CN103756631A - Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant - Google Patents
Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant Download PDFInfo
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- CN103756631A CN103756631A CN201410010757.9A CN201410010757A CN103756631A CN 103756631 A CN103756631 A CN 103756631A CN 201410010757 A CN201410010757 A CN 201410010757A CN 103756631 A CN103756631 A CN 103756631A
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- organic silicon
- type flame
- autohension
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 239000000853 adhesive Substances 0.000 title claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 18
- 239000010703 silicon Substances 0.000 title claims abstract description 18
- 239000003063 flame retardant Substances 0.000 title claims abstract description 12
- 239000000565 sealant Substances 0.000 title abstract description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 31
- 239000007822 coupling agent Substances 0.000 claims abstract description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003054 catalyst Substances 0.000 claims abstract description 7
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 7
- 239000003112 inhibitor Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims description 14
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 14
- 238000004382 potting Methods 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 10
- 239000011231 conductive filler Substances 0.000 claims description 9
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical group [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 5
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 2
- 239000007795 chemical reaction product Substances 0.000 claims description 2
- 230000009977 dual effect Effects 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 2
- 229920002545 silicone oil Polymers 0.000 abstract description 7
- 230000003287 optical effect Effects 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract 1
- 230000007774 longterm Effects 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 description 9
- 239000000047 product Substances 0.000 description 4
- -1 3 parts of tackifier Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 3
- 230000008676 import Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 238000005987 sulfurization reaction Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229920000260 silastic Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant. The double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant comprises a component A and a component B and is characterized in that the component A is prepared by mixing a basic material, a platinum catalyst and a coupling agent in mass ratio of 100:(0.00001-0.1):(0.1-1); the component B is formed by mixing a basic material, a coupling agent, an inhibitor and a tackifier in mass ratio of 100: (0.2-1.0):(0.01-1):(1-10); the basic material is formed by mixing vinyl-terminated silicone oil, heat-conducting filler and a flame retardant in mass ratio of 100: (120-160):(20-40). The double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant has good optical performance, heat conduction property and relatively good viscosity and can meet the long-term using requirements in high and low temperature environments.
Description
Technical field
The present invention relates to Embedding Material technical field, particularly relate to a kind of two component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive.
Background technology
Along with electronics is constantly integrated into more powerful function in less assembly, flame retardant resistance and the thermal conductivity of electronic component to joint sealant had higher requirement.Add-on type liquid silicon rubber has that no coupling product when crosslinked discharges, shrinking percentage is little, cross-linking density and the feature such as vulcanization rate is easy to control, is the desirable body material of electronic apparatus joint sealant.But addition-type silicon rubber is because molecule itself is nonpolar, cementability is poor, and while using as electronics embedding, coating material, moisture can infiltrate device inside by the space between rubber and base material and cause corrosion and failure of insulation.Use silane coupling agent substrate surface to be processed to the cementability that can improve additional organosilicon material and various materials; But this method has increased production process and production time, solvent evaporates during use causes again unnecessary environmental pollution.Carbonic ether has excellent insulativity, good flame retardancy and dimensional stability, is widely used in electronic apparatus as shell, body and timbering material.The various aminosilanes that condensed type liquid silastic is conventional have better cementability to PC, but add-on type liquid silicon rubber is had poisoning effect and can not be used.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of two component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, has good optical property, heat conductivility and good viscosity, and can meet the requirement of life-time service under high and low temperature environment.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is:
A kind of two component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive is provided, comprise A component and B component, described A component is mixed according to ratio of quality and the number of copies 100:0.00001 ~ 0.1:0.1 ~ 1 by base-material, platinum catalyst and coupling agent, described B component is mixed according to ratio of quality and the number of copies 100:0.2 ~ 1:0.01 ~ 1:1 ~ 10 by base-material, coupling agent, inhibitor and tackifier, and described base-material is mixed according to ratio of quality and the number of copies 100:120 ~ 160:20 ~ 40 by vinyl-terminated silicone fluid, heat conductive filler and fire retardant.
In a preferred embodiment of the present invention, the described heat conductive filler in described base-material is aluminum oxide, and described fire retardant is aluminium hydroxide.
In a preferred embodiment of the present invention, as the described aluminum oxide of heat conductive filler, for the aluminum oxide with different-grain diameter forms according to extra fine quality portion rate mixed preparing.
In a preferred embodiment of the present invention, as the described aluminum oxide of heat conductive filler, be that the alumina raw material of 5 μ m and two kinds of particle diameters of 15 μ m forms according to ratio of quality and the number of copies 1:2 mixed preparing.
In a preferred embodiment of the present invention, described coupling agent is the mixture of vinyltrimethoxy silane and gamma-methyl allyl acyloxypropyl trimethoxysilane.
In a preferred embodiment of the present invention, described tackifier are the reaction product of TriMethylolPropane(TMP) diallyl, γ-glycidoxypropyltrimethoxy silane and tetraethoxy.
In a preferred embodiment of the present invention, described A component mixes and then carries out vacuum defoamation according to ratio of quality and the number of copies 1:1 with described B component, at room temperature vulcanizes 15 ~ 40h and makes described dual composition addition type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive.
The invention has the beneficial effects as follows: a kind of two component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesives of the present invention, there is excellent chemical property, wherein in base-material, be filled with heat conductive filler, can realize higher fill-up, improve thermal conductivity and the mobility of joint sealant, the also use of fire retardant and platinum catalyst has improved the flame retardant properties of joint sealant, the present invention is without silane coupling agent, under the heating condition of 90 ℃, PC and aluminium etc. is had to good cementability, there is good over-all properties.
Embodiment
Below preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
Embodiment 1:
(1) preparation of base-material: 100 parts of vinyl silicone oils, 150 parts of aluminum oxide, 30 parts of aluminium hydroxides are added in high speed dispersor and mixed, and vacuumizing and defoaming, makes base-material.Wherein aluminum oxide, containing the alumina raw material of two kinds of particle diameters of 5 μ m and 15 μ m, forms according to ratio of quality and the number of copies 1:2 mixed preparing.
(2) preparation of A component: get 100 parts of base-materials, the platinum catalyst of 0.000015 part, the coupling agent of 0.5 part, mix vacuumizing and defoaming in high speed dispersor.
(3) preparation of B component: get 100 parts of base-materials, 8 parts of containing hydrogen silicone oils, 0.5 part of coupling agent, 0.05 part of inhibitor, 3 parts of tackifier, mix vacuumizing and defoaming in high speed dispersor.
(4) the A component of being prepared by above-mentioned steps mixes deaeration with B component according to mass ratio 1:1, imports in mould, vulcanizes at ambient temperature 24 hours or in 90 ℃ of sulfurations 30 minutes, makes finished product.
Embodiment 2:
(1) preparation of base-material: 100 parts of vinyl silicone oils, 155 parts of aluminum oxide, 32 parts of aluminium hydroxides are added in high speed dispersor and mixed, and vacuumizing and defoaming, makes base-material.Wherein aluminum oxide, containing the alumina raw material of two kinds of particle diameters of 5 μ m and 15 μ m, forms according to ratio of quality and the number of copies 1:2 mixed preparing.
(2) preparation of A component: get 100 parts of base-materials, the platinum catalyst of 0.000018 part, the coupling agent of 0.5 part, mix vacuumizing and defoaming in high speed dispersor.
(3) preparation of B component: get 100 parts of base-materials, 8 parts of containing hydrogen silicone oils, 0.45 part of coupling agent, 0.05 part of inhibitor, 3 parts of tackifier, mix vacuumizing and defoaming in high speed dispersor.
(4) the A component of being prepared by above-mentioned steps mixes deaeration with B component according to mass ratio 1:1, imports in mould, vulcanizes at ambient temperature 24 hours or in 90 ℃ of sulfurations 30 minutes, makes finished product.
Embodiment 3:
(1) preparation of base-material: 100 parts of vinyl silicone oils, 148 parts of aluminum oxide, 30 parts of aluminium hydroxides are added in high speed dispersor and mixed, and vacuumizing and defoaming, makes base-material.Wherein aluminum oxide, containing the alumina raw material of two kinds of particle diameters of 5 μ m and 15 μ m, forms according to ratio of quality and the number of copies 1:2 mixed preparing.
(2) preparation of A component: get 100 parts of base-materials, the platinum catalyst of 0.000012 part, the coupling agent of 0.5 part, mix vacuumizing and defoaming in high speed dispersor.
(3) preparation of B component: get 100 parts of base-materials, 8 parts of containing hydrogen silicone oils, 0.5 part of coupling agent, 0.05 part of inhibitor, 3 parts of tackifier, mix vacuumizing and defoaming in high speed dispersor.
(4) the A component of being prepared by above-mentioned steps mixes deaeration with B component according to mass ratio 1:1, imports in mould, vulcanizes at ambient temperature 24 hours or in 90 ℃ of sulfurations 30 minutes, makes finished product.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (7)
1. a two component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, comprise A component and B component, it is characterized in that, described A component is mixed according to ratio of quality and the number of copies 100:0.00001 ~ 0.1:0.1 ~ 1 by base-material, platinum catalyst and coupling agent, described B component is mixed according to ratio of quality and the number of copies 100:0.2 ~ 1:0.01 ~ 1:1 ~ 10 by base-material, coupling agent, inhibitor and tackifier, and described base-material is mixed according to ratio of quality and the number of copies 100:120 ~ 160:20 ~ 40 by vinyl-terminated silicone fluid, heat conductive filler and fire retardant.
2. according to claim 1 pair of component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, is characterized in that, the described heat conductive filler in described base-material is aluminum oxide, and described fire retardant is aluminium hydroxide.
3. according to claim 2 pair of component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, is characterized in that, as the described aluminum oxide of heat conductive filler, for the aluminum oxide with different-grain diameter forms according to extra fine quality portion rate mixed preparing.
4. according to claim 3 pair of component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, it is characterized in that, as the described aluminum oxide of heat conductive filler, be that the alumina raw material of 5 μ m and two kinds of particle diameters of 15 μ m forms according to ratio of quality and the number of copies 1:2 mixed preparing.
5. according to claim 1 pair of component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, is characterized in that, described coupling agent is the mixture of vinyltrimethoxy silane and gamma-methyl allyl acyloxypropyl trimethoxysilane.
6. according to claim 1 pair of component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, it is characterized in that, described tackifier are the reaction product of TriMethylolPropane(TMP) diallyl, γ-glycidoxypropyltrimethoxy silane and tetraethoxy.
7. according to claim 1 pair of component autohension add-on type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive, it is characterized in that, described A component mixes and then carries out vacuum defoamation according to ratio of quality and the number of copies 1:1 with described B component, at room temperature vulcanizes 15 ~ 40h and makes described dual composition addition type flame-retarded heat-conducting self-vulcanizing organic silicon potting adhesive.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410010757.9A CN103756631B (en) | 2013-11-28 | 2014-01-10 | Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant |
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| CN201310612073 | 2013-11-28 | ||
| CN2013106120731 | 2013-11-28 | ||
| CN201310612073.1 | 2013-11-28 | ||
| CN201410010757.9A CN103756631B (en) | 2013-11-28 | 2014-01-10 | Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant |
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| CN103756631A true CN103756631A (en) | 2014-04-30 |
| CN103756631B CN103756631B (en) | 2015-06-03 |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104312529A (en) * | 2014-10-08 | 2015-01-28 | 卢儒 | Organic silicon heat conduction electronic filling adhesive and preparation method thereof |
| CN105038694A (en) * | 2015-08-12 | 2015-11-11 | 东莞兆舜有机硅科技股份有限公司 | Double-ingredient addition type organic silicon bonding casting glue and use method of casting glue |
| CN105647463A (en) * | 2016-01-25 | 2016-06-08 | 杭州泓源电动汽车有限公司 | Anti-flaming and anti-explosion heat conducting silica gel and use method thereof |
| CN106753205A (en) * | 2017-01-11 | 2017-05-31 | 湖南博翔新材料有限公司 | A kind of low viscosity, the epoxy modified silicone casting glue of high heat conduction and its application |
| CN108034255A (en) * | 2017-10-31 | 2018-05-15 | 东莞市汉品电子有限公司 | High fire-retardance heat-conducting silica gel sheet and its manufacture method |
| CN109054733A (en) * | 2018-09-19 | 2018-12-21 | 深圳市红叶杰科技有限公司 | A kind of bi-component self-adhesion add-on type electron pouring sealant and preparation method thereof |
| CN109439272A (en) * | 2018-12-28 | 2019-03-08 | 中天东方氟硅材料有限公司 | Two-component heat conductive flame-retarding organic silicon potting adhesive composition and its casting glue for electric vehicle and preparation method |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US10428257B2 (en) | 2014-07-07 | 2019-10-01 | Honeywell International Inc. | Thermal interface material with ion scavenger |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| CN110746926A (en) * | 2019-12-02 | 2020-02-04 | 扬州宏远新材料股份有限公司 | Self-adhesive heat-conducting flame-retardant two-component electronic encapsulating silicone rubber and preparation method thereof |
| CN110982074A (en) * | 2019-12-25 | 2020-04-10 | 广州市高士实业有限公司 | Normal-temperature curing tackifier system, preparation method and pouring sealant using same |
| US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
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| CN115612302A (en) * | 2022-09-30 | 2023-01-17 | 福建纳新硅业科技有限公司 | High-strength composite silicone rubber and preparation method thereof |
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| US10428257B2 (en) | 2014-07-07 | 2019-10-01 | Honeywell International Inc. | Thermal interface material with ion scavenger |
| CN104312529A (en) * | 2014-10-08 | 2015-01-28 | 卢儒 | Organic silicon heat conduction electronic filling adhesive and preparation method thereof |
| CN105038694A (en) * | 2015-08-12 | 2015-11-11 | 东莞兆舜有机硅科技股份有限公司 | Double-ingredient addition type organic silicon bonding casting glue and use method of casting glue |
| CN105647463B (en) * | 2016-01-25 | 2018-11-02 | 浙江泓源汽车集团有限公司 | Fire-retardant, the explosion-proof heat conductive silica gel of one kind and its application method |
| CN105647463A (en) * | 2016-01-25 | 2016-06-08 | 杭州泓源电动汽车有限公司 | Anti-flaming and anti-explosion heat conducting silica gel and use method thereof |
| US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| CN106753205B (en) * | 2017-01-11 | 2020-05-22 | 湖南博翔新材料有限公司 | Epoxy modified organic silicon pouring sealant with low viscosity and high heat conductivity and application thereof |
| CN106753205A (en) * | 2017-01-11 | 2017-05-31 | 湖南博翔新材料有限公司 | A kind of low viscosity, the epoxy modified silicone casting glue of high heat conduction and its application |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| CN111373013A (en) * | 2017-10-23 | 2020-07-03 | 霍尼韦尔国际公司 | Peelable thermal gel |
| CN108034255A (en) * | 2017-10-31 | 2018-05-15 | 东莞市汉品电子有限公司 | High fire-retardance heat-conducting silica gel sheet and its manufacture method |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| CN109054733A (en) * | 2018-09-19 | 2018-12-21 | 深圳市红叶杰科技有限公司 | A kind of bi-component self-adhesion add-on type electron pouring sealant and preparation method thereof |
| CN109439272A (en) * | 2018-12-28 | 2019-03-08 | 中天东方氟硅材料有限公司 | Two-component heat conductive flame-retarding organic silicon potting adhesive composition and its casting glue for electric vehicle and preparation method |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| CN110746926A (en) * | 2019-12-02 | 2020-02-04 | 扬州宏远新材料股份有限公司 | Self-adhesive heat-conducting flame-retardant two-component electronic encapsulating silicone rubber and preparation method thereof |
| CN110982074A (en) * | 2019-12-25 | 2020-04-10 | 广州市高士实业有限公司 | Normal-temperature curing tackifier system, preparation method and pouring sealant using same |
| CN115612302A (en) * | 2022-09-30 | 2023-01-17 | 福建纳新硅业科技有限公司 | High-strength composite silicone rubber and preparation method thereof |
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