TWI298065B - - Google Patents

Download PDF

Info

Publication number
TWI298065B
TWI298065B TW91105417A TW91105417A TWI298065B TW I298065 B TWI298065 B TW I298065B TW 91105417 A TW91105417 A TW 91105417A TW 91105417 A TW91105417 A TW 91105417A TW I298065 B TWI298065 B TW I298065B
Authority
TW
Taiwan
Prior art keywords
weight
group
compound
epoxy compound
parts
Prior art date
Application number
TW91105417A
Other languages
English (en)
Chinese (zh)
Inventor
Takai Hideyuki
Original Assignee
Daicel Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001084195A external-priority patent/JP4663893B2/ja
Priority claimed from JP2001143835A external-priority patent/JP5226162B2/ja
Priority claimed from JP2001193430A external-priority patent/JP4795570B2/ja
Application filed by Daicel Chem filed Critical Daicel Chem
Application granted granted Critical
Publication of TWI298065B publication Critical patent/TWI298065B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D407/00Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00
    • C07D407/02Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00 containing two hetero rings
    • C07D407/12Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00 containing two hetero rings linked by a chain containing hetero atoms as chain links
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D303/00Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02Compounds containing oxirane rings
    • C07D303/12Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/22Ethers with hydroxy compounds containing no oxirane rings with monohydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D301/00Preparation of oxiranes
    • C07D301/02Synthesis of the oxirane ring
    • C07D301/03Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds
    • C07D301/14Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds with organic peracids, or salts, anhydrides or esters thereof
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D303/00Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02Compounds containing oxirane rings
    • C07D303/12Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/16Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/226Mixtures of di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/38Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
TW91105417A 2001-03-23 2002-03-21 TWI298065B (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001084195A JP4663893B2 (ja) 2001-03-23 2001-03-23 エポキシ化合物の製造方法
JP2001143835A JP5226162B2 (ja) 2001-05-14 2001-05-14 液状エポキシ樹脂組成物及びその用途
JP2001193430A JP4795570B2 (ja) 2001-06-26 2001-06-26 紫外線硬化型缶用塗料組成物及び塗装金属缶の製造方法

Publications (1)

Publication Number Publication Date
TWI298065B true TWI298065B (https=) 2008-06-21

Family

ID=27346334

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91105417A TWI298065B (https=) 2001-03-23 2002-03-21

Country Status (7)

Country Link
US (2) US20030059618A1 (https=)
EP (2) EP2031006A1 (https=)
KR (1) KR100877124B1 (https=)
CN (1) CN1243744C (https=)
CA (1) CA2439608A1 (https=)
TW (1) TWI298065B (https=)
WO (1) WO2002076966A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9464186B2 (en) 2011-04-08 2016-10-11 Jx Nippon Oil & Energy Corporation Resin composition, hardened coating films therefrom, and photosemiconductor device using same

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030059618A1 (en) * 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
SG97310A1 (en) * 2001-09-14 2006-09-29 Sumitomo Chemical Co Photosemiconductor encapsulating resin composition
JP2004099467A (ja) * 2002-09-05 2004-04-02 Daicel Chem Ind Ltd 脂環式エポキシ化合物の製造方法
WO2004035558A1 (ja) * 2002-09-05 2004-04-29 Daicel Chemical Industries, Ltd. 脂環式ジエポキシ化合物の製造方法、硬化性エポキシ樹脂組成物、電子部品封止用エポキシ樹脂組成物、電気絶縁油用安定剤、および電気絶縁用注型エポキシ樹脂組成物
JP2004210932A (ja) * 2002-12-27 2004-07-29 Daicel Chem Ind Ltd 硬化性樹脂組成物及び硬化物
TWI340763B (en) * 2003-02-20 2011-04-21 Nippon Kayaku Kk Seal agent for photoelectric conversion elements and photoelectric conversion elements using such seal agent
JP3797348B2 (ja) * 2003-02-24 2006-07-19 コニカミノルタホールディングス株式会社 活性エネルギー線硬化組成物
JP3973611B2 (ja) * 2003-08-25 2007-09-12 ダイセル化学工業株式会社 熱硬化型エポキシ樹脂組成物および透明材料
EP1682599A1 (en) * 2003-11-03 2006-07-26 Union Carbide Chemicals & Plastics Technology Corporation Tougher cycloaliphatic epoxide resins
KR101144420B1 (ko) * 2004-03-18 2012-05-11 가부시끼가이샤 다이셀 고순도 지환식 에폭시 화합물, 그 제조 방법, 경화성에폭시 수지 조성물, 그 경화물, 및 용도
GB0412196D0 (en) * 2004-06-02 2004-07-07 Hexcel Composites Ltd Cure accelerators
WO2006054461A1 (ja) * 2004-11-18 2006-05-26 Konica Minolta Medical & Graphic, Inc. 活性光線硬化組成物、インク活性光線硬化型インク及び画像形成方法
US7825197B2 (en) * 2004-12-16 2010-11-02 Daicel Chemical Industries, Ltd. Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator
JP4688503B2 (ja) * 2005-01-07 2011-05-25 ダイセル化学工業株式会社 高純度脂環式ジエポキシ化合物およびその製造方法
JPWO2006077693A1 (ja) * 2005-01-21 2008-06-19 コニカミノルタエムジー株式会社 重合性活性光線硬化組成物、重合方法、活性光線硬化型インク及び画像形成方法、インクジェット記録装置並びにエポキシ化合物
JP4636469B2 (ja) * 2005-09-02 2011-02-23 ダイセル化学工業株式会社 体積型ホログラム記録用感光性組成物
CN101421205B (zh) * 2006-04-18 2013-10-09 大赛璐化学工业株式会社 环烯烃化合物的制备方法
EP2043865B1 (en) * 2006-07-13 2010-03-31 Telecom Italia S.p.A. Ink jet cartridge comprising a layer made by a curable resin composition
JP5226223B2 (ja) * 2007-01-31 2013-07-03 株式会社ダイセル 透明封止材料及び透明封止物
JP5226224B2 (ja) * 2007-01-31 2013-07-03 株式会社ダイセル 硬化性樹脂組成物及び光導波路
JP5289713B2 (ja) * 2007-02-01 2013-09-11 株式会社ダイセル 硬化性樹脂組成物及びその硬化物
JP5248787B2 (ja) * 2007-02-06 2013-07-31 株式会社ダイセル 光硬化性樹脂組成物及び塗装物
JP5154090B2 (ja) * 2007-02-10 2013-02-27 株式会社ダイセル 活性エネルギー線硬化型インク及び印刷物
JP5248790B2 (ja) * 2007-03-02 2013-07-31 株式会社ダイセル 繊維強化複合材料用エポキシ樹脂組成物及び繊維強化複合材料
JP5638812B2 (ja) 2010-02-01 2014-12-10 株式会社ダイセル 硬化性エポキシ樹脂組成物
EP2505625B1 (de) 2011-03-31 2013-03-27 Henkel AG & Co. KGaA Lackformulierung für Doseninnenflächen
JPWO2013153988A1 (ja) * 2012-04-13 2015-12-17 株式会社ダイセル ジエポキシ化合物、及びその製造方法
JPWO2014084030A1 (ja) * 2012-11-27 2017-01-05 株式会社ダイセル 微細構造体の製造方法及びナノインプリント用光硬化性組成物
DE102012223356A1 (de) 2012-12-17 2014-06-18 Henkel Ag & Co. Kgaa Verfahren zur Herstellung beschichteter Dosendeckel
DE102012223355A1 (de) 2012-12-17 2014-06-18 Henkel Ag & Co. Kgaa Hochvernetzende Lackformulierung für Doseninnenflächen
WO2015064410A1 (ja) * 2013-10-30 2015-05-07 積水化学工業株式会社 有機el表示素子用封止剤
JP6204420B2 (ja) * 2015-08-07 2017-09-27 株式会社ダイセル 硬化性組成物、及びそれを用いた光学素子
AR108133A1 (es) * 2016-04-15 2018-07-18 Valspar Sourcing Inc Composiciones de revestimiento que contienen copolímeros libres de estireno
EP3487828B1 (en) * 2016-07-22 2021-04-07 Prysmian S.p.A. Optical fibre coated with a polyester coating
WO2018085052A1 (en) 2016-10-19 2018-05-11 Swimc Llc Acrylic polymers and compositions containing such polymers
CN109890866B (zh) 2016-10-21 2021-11-12 东丽株式会社 环氧树脂组合物和由其制备的纤维增强复合材料
US10191405B2 (en) * 2016-11-11 2019-01-29 Xerox Corporation Electrostatic charging member
KR102118375B1 (ko) * 2016-12-09 2020-06-04 주식회사 엘지화학 밀봉재 조성물
KR102118365B1 (ko) 2017-04-21 2020-06-04 주식회사 엘지화학 유기전자소자 봉지용 조성물
CN117165157A (zh) 2017-09-01 2023-12-05 宣伟投资管理有限公司 多级聚合物胶乳、含有该胶乳的涂料及其涂布的制品
WO2019046700A1 (en) 2017-09-01 2019-03-07 Swimc Llc MULTI-STAGE POLYMER LATEX, COATING COMPOSITIONS CONTAINING SUCH LATEX, AND ARTICLES THEREOF
CN107734847A (zh) * 2017-10-16 2018-02-23 江苏赛博宇华科技有限公司 一种手机电路板
JP7009201B2 (ja) * 2017-12-21 2022-02-10 デクセリアルズ株式会社 化合物、カチオン硬化剤、及びカチオン硬化性組成物
PL3740461T3 (pl) * 2018-01-19 2024-03-04 Prysmian S.P.A. Włókno optyczne z pokryciem z usieciowanego poliestru
US11912870B2 (en) * 2018-03-28 2024-02-27 Nippon Sheet Glass Company, Limited Cured product of resin composition, laminate, and resin composition
CN109738257A (zh) * 2019-02-28 2019-05-10 山东科技大学 一种粉煤煤岩光片的制备方法
KR102895653B1 (ko) * 2019-05-02 2025-12-08 삼성디스플레이 주식회사 잉크 조성물, 이를 이용한 윈도우 및 이를 이용한 윈도우 제조 방법
WO2021064458A1 (en) 2019-10-02 2021-04-08 Toray Industries, Inc. Benzoxazine resin composition, prepreg, and fiber-reinforced composite material

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE523503A (https=) * 1952-11-03
DE1418465A1 (de) 1959-03-16 1968-10-03 Wacker Chemie Gmbh Verfahren zur Herstellung von Peressigsaeureloesungen
US3075955A (en) * 1960-03-31 1963-01-29 Union Carbide Corp Polyepoxy sulfones
US3271371A (en) * 1960-03-31 1966-09-06 Union Carbide Corp Cured diepoxy sulfone and polyfunctional amine compositions
GB996064A (en) * 1960-08-24 1965-06-23 Union Carbide Corp Improvements in and relating to epoxy resins
US3278456A (en) * 1960-12-27 1966-10-11 Union Carbide Corp Diepoxide compositions
JPS5010636B2 (https=) 1971-08-20 1975-04-23
IT1009956B (it) * 1973-06-12 1976-12-20 Gen Electric Liquido impregnante costituito da estere stabilizzato
JPS5335999A (en) * 1976-09-16 1978-04-03 Nissin Electric Co Ltd Capacitor
JPS543006A (en) 1977-06-07 1979-01-11 Daicel Chem Ind Ltd Preparation of peracetic acid solution
DE2752920A1 (de) * 1977-11-26 1979-05-31 Akzo Gmbh Verfahren zur herstellung von epoxiden
DE3211305A1 (de) * 1982-03-26 1983-09-29 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von 2,2-dicyclohexenylpropandiepoxid
JPS59136321A (ja) * 1983-01-26 1984-08-04 Nitto Electric Ind Co Ltd 光半導体封止用エポキシ樹脂組成物
JPS61213204A (ja) * 1985-03-19 1986-09-22 Sanyo Kokusaku Pulp Co Ltd 紫外線硬化樹脂組成物
JPH02169620A (ja) * 1988-12-22 1990-06-29 Mitsui Petrochem Ind Ltd 硬化用エポキシ樹脂組成物、ならびに、この組成物からなる透明樹脂板、半導体装置用透明窓材および液晶パネル用透明基板
DE69103089T2 (de) * 1990-05-30 1995-01-05 Daicel Chem Alicyclische Verbindung enthaltende Komposition, Verfahren für ihre Herstellung, polymerisierbare Komposition und photopolymerisierbare Komposition.
JPH04325519A (ja) * 1991-04-25 1992-11-13 Nippon Paint Co Ltd 尿素系触媒性硬化剤およびそれを含む樹脂組成物
JPH05239043A (ja) * 1991-10-03 1993-09-17 Daicel Chem Ind Ltd 酢酸とシクロヘキセンオキシドの分離方法
EP0859021A3 (en) * 1991-10-31 1998-11-11 Daicel Chemical Industries, Ltd. Epoxidised compositions
JP2537583B2 (ja) * 1992-01-23 1996-09-25 住友ベークライト株式会社 液状エポキシ樹脂組成物
JPH05279451A (ja) * 1992-03-31 1993-10-26 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びその硬化物
JPH0745126A (ja) * 1993-07-28 1995-02-14 Meidensha Corp 含浸用樹脂組成物
JPH07196774A (ja) * 1993-12-28 1995-08-01 Sumitomo Bakelite Co Ltd 液状エポキシ樹脂組成物
JP3841858B2 (ja) * 1995-11-01 2006-11-08 凸版印刷株式会社 多層プリント配線板用絶縁層樹脂組成物
JPH09176288A (ja) * 1995-12-28 1997-07-08 Hitachi Ltd エポキシ樹脂組成物および絶縁スペーサ
JPH09255764A (ja) 1996-03-26 1997-09-30 Nitto Denko Corp 光半導体封止用エポキシ樹脂組成物硬化体およびそれを用いた光半導体装置
JP3844824B2 (ja) * 1996-11-26 2006-11-15 株式会社Adeka エネルギー線硬化性エポキシ樹脂組成物、光学的立体造形用樹脂組成物及び光学的立体造形方法
JPH10158581A (ja) 1996-12-05 1998-06-16 Kansai Paint Co Ltd 紫外線硬化型缶用塗料組成物
JP3409648B2 (ja) * 1997-06-16 2003-05-26 東洋インキ製造株式会社 紫外線硬化型樹脂組成物
JPH11106474A (ja) * 1997-10-03 1999-04-20 Hitachi Chem Co Ltd 半導体封止用液状エポキシ樹脂組成物
JPH11152441A (ja) * 1997-11-21 1999-06-08 Kansai Paint Co Ltd 紫外線硬化型缶用塗料組成物
WO1999041296A1 (en) * 1998-02-11 1999-08-19 Rensselaer Polytechnic Institute Photopolymerizable compositions containing cycloaliphatic epoxyalcohol monomers
JP3933294B2 (ja) * 1998-03-06 2007-06-20 株式会社Adeka 硬化性組成物
CA2269378C (en) * 1998-04-17 2008-04-01 Ajinomoto Co., Inc. Curable resin composition
JP2886853B1 (ja) * 1998-06-08 1999-04-26 関西ペイント株式会社 カチオン重合性塗料組成物
US6287748B1 (en) * 1998-07-10 2001-09-11 Dsm N.V. Solid imaging compositions for preparing polyethylene-like articles
US6210790B1 (en) * 1998-07-15 2001-04-03 Rensselaer Polytechnic Institute Glass-like composites comprising a surface-modified colloidal silica and method of making thereof
JP4124295B2 (ja) 1998-08-20 2008-07-23 株式会社Adeka 硬化性組成物
JP4274444B2 (ja) 1998-12-10 2009-06-10 株式会社Adeka オレフィン化合物の製造方法
DE10001228B4 (de) * 2000-01-13 2007-01-04 3M Espe Ag Polymerisierbare Zubereitungen auf der Basis von siliziumhaltigen Epoxiden
ATE252981T1 (de) * 2000-12-13 2003-11-15 Fuji Photo Film Co Ltd Flachdruckplattenvorläufer
US20030059618A1 (en) * 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
JP4795570B2 (ja) * 2001-06-26 2011-10-19 ダイセル化学工業株式会社 紫外線硬化型缶用塗料組成物及び塗装金属缶の製造方法
JP4743736B2 (ja) * 2001-08-31 2011-08-10 株式会社Adeka 光学的立体造形用樹脂組成物およびこれを用いた光学的立体造形方法
JP2003109780A (ja) * 2001-09-28 2003-04-11 Hitachi Unisia Automotive Ltd 車両用ランプ点灯装置
JP2004099467A (ja) * 2002-09-05 2004-04-02 Daicel Chem Ind Ltd 脂環式エポキシ化合物の製造方法
JP2004182648A (ja) * 2002-12-03 2004-07-02 Daicel Chem Ind Ltd 脂環式ジエポキシ化合物の製造方法
JP2004204228A (ja) * 2002-12-13 2004-07-22 Daicel Chem Ind Ltd 硬化性エポキシ樹脂組成物および硬化物
JP2004262874A (ja) * 2003-03-03 2004-09-24 Daicel Chem Ind Ltd ジエポキシシクロオクタン類の製造方法
JP4426324B2 (ja) * 2004-01-21 2010-03-03 ダイセル化学工業株式会社 非エステル型エポキシ樹脂および樹脂組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9464186B2 (en) 2011-04-08 2016-10-11 Jx Nippon Oil & Energy Corporation Resin composition, hardened coating films therefrom, and photosemiconductor device using same
TWI621637B (zh) * 2011-04-08 2018-04-21 吉坤日礦日石能源股份有限公司 Method for producing epoxy compound

Also Published As

Publication number Publication date
US7786224B2 (en) 2010-08-31
EP1389615A1 (en) 2004-02-18
US20040242839A1 (en) 2004-12-02
CN1458927A (zh) 2003-11-26
EP1389615A4 (en) 2005-09-07
WO2002076966A1 (en) 2002-10-03
KR100877124B1 (ko) 2009-01-07
EP2031006A1 (en) 2009-03-04
CN1243744C (zh) 2006-03-01
CA2439608A1 (en) 2002-10-03
US20030059618A1 (en) 2003-03-27
KR20030007515A (ko) 2003-01-23

Similar Documents

Publication Publication Date Title
TWI298065B (https=)
CN1325559C (zh) 环氧树脂组合物、可紫外线固化型罐头用涂料组合物、及用途
TWI629307B (zh) Polyoxymethylene modified epoxy resin and its composition and hardened material
KR102629442B1 (ko) 에폭시계 반응성 희석제 및 이것을 포함하는 에폭시 수지 조성물
TW200936683A (en) High Tg epoxy systems for composite application
CN108349919A (zh) 多官能环氧化合物及含有其的硬化性组合物
JP4823892B2 (ja) 高純度脂環式エポキシ化合物、その製造方法、硬化性エポキシ樹脂組成物、その硬化物、および用途
US5338879A (en) Lactone-modified alicyclic composition and an epoxidized composition thereof
JP2003013001A (ja) 紫外線硬化型缶用塗料組成物及び塗装金属缶の製造方法
JP7708122B2 (ja) ジエポキシ化合物、硬化性組成物、硬化物及び光学部材
JP4786200B2 (ja) 紫外線硬化型缶用塗料組成物、塗装金属板、および塗装金属缶
JP4854295B2 (ja) 活性エネルギー線硬化型接着剤およびその接着体
TW201540740A (zh) 經聚矽氧改質之環氧樹脂及包含該環氧樹脂之組合物、以及其硬化物
JP5716512B2 (ja) エポキシ樹脂及びその製造方法
CN109843965B (zh) 印刷配线板形成用环氧树脂组合物
JP2012219134A (ja) 電子部品用樹脂組成物及びそれを用いた液状封止材、電子部品装置
JP7668090B2 (ja) 新規エポキシ樹脂及びエポキシ樹脂組成物
JPH10212335A (ja) アルケニルサリチル酸構造を有する新規エポキシ樹脂
JP2017137374A (ja) エポキシ樹脂とその製造法、及び該樹脂に基づくエポキシ樹脂組成物
JP2023145203A (ja) エポキシ化合物、硬化性組成物および硬化物
JP5716511B2 (ja) エポキシ樹脂組成物
JPWO2006115011A1 (ja) エポキシ化合物の製造方法および硬化性エポキシ樹脂組成物
WO2005121219A1 (ja) シリコーン変性エポキシ樹脂
JPWO2001047907A1 (ja) 脂環式エポキシ含有エステル及びその製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees