EP2901714A4 - Circuit intégré dans un dispositif mems - Google Patents

Circuit intégré dans un dispositif mems

Info

Publication number
EP2901714A4
EP2901714A4 EP13842019.5A EP13842019A EP2901714A4 EP 2901714 A4 EP2901714 A4 EP 2901714A4 EP 13842019 A EP13842019 A EP 13842019A EP 2901714 A4 EP2901714 A4 EP 2901714A4
Authority
EP
European Patent Office
Prior art keywords
mems device
embedded circuit
embedded
circuit
mems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP13842019.5A
Other languages
German (de)
English (en)
Other versions
EP2901714A1 (fr
Inventor
Sandra F Vos
Daniel Giesecke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Knowles Electronics LLC
Original Assignee
Knowles Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knowles Electronics LLC filed Critical Knowles Electronics LLC
Publication of EP2901714A1 publication Critical patent/EP2901714A1/fr
Publication of EP2901714A4 publication Critical patent/EP2901714A4/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
    • H01L2224/251—Disposition
    • H01L2224/2518—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
EP13842019.5A 2012-09-27 2013-09-26 Circuit intégré dans un dispositif mems Ceased EP2901714A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261706350P 2012-09-27 2012-09-27
PCT/US2013/061873 WO2014052559A1 (fr) 2012-09-27 2013-09-26 Circuit intégré dans un dispositif mems

Publications (2)

Publication Number Publication Date
EP2901714A1 EP2901714A1 (fr) 2015-08-05
EP2901714A4 true EP2901714A4 (fr) 2016-06-08

Family

ID=50388957

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13842019.5A Ceased EP2901714A4 (fr) 2012-09-27 2013-09-26 Circuit intégré dans un dispositif mems

Country Status (5)

Country Link
EP (1) EP2901714A4 (fr)
JP (1) JP2015532548A (fr)
KR (1) KR20150058467A (fr)
CN (1) CN104756523B (fr)
WO (1) WO2014052559A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014106503B4 (de) 2014-05-08 2016-03-03 Epcos Ag Verfahren zur Herstellung eines Mikrofons
EP3018092A1 (fr) 2014-11-10 2016-05-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Emballage de mems
US10373883B2 (en) * 2017-10-26 2019-08-06 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
JP2020013835A (ja) * 2018-07-13 2020-01-23 Tdk株式会社 センサー用パッケージ基板及びこれを備えるセンサーモジュール並びに電子部品内臓基板
CN109218862B (zh) * 2018-08-31 2019-12-24 合翔(常州)电子有限公司 一种电声元件及其生产工艺
JP7435306B2 (ja) * 2020-06-25 2024-02-21 Tdk株式会社 キャビティを有する回路基板及びその製造方法
CN113905318B (zh) * 2021-09-16 2024-10-11 歌尔微电子股份有限公司 麦克风结构

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040168825A1 (en) * 2000-02-25 2004-09-02 Hajime Sakamoto Multilayer printed circuit board and multilayer printed circuit board manufacturing method
US20080007927A1 (en) * 2005-12-16 2008-01-10 Ibiden Co., Ltd. Multilayered printed circuit board and the manufacturing method thereof
US20100195864A1 (en) * 2007-08-02 2010-08-05 Nxp B.V. Electro-acoustic transducer comprising a mems sensor
TW201101851A (en) * 2009-06-23 2011-01-01 Merry Electronics Co Ltd Micro-electro-mechanical acoustic sensor package structure
US20110163437A1 (en) * 2010-01-07 2011-07-07 Samsung Electro-Mechanics Co., Ltd. Semiconductor package and method of manufacturing the same
US20110241197A1 (en) * 2010-04-01 2011-10-06 Horst Theuss Device and Method for Manufacturing a Device
US20120020510A1 (en) * 2009-02-05 2012-01-26 Funai Electric Co., Ltd. Microphone unit
US20120087521A1 (en) * 2010-10-12 2012-04-12 Analog Devices, Inc. Microphone Package with Embedded ASIC
JP2012086345A (ja) * 2010-10-22 2012-05-10 Dainippon Printing Co Ltd Ｍｅｍｓデバイス、その製造方法、及びそれを有する半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
US7436054B2 (en) * 2006-03-03 2008-10-14 Silicon Matrix, Pte. Ltd. MEMS microphone with a stacked PCB package and method of producing the same
US8766512B2 (en) * 2009-03-31 2014-07-01 Sand 9, Inc. Integration of piezoelectric materials with substrates
US8421168B2 (en) * 2009-11-17 2013-04-16 Fairchild Semiconductor Corporation Microelectromechanical systems microphone packaging systems
KR101130335B1 (ko) * 2010-07-09 2012-03-26 주식회사 비에스이 마이크로폰

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040168825A1 (en) * 2000-02-25 2004-09-02 Hajime Sakamoto Multilayer printed circuit board and multilayer printed circuit board manufacturing method
US20080007927A1 (en) * 2005-12-16 2008-01-10 Ibiden Co., Ltd. Multilayered printed circuit board and the manufacturing method thereof
US20100195864A1 (en) * 2007-08-02 2010-08-05 Nxp B.V. Electro-acoustic transducer comprising a mems sensor
US20120020510A1 (en) * 2009-02-05 2012-01-26 Funai Electric Co., Ltd. Microphone unit
TW201101851A (en) * 2009-06-23 2011-01-01 Merry Electronics Co Ltd Micro-electro-mechanical acoustic sensor package structure
US20110163437A1 (en) * 2010-01-07 2011-07-07 Samsung Electro-Mechanics Co., Ltd. Semiconductor package and method of manufacturing the same
US20110241197A1 (en) * 2010-04-01 2011-10-06 Horst Theuss Device and Method for Manufacturing a Device
US20120087521A1 (en) * 2010-10-12 2012-04-12 Analog Devices, Inc. Microphone Package with Embedded ASIC
JP2012086345A (ja) * 2010-10-22 2012-05-10 Dainippon Printing Co Ltd Ｍｅｍｓデバイス、その製造方法、及びそれを有する半導体装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014052559A1 *

Also Published As

Publication number Publication date
KR20150058467A (ko) 2015-05-28
JP2015532548A (ja) 2015-11-09
EP2901714A1 (fr) 2015-08-05
CN104756523A (zh) 2015-07-01
WO2014052559A1 (fr) 2014-04-03
CN104756523B (zh) 2018-01-16

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