TWI718266B - 相變化材料 - Google Patents
相變化材料 Download PDFInfo
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- TWI718266B TWI718266B TW106107168A TW106107168A TWI718266B TW I718266 B TWI718266 B TW I718266B TW 106107168 A TW106107168 A TW 106107168A TW 106107168 A TW106107168 A TW 106107168A TW I718266 B TWI718266 B TW I718266B
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Abstract
在一個例示性實施例中,一種熱界面材料包括至少一種聚合物、至少一種相變化材料、至少一種交聯劑及至少一種導熱填料。該至少一種導熱填料包括第一複數個粒子直徑係約1微米或更小的粒子。該至少一種導熱填料佔該熱界面材料總重量的至少80重量%。亦提供用於形成熱界面材料之調配物及包括熱界面材料之電子組件。
Description
本發明大體上係關於熱界面材料,且更特定而言係關於包括相變化材料之熱界面材料。
熱界面材料廣泛用於耗散來自電子組件之熱量,該等電子組件諸如中央處理單元、視訊圖形陣列、伺服器、遊戲控制台、智慧型手機、LED板及類似者。熱界面材料通常用於將餘熱自電子組件轉移至熱散播器,隨後將熱量轉移至散熱片。 圖1示意性地說明電子晶片10,其包括矽晶粒12、印刷電路板14及印刷電路板14上的複數個覆晶接頭16。電子晶片10係藉由一或多種第一熱界面材料(TIM) 22說明性地連接至熱散播器18及散熱片20。如圖1中所說明,第一TIM 22A連接散熱片20與熱散播器18,且第二TIM 22B連接熱散播器18與電子晶片10之矽晶粒12。熱界面材料22A、22B中的一者或兩者可為如下文所描述之熱界面材料。 TIM 22A指定為TIM 2且位於熱散播器18與散熱片20之間,使得TIM 22A之第一表面與熱散播器18之表面接觸,且TIM 22A之第二表面與散熱片20之表面接觸。 TIM 22B指定為TIM 1且位於電子晶片10與熱散播器18之間,使得TIM 22B之第一表面與電子晶片10之表面(諸如矽晶粒12之表面)接觸,且TIM 22B之第二表面與熱散播器18之表面接觸。 在一些實施例(未顯示)中,TIM 22指定為TIM 1.5且位於電子晶片10與散熱片20之間,使得TIM 22之第一表面與電子晶片10之表面(諸如矽晶粒12之表面)接觸,且TIM 2之第二表面與散熱片20之表面接觸。 熱界面材料包括熱油脂、油脂狀材料、彈性體條帶及相變化材料。傳統熱界面材料包括諸如間隙墊片及熱墊片之組件。例示性熱界面材料揭示於以下專利及申請案中:CN 103254647、CN 103254647、JP 0543116、U.S. 6,238,596、U.S. 6,451,422、U.S. 6,500,891、U.S. 6,605,238、U.S. 6,673,434、U.S. 6,706,219、U.S. 6,797,382、U.S. 6,811,725、U.S. 6,874,573、U.S. 7,172,711、U.S. 7,147,367、U.S. 7,244,491、U.S. 7,867,609、U.S. 8,324,313、U.S. 8,586,650、U.S. 2005/0072334、U.S. 2007/0051773、U.S. 2007/0179232、U.S. 2008/0044670、U.S. 2009/0111925、U.S. 2010/0048438、U.S. 2010/0129648、U.S. 2011/0308782、US 2013/0248163、WO 2008/121491及PCT/CN2014/093138。 由於在極薄層中擴散及提供相鄰表面之間的緊密接觸之能力,熱油脂及相變化材料比其他類型之熱界面材料具有更低熱阻。然而,在一些情況下,電子晶片10及散熱片20及/或熱散播器18沿豎直方向安置,如圖2中所顯示。沿該豎直方向,氣隙24直接位於TIM 22A及/或TIM 22B下方,使得TIM在下端處不受支撐。在較高溫度下,諸如TIM 22A、22B之熱界面材料可經由氣隙24自界面滴落且滴落於電子組件之其他部件上。 需要對前述內容進行改良。
本發明提供熱界面材料,其適用於將熱量自諸如電腦晶片之產熱電子裝置轉移至諸如熱散播器及散熱片之熱量耗散結構。熱界面材料說明性地包括至少一種相變化材料、至少一種聚合物基質材料、一或多種導熱填料及至少一種交聯劑,其中導熱填料佔熱界面材料總重量的至少80重量%,且導熱填料包括第一複數個粒子直徑小於1微米之粒子。在一更特定實施例中,導熱填料佔熱界面材料總重量的至少90重量%、91重量%、92重量%、93重量%或95重量%。 在任一以上實施例之一個更特定實施例中,熱界面材料包含1重量%至16重量%的至少一種聚合物基質材料;0.5重量%至8重量%的至少一種相變化材料;及0.1重量%至1重量%的至少一種胺或基於胺之交聯劑。在一更特定實施例中,熱界面材料包含1重量%至8重量%的至少一種聚合物基質材料;0.5重量%至5重量%的至少一種相變化材料;及0.1重量%至1重量%的至少一種胺或基於胺之交聯劑。 在任一以上實施例之一個更特定實施例中,第一複數個粒子包含氧化鋅粒子。在一甚至更特定實施例中,氧化鋅粒子之直徑係0.1微米至約1微米。在另一更特定實施例中,氧化鋅粒子之直徑係0.9微米或更小。 在任一以上實施例之一個更特定實施例中,導熱填料進一步包括第二複數個粒子直徑大於1微米之粒子。在一甚至更特定實施例中,第二複數個粒子包含鋁粒子。在一又更特定實施例中,第二複數個粒子包含直徑係約3微米至約15微米的鋁粒子。在一又更特定實施例中,第二複數個粒子包含直徑係約3微米的第一部分鋁粒子及直徑係約10微米的第二部分鋁粒子。 在任一以上實施例之一個更特定實施例中,交聯劑係胺或基於胺之交聯劑。 在任一以上實施例之一個更特定實施例中,導熱填料佔熱界面材料總重量的91重量%至95重量%。在一甚至更特定實施例中,導熱填料佔熱界面材料總重量的92重量%至94重量%。 在任一以上實施例之一個更特定實施例中,熱界面材料進一步包括至少一種偶合劑,諸如鈦酸酯偶合劑。在任一以上實施例之另一更特定實施例中,熱界面材料進一步包括至少一種抗氧化劑。在任一以上實施例之另一更特定實施例中,熱界面材料進一步包括至少一種離子清除劑。在任一以上實施例之另一更特定實施例中,熱界面材料進一步包括至少一種觸變劑。 在另一實施例中,提供用於形成熱界面材料之調配物。調配物包括溶劑、至少一種相變化材料、至少一種聚合物基質材料、一或多種導熱填料及至少一種交聯劑,其中導熱填料佔熱界面材料乾重(不含溶劑之重量)的至少80重量%,且導熱填料包括第一複數個粒子直徑小於1微米之粒子。 在另一實施例中,提供電子組件。電子組件包括散熱片、電子晶片及位於散熱片與電子晶片之間的熱界面材料,該熱界面材料包括:至少一種相變化材料、至少一種聚合物基質材料、一或多種導熱填料及至少一種交聯劑,其中導熱填料佔熱界面材料總重量的至少91重量%,且導熱填料包括第一複數個粒子直徑小於1微米之粒子。電子晶片及散熱片係沿豎直方向安置,且熱界面材料係沿豎直方向位於豎直定向的電子晶片與散熱片之間。 在一更特定實施例中,熱界面材料之第一表面與電子晶片之表面接觸,且熱界面材料之第二表面與散熱片接觸。在另一更特定實施例中,電子組件包括位於散熱片與電子晶片之間的熱散播器,其中熱界面材料之第一表面與電子晶片之表面接觸,且熱界面材料之第二表面與熱散播器接觸。在又另一更特定實施例中,電子組件包括位於散熱片與電子晶片之間的熱散播器,其中熱界面材料之第一表面與熱散播器之表面接觸,且熱界面材料之第二表面與散熱片接觸。
本發明係關於適用於將熱量轉移離開電子組件之熱界面材料。A . 熱界面材料
在一個例示性實施例中,TIM 22係熱界面材料。在一些例示性實施例中,TIM 22包含一或多種相變化材料、一或多種聚合物基質材料、一或多種導熱填料、一或多種交聯劑及視情況一或多種添加劑。a . 導熱填料
在一些例示性實施例中,TIM 22包括至少一種導熱填料。 例示性導熱填料包括金屬、合金、非金屬、金屬氧化物、金屬氮化物及陶瓷,及其組合。例示性金屬包括(但不限於)鋁、銅、銀、鋅、鎳、錫、銦、鉛、銀塗佈之金屬(諸如銀塗佈之銅或銀塗佈之鋁)、金屬塗佈之碳纖維及鎳塗佈之纖維。例示性非金屬包括(但不限於)碳、碳黑、石墨、碳奈米管、碳纖維、石墨烯、粉末狀金剛石、玻璃、二氧化矽、氮化矽及硼塗佈之粒子。例示性金屬氧化物、金屬氮化物及陶瓷包括(但不限於)氧化鋁、氮化鋁、氮化硼、氧化鋅及氧化錫。 TIM 22可以如下總量包含一或多種導熱填料:按TIM 22之總重量計,少至80重量%、85重量%、90重量%、91重量%、91.5重量%、92重量%、92.5重量%、93重量%,多至93.5重量%、94重量%、95重量%、96重量%、97重量%、98重量%、99重量%,或介於任何兩個前述值之間所界定的任何範圍內,諸如80重量%至99重量%、91重量%至99重量%、91重量%至95重量%、或92重量%至94重量%。 導熱填料可以粒子形式提供。平均粒徑(D50)常用於量測粒度。例示性粒子之平均粒徑小至10奈米、20奈米、50奈米、0.1微米、0.2微米、0.5微米、1微米、2微米、3微米,大至5微米、8微米、10微米、12微米、15微米、20微米、25微米、50微米、100微米,或介於任何兩個前述值之間所界定的任何範圍內,諸如10奈米至100微米、0.1微米至20微米、或0.5微米至12微米。 在一個實施例中,第一導熱填料之粒子直徑小至1微米、0.9微米、0.8微米、0.6微米、0.5微米、0.2微米、0.1微米或更小,或介於任何兩個前述值之間所界定的任何範圍內,諸如1微米至0.1微米、1微米至0.2微米、或1微米至0.8微米。在一更特定實施例中,第一導熱填料包括複數個直徑係1微米或更小的氧化鋅粒子。 在一個實施例中,與第一導熱填料共同提供之第二導熱填料的粒子直徑小至1微米、2微米、3微米、4微米,大至6微米、8微米、10微米、或12微米,或介於任何兩個前述值之間所界定的任何範圍內,諸如1微米至12微米、3微米至10微米、2微米至4微米、或8微米至12微米。在一更特定實施例中,第二導熱填料包含具有大於1微米之混合粒度的粒子,包括直徑小至2微米、3微米、4微米,大至6微米、8微米、10微米、或12微米、或其混合之粒子。在一更特定實施例中,第一導熱填料包括複數個直徑大於1微米之鋁粒子。 在一更特定實施例中,第二導熱填料包括複數個直徑大於1微米之粒子,第一導熱填料包括複數個直徑係1微米或更小的粒子,且第二導熱填料與第一導熱填料之重量比小至0.5:1、1:1、1.25:1、1.5:1、2:1、2.5:1,大至2.75:1、3:1、5:1、10:1、20:1,或介於任何兩個前述值之間所界定的任何範圍內,諸如0.5:1至20:1、1:1至10:1、1.25:1至5:1、或2.5:1至3:1。 在一更特定實施例中,導熱填料包括:複數個鋁粒子,其粒子直徑小至1微米、2微米、3微米,大至5微米、8微米、10微米、12微米、15微米,或介於任何兩個前述值之間所界定的任何範圍內,諸如1微米至15微米、或2微米至12微米、或3微米至10微米;及複數個粒子直徑係1微米或更小的氧化鋅粒子。b . 聚合物基質材料
在一些例示性實施例中,TIM 22包含聚合物基質材料。在一些例示性實施例中,聚合物基質材料提供用於併入導熱填料之基質,且當在加熱及加壓情況下受到按壓時提供流動性。 在一個例示性實施例中,聚合物基質材料包含烴橡膠化合物或橡膠化合物之摻合物。例示性材料包括飽和及不飽和橡膠化合物。在一些實施例中,飽和橡膠相較於不飽和橡膠化合物可對熱氧化降解較不敏感。例示性飽和橡膠化合物包括乙烯-丙烯橡膠(EPR、EPDM)、聚乙烯/丁烯、聚乙烯-丁烯-苯乙烯、聚乙烯-丙烯-苯乙烯、氫化聚烷基二烯「單醇」(諸如氫化聚丁二烯單醇、氫化聚丙二烯單醇、氫化聚戊二烯單醇)、氫化聚烷基二烯「二醇」(諸如氫化聚丁二烯二醇、氫化聚丙二烯二醇、氫化聚戊二烯二醇)及氫化聚異戊二烯、聚烯烴彈性體、或任何其他適合之飽和橡膠或其摻合物。在一個實施例中,聚合物基質材料係氫化聚丁二烯單醇,其亦可稱為羥基封端之乙烯丁烯共聚物,特殊單醇。 在一個例示性實施例中,聚合基質材料包含聚矽氧橡膠、矽氧烷橡膠、矽氧烷共聚物或任何其他適合之含有聚矽氧的橡膠。 在一些例示性實施例中,TIM 22可以如下量包含聚合物基質材料:按TIM 22之總重量計,少至0.5重量%、1重量%、2重量%、3重量%、4重量%,多至5重量%、6重量%、7重量%、8重量%、10重量%、12重量%、16重量%,或介於任何兩個前述值之間所界定的任何範圍內,諸如1重量%至16重量%、1重量%至8重量%、或4重量%至6重量%。c . 相變化材料
在一些例示性實施例中,TIM 22包含一或多種相變化材料。相變化材料係熔點或熔點範圍處於或低於使用TIM 22之電子裝置的一部分之操作溫度的材料。例示性相變化材料係蠟,諸如石蠟。石蠟係具有通式Cn
H2n + 2
且熔點介於約20℃至100℃範圍內的固體烴之混合物。聚合物蠟包括聚乙烯蠟及聚丙烯蠟,且通常具有約40℃至160℃之熔點範圍。其他例示性相變化材料包括低熔點合金,諸如Wood之金屬、Field之金屬,或熔點介於約20℃與90℃之間的金屬或合金。 在一些實施例中,相變化材料之量可用於調節TIM 22之硬度。舉例而言,在相變化材料之負載量較低的一些實施例中,組合物可呈軟凝膠形式,且在相變化材料之負載量較高的一些實施例中,組合物可為硬固體。TIM 22可以如下量包含一或多種相變化材料:按TIM 22之總重量計,少至0.1重量%、0.2重量%、0.5重量%、1重量%、2重量%,多至3重量%、3.5重量%、4重量%、5重量%、7重量%、8重量%、10重量%、12重量%,或介於任何兩個前述值之間所界定的任何範圍內,諸如0.1重量%至10重量%、0.5重量%至8重量%、或0.5重量%至5重量%。d . 偶合劑
在一些例示性實施例中,TIM 22包含一或多種偶合劑。在一些例示性實施例中,包括偶合劑可藉由在聚合物基質與導熱填料之間設置界面來改良熱特性,諸如相對較高溫度下的特性。例示性偶合劑包括鈦酸酯偶合劑,諸如美國專利申請公開案2011/0308782中所揭示之彼等物,該美國專利申請公開案之揭示內容特此以全文引用之方式併入。例示性偶合劑包括: 鈦IV 2,2 (雙2-丙烯醇根合甲基)丁醇酸根合、三(二辛基)焦磷酸酯-O;鋯IV 2,2 (雙2-丙烯醇根合甲基)丁醇酸根合、三(二異辛基)焦磷酸酯-O:鈦IV 2-丙醇根合、三(二辛基)-焦磷酸酯-O)與1 mol亞磷酸二異辛酯的加合物:鈦IV 雙(二辛基)焦磷酸酯-O、氧乙二醇合(加合物)、雙(二辛基) (氫)亞磷酸酯-O:鈦IV 雙(二辛基)焦磷酸酯-O、乙二醇合(加合物)、雙(二辛基)氫亞磷酸酯;及鋯IV 2,2-雙(2-丙烯醇根合甲基)丁醇酸根合、環二[2,2-(雙2-丙烯醇根合甲基)丁醇酸根合]、焦磷酸酯-O,O:在一個例示性實施例中,偶合劑係鈦IV 2,2(雙2-丙烯醇根合甲基)丁醇酸根合, 三(二辛基)焦磷酸酯-O。 在一些例示性實施例中,TIM 22可以如下量包含一或多種偶合劑:按TIM 22之總重量計,少至0.1重量%、0.2重量%、0.3重量%、0.5重量%,多至1重量%、2重量%、3重量%、5重量%,或介於任何兩個前述值之間所界定的任何範圍內,諸如0.1重量%至5重量%、0.2重量%至2重量%、或0.2重量%至1重量%。e . 交聯劑
在一些例示性實施例中,TIM 22包含一或多種交聯劑,諸如胺或基於胺之樹脂。將交聯劑添加或併入熱界面材料組合物中,以促進交聯劑與聚合物基質材料中之至少一者上的第一或末端羥基之間的交聯反應。例示性交聯劑揭示於美國專利第7,244,491號中,該專利之揭示內容特此以全文引用之方式併入。 在一個例示性實施例中,交聯劑係胺或基於胺之樹脂,其在樹脂主鏈之任何部分上包含至少一個胺取代基。例示性胺及基於胺之樹脂包括烷基化三聚氰胺樹脂及衍生自脲、硫脲、三聚氰胺或聯合化合物與醛(尤其是甲醛)之反應的合成樹脂。在一更特定實施例中,交聯劑係選自由以下組成之群的樹脂:一級胺樹脂、二級胺樹脂、三級胺樹脂、縮水甘油胺環氧樹脂、烷氧基苯甲胺樹脂、環氧胺樹脂、三聚氰胺樹脂、烷基化三聚氰胺樹脂及三聚氰胺-丙烯酸樹脂。 在一個例示性實施例中,交聯劑係三聚氰胺樹脂,諸如烷基化三聚氰胺樹脂,或甚至更特定而言,係丁基化三聚氰胺樹脂。三聚氰胺樹脂係基於環之化合物,其中環含有三個碳原子及三個氮原子。三聚氰胺樹脂通常易於經由縮合反應與其他化合物及分子組合。三聚氰胺樹脂通常可與其他分子及化合物反應以促進鏈生長及交聯,比脲樹脂更耐水及耐熱,可用作水溶性糖漿或用作可分散於水中的不溶性粉末,且具有高熔點(大於325℃)且相對非可燃。諸如丁基化三聚氰胺樹脂的烷基化三聚氰胺樹脂係藉由在樹脂形成期間併入烷基醇而形成。其可溶於油漆及瓷漆溶劑且可溶於表面塗料中。 在一些例示性實施例中,TIM 22可以如下量包含一或多種交聯劑:按TIM 22之總重量計,少至0.1重量%、0.2重量%、0.3重量%、0.5重量%,多至1重量%、2重量%、3重量%、5重量%,或介於任何兩個前述值之間所界定的任何範圍內,諸如0.1重量%至5重量%、0.2重量%至2重量%、或0.2重量%至1重量%。f . 添加劑
在一些例示性實施例中,TIM 22包含一或多種添加劑。例示性添加劑包括抗氧化劑、離子清除劑及觸變劑。 在一個例示性實施例中,抗氧化劑藉由將自由基之電子轉移至氧化劑來抑制聚合物基質的熱降解。例示性抗氧化劑包括酚型抗氧化劑、胺型抗氧化劑、或任何其他適合類型之抗氧化劑或其組合,諸如位阻酚或位阻胺型抗氧化劑。例示性抗氧化劑包括:酚型抗氧化劑,諸如Irganox® 1076或3-(3,5-二-(叔)-丁基-4-羥苯基)丙酸十八酯;胺型抗氧化劑,諸如Irganox® 565或2,6-二第三丁基-4-(4,6-雙(辛硫基)-1,3,5-三嗪-2-基胺基)酚;及含硫酚類抗氧化劑,諸如位阻含硫酚類抗氧化劑。其他例示性抗氧化劑包括: Irganox® 1010:Irgafos 168®:及Irganox® 802:在一些例示性實施例中,TIM 22可以如下量包含一或多種抗氧化劑:按TIM之總重量計,少至0.05重量%、0.1重量%、0.2重量%、0.5重量%,多至1重量%、1.5重量%、2重量%、5重量%,或介於任何兩個前述值之間所界定的任何範圍內,諸如0.05重量%至5重量%、0.1重量%至2重量%、或0.1重量%至1重量%。 在一個例示性實施例中,離子清除劑藉由捕獲及結合金屬離子以使其無法引發聚合物中自由基的形成來抑制聚合物基質的熱降解。例示性離子清除劑揭示於PCT申請案第PCT/CN2014/081724號中,該申請案之揭示內容特此以全文引用之方式併入。例示性離子清除劑包括: N-亞柳基-N'柳醯基醯肼:草醯基雙(苯亞甲基醯肼):N,N'-雙(柳醯基)肼:3-(N-柳醯基)胺基-1,2,4-三唑:2,2'-草醯胺基雙[3-(3,5-二第三丁基-4-羥苯基)丙酸乙酯]N,N'-雙(亞柳基)乙二胺:2',3-雙[[3-[3,5-二第三丁基-4-羥苯基]丙酸]]丙醯基醯肼:草醯苯胺:甲基丙二酸二苯胺:N-甲醯基-N'-柳醯基肼:伸癸基二甲酸二柳醯基醯肼:及雙(2,6-二第三丁基-4-甲基苯基)季戊四醇-二亞磷酸酯:在一些例示性實施例中,TIM 22可以如下量包含一或多種離子清除劑:按TIM之總重量計,少至0.05重量%、0.1重量%、0.2重量%、0.5重量%,多至0.6重量%、1重量%、1.5重量%、2重量%、5重量%,或介於任何兩個前述值之間所界定的任何範圍內,諸如0.05重量%至5重量%、0.1重量%至1重量%、或0.1重量%至0.6重量%。 例示性觸變劑包括煙霧狀二氧化矽及纖維素。在一些例示性實施例中,TIM 22可以如下量包含一或多種觸變劑:按TIM 22之總重量計,少至0.1重量%、0.2重量%、0.3重量%、0.5重量%,多至1重量%、2重量%、3重量%、5重量%,或介於任何兩個前述值之間所界定的任何範圍內,諸如0.1重量%至5重量%、0.2重量%至2重量%、或0.2重量%至1重量%。B . 形成熱界面材料之方法
在一些實施例中,TIM 22係由包括以下之非必需調配物形成:一或多種聚合物基質材料、一或多種相變化材料、兩種或多於兩種導熱填料、一或多種溶劑及視情況一或多種添加劑。 例示性溶劑描述於美國專利申請公開案2007/0517733中,其揭示內容特此以全文引用之方式併入本文中。適合溶劑包括純溶劑或有機或無機溶劑之混合物,該等溶劑在所要溫度(諸如臨界溫度)下揮發;或可促進上文所提及之設計目標或需要中的任一者;且與相變化材料相容,以便其將與相變化材料相互作用以達成先前提及之目標。在一些實施例中,溶劑、溶劑混合物或其組合將溶合相變化材料以使其可藉由印刷技術而得以應用。在一些例示性實施例中,溶劑或兩種或多於兩種溶劑之混合物係選自烴族溶劑。烴溶劑包含碳及氫。大部分烴溶劑係非極性的;然而,少許烴溶劑視為極性的。 烴溶劑通常分為三個種類:脂族、環狀及芳族。脂族烴溶劑包含直鏈化合物及分支及可能交聯之化合物兩種,然而,脂族烴溶劑通常並不視為環狀。環烴溶劑係包含定向於環結構中之至少三個碳原子具有類似於脂族烴溶劑之特性的彼等溶劑。芳族烴溶劑係大體包含三個或多於三個不飽和鍵之彼等溶劑,其中單個環或多個環藉由共用鍵連接及/或多個環稠合在一起。在一些例示性實施例中,溶劑或兩種或多於兩種溶劑之混合物係選自並不視為烴溶劑族化合物之一部分的溶劑,諸如酮、醇、酯、醚及胺。在又其他所涵蓋之實施例中,溶劑或溶劑混合物可包含本文中所提及之任何溶劑的組合。 例示性烴溶劑包括:甲苯、二甲苯、對二甲苯、間二甲苯、均三甲苯、溶劑石腦油H、溶劑石腦油A、異構烷烴H及其他石蠟油及異石蠟流體、烷烴(諸如戊烷、己烷、異己烷、庚烷、壬烷、辛烷、十二烷、2-甲基丁烷、十六烷、十三烷、十五烷、環戊烷、2,2,4-三甲基戊烷)、石油醚、鹵化烴(諸如氯化烴、硝化烴)、苯、1,2-二甲苯、1,2,4-三甲苯、礦油精、煤油、異丁基苯、甲基萘、乙基甲苯、石油醚。例示性酮溶劑包括丙酮、二乙基酮、甲基乙基酮及類似者。 在一個例示性實施例中,溶劑包括一或多種選自以下之溶劑:戊烷、己烷、庚烷、環己烷、石蠟油、異石蠟流體、苯、甲苯、二甲苯及其混合物或組合。 在一些例示性實施例中,調配物可以如下量包含一或多種溶劑:按調配物之總重量計,少至0.1重量%、0.5重量%、1重量%,多至5重量%、10重量%、20重量%,或介於任何兩個前述值之間所界定的任何範圍內。 在一些例示性實施例中,提供形成TIM 22之方法。在一些例示性實施例中,形成TIM 22包括諸如烘烤及乾燥TIM 22之製程。 在一些例示性實施例中,烘烤TIM 22包括在以下溫度下烘烤:低至25℃、50℃、75℃、80℃,高達100℃、125℃、150℃、170℃,或介於任何兩個前述值之間所界定的任何範圍內。在一些例示性實施例中,烘烤TIM 22持續以下時間:短至0.5分鐘、1分鐘、30分鐘、1小時、2小時,長達8小時、12小時、24小時、36小時、48小時,或介於任何兩個前述值之間所界定的任何範圍內。C . 熱界面材料特性
在一些例示性實施例中,TIM 22之熱阻抗係少至0.05℃·cm2
/W、0.06℃·cm2
/W、0.07℃·cm2
/W,高達0.08℃·cm2
/W、0.09℃·cm2
/W、0.1℃·cm2
/W、0.12℃·cm2
/W,或介於任何兩個前述值之間所界定的任何範圍內,諸如0.05℃·cm2
/W至0.12℃·cm2
/W、0.06℃·cm2
/W至0.1℃·cm2
/W、或0.06℃·cm2
/W至0.08℃·cm2
/W。 在一些例示性實施例中,在130℃之溫度及85%之相對濕度下調節96小時後,TIM 22之熱阻抗大於該調節之前TIM 22之熱阻抗不超過20%、不超過10%、不超過5%或不大於該調節之前TIM 22之熱阻抗。 在一些例示性實施例中,在150℃之溫度下調節1000小時後,TIM 22之熱阻抗大於該調節之前TIM 22之熱阻抗不超過20%、不超過10%、不超過5%或不大於該調節之前TIM 22之熱阻抗。 在將TIM應用於產熱組件與熱量耗散組件之間後,所應用之TIM的最終厚度稱為結合線厚度(BLT)。BLT的值係部分藉由當由產熱組件加熱時TIM之流動性而測定。相變化材料(PCM)包括蠟或當由產熱組件加熱時提高TIM之流動性,如此又會減小BLT之其他材料。BLT係藉由方程式TI = BLT/TC而與熱阻抗(TI)及熱導率(TC)相關,使得在相同熱導率下較低BLT導致較低熱阻抗。不希望受任何特定理論束縛,咸信包括多種尺寸之導熱填料允許較小粒度來填充存在於較大粒度之間的間隙,從而提高TIM之流動性且減小BLT。具有低BLT之TIM調配物往往具有低熱阻抗。 在一些實施例中,當經受40 psi之壓力且加熱至80℃時,TIM 22之結合線厚度大至80微米、70微米、60微米、50微米、40微米,小至30微米、25微米、20微米、15微米、10微米、5微米或更小,或介於任何兩個前述值之間所界定的任何範圍內,諸如80微米至5微米、60微米至10微米、或30微米至20微米。 在一些實施例中,TIM 22能防止高溫下滴落。在一個例示性滴落測試中,TIM 22組合物係以約0.6 mm之厚度塗覆於兩個金屬棒之間且經受約30 psi之壓力。金屬之間的TIM 22界面豎直地定位且經受120℃溫度持續兩天。在兩天期間,任何自界面滴落之TIM 22材料均指示烘烤測試不合格。樣品隨後在-55℃與125℃之間循環90次。在循環期間,任何自界面滴落之TIM 22材料均指示循環測試不合格。實例
實例係根據表1中指示的組成來製備。如表1中所示,實例1包括三聚氰胺樹脂交聯劑及約91.9重量%的總導熱填料,該導熱填料由直徑大於1微米之鋁粒子及直徑小於1微米之氧化鋅粒子構成。比較實例1不含三聚氰胺樹脂交聯劑,僅包括約90.8重量%的總導熱填料,且不包括任何直徑小於1微米之粒子。比較實例2包括三聚氰胺樹脂交聯劑,但僅具有約89.8重量%的總導熱填料,且不包括任何直徑小於1微米之粒子。比較實例3不含三聚氰胺樹脂交聯劑,但包括約93.0重量%的總導熱填料,該導熱填料由直徑大於1微米之鋁粒子及直徑小於1微米之氧化鋅粒子構成。表 1 :實例組成
各TIM包夾於與界面一起沿豎直方向定向的兩個金屬板之間且經受30 psi。如表2中所示,各樣品之初始厚度係約0.6 mm。 各樣品均經受120℃溫度之烘烤測試持續兩天。在兩天期間,任何自界面滴落之TIM材料均指示烘烤測試不合格。隨後各樣品在兩天半內經受90次-55℃至125℃溫度循環之熱循環測試。在循環期間,任何自界面滴落之TIM材料均指示熱循環測試不合格。表 2 :滴落測試結果
如表2中所示,只有包括次微米級導熱填料及交聯劑之實例1通過烘烤測試及熱循環溫度循環測試。包括交聯劑但不含次微米級填充劑之比較實例1及比較實例2未通過烘烤結果測試及熱循環循環測試。包括次微米級填充劑但不含交聯劑之比較實例3通過烘烤測試,但未通過熱循環循環測試。相較於任何比較實例,實例1之抗滴落特性更佳。 各TIM隨後經受熱可靠性測試。在90℃下將各樣品包夾於模具中持續1小時,且量測初始熱阻抗及厚度(結合線厚度)。針對比較實例1、比較實例2及實例1,以35 psi向各材料之前兩個樣品施壓,而在無壓力的情況下烘烤第三個樣品。針對比較實例3,不向三個樣品中的任一者施加壓力。 在260℃下烘烤各樣品10分鐘,其後清潔樣品且再測試熱阻抗。針對實例1,亦烘烤樣品20分鐘,其後清潔樣品且再測試熱阻抗。烘烤後,熱阻抗變化較小係理想的。表 3 :熱可靠性結果
如表3中所示,只有包括次微米級導熱填料及交聯劑之實例1在施壓(35 psi)及未施壓(0 psi)結果中提供良好結果。即使處於26℃下20分鐘後,實例1之熱阻抗仍顯示為相對恆定的。包括交聯劑但不含次微米級填充劑之比較實例1及比較實例2在施壓(35 psi)時顯示熱阻抗提高,且在未施壓(0 psi)時顯示熱阻抗顯著提高。包括次微米級填充劑但不含交聯劑之比較實例3在未施壓(0 psi)時顯示熱阻抗顯著提高。因此,相較於比較實例中的任一者,實例1提供更佳可靠性。 儘管已將本發明描述為具有例示性設計,但可在本發明之精神及範疇內進一步修改本發明。因此,本申請案意欲涵蓋使用本發明之通用原理對其所進行之任何變化、使用或調適。此外,本申請案意欲涵蓋如在本發明涉及之領域的已知或習用實踐內及在所附申請專利範圍之限制內針對本發明的該等偏離。
10‧‧‧電子晶片
12‧‧‧矽晶粒
14‧‧‧印刷電路板
16‧‧‧覆晶接頭
18‧‧‧熱散播器
20‧‧‧散熱片
22A‧‧‧第一熱界面材料/第一TIM
22B‧‧‧第二熱界面材料/第二TIM
24‧‧‧氣隙
參照以下結合附圖之本發明實施例的描述,上文所提及以及本發明之其他特徵及優點以及其實現方式將變得更顯而易見且本發明本身將更好理解,其中: 圖1示意性地說明電子晶片、熱散播器、散熱片及第一與第二熱界面材料。 圖2示意性地說明沿豎直方向之圖1的電子晶片、熱散播器、散熱片及第一與第二熱界面材料。 貫穿若干視圖,相應參考標號指示相應部件。本文中所陳述之例證說明本發明之例示性實施例,且該等例證並不解釋為以任何方式限制本發明之範疇。
10‧‧‧電子晶片
12‧‧‧矽晶粒
14‧‧‧印刷電路板
16‧‧‧覆晶接頭
18‧‧‧熱散播器
20‧‧‧散熱片
22A‧‧‧第一熱界面材料/第一TIM
22B‧‧‧第二熱界面材料/第二TIM
24‧‧‧氣隙
Claims (7)
- 一種熱界面材料,其包含:1重量%至16重量%的至少一種聚合物基質材料;0.5重量%至8重量%的至少一種相變化材料;0.1重量%至1重量%的至少一種胺或基於胺之交聯劑;及導熱填料,其包括第一複數個平均粒子直徑係約0.1微米至約1微米的氧化鋅粒子及第二複數個平均粒子直徑係約2微米至約12微米的鋁粒子,且其中該等鋁粒子對該等氧化鋅粒子之重量比係自1.25:1至5:1;且其中該至少一種導熱填料佔該熱界面材料總重量之至少80重量%。
- 如請求項1之熱界面材料,其中該胺或基於胺之交聯劑係烷基化三聚氰胺樹脂。
- 如請求項1之熱界面材料,其中按該熱界面材料之總重量計,該熱界面材料包含1重量%至8重量%的該至少一種聚合物基質材料;0.5重量%至5重量%的該至少一種相變化材料;0.1重量%至1重量%的該至少一種胺或基於胺之交聯劑;及91重量%至95重量%的該至少一種導熱填料。
- 如請求項1之熱界面材料,其進一步包含至少一種偶合劑、抗氧化劑、離子清除劑或觸變劑。
- 一種電子組件,其包含: 散熱片;電子晶片;沿豎直方向安置於該散熱片與該電子晶片之間的熱界面材料,該熱界面材料包括:1重量%至16重量%的至少一種聚合物基質材料;0.5重量%至8重量%的至少一種相變化材料;0.1重量%至1重量%的至少一種胺或基於胺之交聯劑;及導熱填料,其包括第一複數個平均直徑係約0.1微米至約1微米的氧化鋅粒子及第二複數個粒子直徑係約2微米至約12微米的鋁粒子,且其中該等鋁粒子對該等氧化鋅粒子之重量比係自1.25:1至5:1;其中該至少一種導熱填料佔該熱界面材料總重量的至少80重量%。
- 如請求項5之電子組件,其中該胺或基於胺之交聯劑係烷基化三聚氰胺樹脂。
- 如請求項5之電子組件,其中按該熱界面材料之總重量計,該熱界面材料包含1重量%至8重量%的該至少一種聚合物基質材料;0.5重量%至5重量%的該至少一種相變化材料;0.1重量%至1重量%的該至少一種胺或基於胺之交聯劑;及91重量%至95重量%的該至少一種導熱填料。
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- 2016-03-08 BR BR112018067991A patent/BR112018067991A2/pt not_active Application Discontinuation
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Publication number | Publication date |
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EP3426746B1 (en) | 2021-07-14 |
EP3426746A1 (en) | 2019-01-16 |
JP2019515968A (ja) | 2019-06-13 |
CN109072051B (zh) | 2023-12-26 |
KR102554661B1 (ko) | 2023-07-13 |
JP6842469B2 (ja) | 2021-03-17 |
TW201803928A (zh) | 2018-02-01 |
US20190085225A1 (en) | 2019-03-21 |
KR20180120248A (ko) | 2018-11-05 |
EP3426746A4 (en) | 2019-10-23 |
MX2018010819A (es) | 2019-01-14 |
BR112018067991A2 (pt) | 2019-01-15 |
CN109072051A (zh) | 2018-12-21 |
US10781349B2 (en) | 2020-09-22 |
WO2017152353A1 (en) | 2017-09-14 |
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