CN102627943A - Moisture/ultraviolet double-curing organic silicon adhesive - Google Patents
Moisture/ultraviolet double-curing organic silicon adhesive Download PDFInfo
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- CN102627943A CN102627943A CN2012101046130A CN201210104613A CN102627943A CN 102627943 A CN102627943 A CN 102627943A CN 2012101046130 A CN2012101046130 A CN 2012101046130A CN 201210104613 A CN201210104613 A CN 201210104613A CN 102627943 A CN102627943 A CN 102627943A
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Abstract
The invention discloses design preparation of a double-curing organic silicon adhesive. The adhesive comprises the following components in parts by weight: 100-160 parts of polypropylene acyloxy alkoxy organic silicone, 0-150 parts of a silane coupling agent containing a structure, 0-50 parts of a filler, 0.1-5 parts of a catalyst, 1-5 parts of a photoinitiator, 0.1-1 part of an accelerator and 0.1-1 part of a polymerization inhibitor. The double-curing organic silicon adhesive has superior temperature resistance, and can be used at the temperature of between 60 DEG C below zero and 350 DEG C for a long time. The adhesive can be subjected to separate moisture curing or ultraviolet curing, and has higher bonding strength, hardness and the like after ultraviolet radiation; and after ultraviolet light is removed, moisture curing can be performed continually, so that the bonding strength of the adhesive is further improved, and a larger deeper depth is achieved. In an application field where ultraviolet light irradiation is unavailable and high bonding strength is required after curing, the double-curing performance of the adhesive can meet the application requirements of the field.
Description
Technical field
The present invention relates to the designing and preparing of a kind of pair of cured silicone tackiness agent, particularly a kind of not only uV curable but also moisture cured and solidify the higher two functional type tackiness agent that solidify of back cohesive strength.
Background technology
Silicone resin (being also referred to as ZGK 5) is one type and alternately linked by Siliciumatom and Sauerstoffatom and to form skeleton, different organic groups again with the general designation of Siliciumatom banded polymkeric substance.Both contained in the silicone resin structure " organic group "; Contain " inorganic structure " again, this special composition and molecular structure make it integrate organism characteristic and inorganics function, not only can be high temperature resistant; And can be low temperature resistant; Therefore can in awide temperature range, use good weathering resistance, erosion resistance, electric insulation, performances such as anti-ozone, hydrophobic, difficult combustion, physiology inertia.Thereby the organosilicon macromolecule material has all obtained using widely in national economy all respects such as aerospace, electric, chemical machinery, health cares.
Characteristics such as it is efficient, pollution-free, energy-conservation, easy that UV-curing technology has are a kind of eco-friendly green technologies.If on the organopolysiloxane molecular chain, introduce photo curable group, make it to become the ZGK 5 of uV curable, then the efficient of cross-linking and curing reaction will improve greatly, and not only save energy also can reduce pollution.Advantages such as curing speed is fast, efficient is high owing to having for photocuring system, solvent-free and self-vulcanizing are widely used in electronic applications; In some Application Areas, complicated for device, require the excellent temperature tolerance of organic silicon adhesive; Tackiness agent is moisture curing or ultraviolet light polymerization separately both; Behind UV-irradiation, cohesive strength, hardness etc. are higher, and moisture-curable mechanism is withdrawn with the continued crosslinking curing at UV-light.Also or in some Application Areas, for UV-irradiation less than and require to solidify the higher field of cohesive strength, back, simple photocuring system is difficult to reach completion of cure.In order to overcome the shortcoming of photocuring, the functional type dual cure systems arises at the historic moment, and contains the focus that uV curable and moisture-curable become people's research.
Summary of the invention
The objective of the invention is to address the above problem: provide a kind of moisture/UV-light two cured silicone tackiness agent.
The present invention adopts following technical scheme to realize this purpose:
The designing and preparing of the two cured silicone tackiness agent of functional type of the present invention is formed by the feedstock production of following weight part: ZGK 5: 100~160 parts; The silane coupling agent that contains
structure: 0~150 part; Light trigger: 1~5 part; Promotor: 0.1~1 part; Stopper: 0.1~1 part; Filler: 0~50 part; Catalyzer: 0.1~5 part.
Described ZGK 5 is the mixture of any or two kinds in 2-acryloyl-oxy oxyethyl group alcoxyl based polysiloxane, the vinyl alkoxy ZGK 5.
Described light trigger is one or both in methyl phenyl ketone, acetophenone derivs, benzoin dimethylether, 2-methyl-2-hydroxyl-1-phenyl-1-acetone (IHT-PI 1173), 2-methyl-2-hydroxyl-1-(the 4-tertiary butyl) phenyl-1-acetone (IHT-PI185), 1-(4-(2-hydroxy ethoxy)-phenyl)-2-hydroxy-2-methyl-1-acetone (IRGACURE 2959), the siliceous macromolecular photoinitiator.
Described promotor is triethylamine, N, the N-dimethyl-p-toluidine, faces a kind of in the benzoyl sulfimide.
Described stopper is one or more in hydroquinone monomethyl ether (MEHQ), para benzoquinone (BQ), tetrachlorobenzoquinone, anthraquinone, the Resorcinol quinones stoppers such as (HQ).
Described catalyzer is metallic compounds such as tin, titanium, zinc, one or more in preferred organotin, titanic acid ester, tin inner complex or the titanium chelate.
Described filler is one or more of surface treatment or the lime carbonate of not handling, silicon-dioxide, aluminum oxide, graphite, carbon black, titanium oxide, permanent white, white titanium pigment, magnetic.
The two cured silicone tackiness agent of moisture/UV-light of the present invention have following characteristic:
Of the present invention pair of cured silicone tackiness agent has excellent temperature tolerance, can be at-60~350 ℃ of life-time service.This tackiness agent is moisture curing or ultraviolet light polymerization separately both; Behind UV-irradiation; Cohesive strength, hardness etc. are higher, and moisture-curable mechanism is withdrawn with the continued crosslinking curing at UV-light, further improves the bonding strength of tackiness agent; Simultaneously can reach darker curing depth, satisfy the application requiring of sophisticated electronic electrical apparatus industry.
Embodiment
Embodiment 1
UV-light of the present invention-moisture dual cure organic silicon adhesive is processed by the raw material of following weight part: methacryloxypropyl oxyethyl group alcoxyl based polysiloxane: 100 parts; Silane coupling agent KH570:20 part; Siliceous macromolecular photoinitiator: 4 parts; Promotor triethylamine: 0.7 part; Hydroquinone of polymerization retarder: 0.5 part; Catalyzer organotin: 1 part; Filler-calcium carbonate: 5 parts.
Embodiment 2
UV-light of the present invention-moisture dual cure organic silicon adhesive is processed by the raw material of following weight part: methacryloxypropyl oxyethyl group alcoxyl based polysiloxane: 120 parts; Silane coupling agent KH570:15 part; Benzoin dimethylether light trigger: 5 parts; Promotor triethylamine: 0.8 part; Hydroquinone of polymerization retarder: 0.4 part; Catalyzer organotin: 2 parts; Filler-silicon dioxide: 2 parts.
Embodiment 3
UV-light of the present invention-moisture dual cure organic silicon adhesive is processed by the raw material of following weight part: vinyl alkoxy ZGK 5: 160 parts; Silane coupling agent KH570:40 part; Siliceous macromolecular photoinitiator: 5 parts; 2-methyl-2-hydroxyl-1-phenyl-1-acetone: 1 part; Promotor triethylamine: 1 part; Hydroquinone of polymerization retarder: 0.1 part; Catalyzer tin inner complex: 1 part; Filler titanium oxide: 10 parts.
Embodiment 4
UV-light of the present invention-moisture dual cure organic silicon adhesive is processed by the raw material of following weight part: methacryloxypropyl oxyethyl group alcoxyl based polysiloxane: 100 parts; Silane coupling agent KH570:5 part; Siliceous macromolecular photoinitiator: 3 parts; 2-methyl-2-hydroxyl-1-(the 4-tertiary butyl) phenyl-1-acetone: 1 part; Accelerant N, N-dimethyl-p-toluidine: 0.4 part; Stopper hydroquinone monomethyl ether: 0.1 part; Catalyzer tin inner complex: 1.5 parts; Filling alumina: 5 parts.
Embodiment 5
UV-light of the present invention-moisture dual cure organic silicon adhesive is processed by the raw material of following weight part: methacryloxypropyl oxyethyl group alcoxyl based polysiloxane: 110 parts; Silane coupling agent KH570:50 part; Siliceous macromolecular photoinitiator: 4.5 parts; 2-methyl-2-hydroxyl-1-(the 4-tertiary butyl) phenyl-1-acetone: 1.5 accelerant Ns, N-dimethyl-p-toluidine: 0.5 part; Stopper hydroquinone monomethyl ether: 0.3 part; Catalyzer tin inner complex: 1 part; Silicon-dioxide: 5 parts; Titanium oxide: 5 parts.
Claims (9)
1. the two cured silicone tackiness agent of a moisture/UV-light is characterized in that, are formed by the feedstock production of following weight part:
ZGK 5: 100~160 parts;
Light trigger: 1~5 part;
Promotor: 0.1~1 part;
Stopper: 0.1~1 part;
Filler: 0~50 part;
Catalyzer: 0.1~5 part.
2. the two cured silicone tackiness agent of a kind of moisture/UV-light according to claim 1, it is characterized in that: described ZGK 5 is an acryloxy alkoxyl group ZGK 5.
R in the functional poly siloxanes wherein
1Be CH
3, C
6H
5, CH=CH
2, CH=CHCH
3,
Deng, R
2Be CH
3, C
6H
5, OCH
3, OCH
2CH
3, OCH (CH
3)
2Deng, R
3Be OCH
3, OCH
2CH
3, OCH (CH
3)
2, O (CH
2) nCH
3Deng, R
4For
Deng, R
5Be H, OH, CH
3Deng.Can obtain the silicone resin of different viscosity according to the difference of polymerization degree m, n.
3. the two cured silicone tackiness agent of a kind of moisture/UV-light according to claim 1, it is characterized in that: described light trigger is one or both in methyl phenyl ketone, acetophenone derivs, benzoin dimethylether, 2-methyl-2-hydroxyl-1-phenyl-1-acetone (IHT-PI 1173), 2-methyl-2-hydroxyl-1-(the 4-tertiary butyl) phenyl-1-acetone (IHT-PI 185), 1-(4-(2-hydroxy ethoxy)-phenyl)-2-hydroxy-2-methyl-1-acetone (IRGACURE 2959), the siliceous macromolecular photoinitiator.
4. the two cured silicone tackiness agent of a kind of moisture/UV-light according to claim 3 is characterized in that: described siliceous macromolecular photoinitiator is that the small molecules light trigger with containing hydrogen silicone oil and hydroxyl makes through dehydrogenation reaction under catalyzer.
5. the two cured silicone tackiness agent of a kind of moisture/UV-light according to claim 1, it is characterized in that: described catalyzer is metallic compounds such as tin, titanium, zinc, one or more in preferred organotin, titanic acid ester, tin inner complex or the titanium chelate.
6. according to the two cured silicone tackiness agent of a kind of moisture/UV-light described in the claim 4, it is characterized in that: described small molecules light trigger can be at least a in 2-methyl-2-hydroxyl-1-phenyl-1-acetone (IHT-PI 1173), 2-methyl-2-hydroxyl-1-(the 4-tertiary butyl) phenyl-1-acetone (IHT-PI 185), 1-(4-(2-hydroxy ethoxy)-the phenyl)-2-hydroxy-2-methyl-1-acetone (IRGACURE 2959).
7. the two cured silicone tackiness agent of a kind of moisture/UV-light according to claim 1, it is characterized in that: described promotor is triethylamine, N, a kind of in N-dimethyl-p-toluidine, the o-benzoic sulfimide.
8. tackiness agent according to claim 1 is characterized in that: described stopper is one or more in hydroquinone monomethyl ether (MEHQ), para benzoquinone (BQ), tetrachlorobenzoquinone, anthraquinone, the Resorcinol quinones stoppers such as (HQ).
9. the two cured silicone tackiness agent of a kind of moisture/UV-light according to claim 1 is characterized in that: described filler is one or more of surface treatment or the lime carbonate of not handling, silicon-dioxide, aluminum oxide, graphite, carbon black, titanium oxide, permanent white, white titanium pigment, magnetic.
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Cited By (24)
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CN103232829A (en) * | 2013-04-23 | 2013-08-07 | 广东信翼新材料股份有限公司 | Light-moisture dual-curing adhesive |
CN103965821A (en) * | 2014-04-30 | 2014-08-06 | 京东方科技集团股份有限公司 | Frame sealant composition and display device |
CN105400486A (en) * | 2014-09-10 | 2016-03-16 | 郝建强 | Ultraviolet ray/wet gas double curing organosilicon resin composition |
CN107225248A (en) * | 2017-06-13 | 2017-10-03 | 北京科技大学 | A kind of method that double solidification 3D gel printings prepare magnetic material product |
CN107446509A (en) * | 2017-08-03 | 2017-12-08 | 合肥隆延科技有限公司 | UV (ultraviolet) curing silicone sealant and preparation method thereof |
CN107849253A (en) * | 2015-03-10 | 2018-03-27 | 汉高知识产权控股有限责任公司 | Polysiloxane and moisture and the adhesive composition of radiation-curable comprising it |
CN108395858A (en) * | 2018-03-27 | 2018-08-14 | 广州机械科学研究院有限公司 | A kind of silane-modified fluid sealant of UV- moistures dual UV curable paint and preparation method thereof |
CN108484803A (en) * | 2018-03-27 | 2018-09-04 | 浙江欧仁新材料有限公司 | A kind of silane-terminated polymer and moisture-curable adhesive compound prepared therefrom |
US10155894B2 (en) | 2014-07-07 | 2018-12-18 | Honeywell International Inc. | Thermal interface material with ion scavenger |
US10174433B2 (en) | 2013-12-05 | 2019-01-08 | Honeywell International Inc. | Stannous methanesulfonate solution with adjusted pH |
US10287471B2 (en) | 2014-12-05 | 2019-05-14 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
CN109929079A (en) * | 2019-02-27 | 2019-06-25 | 惠州市德佑威新材料有限公司 | A kind of UV/ moisture dual cure resin and preparation method thereof |
US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
CN112724927A (en) * | 2020-12-25 | 2021-04-30 | 浙江中特化工有限公司 | UV curing silicone gel for lead sealing |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
CN113736087A (en) * | 2021-09-13 | 2021-12-03 | 北京天山新材料技术有限公司 | Organic silicon resin and preparation method thereof, organic silicon conductive adhesive composition and organic silicon conductive adhesive |
CN114214029A (en) * | 2021-12-29 | 2022-03-22 | 苏州润邦半导体材料科技有限公司 | Ultraviolet-moisture dual-cured LOCA adhesive |
CN114409905A (en) * | 2022-01-21 | 2022-04-29 | 青岛科技大学 | Acrylate modified organic silicon resin and application thereof in UV/moisture dual-curing organic silicon three-proofing paint |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
CN115820201A (en) * | 2022-12-13 | 2023-03-21 | 烟台泰盛精化科技有限公司 | Ultraviolet light-moisture dual-curing adhesive and preparation method thereof |
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US10174433B2 (en) | 2013-12-05 | 2019-01-08 | Honeywell International Inc. | Stannous methanesulfonate solution with adjusted pH |
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US10155894B2 (en) | 2014-07-07 | 2018-12-18 | Honeywell International Inc. | Thermal interface material with ion scavenger |
US10428257B2 (en) | 2014-07-07 | 2019-10-01 | Honeywell International Inc. | Thermal interface material with ion scavenger |
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US10287471B2 (en) | 2014-12-05 | 2019-05-14 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
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US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
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US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
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Application publication date: 20120808 |