IT1403475B1 - Struttura di connessione per un circuito integrato con funzione capacitiva - Google Patents

Struttura di connessione per un circuito integrato con funzione capacitiva

Info

Publication number
IT1403475B1
IT1403475B1 ITVI2010A000339A ITVI20100339A IT1403475B1 IT 1403475 B1 IT1403475 B1 IT 1403475B1 IT VI2010A000339 A ITVI2010A000339 A IT VI2010A000339A IT VI20100339 A ITVI20100339 A IT VI20100339A IT 1403475 B1 IT1403475 B1 IT 1403475B1
Authority
IT
Italy
Prior art keywords
integrated circuit
connection structure
capacitive function
capacitive
function
Prior art date
Application number
ITVI2010A000339A
Other languages
English (en)
Inventor
Alberto Pagani
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITVI2010A000339A priority Critical patent/IT1403475B1/it
Priority to PCT/EP2011/006449 priority patent/WO2012084207A1/en
Priority to CN201180058905.9A priority patent/CN103250248B/zh
Publication of ITVI20100339A1 publication Critical patent/ITVI20100339A1/it
Priority to US13/914,820 priority patent/US9257499B2/en
Application granted granted Critical
Publication of IT1403475B1 publication Critical patent/IT1403475B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
    • H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
ITVI2010A000339A 2010-12-20 2010-12-20 Struttura di connessione per un circuito integrato con funzione capacitiva IT1403475B1 (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
ITVI2010A000339A IT1403475B1 (it) 2010-12-20 2010-12-20 Struttura di connessione per un circuito integrato con funzione capacitiva
PCT/EP2011/006449 WO2012084207A1 (en) 2010-12-20 2011-12-20 Connection structure for an integrated circuit with capacitive function
CN201180058905.9A CN103250248B (zh) 2010-12-20 2011-12-20 具有电容功能的用于集成电路的连接结构
US13/914,820 US9257499B2 (en) 2010-12-20 2013-06-11 Connection structure for an integrated circuit with capacitive function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITVI2010A000339A IT1403475B1 (it) 2010-12-20 2010-12-20 Struttura di connessione per un circuito integrato con funzione capacitiva

Publications (2)

Publication Number Publication Date
ITVI20100339A1 ITVI20100339A1 (it) 2012-06-21
IT1403475B1 true IT1403475B1 (it) 2013-10-17

Family

ID=43737547

Family Applications (1)

Application Number Title Priority Date Filing Date
ITVI2010A000339A IT1403475B1 (it) 2010-12-20 2010-12-20 Struttura di connessione per un circuito integrato con funzione capacitiva

Country Status (4)

Country Link
US (1) US9257499B2 (it)
CN (1) CN103250248B (it)
IT (1) IT1403475B1 (it)
WO (1) WO2012084207A1 (it)

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US8779564B1 (en) * 2013-03-14 2014-07-15 Intel IP Corporation Semiconductor device with capacitive coupling structure
US9653533B2 (en) * 2015-02-18 2017-05-16 Qualcomm Incorporated Multi-layer interconnected spiral capacitor
US20170194245A1 (en) * 2016-01-04 2017-07-06 Globalfoundries Inc. On-chip variable capacitor with geometric cross-section
US10741486B2 (en) * 2016-03-06 2020-08-11 Intel Corporation Electronic components having three-dimensional capacitors in a metallization stack
KR20180069629A (ko) 2016-12-15 2018-06-25 삼성전자주식회사 반도체 장치
US10868479B2 (en) * 2018-10-04 2020-12-15 Stmicroelectronics S.R.L. Inverse electrowetting and magnetic energy harvesting and scavenging methods, circuits and systems
WO2020210932A1 (zh) * 2019-04-15 2020-10-22 华为技术有限公司 电容器和半导体芯片
EP3796013B1 (en) * 2019-09-18 2023-08-02 Infineon Technologies AG Interface adapted to receive a radio frequency probe for testing an electric device, and method for testing an electric device arranged on a substrate
US11538638B2 (en) 2020-07-01 2022-12-27 International Business Machines Corporation Co-axial grid array capacitor assembly
US11646262B2 (en) * 2021-06-21 2023-05-09 Nanya Technology Corporation Semiconductor device with horizontally arranged capacitor and method for fabricating the same

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Also Published As

Publication number Publication date
CN103250248A (zh) 2013-08-14
CN103250248B (zh) 2017-04-19
US20130277803A1 (en) 2013-10-24
US9257499B2 (en) 2016-02-09
WO2012084207A1 (en) 2012-06-28
ITVI20100339A1 (it) 2012-06-21

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