CN103756631B - Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant - Google Patents

Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant Download PDF

Info

Publication number
CN103756631B
CN103756631B CN201410010757.9A CN201410010757A CN103756631B CN 103756631 B CN103756631 B CN 103756631B CN 201410010757 A CN201410010757 A CN 201410010757A CN 103756631 B CN103756631 B CN 103756631B
Authority
CN
China
Prior art keywords
component
organic silicon
type flame
flame retardant
copies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410010757.9A
Other languages
Chinese (zh)
Other versions
CN103756631A (en
Inventor
陈春浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sika Jiangsu Industrial Materials Co Ltd
Original Assignee
CHANGSHU HENGXIN ADHESIVE CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGSHU HENGXIN ADHESIVE CO LTD filed Critical CHANGSHU HENGXIN ADHESIVE CO LTD
Priority to CN201410010757.9A priority Critical patent/CN103756631B/en
Publication of CN103756631A publication Critical patent/CN103756631A/en
Application granted granted Critical
Publication of CN103756631B publication Critical patent/CN103756631B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention discloses double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant. The double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant comprises a component A and a component B and is characterized in that the component A is prepared by mixing a basic material, a platinum catalyst and a coupling agent in mass ratio of 100:(0.00001-0.1):(0.1-1); the component B is formed by mixing a basic material, a coupling agent, an inhibitor and a tackifier in mass ratio of 100: (0.2-1.0):(0.01-1):(1-10); the basic material is formed by mixing vinyl-terminated silicone oil, heat-conducting filler and a flame retardant in mass ratio of 100: (120-160):(20-40). The double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant has good optical performance, heat conduction property and relatively good viscosity and can meet the long-term using requirements in high and low temperature environments.

Description

Two component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive
Technical field
The present invention relates to Embedding Material technical field, particularly relate to a kind of two component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive.
Background technology
Along with electronics constantly by more powerful function i ntegration in less assembly, electronic component is had higher requirement to the flame retardant resistance of joint sealant and thermal conductivity.The features such as when add-on type liquid silicon rubber has crosslinked no coupling product release, little, the cross-linking density of shrinking percentage and vulcanization rate be easy to control are the desired matrix materials of electronic apparatus joint sealant.But addition-type silicon rubber is because molecule itself is in nonpolar, and cementability is poor, when using as electronics embedding, coating material, moisture can infiltrate device inside by the space between rubber and base material and cause corrosion and failure of insulation.Silane coupling agent is used to carry out substrate surface processing the cementability that can improve additional organosilicon material and various material; But such a process increases production process and production time, solvent evaporates during use causes again unnecessary environmental pollution.Carbonic ether has excellent insulativity, good flame retardancy and dimensional stability, is widely used in electronic apparatus as shell, body and timbering material.The various aminosilanes that condensed type liquid silastic is conventional have better cementability to PC, but have poisoning effect to add-on type liquid silicon rubber and can not use.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of two component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, has good optical property, heat conductivility and viscosity preferably, and the requirement of life-time service under high and low temperature environment can be met.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is:
A kind of two component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive is provided, comprise component A and B component, described component A is mixed according to ratio of quality and the number of copies 100:0.00001 ~ 0.1:0.1 ~ 1 by base-material, platinum catalyst and coupling agent, described B component is mixed according to ratio of quality and the number of copies 100:0.2 ~ 1:0.01 ~ 1:1 ~ 10 by base-material, coupling agent, inhibitor and tackifier, and described base-material is mixed by vinyl-terminated silicone fluid, heat conductive filler and fire retardant ratio of quality and the number of copies 100:120 ~ 160:20 ~ 40.
In a preferred embodiment of the present invention, the described heat conductive filler in described base-material is aluminum oxide, and described fire retardant is aluminium hydroxide.
In a preferred embodiment of the present invention, as the described aluminum oxide of heat conductive filler, for the aluminum oxide with different-grain diameter forms according to extra fine quality portion rate mixed preparing.
In a preferred embodiment of the present invention, as the described aluminum oxide of heat conductive filler, be 5 μm and form according to ratio of quality and the number of copies 1:2 mixed preparing with the alumina raw material of 15 μm of two kinds of particle diameters.
In a preferred embodiment of the present invention, described coupling agent is the mixture of vinyltrimethoxy silane and gamma-methyl allyl acyloxypropyl trimethoxysilane.
In a preferred embodiment of the present invention, described tackifier are the reaction product of TriMethylolPropane(TMP) diallyl, γ-glycidoxypropyltrimethoxy silane and tetraethoxy.
In a preferred embodiment of the present invention, described component A and described B component mix according to ratio of quality and the number of copies 1:1 then carries out vacuum defoamation, and at room temperature sulfuration 15 ~ 40h makes described dual composition addition type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive.
The invention has the beneficial effects as follows: a kind of two component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive of the present invention, there is excellent chemical property, wherein be filled with heat conductive filler in base-material, higher fill-up can be realized, improve thermal conductivity and the mobility of joint sealant, fire retardant and platinum catalyst and by the flame retardant properties that improve joint sealant, the present invention is without the need to silane coupling agent, under the heating condition of 90 DEG C, there is good cementability to PC and aluminium etc., there is good over-all properties.
Embodiment
Below preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Embodiment 1:
(1) preparation of base-material: 100 parts of vinyl silicone oils, 150 parts of aluminum oxide, 30 parts of aluminium hydroxides are added in high speed dispersor and mixes, vacuumizing and defoaming, obtained base-material.Wherein aluminum oxide containing 5 μm with the alumina raw material of two kinds of particle diameters of 15 μm, form according to ratio of quality and the number of copies 1:2 mixed preparing.
(2) preparation of component A: get 100 parts of base-materials, the platinum catalyst of 0.000015 part, the coupling agent of 0.5 part, mix in high speed dispersor, vacuumizing and defoaming.
(3) preparation of B component: get 100 parts of base-materials, 8 parts of containing hydrogen silicone oils, 0.5 part of coupling agent, 0.05 part of inhibitor, 3 parts of tackifier, mix in high speed dispersor, vacuumizing and defoaming.
(4) component A above-mentioned steps prepared mixes deaeration with B component according to mass ratio 1:1, imports in mould, at ambient temperature sulfuration 24 hours or in 90 DEG C of sulfurations 30 minutes, makes finished product.
Embodiment 2:
(1) preparation of base-material: 100 parts of vinyl silicone oils, 155 parts of aluminum oxide, 32 parts of aluminium hydroxides are added in high speed dispersor and mixes, vacuumizing and defoaming, obtained base-material.Wherein aluminum oxide containing 5 μm with the alumina raw material of two kinds of particle diameters of 15 μm, form according to ratio of quality and the number of copies 1:2 mixed preparing.
(2) preparation of component A: get 100 parts of base-materials, the platinum catalyst of 0.000018 part, the coupling agent of 0.5 part, mix in high speed dispersor, vacuumizing and defoaming.
(3) preparation of B component: get 100 parts of base-materials, 8 parts of containing hydrogen silicone oils, 0.45 part of coupling agent, 0.05 part of inhibitor, 3 parts of tackifier, mix in high speed dispersor, vacuumizing and defoaming.
(4) component A above-mentioned steps prepared mixes deaeration with B component according to mass ratio 1:1, imports in mould, at ambient temperature sulfuration 24 hours or in 90 DEG C of sulfurations 30 minutes, makes finished product.
Embodiment 3:
(1) preparation of base-material: 100 parts of vinyl silicone oils, 148 parts of aluminum oxide, 30 parts of aluminium hydroxides are added in high speed dispersor and mixes, vacuumizing and defoaming, obtained base-material.Wherein aluminum oxide containing 5 μm with the alumina raw material of two kinds of particle diameters of 15 μm, form according to ratio of quality and the number of copies 1:2 mixed preparing.
(2) preparation of component A: get 100 parts of base-materials, the platinum catalyst of 0.000012 part, the coupling agent of 0.5 part, mix in high speed dispersor, vacuumizing and defoaming.
(3) preparation of B component: get 100 parts of base-materials, 8 parts of containing hydrogen silicone oils, 0.5 part of coupling agent, 0.05 part of inhibitor, 3 parts of tackifier, mix in high speed dispersor, vacuumizing and defoaming.
(4) component A above-mentioned steps prepared mixes deaeration with B component according to mass ratio 1:1, imports in mould, at ambient temperature sulfuration 24 hours or in 90 DEG C of sulfurations 30 minutes, makes finished product.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.

Claims (4)

1. a two component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, comprise component A and B component, it is characterized in that, described component A is mixed according to ratio of quality and the number of copies 100:0.00001 ~ 0.1:0.1 ~ 1 by base-material, platinum catalyst and coupling agent, described B component is mixed according to ratio of quality and the number of copies 100:8:0.2 ~ 1:0.01 ~ 1:1 ~ 10 by base-material, containing hydrogen silicone oil, coupling agent, inhibitor and tackifier, and described base-material is mixed by vinyl-terminated silicone fluid, heat conductive filler and fire retardant ratio of quality and the number of copies 100:120 ~ 160:20 ~ 40; Described heat conductive filler in described base-material is aluminum oxide, and described fire retardant is aluminium hydroxide;
As the described aluminum oxide of heat conductive filler, be 5 μm and form according to ratio of quality and the number of copies 1:2 mixed preparing with the alumina raw material of 15 μm of two kinds of particle diameters.
2. according to claim 1 pair of component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, it is characterized in that, described coupling agent is the mixture of vinyltrimethoxy silane and gamma-methyl allyl acyloxypropyl trimethoxysilane.
3. according to claim 1 pair of component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, it is characterized in that, described tackifier are the reaction product of TriMethylolPropane(TMP) diallyl, γ-glycidoxypropyltrimethoxy silane and tetraethoxy.
4. according to claim 1 pair of component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, it is characterized in that, described component A and described B component mix according to ratio of quality and the number of copies 1:1 then carries out vacuum defoamation, and at room temperature sulfuration 15 ~ 40h makes described dual composition addition type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive.
CN201410010757.9A 2013-11-28 2014-01-10 Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant Expired - Fee Related CN103756631B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410010757.9A CN103756631B (en) 2013-11-28 2014-01-10 Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201310612073 2013-11-28
CN201310612073.1 2013-11-28
CN2013106120731 2013-11-28
CN201410010757.9A CN103756631B (en) 2013-11-28 2014-01-10 Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant

Publications (2)

Publication Number Publication Date
CN103756631A CN103756631A (en) 2014-04-30
CN103756631B true CN103756631B (en) 2015-06-03

Family

ID=50523963

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410010757.9A Expired - Fee Related CN103756631B (en) 2013-11-28 2014-01-10 Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant

Country Status (1)

Country Link
CN (1) CN103756631B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HUE061592T2 (en) 2014-07-07 2023-07-28 Honeywell Int Inc Thermal interface material with ion scavenger
CN104312529B (en) * 2014-10-08 2017-01-25 卢儒 Organic silicon heat conduction electronic filling adhesive and preparation method thereof
CN105038694B (en) * 2015-08-12 2018-10-19 东莞兆舜有机硅科技股份有限公司 A kind of dual composition addition type organosilicon bonding casting glue and its application method
CN105647463B (en) * 2016-01-25 2018-11-02 浙江泓源汽车集团有限公司 Fire-retardant, the explosion-proof heat conductive silica gel of one kind and its application method
EP3426746B1 (en) 2016-03-08 2021-07-14 Honeywell International Inc. Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
CN106753205B (en) * 2017-01-11 2020-05-22 湖南博翔新材料有限公司 Epoxy modified organic silicon pouring sealant with low viscosity and high heat conductivity and application thereof
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
CN108034255A (en) * 2017-10-31 2018-05-15 东莞市汉品电子有限公司 High fire-retardance heat-conducting silica gel sheet and its manufacture method
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
CN109054733A (en) * 2018-09-19 2018-12-21 深圳市红叶杰科技有限公司 A kind of bi-component self-adhesion add-on type electron pouring sealant and preparation method thereof
CN109439272A (en) * 2018-12-28 2019-03-08 中天东方氟硅材料有限公司 Two-component heat conductive flame-retarding organic silicon potting adhesive composition and its casting glue for electric vehicle and preparation method
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN110746926A (en) * 2019-12-02 2020-02-04 扬州宏远新材料股份有限公司 Self-adhesive heat-conducting flame-retardant two-component electronic encapsulating silicone rubber and preparation method thereof
CN110982074A (en) * 2019-12-25 2020-04-10 广州市高士实业有限公司 Normal-temperature curing tackifier system, preparation method and pouring sealant using same
CN115612302A (en) * 2022-09-30 2023-01-17 福建纳新硅业科技有限公司 High-strength composite silicone rubber and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010096412A2 (en) * 2009-02-17 2010-08-26 Dow Corning Corporation Silicone gel seal and method for its preparation and use
CN103146340A (en) * 2013-03-06 2013-06-12 广州市高士实业有限公司 Low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and preparation method thereof
CN103275671A (en) * 2013-06-20 2013-09-04 李季 Flame-retardant and heat-conducting organosilicone pouring sealant for carbon nano tube

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010096412A2 (en) * 2009-02-17 2010-08-26 Dow Corning Corporation Silicone gel seal and method for its preparation and use
CN103146340A (en) * 2013-03-06 2013-06-12 广州市高士实业有限公司 Low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and preparation method thereof
CN103275671A (en) * 2013-06-20 2013-09-04 李季 Flame-retardant and heat-conducting organosilicone pouring sealant for carbon nano tube

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
黄文润.《加成型液体硅橡胶的底涂剂及增粘剂(续)》.《有机硅材料》.2005,第19卷(第5期),37-43. *

Also Published As

Publication number Publication date
CN103756631A (en) 2014-04-30

Similar Documents

Publication Publication Date Title
CN103756631B (en) Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant
CN103131381B (en) High-performance environmentally-friendly flame retardant type organic electron pouring sealant and preparation method thereof
CN108819360B (en) Preparation method of graphene heat-conducting film/heat-conducting silicone film composite material with layered alternating structure
CN101735619B (en) Halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive and preparation method thereof
CN106751904B (en) Heat-conducting organic silicon gel and preparation method thereof
CN102337033B (en) Additive high-thermal-conductivity organic silicon electronic pouring sealant and preparation method thereof
CN103146340B (en) Low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and preparation method thereof
CN102618208B (en) Halogen-free flame-retardant heat-conduction organosilicon electronic pouring sealant and preparation technology thereof
CN101831264B (en) Isotropic high-performance thermal conductive adhesive for filling carbon nano tube
CN104804705A (en) Low release quantity additive halogen-free flame-retardant heat-conduction organic silicon pouring sealant and preparation method thereof
CN110591371A (en) High-adhesion heat-conducting silica gel capable of being formed in situ and preparation method thereof
CN105670555A (en) High heat conductivity organosilicon potting compound
CN102952403A (en) Additive organosilicon heat-conducting electronic potting adhesive and manufacturing method thereof
CN106146889B (en) Inorganic filler, the resin combination comprising the filler and the heat dissipating substrate using the filler
CN102942895A (en) Heat-conduction electronic potting adhesive and preparation method thereof
KR20130101902A (en) Composite composition comprising aerogel and method for preparing the same
CN106753213A (en) A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance
CN103275671A (en) Flame-retardant and heat-conducting organosilicone pouring sealant for carbon nano tube
CN103265929A (en) Preparation method for carbon nano tube antiflaming heat conducting organic silicone pouring sealant
CN104845379A (en) Solvent-free type organic silicone pouring sealant and preparation method thereof
CN105368068A (en) High-temperature-resistant, high-breakdown-voltage and filler-free organic silicone rubber for sleeve
CN106753212A (en) A kind of good transparency of caking property PCB organic silicon electronic potting adhesive high
CN106634814A (en) Organic silicon electronic pouring sealant with good ultraviolet-resisting cooling performance for PCB (Printed Circuit Board)
CN105586002B (en) High fluidity halogen-free flameproof tack organic silicon potting adhesive and preparation method thereof
CN106753211A (en) A kind of flame-retarded heat-conducting PCB organic silicon electronic potting adhesive

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20190926

Address after: 215542 Zhongtian Road, Changkun Industrial Park, Shajiabang Town, Changshu City, Jiangsu Province

Patentee after: JIANGSU CREVO SCIENCE & TECHNOLOGY CO.,LTD.

Address before: 215500 New Lane Village, Lake Town, Suzhou, Jiangsu, Changshou City

Patentee before: Changshu Hengxin Adhesive Co.,Ltd.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 215542 Zhongtian Road, Changkun Industrial Park, Shajiabang Town, Changshu City, Suzhou City, Jiangsu Province

Patentee after: Sika (Jiangsu) Industrial Materials Co.,Ltd.

Address before: 215542 Zhongtian Road, Changkun Industrial Park, Shajiabang Town, Changshu City, Suzhou City, Jiangsu Province

Patentee before: JIANGSU CREVO SCIENCE & TECHNOLOGY CO.,LTD.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150603