JP6401310B2 - イオンスカベンジャーを有する熱界面材料 - Google Patents
イオンスカベンジャーを有する熱界面材料 Download PDFInfo
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- JP6401310B2 JP6401310B2 JP2016575794A JP2016575794A JP6401310B2 JP 6401310 B2 JP6401310 B2 JP 6401310B2 JP 2016575794 A JP2016575794 A JP 2016575794A JP 2016575794 A JP2016575794 A JP 2016575794A JP 6401310 B2 JP6401310 B2 JP 6401310B2
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Description
[0013]より特定の態様においては、イオンスカベンジャーは、窒素含有錯化剤、リン含有錯化剤、ヒドロキシルカルボン酸ベースの錯化剤、及び上記の組合せからなる群から選択される錯化剤である。他のより特定の態様においては、イオンスカベンジャーは、酸アミド化合物、トリアゾール化合物、テトラゾール化合物、トリアゼン化合物、オキサミド化合物、マロンアミド化合物、及び上記の組合せからなる群から選択される。他のより特定の態様においては、イオンスカベンジャーは酸アミド化合物である。他のより特定の態様においては、イオンスカベンジャーは、デカメチレンジカルボン酸ジサリチロイルヒドラジド;3−(N−サリチロイル)アミノ−1,2,4−トリアゾール;2’,3−ビス[[3−[3,5−ジ−tert−ブチル−4−ヒドロキシルフェニル]プロピオン酸]]プロピオニルヒドラジド、及び上記の組合せからなる群から選択される。
[0015]上記の態様のいずれかのより特定の態様においては、熱界面材料は、熱界面材料の全重量を基準として0.1重量%〜5重量%のイオンスカベンジャーを含む。より特定の態様においては、熱界面材料は、熱界面材料の全重量を基準として0.5重量%〜1重量%のイオンスカベンジャーを含む。
[0019]上記の態様のいずれかのより特定の態様においては、熱界面材料は、熱界面材料の全重量を基準として5重量%〜10重量%の少なくとも1種類のポリマー;50重量%〜95重量%の少なくとも1種類の熱伝導性フィラー;及び0.1重量%〜5重量%のイオンスカベンジャー;を含む。第1の更により特定の態様においては、熱界面材料は、熱界面材料の全重量を基準として2重量%〜5重量%の少なくとも1種類のワックス;0.1〜0.5重量%の少なくとも1種類の酸化防止剤;1重量%〜2重量%の少なくとも1種類のカップリング剤;及び0.5重量%〜0.6重量%の少なくとも1種類の架橋剤;を含み;熱界面材料は熱界面材料の全重量を基準として75重量%〜90重量%の少なくとも1種類の熱伝導性フィラーを含む。第2の更により特定の態様においては、熱界面材料は、熱界面材料の全重量を基準として2重量%〜5重量%の少なくとも1種類のワックス;0.1〜0.5重量%の少なくとも1種類の酸化防止剤;1重量%〜2重量%の少なくとも1種類のカップリング剤;及び0.5重量%〜0.6重量%の少なくとも1種類の架橋剤;を含み;熱界面材料は熱界面材料の全重量を基準として75重量%〜90重量%の少なくとも1種類の熱伝導性フィラーを含む。更なるより特定の態様においては、熱界面材料は、1.5重量%〜2重量%の少なくとも1種類のワックス;0.1〜1重量%の少なくとも1種類の酸化防止剤;及び0.5〜1重量%の少なくとも1種類のカップリング剤;を含み;熱界面材料は熱界面材料の全重量を基準として85重量%〜95重量%の少なくとも1種類の熱伝導性フィラーを含む。他の更により特定の態様においては、熱界面材料は0.1重量%〜1重量%の少なくとも1種類の架橋剤を更に含む。
[0027]本発明は、電子コンポーネントから熱を取り除くのに有用な熱界面材料(TIM)に関する。1つの代表的な態様においては、TIMは、ポリマーマトリクス、少なくとも1種類の熱伝導性フィラー、及び少なくとも1種類のイオンスカベンジャーを含む。
[0029]いかなる理論にも縛られることは望まないが、イオンスカベンジャーを添加することによって、金属イオンで誘発されるフリーラジカルの形成が抑制されると考えられる。イオンスカベンジャーは、金属イオンを錯体内に捕捉及び結合して、金属イオンがもはや空電子軌道を有さず、ポリマー内においてフリーラジカルの形成が開始するのが有効に停止されるようになる。
1.ポリマー:
[0032]TIMは、エラストマーのようなポリマーを含む。幾つかの態様においては、ポリマーは、シリコーンラバー、シロキサンラバー、シロキサンコポリマー、又は他の好適なシリコーン含有ラバーを含む。幾つかの態様においては、ポリマーは1種類以上の炭化水素ラバー化合物、例えば飽和又は不飽和炭化水素ラバー化合物を含む。
[0036]TIMは、1種類以上の熱伝導性フィラーを含む。代表的な熱伝導性フィラーとしては、金属、合金、非金属、金属酸化物、及びセラミクス、並びにこれらの組合せが挙げられる。金属としては、アルミニウム、銅、銀、亜鉛、ニッケル、スズ、インジウム、及び鉛が挙げられるが、これらに限定されない。非金属としては、炭素、グラファイト、カーボンナノチューブ、炭素繊維、グラフェン、及び窒化ケイ素が挙げられるが、これらに限定されない。金属酸化物又はセラミクスとしては、アルミナ、窒化アルミニウム、窒化ホウ素、酸化亜鉛、及び酸化スズが挙げられるが、これらに限定されない。
[0038]TIMは1種類以上のイオンスカベンジャーを含む。代表的なイオンスカベンジャーとしては、窒素含有錯化剤、リン含有錯化剤、及びヒドロキシルカルボン酸ベースの錯化剤が挙げられる。幾つかの代表的な態様においては、イオンスカベンジャーは、ヒドラジド又はジヒドラジドのような酸アミド化合物から選択される。幾つかの代表的な態様においては、イオンスカベンジャーは、トリアゾール化合物、テトラゾール化合物、トリアゼン化合物、オキサミド化合物、又はマロンアミド化合物から選択される。幾つかの代表的な態様においては、イオンスカベンジャーは、デカメチレンジカルボン酸ジサリチロイルヒドラジド;3−(N−サリチロイル)アミノ−1,2,4−トリアゾール;及び2’,3−ビス[[3−[3,5−ジ−tert−ブチル−4−ヒドロキシルフェニル]プロピオン酸]]プロピオニルヒドラジドから選択される。
[0040]TIMには、TIMの全重量を基準として、0.1重量%、0.2重量%、0.5重量%、1重量%程度の少ない量、1.5重量%、2重量%、5重量%、10重量%程度の多い量、或いは上記の値の任意の2つの間で規定される任意の範囲内の量の1種類以上のイオンスカベンジャーを含ませることができる。
[0041]幾つかの代表的な態様においては、TIMは1種類以上のカップリング剤を含む。代表的なカップリング剤としては、チタネートカップリング剤又はジルコネートカップリング剤のような有機金属化合物、及びシランカップリング剤のような有機化合物が挙げられる。代表的なカップリング剤としては、チタンIV−2,2−(ビス−2−プロペノラトメチル)ブタノラト,トリス(ジオクチル)ピロホスファト−O;ジルコニウムIV−2,2−(ビス−2−プロペノラトメチル)ブタノラト,トリス(ジイソオクチル)ピロホスファト−O;1モルのジイソオクチルホスファイトとのチタンIV−2−プロパノラト,トリス(ジオクチル)ピロホスファト−O)付加体;チタンIV−ビス(ジオクチル)ピロホスファト−O,オキソエチレンジオラト,(付加体),ビス(ジオクチル)(水素)ホスファイト−O;チタンIV−ビス(ジオクチル)ピロホスファト−O,エチレンジオラト(付加体),ビス(ジオクチル)ハイドロジェンホスファイト;及びジルコニウムIV−2,2−ビス(2−プロペノラトメチル)ブタノラト,シクロジ[2,2−(ビス−2−プロペノラトメチル)ブタノラト],ピロホスファト−O,O;が挙げられる。
[0043]幾つかの代表的な態様においては、TIMは1種類以上の酸化防止剤を含む。代表的な酸化防止剤としては、フェノールタイプ、アミンタイプの酸化防止剤、又は任意の他の好適なタイプの酸化防止剤、或いはこれらの組合せが挙げられる。フェノール又はアミンタイプの酸化防止剤はまた、立体障害フェノール又はアミンタイプの酸化防止剤であってもよい。代表的なフェノールタイプの酸化防止剤としては、オクタデシル3−(3,5−ジ−(tert)−ブチル−4−ヒドロキシフェニル)プロピオネートが挙げられる。代表的なアミンタイプの酸化防止剤としては、2,6−ジ−tert−ブチル−4−(4,6−ビス(オクチルチオ)−1,3,5−トリアジン−2−イルアミノ)フェノールが挙げられる。代表的な立体障害酸化防止剤としては、立体障害イオウ含有フェノール系酸化防止剤が挙げられる。代表的な酸化防止剤としては、BASFから入手できるIrganox(登録商標)酸化防止剤が挙げられる。
[0046]幾つかの代表的な態様においては、TIMは1種類以上の相変化材料を含む。相変化材料は、その中でTIMが用いられる電子デバイスの一部の運転温度と同じか又はこれよりも低い融点又は融点範囲を有する材料である。代表的な相変化材料はワックスである。他の代表的な相変化材料としては、ウッド合金、フィールド合金のような低融点の合金、或いは約20℃〜90℃の間の融点を有する金属若しくは合金が挙げられる。
[0050]幾つかの代表的な態様においては、TIMは1種類以上の更なる添加剤を含む。代表的な添加剤としては、アルキル化メラミンホルムアルデヒド樹脂のような架橋剤、顔料、及びイソパラフィン系流体のような溶剤が挙げられる。幾つかの代表的な態様においては、TIMには、TIMの全重量を基準として、0.1重量%、0.5重量%、1重量%程度の少ない量、1.5重量%、2重量%、5重量%、10重量%程度の多い量、或いは上記の値の任意の2つの間で規定される任意の範囲内の量の1種類以上の添加剤を含ませることができる。
[0051]第1の非限定的な具体的態様においては、TIMは、約1重量%〜約25重量%のポリマー、約50重量%〜約95重量%の熱伝導性フィラー、及び約0.1重量%〜約5重量%のイオンスカベンジャーを含む。より特定の態様においては、イオンスカベンジャーは、ヒドラジド又はジヒドラジドのような酸アミド化合物である。更により特定の態様においては、イオンスカベンジャーは、デカンジカルボン酸ジエトリチルオイルヒドラジド(decanedicarboxylic acid dietlythyl oylhydrazide);3−(N−サリチロイル)アミノ−1,2,4−トリアゾール;及び2’,3−ビス[[3−[3,5−ジ−tert−ブチル−4−ヒドロキシルフェニル]プロピオン酸]]プロピオニルヒドラジド;から選択される。
[0053]第1又は第2の具体的態様のいずれかのより特定の態様である第3の具体的態様においては、TIMは約0.1重量%〜約5重量%の少なくとも1種類の架橋剤を含む。
[0056]幾つかの代表的な態様においては、イオンスカベンジャーを含む材料である熱界面材料は、イオンスカベンジャーを含ませないで同様に配合される熱界面材料よりも大きい耐分解性を有する。耐分解性は、ASTM−D3859−07(その開示事項はそれらの全部を参照として本明細書中に包含する)などによって定められている酸素誘導時間(OIT)によって特徴付けることができる。より長いOITはより良好な熱安定性を示す。
[0063]幾つかの代表的な態様においては、TIMは、加熱したミキサー内で個々の成分を混合して組成物を一緒にブレンドすることによって製造される。ブレンドした組成物は次に加熱処理することができる。
[0065]再び図1を参照すると、幾つかの代表的な態様においては、TIM18によって示されるように、イオンスカベンジャーを含む熱界面材料を、電子コンポーネント12とヒートスプレッダー14の間にTIM1として配置する。幾つかの代表的な態様においては、TIM20によって示されるように、イオンスカベンジャーを含む熱界面材料を、ヒートスプレッダー14とヒートシンク16の間にTIM2として配置する。幾つかの代表的な態様においては、イオンスカベンジャーを含む熱界面材料を、電子コンポーネント12とヒートシンク16の間にTIM1.5(図示せず)として配置する。
[0080]実施例3を調製するために、12.5部のKratonエラストマー(ヒドロキシル末端エチレンブチレンコポリマー;特殊なモノオール)、1.5部のチタンIV−2−プロパノラト,トリスイソオクタデカノアト−O、及び0.6部のイオンスカベンジャーのSongnox(登録商標)1024を、混合物が実質的に均一な外観を有するまで混合及びブレンドした。71.66部のアルミニウム粉末、及び14.34部の酸化亜鉛粉末を加え、混合物を実質的に均一な外観を有するまで再びブレンドした。
本発明の具体的態様は以下のとおりである。
[1]
少なくとも1種類のポリマー;
少なくとも1種類の熱伝導性フィラー;及び
少なくとも1種類のイオンスカベンジャー;
を含む熱界面材料。
[2]
前記イオンスカベンジャーが、窒素含有錯化剤、リン含有錯化剤、及びヒドロキシルカルボン酸ベースの錯化剤、並びに上記の組合せからなる群から選択される錯化剤である、[1]に記載の熱界面材料。
[3]
前記イオンスカベンジャーが、酸アミド化合物、トリアゾール化合物、テトラゾール化合物、トリアゼン化合物、オキサミド化合物、マロンアミド化合物、及び上記の組合せからなる群から選択される、[1]に記載の熱界面材料。
[4]
前記イオンスカベンジャーが酸アミド化合物である、[1]に記載の熱界面材料。
[5]
前記イオンスカベンジャーが、ヒドラジド、ジヒドラジド、及び上記の組合せからなる群から選択される、[1]に記載の熱界面材料。
[6]
前記イオンスカベンジャーが、デカメチレンジカルボン酸ジサリチロイルヒドラジド;3−(N−サリチロイル)アミノ−1,2,4−トリアゾール;及び2’,3−ビス[[3−[3,5−ジ−tert−ブチル−4−ヒドロキシルフェニル]プロピオン酸]]プロピオニルヒドラジドからなる群から選択される、[1]に記載の熱界面材料。
[7]
前記イオンスカベンジャーが、式I〜式XI:
[8]
前記熱界面材料が、前記熱界面材料の全重量を基準として0.1重量%〜5重量%の前記イオンスカベンジャーを含む、[1]に記載の熱界面材料。
[9]
前記熱界面材料が、前記熱界面材料の全重量を基準として0.5重量%〜1重量%の前記イオンスカベンジャーを含む、[1]に記載の熱界面材料。
[10]
少なくとも1種類の相変化材料を更に含む、[1]に記載の熱界面材料。
[11]
前記少なくとも1種類の相変化材料がワックスである、[10]に記載の熱界面材料。
[12]
少なくとも1種類のカップリング剤を更に含む、[1]に記載の熱界面材料。
[13]
前記少なくとも1種類のカップリング剤が、チタネートカップリング剤、ジルコネートカップリング剤、シランカップリング剤、及び上記の組合せからなる群から選択される、[12]に記載の熱界面材料。
[14]
少なくとも1種類の架橋剤を更に含む、[1]に記載の熱界面材料。
[15]
少なくとも1種類のワックス、少なくとも1種類の酸化防止剤、少なくとも1種類のカップリング剤、及び少なくとも1種類の架橋剤を更に含む、[1]に記載の熱界面材料。
[16]
前記熱界面材料が、前記熱界面材料の全重量を基準として
5重量%〜10重量%の少なくとも1種類のポリマー;
50重量%〜95重量%の少なくとも1種類の熱伝導性フィラー;及び
0.1重量%〜5重量%のイオンスカベンジャー;
を含む、[1]に記載の熱界面材料。
[17]
前記熱界面材料の全重量を基準として
2重量%〜5重量%の少なくとも1種類のワックス;
0.1〜0.5重量%の少なくとも1種類の酸化防止剤;
1重量%〜2重量%の少なくとも1種類のカップリング剤;及び
0.5重量%〜0.6重量%の少なくとも1種類の架橋剤;
を更に含み、
前記熱界面材料は前記熱界面材料の全重量を基準として75重量%〜90重量%の少なくとも1種類の熱伝導性フィラーを含む、[16]に記載の熱界面材料。
[18]
1.5重量%〜2重量%の少なくとも1種類のワックス;
0.1〜1重量%の少なくとも1種類の酸化防止剤;及び
0.5重量%〜1重量%の少なくとも1種類のカップリング剤;
を更に含み、
前記熱界面材料は前記熱界面材料の全重量を基準として85重量%〜95重量%の少なくとも1種類の熱伝導性フィラーを含む、[16]に記載の熱界面材料。
[19]
0.1重量%〜1重量%の少なくとも1種類の架橋剤を更に含む、[18]に記載の熱界面材料。
[20]
電子コンポーネントであって:
ヒートシンク;
電子チップ;
第1の表面層及び第2の表面層を有する熱界面材料であって、前記熱界面材料は前記ヒートシンクと電子チップの間に配置されており、前記熱界面材料は:
少なくとも1種類のポリマー、
少なくとも1種類の熱伝導性フィラー、及び
少なくとも1種類のイオンスカベンジャー
を含む前記熱界面材料;
を含む前記電子コンポーネント。
Claims (11)
- 熱界面材料であって:
前記熱界面材料の全重量を基準として2重量%と10重量%との間の量で存在する少なくとも1種類のエラストマーポリマー;
架橋剤;
少なくとも1種類の熱伝導性フィラー;及び
少なくとも1種類のイオンスカベンジャー;
を含む前記熱界面材料。 - 前記イオンスカベンジャーが、窒素含有錯化剤、リン含有錯化剤、及びヒドロキシルカルボン酸ベースの錯化剤、並びに上記の組合せからなる群から選択される錯化剤である、請求項1に記載の熱界面材料。
- 電子コンポーネントであって:
ヒートシンク;
電子チップ;
第1の表面層及び第2の表面層を有する熱界面材料であって、前記熱界面材料は前記ヒートシンクと電子チップの間に配置されており、前記熱界面材料は:
前記熱界面材料の全重量を基準として2重量%と10重量%との間の量で存在する少なくとも1種類のエラストマーポリマー、
架橋剤;
少なくとも1種類の熱伝導性フィラー、及び
少なくとも1種類のイオンスカベンジャー
を含む前記熱界面材料;
を含む前記電子コンポーネント。 - 前記熱伝導性フィラーが、アルミニウム、銅、銀、亜鉛、ニッケル、スズ、インジウム、及び鉛からなる群から選択される金属を含む、請求項1に記載の熱界面材料。
- 前記熱伝導性フィラーが、炭素、グラファイト、カーボンナノチューブ、炭素繊維、グラフェン、窒化ケイ素、アルミナ、窒化アルミニウム、窒化ホウ素、酸化亜鉛、及び酸化スズから選択される非金属、金属酸化物、又はセラミクスを含む、請求項1に記載の熱界面材料。
- 前記エラストマーポリマーがヒドロキシル末端エチレンブチレンコポリマーである、請求項1に記載の熱界面材料。
- 前記架橋剤がアルキル化メラミンホルムアルデヒド樹脂である、請求項1に記載の熱界面材料。
- 前記熱伝導性フィラーが、前記熱界面材料の全重量を基準として80重量%と95重量%との間の量で存在する、請求項1に記載の熱界面材料。
- 前記エラストマーポリマーがヒドロキシル末端エチレンブチレンコポリマーである、請求項3に記載の電子コンポーネント。
- 前記架橋剤がアルキル化メラミンホルムアルデヒド樹脂である、請求項3に記載の電子コンポーネント。
- 前記熱伝導性フィラーが、前記熱界面材料の全重量を基準として80重量%と95重量%との間の量で存在する、請求項3に記載の電子コンポーネント。
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US10155894B2 (en) | 2018-12-18 |
WO2016004565A1 (en) | 2016-01-14 |
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