CN104845379A - Solvent-free type organic silicone pouring sealant and preparation method thereof - Google Patents
Solvent-free type organic silicone pouring sealant and preparation method thereof Download PDFInfo
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- CN104845379A CN104845379A CN201510216593.XA CN201510216593A CN104845379A CN 104845379 A CN104845379 A CN 104845379A CN 201510216593 A CN201510216593 A CN 201510216593A CN 104845379 A CN104845379 A CN 104845379A
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Abstract
The invention discloses a high-elasticity high-hardness quickly-cured double-component-condensed solvent-free type organic silicone pouring sealant and a preparation method thereof. The pouring sealant include a component A and a component B, wherein the component A includes vinyl silicone oil, a crosslinking catalyst, a defoaming agent, an inorganic filler and an inhibitor, the component B includes silicone oil, vinyl silicone oil, an inorganic heat conducting filler and an inorganic filler. The component A and the component B are evenly mixed according to the mass ratio 1:1 and then can be used, the pouring sealant formed through curing has good overall performance, higher heat conducting performance and good mechanical property and is environment-friendly and flame-retardant, the heat conducting rate is up to 0.6-1.2W.m-1.K-1, liquidity is better, and the viscosity is 1800-2500mPa.s. The solvent-free type organic silicone pouring sealant can be applied to pouring of electronic parts and components, is especially suitable for overall pouring of LED strip strips and has higher assembling efficiency.
Description
Technical field
The present invention relates to a kind of no-solvent type organic silicon potting adhesive and preparation method thereof, belong to organosilicon macromolecule field of material technology.
Background technology
Along with the continuous progress of human society, under the background of global energy shortage, the electronic devices and components of energy saving are more and more by people are paid close attention to.Such as, but because of portions of electronics components and parts, light-emitting diode display part, works under rugged environment because it is chronically exposed to harshness, and requirement must have good environmental compatibility.This just needs to carry out embedding process to these electronic devices and components, its object mainly contains: one is sealing and insulation, the pin of printed circuit board and photodiode is avoided to be exposed in environment, thus from environmental injuries such as moisture, rainwater, dust, radiation (light, heat), migration ions; Two is fixing electronic devices and components, improves product to the resistibility of external shock, vibrations, prevents the defect causing quality product to decline because electronic devices and components are crooked.Along with the high-tech areas such as electronic devices and components, large-scale surface-mounted integrated circuit, LED realize high-performance, high reliability and miniaturization at present gradually, the raising of its power is also had higher requirement to the flame retardant resistance of joint sealant and thermal conductivity.Require that it not only has excellent high and low temperature resistance, mechanical mechanics property, electronic isolation performance, also will possess good heat conductivility, flame retardant properties and flowing property simultaneously.
That commonly uses joint sealant has epoxide resin type, polyurethane-type and organic silicon type.Epoxy resin faces wet fastness, thermotolerance, internal stress problem etc.; It is that joint sealant surface is excessively soft, easy to foaming that urethane also exists insoluble problem in the application; Easy embrittlement when solidifying insufficient and hot setting; In the Working environment of condition harshness, polyurethane potting material is often difficult to meet that wet-heat resisting is ageing-resistant, high-low temperature resistant requirement.Organosilicon macromolecule material has unique weather, ageing-resistant performance because of special siloxane bond backbone structure, excellent high and low temperature resistance, good hydrophobicity, mechanical property, electrical isolation etc., is thus widely used in the embedding protection of electrical and electronic component.
Organic silicon potting adhesive both at home and abroad for electronic devices and components mostly is single-component product, and its electric property, waterproof, weather-proof, ageing-resistant performance better, but the cementability of elastomerics after sulfuration and metal is poor.Electronic devices and components embedding also there is many research both at home and abroad.Peeling off with pin, support of occurring in electronic devices and components embedding, the problem such as tensile strength and bonding force can not be solved completely.The patent No. is that the Chinese patent of ZL 201110031612.3 discloses a kind of halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive, and its viscosity reaches 5500mPaS, poor fluidity, not easily applying glue.The patent No. is the organic silicon electronic potting adhesive of ZL 201310071584.7, and its viscosity is comparatively moderate, but in preparation process, use multiple Compositional type coupling agent, because of its hydrolytic action, need carry out processed for a long time, reduce production efficiency.And a small amount of remaining moisture content also can affect bonding and the mechanical property of joint sealant.How preparing a kind of high performance organo-silicon joint sealant of high comprehensive performance quickly and efficiently, is a problem needing to be solved.
Summary of the invention
The object of the invention is for the deficiencies in the prior art, a kind of no-solvent type organic silicon potting adhesive and preparation method thereof is provided, gained joint sealant not only has excellent high heat conductance, flame retardant resistance, electronic isolation and mobility, possesses snappiness, high rigidity, quick-setting feature simultaneously; And do not have solvent to use in process of production, there is Environmental Safety, easy handling and facilitate the advantages such as production and application.
In order to achieve the above object, a kind of no-solvent type organic silicon potting adhesive provided by the invention, is characterized in that, this organic silicon potting adhesive comprises the component A and B component that 1:1 in mass ratio mixes;
Described component A comprises following component and weight part content:
Described B component comprises following component and weight part content:
The thermal conductivity of described organic silicon potting adhesive reaches 0.6 ~ 1.2Wm
-1k
-1, viscosity is 1800 ~ 2500mPas.
The contents of ethylene of described vinyl silicone oil is 0.5-1.5% (mass percent); The hydrogen content of described containing hydrogen silicone oil is 0.2 ~ 1.0% (mass percent).
Described crosslinking catalyst is platinum catalyst, and its Pt content is 0.5 ~ 1.0%.
Described defoamer is one or more in polyether-modified polysiloxane, methyl phenyl silicone multipolymer or silane coupling agent.
Described inorganic fillings is one or more in silica powder, aluminium hydroxide, magnesium hydroxide, calcium hydroxide.
Described inhibitor is ethynylcyclohexanol.
Described inorganic heat conductive filler is one or more in boron nitride, Graphite Powder 99, aluminum oxide, thermal conductive ceramic powder, CNT (carbon nano-tube), powdered carbon.
A preparation method for no-solvent type organic silicon potting adhesive, is characterized in that comprising the following steps:
1) component A is prepared
Get each raw material according to the following ratio:
Above-mentioned raw materials is put into reactor, stirs and deaeration, obtain component A;
2) B component is prepared
Get each raw material according to the following ratio:
Above-mentioned raw materials is put into reactor, stirs and deaeration, obtain B component;
3) gained component A and B component being mixed according to mass ratio 1:1 can;
Described deaeration pressure <100Pa, the time is 5-10min.
The temperature that is heating and curing of described organic silicon potting adhesive is 50-80 DEG C, and the time is 0.3-1.0h.
The contents of ethylene of described vinyl silicone oil is 0.5-1.5% (mass percent); The hydrogen content of described containing hydrogen silicone oil is 0.2 ~ 1.0% (mass percent); Described crosslinking catalyst is platinum catalyst, and its Pt content is 0.5 ~ 1.0%; Described defoamer is one or more in polyether-modified polysiloxane, methyl phenyl silicone multipolymer or silane coupling agent; Described inorganic fillings is one or more in silica powder, aluminium hydroxide, magnesium hydroxide, calcium hydroxide; Described inhibitor is ethynylcyclohexanol; Described inorganic heat conductive filler is one or more in boron nitride, Graphite Powder 99, aluminum oxide, thermal conductive ceramic powder, CNT (carbon nano-tube), powdered carbon.
Compared with prior art, gained organic silicon potting adhesive of the present invention not only has excellent high heat conductance, flame retardant resistance, electronic isolation and mobility, possesses snappiness, high rigidity, quick-setting feature simultaneously; Thermal conductivity reaches 0.6 ~ 1.2Wm
-1k
-1, viscosity is 1800 ~ 2500mPas; And do not have solvent to use in process of production, there is Environmental Safety, easy handling and facilitate the advantages such as production and application.
Embodiment
Below by the description that embodiment is concrete to the present invention; be noted that the following stated is only the preferred embodiment of the present invention; for those skilled in the art; under the premise of not departing from the present invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Embodiment 1:
The preparation of base-material: vinyl silicone oil 85 parts, crosslinking catalyst 0.5 part, defoamer 0.5 part, inorganic fillings 10 parts, 0.01 part, inhibitor (ethynylcyclohexanol), stirs also vacuum defoamation 10 minutes, obtained component A; Containing hydrogen silicone oil 20 parts, vinyl silicone oil 50 parts, inorganic fillings 20 parts, inorganic heat conductive filler 10 parts, stirs and vacuum defoamation 8 minutes obtained B component.Wherein the contents of ethylene of vinyl silicone oil is 0.5%, crosslinking catalyst is platinum catalyst (Pt content 1%), and defoamer is polyether-modified polysiloxane, and inorganic fillings is aluminium hydroxide, the hydrogen content of containing hydrogen silicone oil is 0.2%, and inorganic heat conductive filler is aluminum oxide.The component A of getting equivalent mixes with B component, is stirred to color homogeneous, both obtains no-solvent type organic silicon potting adhesive.At temperature is 80 DEG C, time 20min can realize solidification.
Embodiment 2:
The preparation of base-material: vinyl silicone oil 80 parts, crosslinking catalyst 1.5 parts, defoamer 1.5 parts, inorganic fillings 17 parts, 0.1 part, inhibitor (ethynylcyclohexanol), stirs also vacuum defoamation 8 minutes, obtained component A; Containing hydrogen silicone oil 30 parts, vinyl silicone oil 30 parts, inorganic fillings 27 parts, inorganic heat conductive filler 13 parts, stirs and vacuum defoamation 8 minutes obtained B component.Wherein the contents of ethylene of vinyl silicone oil is 0.7%, crosslinking catalyst is platinum catalyst (Pt content 0.6%), and defoamer is methyl phenyl silicone multipolymer, and inorganic fillings is silica powder, the hydrogen content of containing hydrogen silicone oil is 0.4%, and inorganic heat conductive filler is boron nitride.The component A of getting equivalent mixes with B component, is stirred to color homogeneous, both obtains no-solvent type organic silicon potting adhesive.At temperature is 50 DEG C, time 60min can realize solidification.
Embodiment 3:
The preparation of base-material: vinyl silicone oil 90 parts, crosslinking catalyst 0.5 part, defoamer 1.5 parts, inorganic fillings 8 parts, 0.1 part, inhibitor, stirs also vacuum defoamation 10 minutes, obtained component A; Containing hydrogen silicone oil 20 parts, vinyl silicone oil 35 parts, inorganic fillings 30 parts, inorganic heat conductive filler 15 parts, stirs and vacuum defoamation 8 minutes obtained B component.Wherein the contents of ethylene of vinyl silicone oil is 0.9%, crosslinking catalyst is platinum catalyst (Pt content 0.8%), defoamer is polyether-modified polysiloxane and silane coupling agent (KH-570), inorganic fillings is aluminium hydroxide and silica powder, respectively account for 50%, the hydrogen content of containing hydrogen silicone oil is 0.4%, and inorganic heat conductive filler is boron nitride and carbon nanotube, each 7.5 parts.The component A of getting equivalent mixes with B component, is stirred to color homogeneous, both obtains no-solvent type organic silicon potting adhesive.At temperature is 80 DEG C, time 25min can realize solidification.
Embodiment 4:
The preparation of base-material: vinyl silicone oil 90 parts, crosslinking catalyst 1.5 parts, defoamer 0.5 part, inorganic fillings 8 parts, 0.05 part, inhibitor (ethynylcyclohexanol), stirs also vacuum defoamation 10 minutes, obtained component A; Containing hydrogen silicone oil 10 parts, vinyl silicone oil 35 parts, inorganic fillings 25 parts, inorganic heat conductive filler 20 parts, stirs and vacuum defoamation 8 minutes obtained B component.Wherein the contents of ethylene of vinyl silicone oil is 1.2%, crosslinking catalyst is platinum catalyst (Pt content 0.5%), defoamer is polyether-modified polysiloxane, inorganic fillings is calcium hydroxide, the hydrogen content of containing hydrogen silicone oil is 0.4%, inorganic heat conductive filler is boron nitride and aluminum oxide, each 10 parts.The component A of getting equivalent mixes with B component, is stirred to color homogeneous, both obtains no-solvent type organic silicon potting adhesive.At temperature is 70 DEG C, time 30min can realize solidification.
Embodiment 5:
The preparation of base-material: vinyl silicone oil 90 parts, crosslinking catalyst 1.5 parts, defoamer 0.5 part, inorganic fillings 8 parts, 0.02 part, inhibitor (ethynylcyclohexanol), stirs also vacuum defoamation 10 minutes, obtained component A; Containing hydrogen silicone oil 10 parts, vinyl silicone oil 45 parts, inorganic fillings 20 parts, inorganic heat conductive filler 25 parts, stirs and vacuum defoamation 8 minutes obtained B component.Wherein the contents of ethylene of vinyl silicone oil is 1.5%, crosslinking catalyst is platinum catalyst (Pt content 1%), defoamer is polyether-modified polysiloxane and silane coupling agent (KH-550), inorganic fillings is magnesium hydroxide, the hydrogen content of containing hydrogen silicone oil is 0.6%, and inorganic heat conductive filler is Graphite Powder 99.The component A of getting equivalent mixes with B component, is stirred to color homogeneous, both obtains no-solvent type organic silicon potting adhesive.At temperature is 60 DEG C, time 40min can realize solidification.
In embodiment, the test result details of each product performance, see the following form
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | |
| Viscosity (Cps) after mixing | 1850 | 2470 | 2180 | 2320 | 2380 |
| Thermal conductivity (W/mk) | 0.62 | 0.68 | 0.74 | 1.17 | 1.21 |
| Hardness (HA) | 40 | 42 | 45 | 48 | 50 |
| Specific inductivity (1.2MHz) | 3.12 | 3.11 | 3.12 | 3.11 | 3.17 |
| Tensile strength (psi) | 237 | 242 | 239 | 243 | 240 |
| Proportion 25 DEG C (g/ML) | 1.58 | 1.55 | 1.53 | 1.58 | 1.59 |
| Flame retardant rating | V-0 | V-0 | V-0 | V-0 | V-0 |
Claims (11)
1. a no-solvent type organic silicon potting adhesive, is characterized in that, this organic silicon potting adhesive comprises the component A and B component that 1:1 in mass ratio mixes;
Described component A comprises following component and weight part content:
Described B component comprises following component and weight part content:
2. no-solvent type organic silicon potting adhesive according to claim 1, is characterized in that: the thermal conductivity of described organic silicon potting adhesive reaches 0.6 ~ 1.2Wm
-1k
-1, viscosity is 1800 ~ 2500mPas.
3. no-solvent type organic silicon potting adhesive according to claim 1, is characterized in that: the contents of ethylene of described vinyl silicone oil is 0.5-1.5%; The hydrogen content of described containing hydrogen silicone oil is 0.2 ~ 1.0%.
4. no-solvent type organic silicon potting adhesive according to claim 1, is characterized in that: described crosslinking catalyst is platinum catalyst, and its Pt content is 0.5 ~ 1.0%.
5. no-solvent type organic silicon potting adhesive according to claim 1, is characterized in that: described defoamer is one or more in polyether-modified polysiloxane, methyl phenyl silicone multipolymer or silane coupling agent.
6. no-solvent type organic silicon potting adhesive according to claim 1, is characterized in that: described inorganic fillings is one or more in silica powder, aluminium hydroxide, magnesium hydroxide, calcium hydroxide.
7. no-solvent type organic silicon potting adhesive according to claim 1, is characterized in that: described inhibitor is ethynylcyclohexanol.
8. no-solvent type organic silicon potting adhesive according to claim 1, is characterized in that: described inorganic heat conductive filler is one or more in boron nitride, Graphite Powder 99, aluminum oxide, thermal conductive ceramic powder, CNT (carbon nano-tube), powdered carbon.
9. a preparation method for no-solvent type organic silicon potting adhesive, is characterized in that comprising the following steps:
1) component A is prepared
Get each raw material according to the following ratio:
Above-mentioned raw materials is put into reactor, stirs and deaeration, obtain component A;
2) B component is prepared
Get each raw material according to the following ratio:
Above-mentioned raw materials is put into reactor, stirs and deaeration, obtain B component;
3) gained component A and B component are mixed according to mass ratio 1:1;
Described deaeration pressure <100Pa, the time is 5-10min.
10. the preparation method of no-solvent type organic silicon potting adhesive according to claim 9, is characterized in that: the temperature that is heating and curing of described organic silicon potting adhesive is 50-80 DEG C, and the time is 0.3-1.0h.
The preparation method of 11. no-solvent type organic silicon potting adhesives according to claim 9, is characterized in that: the contents of ethylene of described vinyl silicone oil is 0.5-1.5%; The hydrogen content of described containing hydrogen silicone oil is 0.2 ~ 1.0%; Described crosslinking catalyst is platinum catalyst, and its Pt content is 0.5 ~ 1.0%; Described defoamer is one or more in polyether-modified polysiloxane, methyl phenyl silicone multipolymer or silane coupling agent; Described inorganic fillings is one or more in silica powder, aluminium hydroxide, magnesium hydroxide, calcium hydroxide; Described inhibitor is ethynylcyclohexanol; Described inorganic heat conductive filler is one or more in boron nitride, Graphite Powder 99, aluminum oxide, thermal conductive ceramic powder, CNT (carbon nano-tube), powdered carbon.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105566921A (en) * | 2015-12-29 | 2016-05-11 | 浙江荣泰科技企业有限公司 | Conductive organic silicone rubber composition and preparation method thereof |
| CN107227026A (en) * | 2017-07-26 | 2017-10-03 | 合肥同佑电子科技有限公司 | A kind of power electronic devices casting glue and preparation method thereof |
| CN108130040A (en) * | 2017-12-27 | 2018-06-08 | 深圳航美新材料科技有限公司 | A kind of modified double components casting glue and preparation method thereof |
| CN111410442A (en) * | 2020-04-17 | 2020-07-14 | 安徽东方钙业有限公司 | High-quality production process of active calcium oxide |
| CN111876135A (en) * | 2020-07-14 | 2020-11-03 | 广东乐普泰新材料科技有限公司 | Heat-conducting gel and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104479623A (en) * | 2014-12-03 | 2015-04-01 | 湖南皓志科技股份有限公司 | Normal-temperature solidified organic silicon pouring sealant having high thermal conductivity |
-
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- 2015-04-30 CN CN201510216593.XA patent/CN104845379A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104479623A (en) * | 2014-12-03 | 2015-04-01 | 湖南皓志科技股份有限公司 | Normal-temperature solidified organic silicon pouring sealant having high thermal conductivity |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105566921A (en) * | 2015-12-29 | 2016-05-11 | 浙江荣泰科技企业有限公司 | Conductive organic silicone rubber composition and preparation method thereof |
| CN105566921B (en) * | 2015-12-29 | 2021-11-30 | 浙江荣泰科技企业有限公司 | Conductive silicone rubber composition and preparation method thereof |
| CN107227026A (en) * | 2017-07-26 | 2017-10-03 | 合肥同佑电子科技有限公司 | A kind of power electronic devices casting glue and preparation method thereof |
| CN108130040A (en) * | 2017-12-27 | 2018-06-08 | 深圳航美新材料科技有限公司 | A kind of modified double components casting glue and preparation method thereof |
| CN108130040B (en) * | 2017-12-27 | 2019-12-03 | 深圳航美新材料科技有限公司 | A kind of modified double components casting glue and preparation method thereof |
| CN111410442A (en) * | 2020-04-17 | 2020-07-14 | 安徽东方钙业有限公司 | High-quality production process of active calcium oxide |
| CN111410442B (en) * | 2020-04-17 | 2022-04-22 | 安徽东方钙业有限公司 | High-quality production process of active calcium oxide |
| CN111876135A (en) * | 2020-07-14 | 2020-11-03 | 广东乐普泰新材料科技有限公司 | Heat-conducting gel and preparation method thereof |
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