CN107227026A - A kind of power electronic devices casting glue and preparation method thereof - Google Patents
A kind of power electronic devices casting glue and preparation method thereof Download PDFInfo
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- CN107227026A CN107227026A CN201710617923.5A CN201710617923A CN107227026A CN 107227026 A CN107227026 A CN 107227026A CN 201710617923 A CN201710617923 A CN 201710617923A CN 107227026 A CN107227026 A CN 107227026A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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Abstract
The invention discloses a kind of power electronic devices casting glue, belong to casting glue technical field, include the raw material of following parts by weight：Component A：70 80 parts of vinyl silicone oil, 28 32 parts of brominated epoxy resin, 35 parts of containing hydrogen silicone oil, 13 parts of coupling agent, 68 parts of epoxidized methyl acetorieinoleate；B component：90 100 parts of vinyl silicone oil, 16 parts of platinum catalyst, 57 parts of antimony oxide, 20 24 parts of magnesium hydroxide, 8 10 parts of boron carbide, 15 17 parts of calcium carbonate, 24 parts of carbon black, 11 15 parts of polyorganosiloxane resin, 79 parts of ATBC, 0.5 1 parts of antistatic additive；The invention also discloses a kind of preparation method of power electronic devices casting glue；Mechanical property of the present invention is strong, and with preferably high temperature resistant and fire retardancy, service life is long.
Description
Technical field
The present invention relates to casting glue technical field, specifically, relate to a kind of power electronic devices casting glue and its
Preparation method.
Background technology
As the high-tech areas such as electronic component, power circuitry module, large-scale surface-mounted integrated circuit, LED are further realized
High-performance, high reliability and miniaturization, and working environment is harsher, it is desirable to embedding part must between low temperature and high temperature,
At a high speed rotation etc. under the conditions of run, this require Embedding Material not only have excellent high and low temperature resistance, mechanical mechanics property,
Electrical insulation capability etc., and need to possess good heat conductivility and fire resistance.
The use of more Embedding Material is at present various synthetic polymers, wherein with epoxy resin, polyurethane and synthesis rubber
The application of glue is wide.Silicon rubber can keep elasticity for a long time within the scope of very wide temperature, not absorbed heat during vulcanization, not heat release, and
It is the preferred material of electric assembly embedding with excellent electric property and chemical stability.But typical case is without filling out
The heat conductivility of the silicon rubber filled is very poor, and thermal conductivity factor only has 0.2W/mK, and fire resistance is poor, complete once ignited energy
Full burning.
In Publication No. CN101735619A patent document, disclose a kind of halogen-free flame-retarded heat-conducting organic silicon electronic and fill
Sealing and preparation method thereof, vacuum is added by vinyldimethicone, supporting material, heat filling and halogen-free flame retardants
In kneader, in 100-150 DEG C of temperature, vacuum 0.06-0.1MPa, dehydration 30-120 minutes acquisition base-materials of blending.In normal temperature
Under, in base-material, containing hydrogen silicone oil crosslinking agent and cross-linked inhibitor are added, is sufficiently stirred for component A being made in 10-30 minutes；Base-material is added
Platinum catalyst, is sufficiently stirred for B component being made in 10-30 minutes.Parts by weight component A and the B component blending such as take uniform again, in vacuum
Deaeration 5-10 minutes under 0.06-0.1MPa, halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive is obtained.The casting glue mobile performance
It is good, it is easy to use, it can solidify under normal temperature or high temperature, solidfied material has excellent flame retardant and heat conductivility, can be widely applied to
The fields such as electronic apparatus, chip package, LED encapsulation；But its performance remains to further reinforcement.
The content of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, there is provided a kind of power electronic devices casting glue
And preparation method thereof, prepare simply, mechanical property is strong, and with preferably high temperature resistant and fire retardancy, service life is long.
A kind of power electronic devices casting glue that the present invention is provided, includes the raw material of following parts by weight：
Component A：70-80 parts of vinyl silicone oil, 28-32 parts of brominated epoxy resin, 3-5 parts of containing hydrogen silicone oil, 1-3 parts of coupling agent, ring
6-8 parts of oxygen methyl acetylricinolate；
B component：90-100 parts of vinyl silicone oil, 1-6 parts of platinum catalyst, 5-7 parts of antimony oxide, 20-24 parts of magnesium hydroxide, carbon
Change 8-10 part of boron, 15-17 parts of calcium carbonate, 2-4 parts of carbon black, 11-15 parts of polyorganosiloxane resin, 7-9 parts of ATBC, resist it is quiet
Electric agent 0.5-1 parts.
Preferably, vinyl silicone oil is end-vinyl dimethyl silicone polymer and the poly- methyl ethylene silica of end-vinyl
The mixture of alkane, weight ratio between the two is 6:1.
Preferably, containing hydrogen silicone oil is containing hydrogen silicone oil of the hydrogen content in 1.65-1.75%.
Preferably, antimony oxide, magnesium hydroxide, the mesh number of carbon black and boron carbide are 400 mesh, calcium carbonate is 600 mesh
Precipitated calcium carbonate.
Preferably, antistatic additive is polyethylene glycol methacrylic acid copolymer body, polyether ester amides, polyether ester acetyl
Amine, polyethylene glycol oxide, one or two or more kinds of mixtures of epoxypropane copolymerization thing.
Preferably, coupling agent is the mixture of silane coupler, titanate coupling agent and zirconium class coupling agent, between three
Weight ratio be 4:2:1.
Present invention also offers a kind of preparation method of power electronic devices casting glue, comprise the following steps：
（1）, by above-mentioned parts by weight weigh various raw materials；
（2）, component A preparation：By vinyl silicone oil, brominated epoxy resin, containing hydrogen silicone oil, coupling agent, epoxy acetylated castor oil
Sour methyl esters is added in mixer, and it is 40-50 DEG C to control temperature, and stir acquisition component A；
（3）, B component preparation：Platinum catalyst, antimony oxide, magnesium hydroxide, boron carbide, calcium carbonate, carbon black are added another
In mixer after stirring 20min, vinyl silicone oil, polyorganosiloxane resin, ATBC, antistatic additive are added, stirring is equal
Even acquisition B component；
（4）, by component A and B component by weight being 7:1 is well mixed, and casting glue is obtained after vacuum distillation.
Wherein,
Step（2）Mixing speed be 400-450r/min, step（3）In mixing speed be 220-250r/min.
A kind of power electronic devices casting glue of the present invention and preparation method thereof, is prepared simply, mechanical property is strong, has
Preferably high temperature resistant and fire retardancy, service life are long, specifically have the beneficial effect that：
（1）, glue based on vinyl silicone oil, with preferably cementitiousness；Containing hydrogen silicone oil is crosslinking agent, with particularly excellent
Hydrophobicity and antifouling capacity, cross-linking film forming；Brominated epoxy resin have good self-extinguishment, heat resistance, electric insulating quality and
Caking property, can effectively improve the fire-retardant and heat-resisting ability of casting glue；
（2）, coupling agent can improve the interface performance of synthetic resin and inorganic filler；Platinum catalyst high activity, high catalytic efficiency,
Stabilizer is good, and mithridatism is strong, reduces the generation of atrament, mitigates the influence of nitrogenous sulphur-containing substance；Epoxy acetylricinoleate oleic acid
Methyl esters has preferably catalytic action；
（3）, antimony oxide, magnesium hydroxide, boron carbide and calcium carbonate can increase the high temperature resistant and fire retardancy of casting glue, also can
Ensure the mechanical strength and weather resistance of casting glue；Carbon black has preferably photostability, can improve the uvioresistant of casting glue
Ability；
（4）, polyorganosiloxane resin have good electrical insulation property, the effect with preferably weather-proof, high temperature resistant and waterproof can have
Improve the performance of casting glue in effect ground；ATBC can improve plasticity；The generation of antistatic additive energy minimizing electrostatic；
（5）, various raw materials correspondence ratios of the invention mixing, be effective to ensure that the mechanical strength of casting glue, weather-proof, energy of attachment
Power, heat-resisting ability and fire retardancy, use time are long；Preparation method is simple, stably, can effectively will be between each raw material fully
Mixing, so as to ensure the quality of casting glue.
Embodiment
Invention is described in further detail below in conjunction with specific embodiment.
Embodiment 1
A kind of power electronic devices casting glue of the present embodiment, includes the raw material of following parts by weight：
Component A：70 parts of vinyl silicone oil, 28 parts of brominated epoxy resin, 3 parts of containing hydrogen silicone oil, 1 part of coupling agent, epoxy acetylricinoleate
6 parts of methyl oleate；
B component：90 parts of vinyl silicone oil, 1 part of platinum catalyst, 5 parts of antimony oxide, 20 parts of magnesium hydroxide, 8 parts of boron carbide, carbon
Sour 15 parts of calcium, 2 parts of carbon black, 11 parts of polyorganosiloxane resin, 7 parts of ATBC, 0.5 part of antistatic additive.
In the present embodiment, vinyl silicone oil is end-vinyl dimethyl silicone polymer and the poly- methyl ethylene silicon of end-vinyl
The mixture of oxygen alkane, weight ratio between the two is 6:1.
In the present embodiment, containing hydrogen silicone oil is containing hydrogen silicone oil of the hydrogen content 1.65%.
In the present embodiment, antimony oxide, magnesium hydroxide, the mesh number of carbon black and boron carbide are 400 mesh, and calcium carbonate is 600
Mesh precipitated calcium carbonate.
In the present embodiment, antistatic additive is polyethylene glycol methacrylic acid copolymer body, polyether ester amides, polyether ester second
Acid amides, polyethylene glycol oxide, the mixture of epoxypropane copolymerization thing.
In the present embodiment, coupling agent be silane coupler, titanate coupling agent and zirconium class coupling agent mixture, three it
Between weight ratio be 4:2:1.
The present embodiment additionally provides a kind of preparation method of power electronic devices casting glue, comprises the following steps：
（1）, by above-mentioned parts by weight weigh various raw materials；
（2）, component A preparation：By vinyl silicone oil, brominated epoxy resin, containing hydrogen silicone oil, coupling agent, epoxy acetylated castor oil
Sour methyl esters is added in mixer, and it is 40 DEG C to control temperature, and stir acquisition component A；
（3）, B component preparation：Platinum catalyst, antimony oxide, magnesium hydroxide, boron carbide, calcium carbonate, carbon black are added another
In mixer after stirring 20min, vinyl silicone oil, polyorganosiloxane resin, ATBC, antistatic additive are added, stirring is equal
Even acquisition B component；
（4）, by component A and B component by weight being 7:1 is well mixed, and casting glue is obtained after vacuum distillation.
Wherein,
Step（2）Mixing speed be 400r/min, step（3）In mixing speed be 220r/min.
Embodiment 2
A kind of power electronic devices casting glue of the present embodiment, includes the raw material of following parts by weight：
Component A：75 parts of vinyl silicone oil, 30 parts of brominated epoxy resin, 4 parts of containing hydrogen silicone oil, 2 parts of coupling agent, epoxy acetylricinoleate
7 parts of methyl oleate；
B component：90-100 parts of vinyl silicone oil, 4 parts of platinum catalyst, 6 parts of antimony oxide, 22 parts of magnesium hydroxide, boron carbide 9
Part, 16 parts of calcium carbonate, 3 parts of carbon black, 13 parts of polyorganosiloxane resin, 8 parts of ATBC, 0.8 part of antistatic additive.
In the present embodiment, vinyl silicone oil is end-vinyl dimethyl silicone polymer and the poly- methyl ethylene silicon of end-vinyl
The mixture of oxygen alkane, weight ratio between the two is 6:1.
In the present embodiment, containing hydrogen silicone oil is containing hydrogen silicone oil of the hydrogen content 1.7%.
In the present embodiment, antimony oxide, magnesium hydroxide, the mesh number of carbon black and boron carbide are 400 mesh, and calcium carbonate is 600
Mesh precipitated calcium carbonate.
In the present embodiment, antistatic additive is polyethylene glycol methacrylic acid copolymer body, polyether ester amides, polyether ester second
Acid amides, polyethylene glycol oxide, the mixture of epoxypropane copolymerization thing.
In the present embodiment, coupling agent be silane coupler, titanate coupling agent and zirconium class coupling agent mixture, three it
Between weight ratio be 4:2:1.
The present embodiment additionally provides a kind of preparation method of power electronic devices casting glue, comprises the following steps：
（1）, by above-mentioned parts by weight weigh various raw materials；
（2）, component A preparation：By vinyl silicone oil, brominated epoxy resin, containing hydrogen silicone oil, coupling agent, epoxy acetylated castor oil
Sour methyl esters is added in mixer, and it is 45 DEG C to control temperature, and stir acquisition component A；
（3）, B component preparation：Platinum catalyst, antimony oxide, magnesium hydroxide, boron carbide, calcium carbonate, carbon black are added another
In mixer after stirring 20min, vinyl silicone oil, polyorganosiloxane resin, ATBC, antistatic additive are added, stirring is equal
Even acquisition B component；
（4）, by component A and B component by weight being 7:1 is well mixed, and casting glue is obtained after vacuum distillation.
Wherein,
Step（2）Mixing speed be 430r/min, step（3）In mixing speed be 230r/min.
Embodiment 3
A kind of power electronic devices casting glue of the present embodiment, includes the raw material of following parts by weight：
Component A：80 parts of vinyl silicone oil, 32 parts of brominated epoxy resin, 5 parts of containing hydrogen silicone oil, 3 parts of coupling agent, epoxy acetylricinoleate
8 parts of methyl oleate；
B component：100 parts of vinyl silicone oil, 6 parts of platinum catalyst, 7 parts of antimony oxide, 24 parts of magnesium hydroxide, 10 parts of boron carbide,
17 parts of calcium carbonate, 4 parts of carbon black, 15 parts of polyorganosiloxane resin, 9 parts of ATBC, 1 part of antistatic additive.
In the present embodiment, vinyl silicone oil is end-vinyl dimethyl silicone polymer and the poly- methyl ethylene silicon of end-vinyl
The mixture of oxygen alkane, weight ratio between the two is 6:1.
In the present embodiment, containing hydrogen silicone oil is containing hydrogen silicone oil of the hydrogen content 1.75%.
In the present embodiment, antimony oxide, magnesium hydroxide, the mesh number of carbon black and boron carbide are 400 mesh, and calcium carbonate is 600
Mesh precipitated calcium carbonate.
In the present embodiment, antistatic additive is polyethylene glycol methacrylic acid copolymer body, polyether ester amides, polyether ester second
Acid amides, polyethylene glycol oxide, the mixture of epoxypropane copolymerization thing.
In the present embodiment, coupling agent be silane coupler, titanate coupling agent and zirconium class coupling agent mixture, three it
Between weight ratio be 4:2:1.
The present embodiment additionally provides a kind of preparation method of power electronic devices casting glue, comprises the following steps：
（1）, by above-mentioned parts by weight weigh various raw materials；
（2）, component A preparation：By vinyl silicone oil, brominated epoxy resin, containing hydrogen silicone oil, coupling agent, epoxy acetylated castor oil
Sour methyl esters is added in mixer, and it is 50 DEG C to control temperature, and stir acquisition component A；
（3）, B component preparation：Platinum catalyst, antimony oxide, magnesium hydroxide, boron carbide, calcium carbonate, carbon black are added another
In mixer after stirring 20min, vinyl silicone oil, polyorganosiloxane resin, ATBC, antistatic additive are added, stirring is equal
Even acquisition B component；
（4）, by component A and B component by weight being 7:1 is well mixed, and casting glue is obtained after vacuum distillation.
Wherein,
Step（2）Mixing speed be 450r/min, step（3）In mixing speed be 250r/min.
Described above is only the preferred embodiment of the present invention, and protection scope of the present invention is not limited merely to above-mentioned implementation
Example, all technical schemes belonged under thinking of the present invention belong to protection scope of the present invention.It should be pointed out that for the art
Those of ordinary skill for, some improvements and modifications without departing from the principles of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (8)
1. a kind of power electronic devices casting glue, it is characterised in that：Include the raw material of following parts by weight：
Component A：70-80 parts of vinyl silicone oil, 28-32 parts of brominated epoxy resin, 3-5 parts of containing hydrogen silicone oil, 1-3 parts of coupling agent, ring
6-8 parts of oxygen methyl acetylricinolate；
B component：90-100 parts of vinyl silicone oil, 1-6 parts of platinum catalyst, 5-7 parts of antimony oxide, 20-24 parts of magnesium hydroxide, carbon
Change 8-10 part of boron, 15-17 parts of calcium carbonate, 2-4 parts of carbon black, 11-15 parts of polyorganosiloxane resin, 7-9 parts of ATBC, resist it is quiet
Electric agent 0.5-1 parts.
2. power electronic devices casting glue according to claim 1, it is characterised in that：Vinyl silicone oil is end-vinyl
The mixture of dimethyl silicone polymer and end-vinyl Polymethyl methacrylate, weight ratio between the two is 6:1.
3. power electronic devices casting glue according to claim 1, it is characterised in that：Containing hydrogen silicone oil is that hydrogen content exists
1.65-1.75% containing hydrogen silicone oil.
4. power electronic devices casting glue according to claim 1, it is characterised in that：Antimony oxide, magnesium hydroxide,
The mesh number of carbon black and boron carbide is 400 mesh, and calcium carbonate is 600 mesh precipitated calcium carbonates.
5. power electronic devices casting glue according to claim 1, it is characterised in that：Antistatic additive is polyethylene second two
Alcohol methacrylic acid copolymer body, polyether ester amides, polyether ester acetamide, polyethylene glycol oxide, one kind of epoxypropane copolymerization thing
Or more than two kinds of mixture.
6. power electronic devices casting glue according to claim 1, it is characterised in that：Coupling agent be silane coupler,
Weight ratio between the mixture of titanate coupling agent and zirconium class coupling agent, three is 4:2:1.
7. a kind of preparation method of power electronic devices casting glue according to claim 1-6 any one, its feature
It is：Comprise the following steps：
（1）, by above-mentioned parts by weight weigh various raw materials；
（2）, component A preparation：By vinyl silicone oil, brominated epoxy resin, containing hydrogen silicone oil, coupling agent, epoxy acetylated castor oil
Sour methyl esters is added in mixer, and it is 40-50 DEG C to control temperature, and stir acquisition component A；
（3）, B component preparation：Platinum catalyst, antimony oxide, magnesium hydroxide, boron carbide, calcium carbonate, carbon black are added another
In mixer after stirring 20min, vinyl silicone oil, polyorganosiloxane resin, ATBC, antistatic additive are added, stirring is equal
Even acquisition B component；
（4）, by component A and B component by weight being 7:1 is well mixed, and casting glue is obtained after vacuum distillation.
8. the preparation method of power electronic devices casting glue according to claim 7, it is characterised in that：Step（2）'s
Mixing speed is 400-450r/min, step（3）In mixing speed be 220-250r/min.
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| CN201710617923.5A CN107227026A (en) | 2017-07-26 | 2017-07-26 | A kind of power electronic devices casting glue and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108504315A (en) * | 2018-03-12 | 2018-09-07 | 合肥同佑电子科技有限公司 | A kind of high temperature resistant casting glue and preparation method thereof |
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| CN103146340A (en) * | 2013-03-06 | 2013-06-12 | 广州市高士实业有限公司 | Low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and preparation method thereof |
| CN103265929A (en) * | 2013-06-20 | 2013-08-28 | 李季 | Preparation method for carbon nano tube antiflaming heat conducting organic silicone pouring sealant |
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| CN105969300A (en) * | 2016-05-31 | 2016-09-28 | 苏州市奎克力电子科技有限公司 | Pouring sealant for power electronic device |
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2017
- 2017-07-26 CN CN201710617923.5A patent/CN107227026A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103146340A (en) * | 2013-03-06 | 2013-06-12 | 广州市高士实业有限公司 | Low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and preparation method thereof |
| CN103265929A (en) * | 2013-06-20 | 2013-08-28 | 李季 | Preparation method for carbon nano tube antiflaming heat conducting organic silicone pouring sealant |
| CN104845379A (en) * | 2015-04-30 | 2015-08-19 | 浙江理工大学 | Solvent-free type organic silicone pouring sealant and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108504315A (en) * | 2018-03-12 | 2018-09-07 | 合肥同佑电子科技有限公司 | A kind of high temperature resistant casting glue and preparation method thereof |
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Application publication date: 20171003 |