ITMI20111040A1 - Disposizione di collegamento elettrica - Google Patents

Disposizione di collegamento elettrica

Info

Publication number
ITMI20111040A1
ITMI20111040A1 ITMI20111040A ITMI20111040A1 IT MI20111040 A1 ITMI20111040 A1 IT MI20111040A1 IT MI20111040 A ITMI20111040 A IT MI20111040A IT MI20111040 A1 ITMI20111040 A1 IT MI20111040A1
Authority
IT
Italy
Prior art keywords
electrical connection
connection arrangement
arrangement
electrical
connection
Prior art date
Application number
Other languages
English (en)
Inventor
Uwe Liskow
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20111040A1 publication Critical patent/ITMI20111040A1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
ITMI20111040 2010-06-15 2011-06-09 Disposizione di collegamento elettrica ITMI20111040A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201010030063 DE102010030063A1 (de) 2010-06-15 2010-06-15 Elektrische Verbindungsanordnung

Publications (1)

Publication Number Publication Date
ITMI20111040A1 true ITMI20111040A1 (it) 2011-12-16

Family

ID=44898734

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI20111040 ITMI20111040A1 (it) 2010-06-15 2011-06-09 Disposizione di collegamento elettrica

Country Status (4)

Country Link
JP (2) JP6143413B2 (it)
CN (1) CN102386490B (it)
DE (1) DE102010030063A1 (it)
IT (1) ITMI20111040A1 (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6328644B2 (ja) * 2013-09-10 2018-05-23 堺ディスプレイプロダクト株式会社 導電体の接続構造及び表示装置
DE102014221973A1 (de) 2014-10-28 2016-04-28 Robert Bosch Gmbh Elektrisches Gerät für den Einsatz in einem kontaminierenden Medium und Verfahren zur Herstellung eines solchen
DE102015208413A1 (de) * 2015-05-06 2016-11-10 Robert Bosch Gmbh Elektrische Verbindungsanordnung
DE102016209421A1 (de) * 2016-05-31 2017-11-30 Robert Bosch Gmbh Steuergeräteeinheit, insbesondere für ein Kraftfahrzeug und Verfahren zum elektrischen Verbinden eines Stanzgitters aus im Wesentlichen Kupfer oder Aluminium mit elektrischen Bauelementen auf einer Montagefläche eines Leiterplattenelements
DE102016216660A1 (de) 2016-09-02 2018-03-08 Volkswagen Aktiengesellschaft Batterieeinheit und Verdrahtungseinheit für eine Batterieeinheit
DE102016219374B4 (de) 2016-10-06 2018-06-14 Siemens Aktiengesellschaft Langzeitstabile und stoffschlüssige Strompfadverbindung für Nieder-, Mittelspannungs- und/oder Hochspannungsanlagen bzw. –Schaltgeräte mittels Nanomaterialien
CN108281804A (zh) * 2018-04-26 2018-07-13 贵州电网有限责任公司 一种用于电力设备的新型螺母垫片
CN109301513B (zh) * 2018-10-24 2020-10-30 云南电网有限责任公司电力科学研究院 一种接触反应式电缆连接装置及连接方法
JP7498619B2 (ja) 2020-08-06 2024-06-12 株式会社今仙電機製作所 アッパーレールとアッパーレール用ワイヤハーネスの取付構造

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624769A (en) * 1979-08-01 1981-03-09 Suwa Seikosha Kk Electric connection terminal
JPS6177279A (ja) * 1984-09-21 1986-04-19 日立化成工業株式会社 回路の接続部材
JPH03133069A (ja) * 1989-10-17 1991-06-06 Toshiba Chem Corp 電気回路成形品
JPH0511380U (ja) * 1991-07-26 1993-02-12 市光工業株式会社 ユニツトを具備する電気機器
JPH07282622A (ja) * 1994-04-08 1995-10-27 Rohm Co Ltd 電極材料及びこれを用いたチップ状電子部品
TW340132B (en) * 1994-10-20 1998-09-11 Ibm Structure for use as an electrical interconnection means and process for preparing the same
TW406454B (en) * 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
DE59806054D1 (de) 1997-04-02 2002-11-28 Siemens Ag Elektrische verbindung eines schaltungsträgers mit einem leiterbahnträger
DE19832062C2 (de) 1998-07-16 2001-03-01 Siemens Ag Steuergerät für ein Kraftfahrzeug
JP2002298940A (ja) * 2001-03-30 2002-10-11 Jst Mfg Co Ltd 樹脂ハンダを用いた電気接触子、電気コネクタ及びこれらのプリント配線板への接続方法
JP2002298962A (ja) * 2001-03-30 2002-10-11 Jst Mfg Co Ltd 樹脂ハンダを用いた電気接触子、電気コネクタ及びこれらのプリント配線板への接続方法
JP2002298946A (ja) * 2001-03-30 2002-10-11 Jst Mfg Co Ltd 樹脂ハンダを用いた電気接続具、電気コネクタ及びこれらへの電線接続方法
JP2002298938A (ja) * 2001-03-30 2002-10-11 Jst Mfg Co Ltd 樹脂ハンダを用いたツイストペアケーブルの電気コネクタ及びこの電気コネクタへの電線接続方法
JP4000865B2 (ja) * 2002-02-22 2007-10-31 モレックス インコーポレーテッド 電気コネクタ
JP2008021873A (ja) * 2006-07-13 2008-01-31 Toshiba Corp インターフェイスモジュール付きｌｓｉパッケージ
JP2007251197A (ja) * 2007-05-15 2007-09-27 Hitachi Chem Co Ltd 半導体装置の製造方法
JP5266774B2 (ja) * 2008-01-31 2013-08-21 住友ベークライト株式会社 樹脂組成物およびそれを用いて作製した半導体装置または回路基板
JP5112908B2 (ja) * 2008-02-22 2013-01-09 株式会社オートネットワーク技術研究所 車両用自動変速機の接続ユニット
JP5189120B2 (ja) * 2010-03-08 2013-04-24 日立オートモティブシステムズ株式会社 電力変換装置

Also Published As

Publication number Publication date
DE102010030063A1 (de) 2011-12-15
JP2016171079A (ja) 2016-09-23
JP6143413B2 (ja) 2017-06-07
JP6121019B2 (ja) 2017-04-26
CN102386490B (zh) 2016-01-20
CN102386490A (zh) 2012-03-21
JP2012004120A (ja) 2012-01-05

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