EP2901714A4 - Embedded circuit in a mems device - Google Patents

Embedded circuit in a mems device

Info

Publication number
EP2901714A4
EP2901714A4 EP13842019.5A EP13842019A EP2901714A4 EP 2901714 A4 EP2901714 A4 EP 2901714A4 EP 13842019 A EP13842019 A EP 13842019A EP 2901714 A4 EP2901714 A4 EP 2901714A4
Authority
EP
European Patent Office
Prior art keywords
mems device
embedded circuit
embedded
circuit
mems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP13842019.5A
Other languages
German (de)
French (fr)
Other versions
EP2901714A1 (en
Inventor
Sandra F Vos
Daniel Giesecke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Knowles Electronics LLC
Original Assignee
Knowles Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knowles Electronics LLC filed Critical Knowles Electronics LLC
Publication of EP2901714A1 publication Critical patent/EP2901714A1/en
Publication of EP2901714A4 publication Critical patent/EP2901714A4/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
    • H01L2224/251—Disposition
    • H01L2224/2518—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
EP13842019.5A 2012-09-27 2013-09-26 Embedded circuit in a mems device Ceased EP2901714A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261706350P 2012-09-27 2012-09-27
PCT/US2013/061873 WO2014052559A1 (en) 2012-09-27 2013-09-26 Embedded circuit in a mems device

Publications (2)

Publication Number Publication Date
EP2901714A1 EP2901714A1 (en) 2015-08-05
EP2901714A4 true EP2901714A4 (en) 2016-06-08

Family

ID=50388957

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13842019.5A Ceased EP2901714A4 (en) 2012-09-27 2013-09-26 Embedded circuit in a mems device

Country Status (5)

Country Link
EP (1) EP2901714A4 (en)
JP (1) JP2015532548A (en)
KR (1) KR20150058467A (en)
CN (1) CN104756523B (en)
WO (1) WO2014052559A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014106503B4 (en) 2014-05-08 2016-03-03 Epcos Ag Method of making a microphone
EP3018092A1 (en) 2014-11-10 2016-05-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft MEMS package
US10373883B2 (en) * 2017-10-26 2019-08-06 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
JP2020013835A (en) * 2018-07-13 2020-01-23 Tdk株式会社 Package substrate for sensor and sensor module including the same and electronic component built-in substrate
CN109218862B (en) * 2018-08-31 2019-12-24 合翔(常州)电子有限公司 Electroacoustic element and production process thereof
JP7435306B2 (en) 2020-06-25 2024-02-21 Tdk株式会社 Circuit board with cavity and manufacturing method thereof
CN113905318A (en) * 2021-09-16 2022-01-07 歌尔微电子股份有限公司 Microphone structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110241197A1 (en) * 2010-04-01 2011-10-06 Horst Theuss Device and Method for Manufacturing a Device
US20120087521A1 (en) * 2010-10-12 2012-04-12 Analog Devices, Inc. Microphone Package with Embedded ASIC
JP2012086345A (en) * 2010-10-22 2012-05-10 Dainippon Printing Co Ltd Mems device, its manufacturing method, and semiconductor device having the device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005053765B4 (en) * 2005-11-10 2016-04-14 Epcos Ag MEMS package and method of manufacture
US7436054B2 (en) * 2006-03-03 2008-10-14 Silicon Matrix, Pte. Ltd. MEMS microphone with a stacked PCB package and method of producing the same
WO2010114602A1 (en) * 2009-03-31 2010-10-07 Sand9, Inc. Integration of piezoelectric materials with substrates
US8421168B2 (en) * 2009-11-17 2013-04-16 Fairchild Semiconductor Corporation Microelectromechanical systems microphone packaging systems
KR101130335B1 (en) * 2010-07-09 2012-03-26 주식회사 비에스이 microphone

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110241197A1 (en) * 2010-04-01 2011-10-06 Horst Theuss Device and Method for Manufacturing a Device
US20120087521A1 (en) * 2010-10-12 2012-04-12 Analog Devices, Inc. Microphone Package with Embedded ASIC
JP2012086345A (en) * 2010-10-22 2012-05-10 Dainippon Printing Co Ltd Mems device, its manufacturing method, and semiconductor device having the device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014052559A1 *

Also Published As

Publication number Publication date
KR20150058467A (en) 2015-05-28
JP2015532548A (en) 2015-11-09
CN104756523B (en) 2018-01-16
CN104756523A (en) 2015-07-01
WO2014052559A1 (en) 2014-04-03
EP2901714A1 (en) 2015-08-05

Similar Documents

Publication Publication Date Title
GB201217905D0 (en) A device
AU349387S (en) Electronic device
AU348054S (en) Electronic device
AU346997S (en) Electronic device
AU346130S (en) Electronic device
EP2816462A4 (en) Electronic device
GB201214425D0 (en) Electronic device
SG11201404734SA (en) Electronic device
EP2800395A4 (en) Electronic device
EP2793484A4 (en) Electronic device
GB201508775D0 (en) A Retention device
AP00415S1 (en) Electronic device
EP2811721A4 (en) Electronic device
GB201322751D0 (en) Electronic device
AP00414S1 (en) Electronic device
AP00339S1 (en) Electronic Device
EP2901714A4 (en) Embedded circuit in a mems device
EP2846556A4 (en) Electronic device
TWI563724B (en) Electronic device
EP2806342A4 (en) Electronic device
AP00338S1 (en) Electronic device
GB201216660D0 (en) Electromechanical device
GB201215394D0 (en) Electronic device
PL2827805T3 (en) A connection device
EP2838434A4 (en) A microbiopsy device

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20150415

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20160509

RIC1 Information provided on ipc code assigned before grant

Ipc: H04R 1/04 20060101AFI20160502BHEP

Ipc: H04R 31/00 20060101ALN20160502BHEP

Ipc: H04R 19/00 20060101ALI20160502BHEP

Ipc: H01L 29/84 20060101ALI20160502BHEP

Ipc: H04R 19/04 20060101ALI20160502BHEP

17Q First examination report despatched

Effective date: 20160613

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

REG Reference to a national code

Ref country code: DE

Ref legal event code: R003

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20210915