05-01 2008-05-21 Objet Geometries Ltd. Rapid-prototyping-vorrichtung
JP2005199523A (ja) 2004-01-14 2005-07-28 Brother Ind Ltd インクジェット記録装置
JP4085429B2 (ja) 2004-05-14 2008-05-14 富士フイルム株式会社 画像形成方法及び装置
JP4052295B2 (ja) 2004-08-25 2008-02-27 セイコーエプソン株式会社 多層配線基板の製造方法、電子デバイス及び電子機器
JP4715209B2 (ja) 2004-09-01 2011-07-06 コニカミノルタホールディングス株式会社 インクジェット記録装置
US7470016B2 (en) 2004-12-03 2008-12-30 Fujifilm Dimatix, Inc. Introducing material into a printhead enclosure
US7236166B2 (en) 2005-01-18 2007-06-26 Stratasys, Inc. High-resolution rapid manufacturing
US7344220B2 (en) 2005-01-25 2008-03-18 Fujifilm Dimatix, Inc. Ink jet printing apparatus having non-contact print head maintenance station
US7494607B2 (en) 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
JP2007061784A (ja) 2005-09-02 2007-03-15 Seiko Epson Corp 液状体の吐出装置および液状体の吐出方法、電気光学装置の製造装置および電気光学装置の製造方法
US20070063366A1 (en) 2005-09-19 2007-03-22 3D Systems, Inc. Removal of fluid by-product from a solid deposition modeling process
US7718092B2 (en) 2005-10-11 2010-05-18 E.I. Du Pont De Nemours And Company Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof
US20070107773A1 (en) 2005-11-17 2007-05-17 Palo Alto Research Center Incorporated Bifacial cell with extruded gridline metallization
JP2007152161A (ja) 2005-11-30 2007-06-21 Kubota Matsushitadenko Exterior Works Ltd 建築板の塗装装置
US20090014916A1 (en) 2005-12-01 2009-01-15 Matsushita Electric Industrial Co., Ltd. Method and apparatus for producing three-dimensional structure
US7604320B2 (en) 2005-12-22 2009-10-20 Lexmark International, Inc. Maintenance on a hand-held printer
DE112006003567T5 (de) 2005-12-27 2008-10-30 Bp Corporation North America Inc., Warrenville Verfahren zum Ausbilden elektrischer Kontakte auf einem Halbleiterwafer unter Verwendung einer Phasenwechsel-Druckfarbe
US20070157078A1 (en) 2005-12-30 2007-07-05 Discovery Productions, Inc. Method for combining input data with run-time parameters into xml output using xsl/xslt
KR100667850B1 (ko) 2006-01-03 2007-01-12 삼성전자주식회사 잉크젯 화상형성장치 및 그 제어 방법
US7857430B2 (en) 2006-03-07 2010-12-28 Fujifilm Corporation Ink jet recording head and ink jet recording apparatus
KR100769348B1 (ko) * 2006-03-17 2007-11-27 주식회사 나노테크 초미립 텅스텐카바이드-코발트 복합분말 제조방법
DE102006015014B4 (de) 2006-03-31 2008-07-24 Uibel, Krishna, Dipl.-Ing. Verfahren zur Herstellung dreidimensionaler keramischer Formkörper
US7717540B1 (en) 2006-04-04 2010-05-18 Hewlett-Packard Development Company, L.P. Clog detection and clearing method for ink delivery system
JP4784379B2 (ja) 2006-04-25 2011-10-05 株式会社村田製作所 3次元構造体の製造方法
US20080024557A1 (en) 2006-07-26 2008-01-31 Moynihan Edward R Printing on a heated substrate
CN101524007A (zh) 2006-08-03 2009-09-02 巴斯夫欧洲公司 生产结构化导电表面的方法
ES2325632T3 (es) * 2006-09-01 2009-09-10 Bernard Hansez-Gonne Sistema de proteccion multifuncional para un terreno de deporte.
KR100726817B1 (ko) 2006-09-07 2007-06-11 한국생산기술연구원 티타늄 수소화물 분말의 제조방법
JP2008073647A (ja) 2006-09-22 2008-04-03 Fujifilm Corp 液体吐出装置及びレジストパターン形成方法
JP4869967B2 (ja) 2006-10-20 2012-02-08 三菱電機株式会社 シリコン基板の粗面化方法および光起電力装置の製造方法
US8322025B2 (en) 2006-11-01 2012-12-04 Solarworld Innovations Gmbh Apparatus for forming a plurality of high-aspect ratio gridline structures
WO2008065657A2 (fr) 2006-11-28 2008-06-05 Xjet Ltd. Système d'impression par jet d'encre avec tête d'impression mobile et procédés associés
CA2671153C (fr) 2006-12-06 2014-07-22 Dow Global Technologies Inc. Mousse de copolymere de styrene-acrylonitrile comprenant des agents attenuant l'effet des infrarouges
JP5189598B2 (ja) * 2006-12-08 2013-04-24 スリーディー システムズ インコーポレーテッド 過酸化物硬化を用いた三次元印刷材料系および方法
KR100931184B1 (ko) 2007-01-09 2009-12-10 주식회사 엘지화학 다중 노즐 헤드를 이용한 라인 패턴 형성 방법 및 이방법에 의하여 제조된 디스플레이 기판
JP4854540B2 (ja) 2007-02-22 2012-01-18 理想科学工業株式会社 画像記録装置
WO2009017648A1 (fr) * 2007-07-26 2009-02-05 The Ex One Company, Llc Suspensions de nanoparticules utilisées dans l'impression tridimensionnelle
US8028198B2 (en) * 2007-07-30 2011-09-27 Micron Technology, Inc. Devices, methods, and apparatuses for detection, sensing, and reporting functionality for semiconductor memory
JP4947303B2 (ja) 2007-07-31 2012-06-06 セイコーエプソン株式会社 液体噴射ヘッドユニット及び液体噴射装置
US7812064B2 (en) 2007-08-07 2010-10-12 Xerox Corporation Phase change ink compositions
TW200918325A (en) 2007-08-31 2009-05-01 Optomec Inc AEROSOL JET® printing system for photovoltaic applications
JP4954837B2 (ja) 2007-09-21 2012-06-20 富士フイルム株式会社 液体吐出ヘッド及び液体吐出装置並びに液体吐出ヘッド製造方法
US8334453B2 (en) 2007-12-11 2012-12-18 Evergreen Solar, Inc. Shaped tab conductors for a photovoltaic cell
ATE490293T1 (de) 2007-12-28 2010-12-15 Eckart Gmbh Pigmentzubereitung und tintenstrahldrucktinte
JP4975667B2 (ja) 2008-03-21 2012-07-11 理想科学工業株式会社 インクジェット記録装置
JP4992788B2 (ja) 2008-03-27 2012-08-08 セイコーエプソン株式会社 補正値算出方法、及び、液体吐出方法
CN101981154B (zh) * 2008-03-31 2014-03-19 大日本印刷株式会社 碱产生剂、感光性树脂组合物、包含该感光性树脂组合物的图案形成用材料、使用了该感光性树脂组合物的图案形成方法以及物品
ATE544601T1 (de) 2008-05-23 2012-02-15 Oce Tech Bv Einstellung einer druckanordnung und substrat in einer druckvorrichtung
TW201016474A (en) 2008-06-24 2010-05-01 Xjet Ltd Method and system for non-contact materials deposition
JP4995166B2 (ja) 2008-09-22 2012-08-08 東芝テック株式会社 液体吐出装置およびその制御方法
KR101358340B1 (ko) 2008-11-30 2014-02-06 엑스제트 엘티디. 기판 상에 물질을 도포하는 방법 및 시스템
JP5675767B2 (ja) * 2009-03-24 2015-02-25 ビーエーエスエフ ソシエタス・ヨーロピアBasf Se 熱交換器のための熱磁気成形体を製造するための印刷方法
US9301390B2 (en) 2009-03-30 2016-03-29 Tokuyama Corporation Process for producing metallized substrate, and metallized substrate
WO2010134072A1 (fr) 2009-05-18 2010-11-25 Xjet Ltd. Procédé et dispositif pour une impression sur des substrats chauffés
EP2436519B1 (fr) 2009-05-29 2013-11-06 Konica Minolta Holdings, Inc. Dispositif d'enregistrement à jet d'encre
JP5451221B2 (ja) 2009-07-09 2014-03-26 キヤノン株式会社 インクジェット記録装置およびインクジェット記録方法
JP5462549B2 (ja) 2009-08-20 2014-04-02 住友電気工業株式会社 超硬合金
JP5725597B2 (ja) 2010-03-19 2015-05-27 富士フイルム株式会社 微細パターン位置検出方法及び装置、不良ノズル検出方法及び装置、及び液体吐出方法及び装置
WO2011138729A2 (fr) 2010-05-02 2011-11-10 Xjet Ltd. Système d'impression pourvu de dispositifs de purge automatique, de prévention de dépôt et d'élimination d'émanations
US8319808B2 (en) 2010-05-25 2012-11-27 Kabushiki Kaisha Toshiba Image forming apparatus
US20110293898A1 (en) 2010-05-28 2011-12-01 Seiko Epson Corporation Ink set, textile printing method and printed textile
JP5429052B2 (ja) * 2010-05-31 2014-02-26 セイコーエプソン株式会社 造形方法
CN103097141A (zh) 2010-07-22 2013-05-08 迅捷有限公司 打印头喷嘴评价
JPWO2012011562A1 (ja) 2010-07-23 2013-09-09 京セラ株式会社 光照射デバイス、光照射モジュール、および印刷装置
WO2012052930A2 (fr) * 2010-10-18 2012-04-26 Xjet Ltd. Stockage et nettoyage des têtes d'impression par jet d'encre
KR101305119B1 (ko) * 2010-11-05 2013-09-12 현대자동차주식회사 잉크젯 인쇄용 반도체 산화물 잉크 조성물과 이의 제조방법 및 이를 이용한 광전변환 소자의 제조방법
WO2012078820A2 (fr) 2010-12-07 2012-06-14 Sun Chemical Corporation Encres conductrices métalliques, encres conductrices métalliques revêtues de verre, encres diélectriques polymérisables par les uv pour impression par jet aérosol, et procédés de préparation et d'impression associés
JP4887458B2 (ja) 2011-03-25 2012-02-29 リコーエレメックス株式会社 ヘッド面清掃装置、インクジェット記録装置、およびヘッド面清掃方法
EP2529694B1 (fr) 2011-05-31 2017-11-15 Ivoclar Vivadent AG Procédé de génération de formes en céramique par jet d'impression 3D
JP2013181055A (ja) * 2012-02-29 2013-09-12 Seiko Epson Corp インクジェット記録用インク組成物及び記録物
US9032874B2 (en) * 2012-03-21 2015-05-19 Xerox Corporation Dampening fluid deposition by condensation in a digital lithographic system
TWI482699B (zh) * 2012-05-21 2015-05-01 Univ Nat Taipei Technology A method for preparing inorganic green bodies with three - dimensional contours
US20150255632A1 (en) 2012-05-28 2015-09-10 Xjet Ltd. Solar cell electrically conductive structure and method
TWI666656B (zh) * 2012-10-29 2019-07-21 阿爾發裝配解決方案公司 燒結粉末
JP6397420B2 (ja) * 2012-11-05 2018-09-26 ストラタシス リミテッド 3d物体の直接インクジェット印刷システムおよび方法
JP6349310B2 (ja) * 2013-05-16 2018-06-27 バンドー化学株式会社 金属接合用組成物
US9234112B2 (en) 2013-06-05 2016-01-12 Korea Institute Of Machinery & Materials Metal precursor powder, method of manufacturing conductive metal layer or pattern, and device including the same
JP6967348B2 (ja) 2013-10-17 2021-11-17 エックスジェット・リミテッドXjet Ltd. 3dインクジェット印刷のためのタングステンーカーバイド/コバルトインク組成物
JP6840674B2 (ja) * 2015-03-11 2021-03-10 ストラタシス リミテッド サポート材配合物およびそれを使用した付加製造法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6305769B1 (en) * 1995-09-27 2001-10-23 3D Systems, Inc. Selective deposition modeling system and method
US20030001313A1 (en) * 2001-06-15 2003-01-02 Tobias Krause Process and a device for producing ceramic molds
WO2003026876A2 (fr) * 2001-09-27 2003-04-03 Z Corporation Imprimante a trois dimensions
DE102015108646A1 (de) * 2015-06-01 2016-12-01 Bundesrepublik Deutschland, Vertreten Durch Den Bundesminister Für Wirtschaft Und Energie, Dieser Vertreten Durch Den Präsidenten Der Bundesanstalt Für Materialforschung Und -Prüfung (Bam) Verfahren zur Herstellung keramischer Multilagen-Schaltungsträger auf Basis einer schlickerbasierten additiven Fertigung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE 102015108646 machine translation (Year: 2016) *

Cited By (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10034392B2 (en) 2006-11-28 2018-07-24 Xjet Ltd Method and system for nozzle compensation in non-contact material deposition
US10026617B2 (en) 2008-11-30 2018-07-17 Xjet Ltd Method and system for applying materials on a substrate
US10232655B2 (en) 2009-05-18 2019-03-19 Xjet Ltd. Method and device for printing on heated substrates
US10315427B2 (en) 2010-05-02 2019-06-11 Xjet Ltd. Printing system with self-purge sediment prevention and fumes removal arrangements
US11104071B2 (en) 2010-05-02 2021-08-31 Xjet Ltd. Printing system with self-purge, sediment prevention and fumes removal arrangements
US10479122B2 (en) 2010-07-22 2019-11-19 Xjet Ltd. Printing head nozzle evaluation
US10611155B2 (en) 2010-10-18 2020-04-07 Xjet Ltd. Inkjet head storage and cleaning
US10864737B2 (en) 2010-10-18 2020-12-15 Xjet Ltd. Inkjet head storage and cleaning
US10913112B2 (en) 2013-10-17 2021-02-09 Xiet, Ltd. Tungsten-Carbide/Cobalt ink composition for 3D inkjet printing
US11623280B2 (en) 2013-10-17 2023-04-11 Xjet Ltd. Support ink for three dimensional (3D) printing
US11000897B2 (en) 2013-10-17 2021-05-11 Xjet Ltd. Support ink for three dimensional (3D) printing
US11577319B2 (en) 2013-10-17 2023-02-14 Xiet Ltd. Tungsten-carbide/cobalt ink composition for 3D inkjet printing
US9776363B2 (en) 2013-11-15 2017-10-03 Kabushiki Kaisha Toshiba Three-dimensional modeling head and three-dimensional modeling device
US10322964B2 (en) * 2014-11-24 2019-06-18 Heraeus Noblelight Gmbh Method for producing a reflector on a reflector base made of glass
US10245786B2 (en) * 2014-12-17 2019-04-02 Xerox Corporation System for planarizing objects in three-dimensional object printing systems with reduced debris
US20150192919A1 (en) * 2015-03-24 2015-07-09 Caterpillar Inc. Support members for three dimensional object printing
US10625339B2 (en) * 2015-06-16 2020-04-21 Seiko Epson Corporation Three-dimensional forming apparatus and three-dimensional forming method
US20190344347A1 (en) * 2015-06-16 2019-11-14 Seiko Epson Corporation Three-dimensional forming apparatus and three-dimensional forming method
US10589464B2 (en) * 2016-03-17 2020-03-17 Hewlett-Packard Development Company, L.P. Spreader roller for additive manufacturing
US20170368832A1 (en) * 2016-06-28 2017-12-28 Seiko Epson Corporation Printer
US10160218B2 (en) * 2016-06-28 2018-12-25 Seiko Epson Corporation Printer
US20190134896A1 (en) * 2016-07-20 2019-05-09 Hewlett-Packard Development Company, L.P. Forming microstructures in 3d printing
US11077612B2 (en) * 2016-07-20 2021-08-03 Hewlett-Packard Development Company, L.P. Forming microstructures in 3D printing by fusing and sintering using a fusing agent
CN109982848A (zh) * 2016-08-30 2019-07-05 雷兹公司 制造具有可移除支撑结构的三维物体的方法
KR102077206B1 (ko) 2016-08-30 2020-02-14 리즈 인코포레이티드 제거 가능한 지지 구조를 갖는 3차원 물체의 제조 방법
WO2018044399A1 (fr) * 2016-08-30 2018-03-08 Rize Inc. Procédé de fabrication d'un objet tridimensionnel à structure de support amovible
KR20190039440A (ko) * 2016-08-30 2019-04-11 리즈 인코포레이티드 제거 가능한 지지 구조를 갖는 3차원 물체의 제조 방법
JP2019528203A (ja) * 2016-08-30 2019-10-10 ライズ インコーポレイテッド 取り外し可能な支持構造体を伴う三次元物体を製造する方法
US11813788B2 (en) 2016-09-15 2023-11-14 Mantle Inc. System and method for additive metal manufacturing
US11919224B2 (en) 2016-09-15 2024-03-05 Mantle Inc. System and method for additive metal manufacturing
US10981331B2 (en) * 2016-10-19 2021-04-20 Hewlett-Packard Development Company, L.P. Additive manufacturing
US11760016B2 (en) * 2016-10-19 2023-09-19 Hewlett-Packard Development Company, L.P. Build material particle layering
US11654626B2 (en) 2016-10-19 2023-05-23 Hewlett-Packard Development Company, L.P. Additive manufacturing
FR3058659A1 (fr) * 2016-11-14 2018-05-18 Fives Michelin Additive Solutions Installation de fabrication additive a base de poudre a dispositif de nettoyage par raclage
WO2018087476A1 (fr) * 2016-11-14 2018-05-17 Addup Installation de fabrication additive a base de poudre a dispositif de nettoyage par raclage
US10800108B2 (en) 2016-12-02 2020-10-13 Markforged, Inc. Sinterable separation material in additive manufacturing
US11173550B2 (en) 2016-12-02 2021-11-16 Markforged, Inc. Supports for sintering additively manufactured parts
US10052815B2 (en) 2016-12-02 2018-08-21 Markforged, Inc. Supports for sintering additively manufactured parts
US10556384B2 (en) 2016-12-02 2020-02-11 Markforged, Inc. Supports for sintering additively manufactured parts
US10464131B2 (en) 2016-12-02 2019-11-05 Markforged, Inc. Rapid debinding via internal fluid channels
US10391714B2 (en) 2016-12-02 2019-08-27 Markforged, Inc. Supports for sintering additively manufactured parts
US10377083B2 (en) 2016-12-02 2019-08-13 Markforged, Inc. Supports for sintering additively manufactured parts
US10040241B2 (en) 2016-12-02 2018-08-07 Markforged, Inc. Supports for sintering additively manufactured parts
US10377082B2 (en) 2016-12-02 2019-08-13 Markforged, Inc. Supports for sintering additively manufactured parts
US10035298B2 (en) 2016-12-02 2018-07-31 Markforged, Inc. Supports for sintering additively manufactured parts
US10040242B2 (en) 2016-12-02 2018-08-07 Markforged, Inc. Supports for sintering additively manufactured parts
US10828698B2 (en) 2016-12-06 2020-11-10 Markforged, Inc. Additive manufacturing with heat-flexed material feeding
DE102016015027A1 (de) * 2016-12-16 2018-01-11 Daimler Ag Verfahren zum Glätten einer Oberfläche
US11351610B2 (en) * 2017-03-07 2022-06-07 Nano Dimension Technologies, Ltd. Composite component fabrication using inkjet printing
WO2018164672A1 (fr) * 2017-03-07 2018-09-13 Nano-Dimension Technologies, Ltd. Fabrication de composant composite utilisant une impression à jet d'encre
US20180264731A1 (en) * 2017-03-15 2018-09-20 Xjet Ltd. System and method for delivering ink into a 3d printing apparatus
WO2018189701A1 (fr) * 2017-04-13 2018-10-18 3D New Technologies S.R.L. Appareil pour préchauffer et/ou post-chauffer des poudres métalliques dans un procédé de fabrication additive
IT201700041694A1 (it) * 2017-04-13 2018-10-13 3D New Tech S R L Apparato di pre- e/o post-riscaldamento per polveri metalliche in un processo di additive manufacturing
US11529685B2 (en) * 2017-04-20 2022-12-20 Xiet Ltd. System and method of making printed articles
US11884008B2 (en) 2017-04-20 2024-01-30 Xjet Ltd. System and method of making printed articles
US20200047252A1 (en) * 2017-04-20 2020-02-13 Xjet Ltd. System and method of making printed articles
US10940643B2 (en) * 2017-10-06 2021-03-09 International Business Machines Corporation Removing a printed item from a printer
US10933587B2 (en) * 2017-10-06 2021-03-02 International Business Machines Corporation Removing a printed item from a printer
US20190105838A1 (en) * 2017-10-06 2019-04-11 International Business Machines Corporation Removing a printed item from a printer
US20190105839A1 (en) * 2017-10-06 2019-04-11 International Business Machines Corporation Removing a printed item from a printer
US11712843B2 (en) * 2017-12-07 2023-08-01 General Electric Company Binder jetting apparatus and methods
US20210283687A1 (en) * 2018-02-09 2021-09-16 Hewlett-Packard Development Company, L.P. Three-dimensional printing systems
US11772163B2 (en) * 2018-02-09 2023-10-03 Hewlett-Packard Development Company, L.P. Three-dimensional printing systems
US20210370598A1 (en) * 2018-04-30 2021-12-02 Hewlett-Packard Development Company, L.P. Build material heaters with baffles
US11858215B2 (en) * 2018-04-30 2024-01-02 Hewlett-Packard Development Company, L.P. Build material heaters with baffles
EP3802131A4 (fr) * 2018-06-07 2022-03-09 Sakuu Corporation Imprimante tridimensionnelle à plusieurs matériaux
WO2019236236A1 (fr) 2018-06-07 2019-12-12 Keracel, Inc. Imprimante tridimensionnelle à plusieurs matériaux
EP3725434A1 (fr) * 2018-06-13 2020-10-21 Rize Inc. Séparation de pièces fabriquées de forme quasi définitive à partir de structures de support
EP3697556A4 (fr) * 2018-06-13 2020-09-23 Rize, Inc. Séparation de pièces fabriquées de forme quasi définitive à partir de structures de support
WO2019241593A1 (fr) 2018-06-13 2019-12-19 Rize, Inc. Séparation de pièces fabriquées de forme quasi définitive à partir de structures de support
KR20200130454A (ko) * 2018-10-02 2020-11-18 주식회사 엘지화학 성형 장치 및 성형체의 제조 방법
WO2020071731A1 (fr) * 2018-10-02 2020-04-09 주식회사 엘지화학 Appareil de moulage et procédé pour la fabrication d'un objet moulé
KR102359059B1 (ko) 2018-10-02 2022-02-08 주식회사 엘지화학 성형 장치 및 성형체의 제조 방법
WO2021020668A1 (fr) * 2018-10-10 2021-02-04 주식회사 클리셀 Dispositif de prévention de photopolymérisation pour prévenir la photopolymérisation d'un biomatériau à l'intérieur d'une buse de pulvérisation et d'un distributeur, et bio-imprimante 3d comprenant celui-ci
US20210229356A1 (en) * 2018-10-12 2021-07-29 Hewlett-Packard Development Company, L.P. Baffles to absorb reflected energy in reflectors
US11872757B2 (en) * 2018-10-30 2024-01-16 Hewlett-Packard Development Company, L.P. Microwave energy emitters with tips
US20210245434A1 (en) * 2018-10-30 2021-08-12 Hewlett-Packard Development Company, L.P. Microwave energy emitters with tips
JP2020100885A (ja) * 2018-12-25 2020-07-02 エルジー・ケム・リミテッド 成形装置及び成形体の製造方法
US11400649B2 (en) * 2019-09-26 2022-08-02 Applied Materials, Inc. Air knife assembly for additive manufacturing
US11413817B2 (en) 2019-09-26 2022-08-16 Applied Materials, Inc. Air knife inlet and exhaust for additive manufacturing
CN111014677A (zh) * 2019-10-18 2020-04-17 南京钛陶智能系统有限责任公司 一种基于磁力搅拌的三维打印锻造方法
US11833586B2 (en) 2020-03-30 2023-12-05 University Of Florida Research Foundation, Incorporated Systems, methods, and apparatuses for printing 3D metallic parts from powder suspensions
WO2021202261A1 (fr) * 2020-03-30 2021-10-07 University Of Florida Research Foundation, Incorporated Systèmes, procédés et appareils permettant d'imprimer des pièces métalliques en 3d à partir de suspensions de poudre
US20220126513A1 (en) * 2020-10-27 2022-04-28 Seiko Epson Corporation Three-dimensional object printing apparatus and three-dimensional object printing method

Also Published As

Publication number Publication date
JP2020059281A (ja) 2020-04-16
US11623280B2 (en) 2023-04-11
IL245143B (en) 2019-12-31
JP2017500222A (ja) 2017-01-05
IL294425A (en) 2022-08-01
IL291209B (en) 2022-09-01
EP3057777A1 (fr) 2016-08-24
US10913112B2 (en) 2021-02-09
JP2020097785A (ja) 2020-06-25
CA2927249A1 (fr) 2015-04-23
IL245142B (en) 2021-12-01
IL245142A0 (en) 2016-06-30
US20160236372A1 (en) 2016-08-18
CN115723335A (zh) 2023-03-03
CN105849208A (zh) 2016-08-10
IL245144B (en) 2022-04-01
IL245143A0 (en) 2016-06-30
JP2017503868A (ja) 2017-02-02
CA2927249C (fr) 2021-07-13
JP6967348B2 (ja) 2021-11-17
CN106457673A (zh) 2017-02-22
JP6625529B2 (ja) 2019-12-25
EP3702418B1 (fr) 2023-01-25
US20200384536A1 (en) 2020-12-10
KR20160091323A (ko) 2016-08-02
WO2015056232A1 (fr) 2015-04-23
BR112016008376A2 (fr) 2017-08-01
EP3057777A4 (fr) 2017-06-14
JP6933402B2 (ja) 2021-09-08
WO2015056230A1 (fr) 2015-04-23
CN114603850A (zh) 2022-06-10
EP3702418A1 (fr) 2020-09-02
EP3058037A4 (fr) 2017-07-12
US20160229128A1 (en) 2016-08-11
IL294425B2 (en) 2023-09-01
IL294425B1 (en) 2023-05-01
EP3057776A1 (fr) 2016-08-24
EP3058037B1 (fr) 2020-07-22
US11577319B2 (en) 2023-02-14
CN116377301A (zh) 2023-07-04
JP2017504468A (ja) 2017-02-09
EP3057776A4 (fr) 2017-08-30
WO2015056231A1 (fr) 2015-04-23
US20210370400A1 (en) 2021-12-02
IL245144A0 (en) 2016-06-30
EP3057776B1 (fr) 2020-03-18
EP3685997A2 (fr) 2020-07-29
EP3685997A3 (fr) 2020-09-23
CN106414033A (zh) 2017-02-15
JP7197914B2 (ja) 2022-12-28
IL291209A (en) 2022-05-01
US11000897B2 (en) 2021-05-11
EP3058037A1 (fr) 2016-08-24
BR112016008376B1 (pt) 2022-04-19

Similar Documents

Publication Publication Date Title
EP3702418B1 (fr) Procédés et systèmes d'impression tridimensionnelle d'objets par jet d'encre
TWI821642B (zh) 形成多孔研磨墊的方法
TWI282761B (en) Pattern forming method, method of manufacturing electronic apparatus, and method of manufacturing substrate
JP6503375B2 (ja) 選択的焼結による3d印刷のための方法及び装置
Hon et al. Direct writing technology—Advances and developments
US8728589B2 (en) Laser decal transfer of electronic materials
US20210187835A1 (en) Build material particle layering
CN109219490A (zh) 用粉末材料进行添加制造的方法及装置
CN108138546B (zh) 用于使用能量束从切削元件的超硬磨料除去间隙材料的方法和系统
US20200398477A1 (en) 3d printing of inorganic material in round inkjet printing configuration
JP6725694B2 (ja) ヒートシンクの3d印刷
US20210354365A1 (en) 3d particle printing
US20220258416A1 (en) Build material particle fusing in a chamber containing vapor
WO2020086630A1 (fr) Procédés et dispositifs pour l'impression 3d
CN114270129A (zh) 用于热管理的装置、系统和方法
Das et al. A review on critical challenges in additive manufacturing via laser-induced forward transfer
WO2018080507A1 (fr) Dispositif de recouvrement pour imprimantes 3d
EP4334119A2 (fr) Impression à particules tridimensionnelle (3d)
CN108698319A (zh) 构建材料飞溅控制
CN116457188A (zh) 用于增材制造的透气平台
Vorobyev et al. Nanomaterials: Laser‐Induced Nano/Microfabrications
JPH09328367A (ja) セラミックグリーンシートの製造方法および装置
JP2022027172A (ja) 立体造形装置
CN116811237A (zh) 用于三维打印的构建粉末材料层的方法及三维打印装置
CN112368131A (zh) 三维打印

Legal Events

Date Code Title Description
STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STCB Information on status: application discontinuation

Free format text: EXPRESSLY ABANDONED -- DURING EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER