JP6558192B2 - 光学装置 - Google Patents
光学装置 Download PDFInfo
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- JP6558192B2 JP6558192B2 JP2015196027A JP2015196027A JP6558192B2 JP 6558192 B2 JP6558192 B2 JP 6558192B2 JP 2015196027 A JP2015196027 A JP 2015196027A JP 2015196027 A JP2015196027 A JP 2015196027A JP 6558192 B2 JP6558192 B2 JP 6558192B2
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- 230000003287 optical effect Effects 0.000 title claims description 212
- 229910052751 metal Inorganic materials 0.000 claims description 290
- 239000002184 metal Substances 0.000 claims description 290
- 239000010410 layer Substances 0.000 claims description 248
- 239000012792 core layer Substances 0.000 claims description 107
- 239000004065 semiconductor Substances 0.000 claims description 100
- 230000008878 coupling Effects 0.000 claims description 15
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 description 68
- 230000017525 heat dissipation Effects 0.000 description 25
- 239000000853 adhesive Substances 0.000 description 19
- 230000001070 adhesive effect Effects 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000003825 pressing Methods 0.000 description 6
- 101150018759 CG10 gene Proteins 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 239000012212 insulator Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 101150067714 PPP1R3A gene Proteins 0.000 description 2
- 102100034503 Protein phosphatase 1 regulatory subunit 3A Human genes 0.000 description 2
- 239000008186 active pharmaceutical agent Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- -1 stainless steel) Chemical compound 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12123—Diode
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12142—Modulator
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Optical Integrated Circuits (AREA)
Description
具体例。
金属片21の厚さTMの範囲:0.1〜0.6mm。
金属片21の材料:銅、アルミニウム、マグネシウム、鉄(ステンレス含む)、アルマイト等。
第1開口13aの深さD1:700〜800μm。
第2開口13bの深さD2:200〜2200μm。
プリント回路基板の厚さ:2〜3mm。
半導体光デバイス15の厚さDV1:700〜1100μm。
半導体光デバイス15の側面と第1開口13aの第1側面13eとの間隔DS:200〜700μm。
(実施例1)
金属層(L1):100μm。
誘電体コア層(CR1):150μm。
金属層(L2):30μm。
絶縁性接着層(AD1H):400μm。
金属層(L3):20μm。
誘電体コア層(CR2):200μm。
金属層(L4):40μm。
金属片21:200μm。
絶縁性接着層(AD2H):200μm。
金属層(L5):40μm。
誘電体コア層(CR3):200μm。
金属層(L6):20μm。
絶縁性接着層(AD3H):400μm。
金属層(L7):30μm。
誘電体コア層(CR4):150μm。
金属層(L8):100μm。
第1開口13aの深さ:約740μm(100+150+30+400+20+200+40−200)。
第2開口13bの深さ:約940μm(40+200+20+400+30+150+100)。
(実施例2)
金属層(L1):100μm。
誘電体コア層(CR1):150μm。
金属層(L2):30μm。
絶縁性接着層(AD1H):400μm。
金属層(L3):20μm。
誘電体コア層(CR2):400μm。
金属層(L4):40μm。
金属片21:400μm。
絶縁性接着層(AD2H):400μm。
金属層(L5):40μm。
誘電体コア層(CR3):100μm。
金属層(L6):20μm。
絶縁性接着層(AD3H):100μm。
金属層(L7):30μm。
誘電体コア層(CR4):150μm。
金属層(L8):100μm。
第1開口13aの深さ:約740μm(100+150+30+400+20+200+40−400)。
第2開口13bの深さ:約540μm(40+100+20+100+30+150+100)。
(実施例3)
金属層(L1):100μm。
誘電体コア層(CR1):150μm。
金属層(L2):30μm。
絶縁性接着層(AD3H):200μm。
金属層(L3):20μm。
誘電体コア層(CR2):150μm。
金属層(L4):40μm。
絶縁性接着層(AD3H):400μm。
金属層(L5):40μm。
誘電体コア層(CR3):200μm。
金属層(L6):20μm。
金属片21:600μm。
絶縁性接着層(AD3H):600μm。
金属層(L7):30μm。
誘電体コア層(CR4):150μm。
金属層(L8):100μm。
第1開口13aの深さ:約750μm(100+150+30+200+20+150+40+400+40+200+20−600)。
第2開口13bの深さ:約280μm(30+150+100)。
Claims (6)
- 光学装置であって、
光学結合素子と、該光学結合素子に係る光を処理する光素子と、該光素子に係る電気信号を処理する回路素子とをモノリシックに集積する半導体光デバイスと、
第1面及び該第1面の反対側の第2面を有する金属片と第1開口及び第2開口を有する本体とを有し、前記半導体光デバイスに電気的に接続されたプリント回路基板と、
前記プリント回路基板上に実装された第1電子部品と、
を備え、
前記光学結合素子はグレーティングカプラを含み、
前記第1開口、前記金属片及び前記第2開口は第1軸の方向に配列されており、
前記金属片は、前記プリント回路基板の前記本体に支持され、
前記プリント回路基板は、おもて面及び該おもて面の反対側に位置する裏面を有し、前記第1開口は、前記おもて面から前記第1軸の方向に延在し、前記第2開口は、前記裏面から前記第1軸の方向に延在し、前記第1開口は前記第1軸の方向に延在する第1側面を有し、前記第2開口は、前記第1軸の方向に延在する第2側面を有し、前記プリント回路基板の前記本体は、前記第1軸の方向に交差する第2軸の方向に延在して前記第1側面を前記第2側面に繋ぐ支持面を有し、前記支持面は前記第1開口において前記金属片の前記第2面を支持しており、前記第2開口は、前記第1軸の方向に延在して前記金属片の前記第2面に到達し、
前記半導体光デバイスは前記第1開口における前記金属片の前記第1面上に搭載され、
前記第1電子部品は、前記プリント回路基板の導電体を介して前記半導体光デバイスに電気的に接続される、光学装置。 - 前記プリント回路基板は、第1層構造及び第2層構造を有し、
前記第1層構造、前記金属片及び前記第2層構造は、前記第1軸の方向に順に配列されており、前記第1開口は、前記第1軸の方向に前記第1層構造を貫通し、前記第2開口は、前記第1軸の方向に前記第2層構造を貫通し、
前記第1層構造は、第11誘電体コア層と、該第11誘電体コア層上に設けられ配線又は接地のための第11金属層とを含み、前記第2層構造は、第21誘電体コア層と、該第21誘電体コア層上に設けられ配線又は接地のための第21金属層とを含む、請求項1に記載された光学装置。 - 複数の光導波路と、前記光導波路を保持する保持体とを含む光学部品を更に備え、
前記光学部品は、前記光導波路が前記光学結合素子に光学的に結合されるように前記半導体光デバイスに支持される、請求項1又は請求項2に記載された光学装置。 - 前記プリント回路基板の前記裏面に実装された第2電子部品を更に備え、
前記第1電子部品は、前記プリント回路基板の前記おもて面に実装され、
前記第2電子部品は、前記プリント回路基板上の前記半導体光デバイスに電気的に接続される、請求項1〜請求項3のいずれか一項に記載された光学装置。 - 前記本体の前記第2開口における前記金属片の前記第2面を支持する支持面を有する放熱部材を更に備える、請求項1〜請求項4のいずれか一項に記載された光学装置。
- 前記半導体光デバイスは、前記光素子としてフォトダイオード及びマッハツェンダ変調器の少なくとも一方を含む、請求項1〜請求項5のいずれか一項に記載された光学装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015196027A JP6558192B2 (ja) | 2015-10-01 | 2015-10-01 | 光学装置 |
US15/280,740 US9983372B2 (en) | 2015-10-01 | 2016-09-29 | Optical device, printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015196027A JP6558192B2 (ja) | 2015-10-01 | 2015-10-01 | 光学装置 |
Publications (2)
Publication Number | Publication Date |
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JP2017069491A JP2017069491A (ja) | 2017-04-06 |
JP6558192B2 true JP6558192B2 (ja) | 2019-08-14 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2015196027A Active JP6558192B2 (ja) | 2015-10-01 | 2015-10-01 | 光学装置 |
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US (1) | US9983372B2 (ja) |
JP (1) | JP6558192B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6631138B2 (ja) * | 2015-10-01 | 2020-01-15 | 住友電気工業株式会社 | 光学装置、プリント回路基板 |
JP6558192B2 (ja) | 2015-10-01 | 2019-08-14 | 住友電気工業株式会社 | 光学装置 |
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