CN105670555A - High heat conductivity organosilicon potting compound - Google Patents
High heat conductivity organosilicon potting compound Download PDFInfo
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- CN105670555A CN105670555A CN201610041064.5A CN201610041064A CN105670555A CN 105670555 A CN105670555 A CN 105670555A CN 201610041064 A CN201610041064 A CN 201610041064A CN 105670555 A CN105670555 A CN 105670555A
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- Prior art keywords
- component
- silicone oil
- powder
- environmental protection
- organic silicon
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a high heat conductivity organosilicon potting compound, comprising component A and component B.The organosilicon potting compound is made from materials according to percent by weight: 40% of vinyl silicone oil, 10% of dimethyl silicone oil, 20% of heat conductive environment-friendly alumina powder, 12% of environment-friendly flame-retardant powder, 14% of heat conductive environment-friendly silica powder, and 4% of other aids; the other aids include platinum complex, hydrogen-containing silicone oil, a coupling agent, a lowering agent, dimethyl-silane, a retarder, and a defoaming agent; the component A and the component B are distinguished by using the other aids of different composition; a making process of the organosilicon potting compound includes: placing the vinyl silicone oil and the dimethyl silicone oil into a vacuum mixer, stirring, pouring in the heat conductive environment-friendly alumina powder, the environment-friendly flame-retardant powder, the heat conductive environment-friendly silica powder and white carbon black proportionally, starting the vacuum mixer and heating to 100 DEG C, stirring and evacuating for 40 min, pouring in a grinding machine for grinding, and packaging.
Description
Technical field
The present invention relates to electron pouring sealant technical field, particularly to the organic silicon potting adhesive of a kind of high heat-conducting type.
Background technology
Electron pouring sealant belongs to liquid before uncured, has mobility, glue viscosity according to the material of product, performance, the difference of production technology and otherwise varied. Casting glue could realize its use value after being fully cured, can play waterproof and dampproof, dust-proof, insulation, heat conduction, secrecy, anticorrosion, heatproof, shockproof effect after solidification. The one of which of electron pouring sealant and organosilicon material due to have the high-low temperature resistant of excellence, weather-proof and electrical insulation capability and be widely used in electronics embedding field, but due to its poor thermal conductivity, thermal conductivity only has 0.2W/m about K, cause that heat produced by electronic equipment cannot distribute in time, so that the reliability of electronic devices and components and life-span decline.
Therefore, how realizing a kind of bi-component addition type, heat conductivity is high, and the good organic silicon potting adhesive of combination property is technical problem urgently to be resolved hurrily in the industry.
Summary of the invention
The main purpose of the present invention is to provide the organic silicon potting adhesive of a kind of high heat-conducting type, it is intended to realize a kind of bi-component addition type, and heat conductivity is high, the organic silicon potting adhesive that combination property is good.
The present invention proposes the organic silicon potting adhesive of a kind of high heat-conducting type, including mixing the component A of use, B component, the percentage by weight of the main making raw material of organic silicon potting adhesive is as follows: vinyl silicone oil 40%, dimethicone 10%, heat conduction environmental protection alumina powder 20%, environmental protection flame retardant powder 12%, heat conduction environmental protection silicon powder 14%, other auxiliary agents 4%, other auxiliary agents include platinum chromium thing, containing hydrogen silicone oil, coupling agent, drop material agent, dimethylamino silane, delayed-action activator, defoamer, and component A and B component are by adopting other auxiliary agents of heterogeneity to make a distinction, the manufacturing process of organic silicon potting adhesive is as follows: first weighs required vinyl silicone oil and dimethicone with percentage by weight and puts into vacuum mixing machine, it is then turned on vacuum mixing machine and carries out stirring operation, pour heat conduction environmental protection alumina powder more in proportion into, environmental protection flame retardant powder, heat conduction environmental protection silicon powder, and pour appropriate white carbon into, then start vacuum mixing machine and be warmed up to 100 DEG C, it is stirred married operation in vacuum mixing machine and carries out vacuum pumping simultaneously, persistent period is 40 minutes, subsequently the object in vacuum mixing machine is poured into and grinder is ground operation makes it more fine and smooth uniformly, packaging operation can be carried out after completing.
Preferably, vinyl silicone oil is made up of end-vinyl polydimethylsiloxane and end-vinyl Polymethyl methacrylate.
The present invention is the electron pouring sealant of a kind of high heat-conducting type, is the organic electronic casting glue of a kind of bi-component addition type. It is made up of component A, two kinds of liquid of B component. Component A is Lycoperdon polymorphum Vitt or black, and B component is white. When two components are sufficiently mixed with the weight ratio of 1:1 or volume ratio, mixed liquor is known from experience and is solidified into a flexible elastomer. Can in cold curing, it is also possible to heat within 60 degree and accelerate to solidify, the phenomenon of material ungauged regions and intensification in solidification process. Having an excellent mobility, A, B two can levelling automatically after component mixing. Sizing material is elastomer after solidifying, and has the cold-and-heat resistent switching performance of brilliance and resistance to outdoor aging performance. It solidify to form the rubber-like of softness, good impact resistance, there is thermostability, moisture resistivity, tolerance to cold, insulation, antidetonation, Inverter fed motor, tracking-resistant and chemical mediator-resitant property. And adhesive force is strong, and contact material not producing corrosiveness, be non-staining novel environment friendly product, the organic silicon potting adhesive long-term work of the present invention is not shunk, indeformable, nothing be full of cracks. Can be widely applied in the embedding of electronic product, the pouring technologies such as power supply, transformator, ignition coil, trigger, reactor, resistor. It addition, phenomenon that is poisoning and that cause colloid not done easily occurs when present invention, avoiding the solidification that existing electron pouring sealant often occurs in use, reduce the disqualification rate of product, thus improving production efficiency. Additionally, dimethicone has heat conductivity, the heat conductivility of this organic silicon potting adhesive can be improved, the heat conductivility of heat conduction environmental protection alumina powder is strong, can improving the heat conductivility of this organic silicon potting adhesive, heat conduction environmental protection silicon powder heat conductivility after modified is high, can improve the heat conductivility of this organic silicon potting adhesive, therefore, this organic silicon potting adhesive has higher heat conductivility. Present invention achieves a kind of bi-component addition type, heat conductivity is high, the organic silicon potting adhesive that combination property is good.
Detailed description of the invention
Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention.
One embodiment of the organic silicon potting adhesive of a kind of high heat-conducting type of the present invention is now proposed, including mixing the component A of use, B component, the percentage by weight of the main making raw material of organic silicon potting adhesive is as follows: vinyl silicone oil 40%, dimethicone 10%, heat conduction environmental protection alumina powder 20%, environmental protection flame retardant powder 12%, heat conduction environmental protection silicon powder 14%, other auxiliary agents 4%.
Other auxiliary agents include platinum chromium thing, containing hydrogen silicone oil, coupling agent, drop material agent, dimethylamino silane, delayed-action activator, defoamer, and component A and B component are by adopting other auxiliary agents of heterogeneity to make a distinction.
The manufacturing process of organic silicon potting adhesive is as follows: first weighs required vinyl silicone oil and dimethicone with percentage by weight and puts into vacuum mixing machine, it is then turned on vacuum mixing machine and carries out stirring operation, pour heat conduction environmental protection alumina powder more in proportion into, environmental protection flame retardant powder, heat conduction environmental protection silicon powder, and pour appropriate white carbon into, then start vacuum mixing machine and be warmed up to 100 DEG C, it is stirred married operation in vacuum mixing machine and carries out vacuum pumping simultaneously, persistent period is 40 minutes, subsequently the object in vacuum mixing machine is poured into and grinder is ground operation makes it more fine and smooth uniformly, packaging operation can be carried out after completing.
Vinyl silicone oil is made up of end-vinyl polydimethylsiloxane and end-vinyl Polymethyl methacrylate, outward appearance is colourless or light yellow transparent liquid, it is commonly used for the base material producing high-temperature silicon disulfide rubber, is equipped with that cross-linking agent, reinforcing agent, coloring agent, constitution controller, antiager etc. are mixing prepares high-temperature sulfuration silicon rubber raw rubber.React with the multiple organic material such as polyurethane, acrylic acid, can be made into the new material that performance is more superior, as having weather-proof, ageing-resistant, uvioresistant, enhancing toughness etc. Vinyl silicone oil is the sizing producing addition-type silicon rubber, improves its material resources mechanical performance such as mobility, tear resistance. As silicone rubber produce in filling time can strengthen the intensity of silicone rubber, hardness. Can be used for making liquid silastic, be the main material of injection thermoforming silicone rubber.
Dimethicone is tasteless nontoxic, has good thermostability, tolerance to cold, and viscosity is little with variation of ambient temperature, having physiological inertia, good chemical stability, electrical insulating property and weatherability, range of viscosities is wide, and freezing point is low, flash-point is high, and hydrophobic performance is good, and has significantly high anti-shear ability. Having heat conductivity, heat conductivity is 0.134-0.159W/m K, and so, the heat conductivility allowing for this organic silicon potting adhesive is strong. It addition, dimethicone has good physical characteristic, can be directly used for the aspects such as electric insulation, the demoulding, froth breaking, damping, shockproof, rolling, dust-proof, waterproof, height be moistening.
Heat conduction environmental protection alumina powder is the white powder crystallization generated under hot conditions, and the crystalline powder of aluminium oxide is numerous, and the aluminium oxide for heat conduction has ball-aluminium oxide, compound oxidizing aluminum. Heat conduction aluminium oxide high fillibility, its even particle size distribution, coupling modifier is reasonable, rational size distribution, can obtain that viscosity is low, the mixture of good fluidity. Heat conduction aluminium oxide has acid and alkali-resistance, high temperature resistant, and the feature that surface property is low, thus the product heat conductivility used under different condition is strong, the heat conductivility of this organic silicon potting adhesive can be improved, be widely used in various silica gel, casting glue, plastics, rubber, heat conduction and heat radiation pottery.
Environmental protection flame retardant powder stable chemical nature at normal temperatures is high, is heated after reaching 220 DEG C and starts endothermic decomposition releases three water of crystallization, and temperature, when 300 DEG C, loses two water of crystallization and is changed into boehmite. More than heat absorption dehydration has delayed the burning of polymer. Endothermic decomposition is based on absorbing heat in a large number when environmental protection flame retardant powder decomposes, and discharges steam when decomposes, and without producing poisonous or corrosive gas, environmental protection flame retardant powder can as the filler of good stability.
Heat conduction environmental protection silicon powder is a kind of environment-friendly materials nontoxic, tasteless, free of contamination. Senior white micropowder, possesses temperature tolerance good, the feature of acid-alkali-corrosive-resisting, and heat conductivility is high after modified, can improve the heat conductivility of this organic silicon potting adhesive, has height and insulate, low bulk, stable chemical performance, and the premium properties that hardness is big can as inserts.
The present invention is the electron pouring sealant of a kind of high heat-conducting type, is the organic electronic casting glue of a kind of bi-component addition type. It is made up of component A, two kinds of liquid of B component. Component A is Lycoperdon polymorphum Vitt or black, and B component is white. When two components are sufficiently mixed with the weight ratio of 1:1 or volume ratio, mixed liquor is known from experience and is solidified into a flexible elastomer. Can in cold curing, it is also possible to heat within 60 degree and accelerate to solidify, the phenomenon of material ungauged regions and intensification in solidification process. Having an excellent mobility, A, B two can levelling automatically after component mixing. Sizing material is elastomer after solidifying, and has the cold-and-heat resistent switching performance of brilliance and resistance to outdoor aging performance. It solidify to form the rubber-like of softness, good impact resistance, there is thermostability, moisture resistivity, tolerance to cold, insulation, antidetonation, Inverter fed motor, tracking-resistant and chemical mediator-resitant property.And adhesive force is strong, and contact material not producing corrosiveness, be non-staining novel environment friendly product, the organic silicon potting adhesive long-term work of the present invention is not shunk, indeformable, nothing be full of cracks. Can be widely applied in the embedding of electronic product, the pouring technologies such as power supply, transformator, ignition coil, trigger, reactor, resistor. It addition, phenomenon that is poisoning and that cause colloid not done easily occurs when present invention, avoiding the solidification that existing electron pouring sealant often occurs in use, reduce the disqualification rate of product, thus improving production efficiency. Additionally, dimethicone has heat conductivity, the heat conductivility of this organic silicon potting adhesive can be improved, the heat conductivility of heat conduction environmental protection alumina powder is strong, can improving the heat conductivility of this organic silicon potting adhesive, heat conduction environmental protection silicon powder heat conductivility after modified is high, can improve the heat conductivility of this organic silicon potting adhesive, therefore, this organic silicon potting adhesive has higher heat conductivility. Present invention achieves a kind of bi-component addition type, heat conductivity is high, the organic silicon potting adhesive that combination property is good.
The foregoing is only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure transformation utilizing description of the present invention to make, or directly or indirectly it is used in other relevant technical fields, all in like manner include in the scope of patent protection of the present invention.
Claims (2)
1. the organic silicon potting adhesive of a high heat-conducting type, it is characterized in that, including mixing the component A of use, B component, the percentage by weight of the main making raw material of organic silicon potting adhesive is as follows: vinyl silicone oil 40%, dimethicone 10%, heat conduction environmental protection alumina powder 20%, environmental protection flame retardant powder 12%, heat conduction environmental protection silicon powder 14%, other auxiliary agents 4%;
Other auxiliary agents include platinum chromium thing, containing hydrogen silicone oil, coupling agent, drop material agent, dimethylamino silane, delayed-action activator, defoamer, and component A and B component are by adopting other auxiliary agents of heterogeneity to make a distinction;
The manufacturing process of organic silicon potting adhesive is as follows: first weighs required vinyl silicone oil and dimethicone with percentage by weight and puts into vacuum mixing machine, it is then turned on vacuum mixing machine and carries out stirring operation, pour heat conduction environmental protection alumina powder more in proportion into, environmental protection flame retardant powder, heat conduction environmental protection silicon powder, and pour appropriate white carbon into, then start vacuum mixing machine and be warmed up to 100 DEG C, it is stirred married operation in vacuum mixing machine and carries out vacuum pumping simultaneously, persistent period is 40 minutes, subsequently the object in vacuum mixing machine is poured into and grinder is ground operation makes it more fine and smooth uniformly, packaging operation can be carried out after completing.
2. the organic silicon potting adhesive of a kind of high heat-conducting type according to claim 1, it is characterised in that vinyl silicone oil is made up of end-vinyl polydimethylsiloxane and end-vinyl Polymethyl methacrylate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610041064.5A CN105670555A (en) | 2016-01-22 | 2016-01-22 | High heat conductivity organosilicon potting compound |
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| CN201610041064.5A CN105670555A (en) | 2016-01-22 | 2016-01-22 | High heat conductivity organosilicon potting compound |
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| CN201610041064.5A Pending CN105670555A (en) | 2016-01-22 | 2016-01-22 | High heat conductivity organosilicon potting compound |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107286902A (en) * | 2017-07-12 | 2017-10-24 | 东莞市佳乾新材料科技有限公司 | A kind of preparation method of high heat conduction organosilicon filling and sealing gum |
| WO2018010672A1 (en) * | 2016-07-15 | 2018-01-18 | 杨金海 | Novel inflation-free anti-puncture explosion-proof wheel assembly and manufacturing method therefor |
| US10428257B2 (en) | 2014-07-07 | 2019-10-01 | Honeywell International Inc. | Thermal interface material with ion scavenger |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| CN110982483A (en) * | 2019-10-16 | 2020-04-10 | 上海阿莱德实业股份有限公司 | Self-curing heat-conducting adhesive for smart phone and use method thereof |
| CN111139025A (en) * | 2019-12-31 | 2020-05-12 | 苏州桐力光电股份有限公司 | Graphene hydrogel and preparation method thereof |
| WO2020164248A1 (en) * | 2019-02-11 | 2020-08-20 | 重庆泰山电缆有限公司 | Silicone rubber formula and preparation method therefor |
| US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103131381A (en) * | 2013-03-06 | 2013-06-05 | 广州市高士实业有限公司 | High-performance environmentally-friendly flame retardant type organic electron pouring sealant and preparation method thereof |
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2016
- 2016-01-22 CN CN201610041064.5A patent/CN105670555A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103131381A (en) * | 2013-03-06 | 2013-06-05 | 广州市高士实业有限公司 | High-performance environmentally-friendly flame retardant type organic electron pouring sealant and preparation method thereof |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10428257B2 (en) | 2014-07-07 | 2019-10-01 | Honeywell International Inc. | Thermal interface material with ion scavenger |
| US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
| WO2018010672A1 (en) * | 2016-07-15 | 2018-01-18 | 杨金海 | Novel inflation-free anti-puncture explosion-proof wheel assembly and manufacturing method therefor |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| CN107286902A (en) * | 2017-07-12 | 2017-10-24 | 东莞市佳乾新材料科技有限公司 | A kind of preparation method of high heat conduction organosilicon filling and sealing gum |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| WO2020164248A1 (en) * | 2019-02-11 | 2020-08-20 | 重庆泰山电缆有限公司 | Silicone rubber formula and preparation method therefor |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| CN110982483A (en) * | 2019-10-16 | 2020-04-10 | 上海阿莱德实业股份有限公司 | Self-curing heat-conducting adhesive for smart phone and use method thereof |
| CN111139025A (en) * | 2019-12-31 | 2020-05-12 | 苏州桐力光电股份有限公司 | Graphene hydrogel and preparation method thereof |
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Application publication date: 20160615 |