EP3426746A1

EP3426746A1 - Phase change material

Info

Publication number: EP3426746A1
Application number: EP16893005.5A
Authority: EP
Inventors: Bright ZHANG; Wei Jun Wang; Ya Qun Liu; Hong Min Huang
Original assignee: Honeywell International Inc
Current assignee: Honeywell International Inc
Priority date: 2016-03-08
Filing date: 2016-03-08
Publication date: 2019-01-16
Anticipated expiration: 2036-03-08
Also published as: CN109072051B; US20190085225A1; KR20180120248A; CN109072051A; JP6842469B2; KR102554661B1; TWI718266B; JP2019515968A; EP3426746A4; EP3426746B1; MX2018010819A; WO2017152353A1; BR112018067991A2; TW201803928A; US10781349B2

Abstract

A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80wt.％ of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

Description

PHASE CHANGE MATERIAL

FIELD OF THE INVENTION

The present disclosure relates generally to thermal interface materials, and more particularly to thermal interface materials including a phase change material.
DESCRIPTION OF RELATED ART
Thermal interface materials are widely used to dissipate heat from electronic components, such as central processing units, video graphics arrays, servers, game consoles, smart phones, LED boards, and the like. Thermal interface materials are typically used to transfer excess heat from the electronic component to a heat spreader, then transfer heat to a heat sink.
Figure 1 schematically illustrates an electronic chip 10, including a silicon die 12, a printed circuit board 14, and a plurality of flip chip joints 16 on the printed circuit board 14. The electronic chip 10 is illustratively connected to a heat spreader 18 and a heat sink 20 by one or more first thermal interface materials (TIM) 22. As illustrated in Figure 1, a first TIM 22A connects the heat sink 20 and heat spreader 18 and a second TIM 22B connects the heat spreader 18 and silicon die 12 of electronic chip 10. One or both of thermal interface materials 22A, 22B may be a thermal interface material as described below.
TIM 22A is designated as a TIM 2 and is positioned between a heat spreader 18 and a heat sink 20, such that a first surface of TIM 22A is in contact with a surface of heat spreader 18 and a second surface of TIM 22A is in contact with a surface of heat sink 20.
TIM 22B is designated as a TIM 1 and is positioned between an electronic chip 10 and a heat spreader 18 such that a first surface of TIM 22B is in contact with a surface of electronic chip 34, such as a surface of silicon die 12, and a second surface of TIM 22B is in contact with a surface of heat spreader 18.
In some embodiments (not shown) , the TIM 22 is designated as a TIM 1.5 and positioned between an electronic chip 10 and a heat sink 20, such that a first surface of TIM 22 is in contact with a surface of electronic chip 10, such as a surface of silicon die 12, and a second surface of TIM 2 is in contact with a surface of heat sink 22.
Thermal interface materials include thermal grease, grease-like materials, elastomer tapes, and phase change materials. Traditional thermal interface materials include components such as gap pads and thermal pads. Exemplary thermal interface materials are disclosed in the following patents and applications: CN 103254647, CN 103254647, JP 0543116, U.S. 6,238,596, U.S. 6,451,422, U.S. 6,500,891, U.S. 6,605,238, U.S. 6,673,434, U.S. 6,706,219, U.S. 6,797,382, U.S. 6,811,725, U.S. 6,874,573, U.S. 7,172,711, U.S. 7,147,367, U.S. 7,244,491, U.S. 7,867,609, U.S. 8,324,313, U.S. 8,586,650, U.S. 2005/0072334, U.S. 2007/0051773, U.S. 2007/0179232, U.S. 2008/0044670, U.S. 2009/0111925, U.S. 2010/0048438, U.S. 2010/0129648, U.S. 2011/0308782, US 2013/0248163, WO 2008/121491, and PCT/CN2014/093138.
Thermal greases and phase change materials have lower thermal resistance than other types of thermal interface materials because of the ability to be spread in very thin layers and provide intimate contact between adjacent surfaces. However, in some situations, the electronic chip 10 and heat sink 20 and/or heat spreader 18 are placed in a vertical orientation, such as shown in Figure 2. In such a vertical orientation, an air gap 24 is positioned directly below TIM 22A and/or TIM 22B such that the TIM is not supported at a lower end. At higher temperatures the thermal interface materials, such as TIM 22A, 22B, may drip out of the interface through air gap 24 and on to other parts of the electronic component.
Improvements in the foregoing are desired.
SUMMARY OF THE INVENTION
The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface materials illustratively include at least one phase change material, at least one polymer matrix material, one or more thermally conductive fillers, and at least one crosslinker, wherein the thermally conductive filler comprises at least 80 wt. ％of the total weight of the thermal interface material, and the thermally conductive filler includes a first plurality of particles having a particle diameter less than 1 micron. In a more particular embodiment, the thermally conductive filler comprises at least 90 wt. ％, 91 wt. ％, 92 wt. ％, 93 wt. ％, or 95 wt. ％of the total weight of the thermal interface material.
In one more particular embodiment of any of the above embodiments, the thermal interface material comprises 1 wt. ％to 16 wt. ％of at least one polymer matrix material； 0.5 wt. ％to 8 wt. ％of at least one phase change material； and 0.1 wt. ％to 1 wt. ％of at least one amine or amine-based crosslinker. In a more particular embodiment, the thermal interface material comprises 1 wt. ％to 8 wt. ％of at least one polymer matrix material； 0.5 wt. ％to 5 wt. ％of at least one phase change material； and 0.1 wt. ％to 1 wt. ％of at least one amine or amine-based crosslinker.
In one more particular embodiment of any of the above embodiments, the first plurality of particles comprises particles of zinc oxide. In an even more particular embodiment, the particles of zinc oxide have a diameter of 0.1 microns to about 1 micron. In another more particular embodiment, the particles of zinc oxide have a diameter of 0.9 micron or less.
In one more particular embodiment of any of the above embodiments, the thermally conductive filler further includes a second plurality of particles having a particle diameter greater than 1 micron. In an even more particular embodiment, the second plurality of particles comprises particles of aluminum. In a still more particular embodiment, the second plurality of particles comprises aluminum particles having a diameter of from about 3 microns to about 15 microns. In a yet still more particular embodiment, the second plurality of particles comprises a first portion of aluminum particles having a diameter of about 3 microns and a second portion of aluminum particles having a diameter about 10 microns.
In one more particular embodiment of any of the above embodiments, the crosslinker is an amine or amine-based crosslinker.
In one more particular embodiment of any of the above embodiments, the thermally conductive filler comprises from 91 wt. ％to 95 wt. ％of the total weight of the thermal interface material. In an even more particular embodiment, the thermally conductive filler comprises from 92 wt. ％to 94 wt. ％of the total weight of the thermal interface material.
In one more particular embodiment of any of the above embodiments, the thermal interface material further includes at least one coupling agent, such as a titanate coupling agent. In another more particular embodiment of any of the above embodiments, the thermal interface material further includes at least one antioxidant. In another more particular embodiment of any of the above embodiments, the thermal interface material further includes at least one ion scavenger. In another more particular embodiment of any of the above embodiments, the thermal interface material further includes at least one thixotropic agent.
In another embodiment, a formulation for forming a thermal interface material is provided. The formulation includes a solvent, at least one phase change material, at least one polymer matrix material, one or more thermally conductive filler, and at least one crosslinker, wherein the thermally conductive filler comprises at least 80 wt. ％of the dry weight (solvent-free weight) of the thermal interface material, and the thermally conductive filler includes a first plurality of particles having a particle diameter less than 1 micron.
In another embodiment, an electronic component is provided. The electronic component includes a heat sink, an electronic chip, and a thermal interface material positioned between the heat sink and electronic chip, the thermal interface material including: at least one phase change material, at least one polymer matrix material, one or more thermally conductive filler, and at least one crosslinker, wherein the thermally conductive filler comprises at least 91 wt. ％of the total weight of the thermal interface material, and the thermally conductive filler includes a first plurality of particles having a particle diameter less than 1 micron. The electronic chip and heat sink are positioned in a vertical orientation, and the thermal interface material is positioned in a vertical orientation between the vertically orientated electronic chip and heat sink.
In a more particular embodiment, a first surface of the thermal interface material is in contact with a surface of the electronic chip and a second surface of the thermal interface material is in contact with the heat sink. In another more particular embodiment, the electronic component includes a heat spreader positioned between the heat sink and the electronic chip, wherein a first surface of the thermal interface material is in contact with a surface of the electronic chip and a second surface of the thermal interface material is in contact with the heat spreader. In still yet another more particular embodiment, the electronic component includes a heat spreader positioned between the heat sink and the electronic chip, wherein a first surface of the thermal interface material is in contact with a surface of the heat spreader and a second surface of the thermal interface material is in contact with the heat sink.

BRIEF DESCRIPTION OF THE DRAWINGS

The above-mentioned and other features and advantages of this disclosure, and the manner of attaining them, will become more apparent and the invention itself will be better understood by reference to the following description of embodiments of the invention taken in conjunction with the accompanying drawings, wherein:
FIG. 1 schematically illustrates an electronic chip, a heat spreader, a heat sink, and first and second thermal interface materials.
FIG. 2 schematically illustrates an electronic chip, a heat spreader, a heat sink, and first and second thermal interface materials of FIG. 1 in a vertical orientation.
Corresponding reference characters indicate corresponding parts throughout the several views. The exemplifications set out herein illustrate exemplary embodiments of the invention and such exemplifications are not to be construed as limiting the scope of the invention in any manner.

DETAILED DESCRIPTION

The present invention relates to thermal interface materials useful in transferring heat away from electronic components.
A. Thermal Interface Material
In one exemplary embodiment, the TIM 22 is a thermal interface material. In some exemplary embodiments, TIM 22 comprises one or more phase change materials, one or more polymer matrix materials, one or more thermally conductive fillers, one or more crosslinkers, and, optionally, one or more additives.
a. Thermally conductive filler
In some exemplary embodiments, the TIM 22 includes at least one thermally conductive filler.
Exemplary thermally conductive fillers include metals, alloys, nonmetals, metal oxides, metal nitrides and ceramics, and combinations thereof. Exemplary metals include but are not limited to aluminum, copper, silver, zinc, nickel, tin, indium, lead, silver coated metals such as silver coated copper or silver coated aluminum, metal coated carbon fibers, and nickel coated fibers. Exemplary nonmetals include but are not limited to carbon, carbon black, graphite, carbon nanotubes, carbon fibers, graphene, powdered diamond, glass, silica, silicon nitride, and boron coated particles. Exemplary metal oxides, metal nitrides and ceramics include but are not limited to alumina, aluminum nitride, boron nitride, zinc oxide, and tin oxide.
The TIM 22 may comprise one or more thermally conductive fillers in a total amount as little as 80 wt. ％, 85 wt. ％, 90 wt. ％, 91 wt. ％, 91.5 wt. ％, 92 wt. ％, 92.5 wt. ％, 93 wt. ％as great as 93.5 wt. ％, 94 wt. ％, 95 wt. ％, 96 wt. ％, 97 wt. ％, 98 wt. ％, 99 wt. ％, or within any range defined between any two of the foregoing values, based on the total weight of the TIM 22, such as 80 wt. ％to 99 wt. ％, 91 wt. ％to 99 wt. ％, 91 wt. ％to 95 wt. ％, or 92 wt. ％to 94 wt. ％.
The thermally conductive fillers may be provided as particles. Average particle diameter (D50) is commonly used to measure particle size. Illustrative particles have average particle diameters as little as 10 nm, 20 nm, 50 nm, 0.1 microns, 0.2 microns, 0.5 microns, 1 micron, 2 microns, 3 microns, as great as 5 microns, 8 microns, 10 microns, 12 microns, 15 microns 20 microns, 25 microns, 50 microns, 100 microns, or within any range defined between any two of the foregoing values, such as 10 nm to 100 microns, 0.1 microns to 20 microns, or 0.5 microns to 12 microns.
In one embodiment, a first thermally conductive filler has a particle diameter as little as 1 micron, 0.9 microns, 0.8 microns, 0.6 microns, 0.5 microns, 0.2 microns, 0.1 microns, or less, or within any range defined between any two of the foregoing values, such as 1 micron to 0.1 microns, 1 micron to 0.2 microns, or 1 micron to 0.8 microns. In a more particular embodiment, the first thermally conductive filler includes a plurality of zinc oxide particles having a diameter of 1 micron or less.
In one embodiment, a second thermally conductive filler provided with the first thermally conductive filler has a particle diameter as little as 1 micron, 2 microns, 3 microns, 4 microns, as great as 6 microns, 8 microns, 10 microns, or 12 microns, or within any range defined between any two of the foregoing values, such as 1 micron to 12 microns, 3 microns to 10 microns, 2 microns to 4 microns, or 8 microns to 12 microns. In a more particular embodiment, the second thermally conductive filler is comprised of particles having a mixture of particle sizes greater than 1 micron, including particles having a diameter as little as 2 microns, 3 microns, 4 microns, as great as 6 microns, 8 microns, 10 microns, or 12 microns, or mixtures thereof. In a more particular embodiment, the first thermally conductive filler includes a plurality of aluminum particles having a diameter greater than 1 micron.
In a more particular embodiment, the second thermally conductive filler includes a plurality of particles having a diameter greater than 1 micron, the first thermally conductive filler includes a plurality of particles having a diameter of 1 micron or less, and a weight ratio of the second thermally conductive filler to the first thermally conductive filler is as little as 0.5: 1, 1: 1, 1.25: 1, 1.5: 1, 2: 1, 2.5: 1, as great as 2.75: 1, 3: 1, 5: 1, 10: 1, 20: 1, or within any range defined between any two of the foregoing values, such as 0.5: 1 to 20: 1, 1: 1 to 10: 1, 1.25: 1 to 5: 1, or 2.5: 1 to 3: 1.
In a more particular embodiment, the thermally conductive filler includes a plurality of aluminum particles having a particle diameter as little as 1 micron, 2 microns, 3 microns, as great as 5 microns, 8 microns, 10 microns, 12 microns, 15 microns, or within any range defined between any two of the foregoing values, such as 1 micron to 15 microns or 2 microns to 12 microns, or 3 microns to 10 microns and a plurality of zinc oxide particles having a particle diameter of one micron or less.
b. Polymer matrix material
In some exemplary embodiments, the TIM 22 comprises a polymer matrix material. In some exemplary embodiments, the polymer matrix material provides a matrix for incorporating the thermally conductive fillers, and provides flowability when pressed under heat and pressure.
In one exemplary embodiment, the polymer matrix material comprises a hydrocarbon rubber compound or a blend of rubber compounds. Exemplary materials include saturated and unsaturated rubber compounds. In some embodiments, saturated rubbers may be less sensitive to thermal oxidation degradation than unsaturated rubber compounds. Exemplary saturated rubber compounds include ethylene-propylene rubbers (EPR, EPDM) , polyethylene/butylene, polyethylene-butylene-styrene, polyethylene-propylene-styrene, hydrogenated polyalkyldiene “mono-ols” (such as hydrogenated polybutadiene mono-ol, hydrogenated polypropadiene mono-ol, hydrogenated polypentadiene mono-ol) , hydrogenated polyalkyldiene “diols” (such as hydrogenated polybutadiene diol, hydrogenated polypropadiene diol, hydrogenated polypentadiene diol) and hydrogenated polyisoprene, polyolefin elastomer, or any other suitable saturated rubber, or blends thereof. In one embodiment, the polymer matrix material is a hydrogenated polybutadiene mono-ol, which may also be referred to as a hydroxyl-terminated ethylene butylene copolymer, specialty mono-ol.
In one exemplary embodiment, the polymeric matrix material comprises a silicone rubber, a siloxane rubber, a siloxane copolymer or any other suitable silicone-containing rubber.
In some exemplary embodiments, the TIM 22 may comprise the polymer matrix material in an amount as little as 0.5 wt. ％, 1 wt. ％, 2 wt. ％, 3 wt. ％, 4 wt. ％as great as 5 wt. ％, 6 wt. ％, 7 wt. ％, 8 wt. ％, 10 wt. ％, 12 wt. ％, 16 wt. ％or within any range defined between any two of the foregoing values, based on the total weight of the TIM 22, such as 1 wt. ％to 16 wt. ％, 1 wt. ％to 8 wt. ％, or 4 wt. ％to 6 wt. ％.
c. Phase change material
In some exemplary embodiments, the TIM 22 comprises one or more phase change materials. A phase change material is a material having a melting point or melting point range at or below the operating temperature of a portion of an electronic device in which the TIM 22 is to be used. An exemplary phase change material is a wax, such as paraffin wax. Paraffin waxes are a mixture of solid hydrocarbons having the general formula C_nH_2n+2 and having melting points in the range of about 20℃ to 100℃. Polymer waxes include polyethylene waxes and polypropylene waxes, and typically have a range of melting points from about 40℃. to 160℃. Other exemplary phase change materials include low melting alloys, such as Wood’s metal, Field’s metal, or a metal or alloy having a melting point between about 20℃ and 90℃.
In some embodiments, the amount of phase change material can be used to adjust the hardness of the TIM 22. For example, in some embodiments wherein the loading of the phase change material is low, the composition may be in the form of a soft gel, and in some embodiments wherein the loading of the phase change material is high, the composition may be a hard solid. The TIM 22 may comprise the one or more phase change materials in an amount in an amount as little as 0.1 wt. ％, 0.2 wt. ％, 0.5 wt. ％, 1 wt. ％, 2 wt. ％, as great as 3 wt. ％, 3.5 wt. ％, 4 wt. ％, 5 wt. ％, 7 wt. ％, 8 wt. ％, 10 wt. ％, 12 wt. ％, or within any range defined between any two of the foregoing values, based on the total weight of the TIM 22, such as 0.1 wt. ％to 10 wt. ％, 0.5 wt. ％wt. ％to 8 wt. ％, or 0.5 wt. ％to 5 wt. ％.
d. Coupling agent
In some exemplary embodiments, the TIM 22 comprises one or more coupling agents. In some exemplary embodiments, inclusion of a coupling agent may improve thermal properties, such as properties at relatively high temperatures by providing an interface between the polymer matrix and the thermally conductive filler. Exemplary coupling agents include titanate coupling agents, such as those disclosed in US Patent Application Publication 2011/0308782, the disclosure of which is hereby incorporated by reference in its entirety. Exemplary coupling agents include:
titanium IV 2, 2 (bis 2-propenolatomethyl) butanolato, tris (dioctyl) pyrophosphato-O；
zirconium IV 2, 2 (bis 2-propenolatomethyl) butanolato, tris (diisooctyl) pyrophosphato-O:
titanium IV 2-propanolato, tris (dioctyl) -pyrophosphato-O) adduct with 1 mole of diisooctyl phosphite:
titanium IV bis (dioctyl) pyrophosphato-O, oxoethylenediolato, (Adduct) , bis (dioctyl) (hydrogen) phosphite-O:
titanium IV bis (dioctyl) pyrophosphato-O, ethylenediolato (adduct) , bis (dioctyl) hydrogen phosphite；
and zirconium IV 2, 2-bis (2-propenolatomethyl) butanolato, cyclo di [2, 2-(bis 2-propenolatomethyl) butanolato] , pyrophosphato-O, O:
In one exemplary embodiment, the coupling agent is titanium IV 2, 2 (bis 2-propenolatomethyl) butanolato, tris (dioctyl) pyrophosphato-O.
In some exemplary embodiments, the TIM 22 may comprise the one or more coupling agents in an amount as little as 0.1 wt. ％, 0.2 wt. ％, 0.3 wt. ％, 0.5 wt. ％, as great as 1 wt. ％, 2 wt. ％, 3 wt. ％, 5 wt. ％, or within any range defined between any two of the foregoing values, based on the total weight of the TIM 22, such as 0.1 wt. ％to 5 wt. ％, 0.2 wt. ％to 2 wt. ％, or 0.2 wt. ％to 1 wt. ％.
e. Crosslinkers
In some exemplary embodiments, the TIM 22 comprises one or more crosslinkers, such as amine or amine-based resins. Crosslinkers are added or incorporated into the thermal interface material composition to facilitate a crosslinking reaction between the crosslinker and the primary or terminal hydroxyl groups on at least one of the polymer matrix materials. Exemplary crosslinkers are disclosed in U.S. Patent No. 7,244,491, the disclosure of which is hereby incorporated by reference in its entirety.
In one exemplary embodiment, the crosslinker is an amine or amine-based resin that comprises at least one amine substituent group on any part of the resin backbone. Exemplary amine and amine-based resins include alkylated melamine resins and synthetic resins derived from the reaction of urea, thiourea, melamine or allied compounds with aldehydes, particularly formaldehyde. In a more particular embodiment, the crosslinker is a resin selected from the group consisting of primary amine resins, secondary amine resins, tertiary amine resins, glycidyl amine epoxy resins, alkoxybenzyl amine resins, epoxy amine resins, melamine resins, alkylated melamine resins, and melamine-acrylic resins.
In one exemplary embodiment, the crosslinker is a melamine resin, such as an alkylated melamine resin, or even more particularly a butylated melamine resin. Melamine resins are ring-based compounds, whereby the ring contains three carbon and three nitrogen atoms. Melamine resins typically combine easily with other compounds and molecules through condensation reactions. Melamine resins typically can react with other molecules and compounds to facilitate chain growth and crosslinking, are more water resistant and heat resistant than urea resins, can be used as water-soluble syrups or as insoluble powders dispersible in water, and have high melting points (greater than 325℃) and are relatively non-flammable) . Alkylated melamine resins, such as butylated melamine resins, are formed by incorporating alkyl alcohols during the resin formation. They are soluble in paint and enamel solvents and in surface coatings.
In some exemplary embodiments, the TIM 22 may comprise the one or more crosslinkers in an amount as little as 0.1 wt. ％, 0.2 wt. ％, 0.3 wt. ％, 0.5 wt. ％, as great as 1 wt. ％, 2 wt. ％, 3 wt. ％, 5 wt. ％, or within any range defined between any two of the foregoing values, based on the total weight of the TIM 22, such as 0.1 wt. ％to 5 wt. ％, 0.2 wt. ％to 2 wt. ％, or 0.2 wt. ％to 1 wt. ％.
f. Additives
In some exemplary embodiments, the TIM 22 comprises one or more additives. Exemplary additives include antioxidants, ion scavengers, and thixotropic agents.
In one exemplary embodiment, an antioxidant inhibits thermal degradation of the polymer matrix by transferring elections of a free radical to an oxidizing agent. Exemplary antioxidants include phenolic-type antioxidants, amine-type antioxidants, or any other suitable type of antioxidant or combinations thereof, such as a sterically hindered phenol or amine type antioxidant. Exemplary antioxidants include phenol type antioxidants such as1076, or octadecyl 3-(3, 5-di- (tert) -butyl-4-hydroxyphenyl) propionate； amine type antioxidants such as 565, or 2, 6-di-tert-butyl-4- (4, 6-bis (octylthio) -1, 3, 5-triazin-2-ylamino) phenol, and sulfur containing phenolic antioxidants, such as a sterically hindered sulfur containing phenolic antioxidant. Other exemplary antioxidants include:
1010:
Irgafos
and802:
In some exemplary embodiments, the TIM 22 may comprise the one or more antioxidants in an amount as little as 0.05 wt. ％, 0.1 wt. ％, 0.2 wt. ％, 0.5 wt. ％, as great as 1 wt. ％1.5 wt. ％, 2 wt. ％, 5 wt. ％, or within any range defined between any two of the foregoing values, based on the total weight of the TIM, such as 0.05 wt. ％to 5 wt. ％, 0.1 wt. ％to 2 wt. ％, or 0.1 wt. ％to 1 wt. ％.
In one exemplary embodiment, an ion scavenger inhibits thermal degradation of the polymer matrix by capturing and binding metal ions such that they cannot initiate the formation of free radicals in the polymer. Exemplary ion scavengers are disclosed in PCT application number PCT/CN2014/081724, the disclosure of which is hereby incorporated by reference in its entirety. Exemplary ion scavengers include:
N-salicylidene-N'salicyloyl hydrazide:
oxalyl bis (benzylidenehydrazide) :
N, N'-bis (salicyloyl) hydrazine:
3- (N-salicyloyl) amino-1, 2, 4-triazole:
2, 2'-oxamido bis [ethyl 3- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate]
N, N'-bis (salicylidene) ethylenediamine:
2', 3-bis [ [3- [3, 5-di-tert-butyl-4-hydroxyphenyl] propionic] ] propionyl hydrazide:
Oxanilide:
Methylmalonic acid dianilide:
N-formyl-N'-salicyloyl hydrazine:
Decamethylenedicarboxylic acid disalicyloylhydrazide:
and Bis (2, 6-di-ter-butyl-4-methylphenyl) pentaerythritol-diphosphite:
In some exemplary embodiments, the TIM 22 may comprise the one or more ion scavengers in an amount as little as 0.05 wt. ％, 0.1 wt. ％, 0.2 wt. ％, 0.5 wt. ％, as great as 0.6 wt. ％, 1 wt. ％1.5 wt. ％, 2 wt. ％, 5 wt. ％, or within any range defined between any two of the foregoing values, based on the total weight of the TIM, such as 0.05 wt. ％to 5 wt. ％, 0.1 wt. ％to 1 wt. ％, or 0.1 wt. ％to 0.6 wt. ％.
Exemplary thixotropic agents include fumed silica and cellulose. In some exemplary embodiments, the TIM 22 may comprise the one or more thixotropic agents in an amount as little as 0.1 wt. ％, 0.2 wt. ％, 0.3 wt. ％, 0.5 wt. ％, as great as 1 wt. ％, 2 wt. ％, 3 wt. ％, 5 wt. ％, or within any range defined between any two of the foregoing values, based on the total weight of the TIM 22, such as 0.1 wt. ％to 5 wt. ％, 0.2 wt. ％to 2 wt. ％, or 0.2 wt. ％to 1 wt. ％.
B. Methods of forming a Thermal Interface Material
In some embodiments, the TIM 22 is formed from a dispensable formulation including one or more polymer matrix materials, one or more phase change materials, two or more thermally conductive fillers, one or more solvents, and, optionally, one or more additives.
Exemplary solvents are described in U.S. Patent Application Publication 2007/0517733, the disclosure of which is hereby incorporated by reference herein in its entirety. Suitable solvents include pure solvents or mixtures of organic or inorganic solvents that are volatilized at a desired temperature, such as the critical temperature, or that can facilitate any of the above-mentioned design goals or needs, and that are compatible with the phase change materials, in that they will interact with the phase change materials to achieve the previously-mentioned goals. In some embodiments, the solvent, solvent mixture or combination thereof will solvate the phase change material such that it can be applied by printing techniques. In some exemplary embodiments, the solvent or mixture of two or more solvents are selected from the hydrocarbon family of solvents. Hydrocarbon solvents comprise carbon and hydrogen. A majority of hydrocarbon solvents are non-polar； however, there are a few hydrocarbon solvents that are considered polar.
Hydrocarbon solvents are generally classified into three classes: aliphatic, cyclic and aromatic. Aliphatic hydrocarbon solvents comprise both straight-chain compounds and compounds that are branched and possibly crosslinked, however, aliphatic hydrocarbon solvents are not typically considered cyclic. Cyclic hydrocarbon solvents are those solvents that comprise at least three carbon atoms oriented in a ring structure with properties similar to aliphatic hydrocarbon solvents. Aromatic hydrocarbon solvents are those solvents that comprise generally three or more unsaturated bonds with a single ring or multiple rings attached by a common bond and/or multiple rings fused together. In some exemplary embodiments, the solvent or mixture of two or more solvents are selected from solvents that are not considered part of the hydrocarbon solvent family of compounds, such as ketones, alcohols, esters, ethers and amines. In yet other contemplated embodiments, the solvent or solvent mixture may comprise a combination of any of the solvents mentioned herein.
Exemplary hydrocarbon solvents include toluene, xylene, p-xylene, m-xylene, mesitylene, solvent naphtha H, solvent naphtha A, Isopar H and other paraffin oils and isoparaffinic fluids, alkanes, such as pentane, hexane, isohexane, heptane, nonane, octane, dodecane, 2-methylbutane, hexadecane, tridecane, pentadecane, cyclopentane, 2, 2, 4-trimethylpentane, petroleum ethers, halogenated hydrocarbons, such as chlorinated hydrocarbons, nitrated hydrocarbons, benzene, 1, 2-dimethylbenzene, 1, 2, 4-trimethylbenzene, mineral spirits, kerosene, isobutylbenzene, methylnaphthalene, ethyltoluene, ligroine. Exemplary ketone solvents include acetone, diethyl ketone, methyl ethyl ketone and the like.
In one exemplary embodiment, the solvent includes one or more solvents selected from: pentane, hexane, heptane, cyclohexane, paraffin oils, isoparaffinic fluids, benzene, toluene, xylene and mixtures or combinations thereof.
In some exemplary embodiments, the formulation may comprise the one or more solvents in an amount as little as 0.1 wt. ％, 0.5 wt. ％, 1 wt. ％as great as 5 wt. ％, 10 wt. ％, 20 wt. ％, or within any range defined between any two of the foregoing values, based on the total weight of the formulation.
In some exemplary embodiments, a method of forming a TIM 22 is provided. In some exemplary embodiments, forming the TIM 22 includes processes such as baking and drying the TIM 22.
In some exemplary embodiments, baking the TIM 22 include baking at a temperature as low as 25℃, 50℃, 75℃, 80℃, as high as 100℃, 125℃, 150℃, 170℃, or within any range defined between any two of the foregoing values. In some exemplary embodiments, the TIM 22 is baked for as little as 0.5 minutes, 1 minute, 30 minutes, 1 hour, 2 hours, as long as 8 hours, 12 hours, 24 hours, 36, hours, 48 hours, or within any range defined between any two of the foregoing values.
C. Thermal Interface Material Properties
In some exemplary embodiments, the TIM 22 has a thermal impedance as little as 0.05℃·cm²/W, 0.06℃·cm²/W, 0.07℃·cm²/W, as high as 0.08℃·cm²/W, 0.09℃·cm²/W, 0.1℃·cm²/W, 0.12℃·cm²/W, or within any range defined between any two of the foregoing values, such as 0.05℃·cm²/W to 0.12℃·cm²/W, 0.06℃·cm²/W to 0.1℃·cm²/W, or 0.06℃·cm²/W to 0.08℃·cm²/W.
In some exemplary embodiments, the TIM 22 has a thermal impedance following conditioning at a temperature of 130℃ and a relative humidity of 85％for 96 hours that is no more than 20％greater, no more than 10％greater, no more than 5％greater, or no more than the thermal impedance of the TIM 22 prior to said conditioning.
In some exemplary embodiments, the TIM 22 has a thermal impedance following conditioning at a temperature of 150℃ for 1000 hours that is no more than 20％greater, no more than 10％greater, no more than 5％greater, or no more than the thermal impedance of the TIM 22 prior to said conditioning.
The final thickness of the applied TIM, following application between the heat generating and heat dissipating components, is referred to as the bond line thickness (BLT) . The value of the BLT is determined, in part, by the flowability of the TIM when being heated by the heat generating component. Phase change materials (PCM) include a wax or other material to be increase the flowability of the TIM when heated by the heat generating component, which in turn reduced the BLT. BLT is related to thermal impedance (TI) and thermal conductivity (TC) by the formula TI＝BLT/TC, such that lower BLT results in lower thermal impedance at the same thermal conductivity. Without wishing to be bound by any particular theory, it is believed that including multiple sizes of thermally conductive fillers allows smaller particle sizes to fill gaps present between larger particle sizes, increasing the flowability of the TIM and reducing the BLT. TIM formulations having low BLT tend to have low thermal impedance.
In some embodiments, when subjected to a pressure of 40 psi and heated to 80℃, the TIM 22 has a bond line thickness as great as 80 microns, 70 microns, 60 microns, 50 microns, 40 microns, as little as 30 microns, 25 microns, 20 microns, 15 microns, 10 microns, 5 microns, or less, or within any range defined between any two of the foregoing values, such as from 80 microns to 5 microns, from 60 microns to 10 microns, or from 30 to 20 microns.
In some embodiments, the TIM 22 resists dripping at elevated temperature. In one exemplary dripping test, aTIM 22 composition is applied at a thickness of about 0.6 mm between two metal bars and subjected to about 30 psi of pressure. The TIM 22 interface between the metal is positioned vertically and subjected to 120℃ temperature for two days. Any TIM 22 material dripping from the interface during the two days indicates a failed baking test. The sample is then cycled 90 times between-55℃ and 125℃. Any TIM 22 material dripping from the interface during the cycling indicates a failed cycling test.
EXAMPLES
Examples were prepared according to the compositions indicated in Table 1. As shown in Table 1, Example 1 included a melamine resin crosslinker and about 91.9 wt. ％total thermally conductive filler comprised of aluminum particles having a diameter greater than 1 micron and zinc oxide particles having a diameter less than 1 micron. Comparative Example 1 lacked the melamine resin crosslinker, included only about 90.8 wt. ％total thermally conductive filler, and did not include any particles having a diameter less than 1 micron. Comparative Example 2 included the melamine resin crosslinker, but had only about 89.8 wt. ％total thermally conductive filler, and did not include any particles having a diameter less than 1 micron. Comparative Example 3 lacked the melamine resin crosslinker, but included about 93.0 wt. ％total thermally conductive filler comprised of aluminum particles having a diameter greater than 1 micron and zinc oxide particles having a diameter less than 1 micron.
Table 1: Example compositions
Each TIM was sandwiched between two metal plates oriented with the interface in the vertical direction and subjected to 30 psi. The original thickness for each sample was about 0.6 mm, as shown in Table 2.
Each sample was subjected a baking test of 120℃ temperature for two days. Any TIM material dripping from the interface during the two days indicates a failed baking test. Each sample was then subjected to a Thermal Cycling test of 90 temperature cycles from-55℃ to 125℃ over two and a half days. Any TIM material dripping from the interface during the cycling indicates a failed Thermal cycling test.
Table 2: Drip test results

	Original thickness (mm)	Baking result	Thermal cycling result
Comp. Ex. 1	0.568	Fail	Fail
Comp. Ex. 2	0.56	Fail	Fail
Comp. Ex. 3	0.634	Pass	Fail
Example 1	0.6	Pass	Pass

As shown in Table 2, only Example 1, which included a submicron thermally conductive filler and a crosslinker, passed both the baking test and the Thermal Cycling temperature cycling test. Comparative Examples 1 and 2, which included the crosslinker but lacked the submicron filler, failed both the baking result test and the Thermal Cycling cycling test. Comparative Example 3, which included the submicron filler but lacked the crosslinker, passed the baking test, but failed the Thermal Cycling cycling test. Example 1 had better anti-drip properties than any of the comparative examples.
Each TIM was then subjected to a thermal reliability test. Each sample was sandwiched in a mold at 90 degrees C for 1 hour, and the original thermal impedance and thickness (bond line thickness) were measured. For Comparative Example 1, Comparative Example 2, and Ex. 1, the first two samples of each material were pressed with 35 psi, while the third sample was baked without pressure. For Comparative Example 3, no pressure was applied to any of the three samples.
Each sample was baked at 260℃ for 10 minutes, after which time the samples were cleaned and thermal impedance retested. For Ex. 1, samples were also backed for 20 minutes, after which time they were cleaned and the thermal impedance retested. A smaller change in the thermal impedance following baking is desirable.
Table 2: Thermal reliability results
As shown in Table 3, only Example 1, which included a submicron thermally conductive filler and a crosslinker, provided good results in both the pressed (35 psi) and unpressed (0 psi) results. The thermal impedance of Example 1 was shown to be relatively constant even after 20 minutes at 26℃. Comparative Examples 1 and 2, which included the crosslinker but lacked the submicron filler, showed increases in thermal impendence for the pressed (35 psi) , and substantial increases in thermal impedance for the unpressed (0 psi) . Comparative Example 3, which included the submicron filler but lacked the crosslinker, showed a substantial increase in thermal impedance for the unpressed (0 psi) . Accordingly, Example 1 provided better reliability than any of the comparative examples.
While this invention has been described as having exemplary designs, the present invention can be further modified within the spirit and scope of this disclosure. This application is therefore intended to cover any variations, uses, or adaptations of the invention using its general principles. Further, this application is intended to cover such departures from the present disclosure as come within known or customary practice in the art to which this invention pertains and which fall within the limits of the appended claims.

Claims

A thermal interface material comprising:

1 wt.％ to 16 wt.％ of at least one polymer matrix material；

0.5 wt.％ to 8 wt.％ of at least one phase change material；

0.1 wt.％ to 1 wt.％ of at least one amine or amine-based crosslinker； and

at least one thermally conductive filler including a first plurality of particles having a particle diameter of about 1 micron or less； wherein the at least one thermally conductive filler comprises at 80 wt.％ of the total weight of the thermal interface material.
The thermal interface material of claim 1, wherein the first plurality of particles comprises particles of zinc oxide having a diameter of about 0.1 microns to about 1 micron.
The thermal interface material of claim 1, wherein the at least one thermally conductive filler comprises a second plurality of particles having a particle diameter of about 1 micron or more.
The thermal interface material of claim 3, wherein the second plurality of particles comprises particles of aluminum having a particle diameter of about 2 microns to about 12 microns.
The thermal interface material of claim 1, wherein the amine or amine-based crosslinker is an alkylated melamine resin.
The thermal interface material of claim 1, wherein the thermal interface material comprises 1 wt.％ to 8 wt.％ of the at least one polymer matrix material； 0.5 wt.％ to 5 wt.％ of the at least one phase change material； 0.1 wt.％ to 1 wt.％ of the at least one amine or amine-based crosslinker； and 91 wt.％ to 95 wt.％ of the at least one thermally conductive filler, based on the total weight of the thermal interface material.
The thermal interface material of claim 1, further comprising at least one coupling agent, antioxidant, ion scavenger, or thixotropic agent.
An electronic component comprising:

a heat sink；

an electronic chip；

a thermal interface material positioned between the heat sink and electronic chip in a vertical orientation, the thermal interface material including:

1 wt.％ to 16 wt.％ of at least one polymer matrix material；

0.5 wt.％ to 8 wt.％ of at least one phase change material；

0.1 wt.％ to 1 wt.％ of at least one amine or amine-based crosslinker； and

at least one thermally conductive filler including a plurality of zinc oxide particles having a diameter of about 0.1 microns to about 1 micron particles and a plurality of aluminum particles having a particle diameter of about 2 microns to about 12； wherein the at least one thermally conductive filler comprises at least 80 wt.％ of the total weight of the thermal interface material.
The electronic component of claim 8, wherein the amine or amine-based crosslinker is an alkylated melamine resin.
The electronic component of claim 8, wherein the at least one thermally conductive filler comprises 1 wt.％ to 8 wt.％ of the at least one polymer matrix material； 0.5 wt.％ to 5 wt.％ of the at least one phase change material； 0.1 wt.％ to 1 wt.％ of the at least one amine or amine-based crosslinker； and 91 wt.％ to 95 wt.％ of the at least one thermally conductive filler, based on the total weight of the thermal interface material.