TW200733842A - Multilayer printed wiring board and method for producing the same - Google Patents

Multilayer printed wiring board and method for producing the same

Info

Publication number
TW200733842A
TW200733842A TW095147038A TW95147038A TW200733842A TW 200733842 A TW200733842 A TW 200733842A TW 095147038 A TW095147038 A TW 095147038A TW 95147038 A TW95147038 A TW 95147038A TW 200733842 A TW200733842 A TW 200733842A
Authority
TW
Taiwan
Prior art keywords
wiring board
printed wiring
multilayer printed
producing
same
Prior art date
Application number
TW095147038A
Other languages
English (en)
Chinese (zh)
Other versions
TWI354522B (cg-RX-API-DMAC7.html
Inventor
Sotaro Ito
Michimasa Takahashi
Yukinobu Mikado
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of TW200733842A publication Critical patent/TW200733842A/zh
Application granted granted Critical
Publication of TWI354522B publication Critical patent/TWI354522B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
TW095147038A 2005-12-16 2006-12-15 Multilayer printed wiring board and method for producing the same TW200733842A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005364088 2005-12-16

Publications (2)

Publication Number Publication Date
TW200733842A true TW200733842A (en) 2007-09-01
TWI354522B TWI354522B (cg-RX-API-DMAC7.html) 2011-12-11

Family

ID=38163087

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147038A TW200733842A (en) 2005-12-16 2006-12-15 Multilayer printed wiring board and method for producing the same

Country Status (7)

Country Link
US (4) US7957154B2 (cg-RX-API-DMAC7.html)
EP (1) EP1962569A1 (cg-RX-API-DMAC7.html)
JP (1) JP5188816B2 (cg-RX-API-DMAC7.html)
KR (2) KR101049390B1 (cg-RX-API-DMAC7.html)
CN (1) CN101331814B (cg-RX-API-DMAC7.html)
TW (1) TW200733842A (cg-RX-API-DMAC7.html)
WO (1) WO2007069789A1 (cg-RX-API-DMAC7.html)

Cited By (6)

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TWI473544B (zh) * 2012-12-17 2015-02-11 Unimicron Technology Corp 內置式晶片封裝結構
TWI497678B (zh) * 2011-06-09 2015-08-21 新力股份有限公司 半導體裝置及其製造方法
US9324664B2 (en) 2013-02-22 2016-04-26 Unimicron Technology Corp. Embedded chip package structure
TWI632654B (zh) * 2015-01-16 2018-08-11 艾馬克科技公司 半導體裝置以及其製造方法
TWI677035B (zh) * 2017-06-23 2019-11-11 力成科技股份有限公司 半導體封裝及半導體封裝的製程方法
TWI870629B (zh) * 2020-11-16 2025-01-21 美商應用材料股份有限公司 具內建電磁干擾屏蔽之封裝結構

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US8101868B2 (en) 2005-10-14 2012-01-24 Ibiden Co., Ltd. Multilayered printed circuit board and method for manufacturing the same
EP1962569A1 (en) 2005-12-16 2008-08-27 Ibiden Co., Ltd. Multilayer printed wiring plate, and method for fabricating the same
JP3942190B1 (ja) * 2006-04-25 2007-07-11 国立大学法人九州工業大学 両面電極構造の半導体装置及びその製造方法
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