IT1395368B1 - Schermatura elettromagnetica per il collaudo di circuiti integrati - Google Patents

Schermatura elettromagnetica per il collaudo di circuiti integrati

Info

Publication number
IT1395368B1
IT1395368B1 ITMI2009A001511A ITMI20091511A IT1395368B1 IT 1395368 B1 IT1395368 B1 IT 1395368B1 IT MI2009A001511 A ITMI2009A001511 A IT MI2009A001511A IT MI20091511 A ITMI20091511 A IT MI20091511A IT 1395368 B1 IT1395368 B1 IT 1395368B1
Authority
IT
Italy
Prior art keywords
testing
integrated circuits
electromagnetic shield
shield
electromagnetic
Prior art date
Application number
ITMI2009A001511A
Other languages
English (en)
Inventor
Alberto Pagani
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITMI2009A001511A priority Critical patent/IT1395368B1/it
Priority to US12/851,680 priority patent/US8907693B2/en
Publication of ITMI20091511A1 publication Critical patent/ITMI20091511A1/it
Application granted granted Critical
Publication of IT1395368B1 publication Critical patent/IT1395368B1/it
Priority to US14/533,526 priority patent/US9874586B2/en
Priority to US15/838,550 priority patent/US10677816B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
ITMI2009A001511A 2009-08-28 2009-08-28 Schermatura elettromagnetica per il collaudo di circuiti integrati IT1395368B1 (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
ITMI2009A001511A IT1395368B1 (it) 2009-08-28 2009-08-28 Schermatura elettromagnetica per il collaudo di circuiti integrati
US12/851,680 US8907693B2 (en) 2009-08-28 2010-08-06 Electromagnetic shield for testing integrated circuits
US14/533,526 US9874586B2 (en) 2009-08-28 2014-11-05 Electromagnetic shield for testing integrated circuits
US15/838,550 US10677816B2 (en) 2009-08-28 2017-12-12 Electromagnetic shield for testing integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI2009A001511A IT1395368B1 (it) 2009-08-28 2009-08-28 Schermatura elettromagnetica per il collaudo di circuiti integrati

Publications (2)

Publication Number Publication Date
ITMI20091511A1 ITMI20091511A1 (it) 2011-02-28
IT1395368B1 true IT1395368B1 (it) 2012-09-14

Family

ID=42040543

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2009A001511A IT1395368B1 (it) 2009-08-28 2009-08-28 Schermatura elettromagnetica per il collaudo di circuiti integrati

Country Status (2)

Country Link
US (3) US8907693B2 (it)
IT (1) IT1395368B1 (it)

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JP2011043377A (ja) * 2009-08-20 2011-03-03 Tokyo Electron Ltd 検査用接触構造体
IT1395368B1 (it) * 2009-08-28 2012-09-14 St Microelectronics Srl Schermatura elettromagnetica per il collaudo di circuiti integrati
CN102693962A (zh) * 2011-03-22 2012-09-26 精材科技股份有限公司 具有电磁屏蔽作用的集成电路晶圆及其制造方法
US8912809B2 (en) * 2012-06-12 2014-12-16 Apple Inc. Methods and apparatus for performing wafer-level testing on antenna tuning elements
CN103792484B (zh) * 2014-01-24 2016-09-28 苏州高新区世纪福科技有限公司 手机pcb板测试装置
CN103792483B (zh) * 2014-01-24 2016-04-06 苏州高新区世纪福科技有限公司 手机pcb板测试装置
US9891266B2 (en) * 2014-02-25 2018-02-13 Taiwan Semiconductor Manufacturing Co., Ltd. Test circuit and method
US9995770B2 (en) * 2014-03-21 2018-06-12 Taiwan Semiconductor Manufacturing Company Limited Multidirectional semiconductor arrangement testing
US9343377B1 (en) * 2015-01-08 2016-05-17 Google Inc. Test then destroy technique for security-focused semiconductor integrated circuits
US9952255B2 (en) 2015-10-30 2018-04-24 Texas Instruments Incorporated Magnetically shielded probe card
US10180454B2 (en) * 2015-12-01 2019-01-15 Texas Instruments Incorporated Systems and methods of testing multiple dies
US10598697B2 (en) 2017-01-12 2020-03-24 Formfactor, Inc. Shielding for vertical probe heads
TWM569114U (zh) * 2018-05-25 2018-10-21 匯宏科技股份有限公司 射頻測試設備及其移動式測試裝置與機殼模組
US11726112B2 (en) * 2019-09-16 2023-08-15 Taiwan Semiconductor Manufacturing Co., Ltd. Electromagnetic shielding during wafer stage testing
US11467207B2 (en) 2020-12-23 2022-10-11 Industrial Technology Research Institute Massive testing of micro integrated circuit
CN113691230B (zh) * 2021-08-25 2023-11-28 北京超材信息科技有限公司 声学装置封装结构
KR20240021416A (ko) 2022-08-10 2024-02-19 조경철 O2o 기반 해양 액티비티 정보 제공 시스템 및 방법
CN117572045B (zh) * 2024-01-12 2024-04-12 南京燧锐科技有限公司 射频芯片的测试座

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US4697143A (en) * 1984-04-30 1987-09-29 Cascade Microtech, Inc. Wafer probe
US5373231A (en) * 1993-06-10 1994-12-13 G. G. B. Industries, Inc. Integrated circuit probing apparatus including a capacitor bypass structure
JPH1130630A (ja) * 1997-07-10 1999-02-02 Tokyo Kasoode Kenkyusho:Kk 探針用プローブ及びプローブカード
US6917525B2 (en) * 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US7173444B2 (en) * 2000-04-04 2007-02-06 Ali Pourkeramati Structure and method for parallel testing of dies on a semiconductor wafer
US6323639B1 (en) * 2000-04-04 2001-11-27 Azalea Microelectronics Corporation Powering dies on a semiconductor wafer through wafer scribe line areas
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JP4519571B2 (ja) * 2004-08-26 2010-08-04 ルネサスエレクトロニクス株式会社 半導体装置及びその検査方法と検査装置並びに半導体装置の製造方法
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US7652491B2 (en) * 2006-11-17 2010-01-26 Suss Microtec Test Systems Gmbh Probe support with shield for the examination of test substrates under use of probe supports
US7651889B2 (en) * 2007-09-13 2010-01-26 Freescale Semiconductor, Inc. Electromagnetic shield formation for integrated circuit die package
US8089295B2 (en) * 2007-12-31 2012-01-03 Hitachi Global Storage Technologies Netherlands B.V. Wafer level balanced capacitance design for magnetic heads
EP2386110A4 (en) * 2009-01-06 2013-01-23 Luxim Corp ELECTRODE-FREE LOW FREQUENCY PLASMA LAMP
IT1395368B1 (it) * 2009-08-28 2012-09-14 St Microelectronics Srl Schermatura elettromagnetica per il collaudo di circuiti integrati
US20130015870A1 (en) * 2011-07-14 2013-01-17 Nickel Joshua G Test system with contact test probes
US8614105B2 (en) * 2011-09-28 2013-12-24 Taiwan Semiconductor Manufacturing Company, Ltd. Production flow and reusable testing method
US9252593B2 (en) * 2012-12-17 2016-02-02 Taiwan Semiconductor Manufacturing Co., Ltd. Three dimensional integrated circuit electrostatic discharge protection and prevention test interface

Also Published As

Publication number Publication date
US20110050267A1 (en) 2011-03-03
US8907693B2 (en) 2014-12-09
US20150054538A1 (en) 2015-02-26
US20180100876A1 (en) 2018-04-12
US10677816B2 (en) 2020-06-09
ITMI20091511A1 (it) 2011-02-28
US9874586B2 (en) 2018-01-23

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