JP6733534B2 - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP6733534B2 JP6733534B2 JP2016244707A JP2016244707A JP6733534B2 JP 6733534 B2 JP6733534 B2 JP 6733534B2 JP 2016244707 A JP2016244707 A JP 2016244707A JP 2016244707 A JP2016244707 A JP 2016244707A JP 6733534 B2 JP6733534 B2 JP 6733534B2
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- semiconductor element
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Description
最初に本願発明の実施形態の内容を列記して説明する。
(2)前記プリント基板は樹脂により形成され、前記インターポーザはセラミックにより形成されてもよい。この構成によれば、インターポーザの加工の精度が高くなり、インターポーザと第2半導体素子との距離が小さくなる。したがって、ボンディングワイヤが短くなり、電気信号の波形の劣化が抑制される。
(3)前記ボンディングワイヤに流れる電気信号は、前記第1半導体素子と前記プリント基板との間で流れる電気信号よりも高速でもよい。この構成によれば、ボンディングワイヤのインダクタンスが低いため、電気信号の波形の劣化が抑制される。
(4)前記第1半導体素子は、前記プリント基板から入力される電気信号の高速化、および前記インターポーザから入力される電気信号の低速化の少なくとも一を行ってもよい。この構成によれば、ボンディングワイヤのインダクタンスが低いため、電気信号の波形の劣化が抑制される。
(5)前記インターポーザの前記第1パッドの上面と前記第2半導体素子の前記第2パッドの上面とは同じ高さに位置してもよい。この構成によれば、ボンディングワイヤがさらに短くなり、インダクタンスが低くなる。このため電気信号の波形の劣化が効果的に抑制される。
(6)前記インターポーザおよび前記第1半導体素子は前記プリント基板の前記上面に表面実装されてもよい。これによりプリント基板、第1半導体素子およびインターポーザが電気的に接続される。
(7)前記インターポーザは前記プリント基板の前記上面に表面実装され、
前記第1半導体素子は前記インターポーザの上面に表面実装されてもよい。これによりプリント基板、第1半導体素子およびインターポーザが電気的に接続される。
(8)前記貫通孔の内側に設けられた金属のベース部材を備え、前記第2半導体素子は前記ベース部材の上面に設けられてもよい。ベース部材の厚さにより第2半導体素子の上面の高さを調節することができる。また第2半導体素子から熱を効果的に放出することができる。
(9)前記第2半導体素子の前記上面または側面から延伸する光ファイバを備え、前記第2半導体素子は前記インターポーザから入力される電気信号を光信号に変換し前記光ファイバに出力すること、および前記光ファイバから入力される光信号を電気信号に変換することの少なくとも一方を行ってもよい。この構成によれば、プリント基板と光ファイバとの接触を抑制することができる。光ファイバとの接触の恐れが小さいため、貫通孔の壁面を第2半導体素子に近づけることができる。貫通孔を小さくすることができるため、プリント基板の小型化が可能である。
(10)上面から下面にかけて貫通する貫通孔を有するプリント基板を準備する工程と、インターポーザの上面に前記インターポーザと電気的に接続される第1半導体素子を搭載する工程と、前記プリント基板の上面に前記プリント基板と電気的に接続される前記インターポーザを搭載する工程と、前記インターポーザと隣接し、かつ前記貫通孔と重なる位置に第2半導体素子を設ける工程と、前記インターポーザの前記上面にあり前記第2半導体素子側に設けられた第1パッドと、前記第2半導体素子の上面にあり前記インターポーザ側に設けられた第2パッドとを、ボンディングワイヤにより電気的に接続する工程と、を有し、前記インターポーザの端面は、前記プリント基板の前記貫通孔の壁面よりも前記第2半導体素子に突出し、かつ前記第2半導体素子の端面と対向する半導体装置の製造方法である。
本発明の実施形態に係る半導体装置およびその製造方法の具体例を、以下に図面を参照しつつ説明する。なお、本発明はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。
図1(a)は第1実施形態に係る半導体装置100を例示する断面図である。図1(b)は半導体装置100を例示する平面図である。X方向はインターポーザ12および半導体チップ16が並ぶ方向である。Y方向は半導体部品22および24が並ぶ方向である。Z方向はXおよびY方向に直交する方向である。
パッド12cの中央からインターポーザ12の端面までの距離(L1/2+D1)+D1の公差の絶対値(50μm)+距離D2+半導体チップ16の端面からパッド16aの中央までの距離(D3+L2/2)+D3の公差の絶対値(50μm)
ボンディングワイヤ30の長さは最長で例えば345μmであり、500μm以下である。
図3(a)、図4(a)、図5(a)、図6(a)および図7(a)は半導体装置100の製造方法を例示する断面図である。図3(b)、図4(b)、図5(b)、図6(b)および図7(b)は半導体装置100の製造方法を例示する平面図である。
次に比較例1について説明する。図8(a)は比較例1に係る半導体装置100Rを例示する断面図である。図8(b)は半導体装置100Rを例示する平面図である。第1実施形態と同じ構成については説明を省略する。
図9(a)は第1実施形態の変形例に係る半導体装置110を例示する断面図である。図9(b)は半導体装置110を例示する平面図である。第1実施形態と同じ構成については説明を省略する。
図10(a)は第2実施形態に係る半導体装置200を例示する断面図である。図10(b)は半導体装置200を例示する平面図である。第1実施形態と同じ構成については説明を省略する。
図12(a)は比較例2に係る半導体装置200Rを例示する断面図である。図12(b)は半導体装置200Rを例示する平面図である。第1実施形態および第2実施形態と同じ構成については説明を省略する。
図13(a)は比較例3に係る半導体装置300Rを例示する断面図である。図13(b)は半導体装置300Rを例示する平面図である。比較例2と同じ構成については説明を省略する。
図14(a)は第2実施形態の変形例に係る半導体装置210を例示する断面図である。図14(b)は半導体装置210を例示する平面図である。第2実施形態と同じ構成については説明を省略する。図14(a)および図14(b)に示すように、半導体部品14をプリント基板10の上面に表面実装し、インターポーザ12をプリント基板10の上面に表面実装する。他の構成は第2実施形態と同じである。変形例によれば、第2実施形態と同様にボンディングワイヤ30を短くすることができる。
10a 貫通孔
10b、10d、10e、10g、12c、16a、16b パッド
10f、10h、12b 配線パターン
11、13、23 半田ボール
12 インターポーザ
14、22、24 半導体部品
15 半導体素子
16、18 半導体チップ
19、25 ホルダ
17 光ファイバ
20 金属板
21 ベース部材
25a、25b、25c 面
30、31 ボンディングワイヤ
100、110、200、210 半導体装置
Claims (10)
- 上面から下面にかけて貫通する貫通孔が設けられたプリント基板と、
前記プリント基板の上に搭載され、前記プリント基板と電気的に接続された第1半導体素子と、
前記プリント基板の前記上面に搭載され、前記第1半導体素子と電気的に接続されたインターポーザと、
前記インターポーザに隣接し、前記貫通孔と重なる位置に設けられた第2半導体素子と、
前記インターポーザの上面にあって前記第2半導体素子側に設けられた第1パッドと前記第2半導体素子の上面にあって前記インターポーザ側に設けられた第2パッドとを接続するボンディングワイヤと、を具備し、
前記インターポーザの端面は、前記プリント基板の前記貫通孔の壁面よりも前記第2半導体素子に突出し、かつ前記第2半導体素子の端面と対向する半導体装置。 - 前記プリント基板は樹脂により形成され、
前記インターポーザはセラミックにより形成されている請求項1に記載の半導体装置。 - 前記ボンディングワイヤに流れる電気信号は、前記第1半導体素子と前記プリント基板との間で流れる電気信号よりも高速である請求項1または2に記載の半導体装置。
- 前記第1半導体素子は、前記プリント基板から入力される電気信号の高速化、および前記インターポーザから入力される電気信号の低速化の少なくとも一方を行う請求項1から3のいずれか一項に記載の半導体装置。
- 前記インターポーザの前記第1パッドの上面と前記第2半導体素子の前記第2パッドの上面とは同じ高さに位置する請求項1から4のいずれか一項に記載の半導体装置。
- 前記インターポーザおよび前記第1半導体素子は前記プリント基板の前記上面に表面実装されている請求項1から5のいずれか一項に記載の半導体装置。
- 前記インターポーザは前記プリント基板の前記上面に表面実装され、
前記第1半導体素子は前記インターポーザの上面に表面実装されている請求項1から5のいずれか一項に記載の半導体装置。 - 前記貫通孔の内側に設けられた金属のベース部材を備え、
前記第2半導体素子は前記ベース部材の上面に設けられている請求項1から7のいずれか一項に記載の半導体装置。 - 前記第2半導体素子の前記上面または側面から延伸する光ファイバを備え、
前記第2半導体素子は前記インターポーザから入力される電気信号を光信号に変換し前記光ファイバに出力すること、および前記光ファイバから入力される光信号を電気信号に変換することの少なくとも一方を行う請求項1から8のいずれか一項に記載の半導体装置。 - 上面から下面にかけて貫通する貫通孔を有するプリント基板を準備する工程と、
インターポーザの上面に前記インターポーザと電気的に接続される第1半導体素子を搭載する工程と、
前記プリント基板の上面に前記プリント基板と電気的に接続される前記インターポーザを搭載する工程と、
前記インターポーザと隣接し、かつ前記貫通孔と重なる位置に第2半導体素子を設ける工程と、
前記インターポーザの前記上面にあり前記第2半導体素子側に設けられた第1パッドと、前記第2半導体素子の上面にあり前記インターポーザ側に設けられた第2パッドとを、ボンディングワイヤにより電気的に接続する工程と、を有し、
前記インターポーザの端面は、前記プリント基板の前記貫通孔の壁面よりも前記第2半導体素子に突出し、かつ前記第2半導体素子の端面と対向する半導体装置の製造方法。
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