KR101999526B1 - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR101999526B1 KR101999526B1 KR1020100019448A KR20100019448A KR101999526B1 KR 101999526 B1 KR101999526 B1 KR 101999526B1 KR 1020100019448 A KR1020100019448 A KR 1020100019448A KR 20100019448 A KR20100019448 A KR 20100019448A KR 101999526 B1 KR101999526 B1 KR 101999526B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive layer
- electrode
- wiring
- layer
- pixel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2009-051779 | 2009-03-05 | ||
| JP2009051779 | 2009-03-05 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020170036805A Division KR101781794B1 (ko) | 2009-03-05 | 2017-03-23 | 반도체 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100100673A KR20100100673A (ko) | 2010-09-15 |
| KR101999526B1 true KR101999526B1 (ko) | 2019-07-12 |
Family
ID=42677438
Family Applications (10)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100019448A Active KR101999526B1 (ko) | 2009-03-05 | 2010-03-04 | 반도체 장치 |
| KR1020170036805A Active KR101781794B1 (ko) | 2009-03-05 | 2017-03-23 | 반도체 장치 |
| KR1020170119580A Active KR101838471B1 (ko) | 2009-03-05 | 2017-09-18 | 반도체 장치 |
| KR1020180022894A Active KR101881734B1 (ko) | 2009-03-05 | 2018-02-26 | 반도체 장치 |
| KR1020180079189A Active KR101991233B1 (ko) | 2009-03-05 | 2018-07-09 | 반도체 장치 |
| KR1020190069030A Active KR102025531B1 (ko) | 2009-03-05 | 2019-06-12 | 반도체 장치 |
| KR1020190115143A Active KR102258875B1 (ko) | 2009-03-05 | 2019-09-19 | 반도체 장치 |
| KR1020210066646A Active KR102329918B1 (ko) | 2009-03-05 | 2021-05-25 | 반도체 장치 |
| KR1020210153498A Active KR102398135B1 (ko) | 2009-03-05 | 2021-11-10 | 반도체 장치 |
| KR1020220055956A Ceased KR20220066015A (ko) | 2009-03-05 | 2022-05-06 | 반도체 장치 |
Family Applications After (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020170036805A Active KR101781794B1 (ko) | 2009-03-05 | 2017-03-23 | 반도체 장치 |
| KR1020170119580A Active KR101838471B1 (ko) | 2009-03-05 | 2017-09-18 | 반도체 장치 |
| KR1020180022894A Active KR101881734B1 (ko) | 2009-03-05 | 2018-02-26 | 반도체 장치 |
| KR1020180079189A Active KR101991233B1 (ko) | 2009-03-05 | 2018-07-09 | 반도체 장치 |
| KR1020190069030A Active KR102025531B1 (ko) | 2009-03-05 | 2019-06-12 | 반도체 장치 |
| KR1020190115143A Active KR102258875B1 (ko) | 2009-03-05 | 2019-09-19 | 반도체 장치 |
| KR1020210066646A Active KR102329918B1 (ko) | 2009-03-05 | 2021-05-25 | 반도체 장치 |
| KR1020210153498A Active KR102398135B1 (ko) | 2009-03-05 | 2021-11-10 | 반도체 장치 |
| KR1020220055956A Ceased KR20220066015A (ko) | 2009-03-05 | 2022-05-06 | 반도체 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (4) | US20100224880A1 (enExample) |
| JP (10) | JP5651350B2 (enExample) |
| KR (10) | KR101999526B1 (enExample) |
| CN (1) | CN101826520B (enExample) |
| TW (1) | TWI512976B (enExample) |
Families Citing this family (79)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101710586B (zh) * | 2009-01-09 | 2011-12-28 | 深超光电(深圳)有限公司 | 提高开口率的储存电容及其制作方法 |
| US20100224878A1 (en) * | 2009-03-05 | 2010-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8461582B2 (en) | 2009-03-05 | 2013-06-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR101768786B1 (ko) | 2009-07-18 | 2017-08-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
| KR101594855B1 (ko) * | 2009-11-25 | 2016-02-18 | 삼성전자주식회사 | Blu 및 디스플레이 장치 |
| JP5351282B2 (ja) * | 2009-11-27 | 2013-11-27 | シャープ株式会社 | 半導体装置およびその製造方法 |
| TWI691960B (zh) * | 2010-10-05 | 2020-04-21 | 日商半導體能源研究所股份有限公司 | 半導體記憶體裝置及其驅動方法 |
| JP2012108311A (ja) * | 2010-11-17 | 2012-06-07 | Toshiba Mobile Display Co Ltd | 液晶表示装置 |
| JP2012151453A (ja) | 2010-12-28 | 2012-08-09 | Semiconductor Energy Lab Co Ltd | 半導体装置および半導体装置の駆動方法 |
| DE102011004577B4 (de) * | 2011-02-23 | 2023-07-27 | Robert Bosch Gmbh | Bauelementträger, Verfahren zur Herstellung eines solchen Bauelementträgers sowie Bauteil mit einem MEMS-Bauelement auf einem solchen Bauelementträger |
| JP2012191008A (ja) * | 2011-03-10 | 2012-10-04 | Sony Corp | 表示装置および電子機器 |
| US9236496B2 (en) * | 2011-03-11 | 2016-01-12 | Sharp Kabushiki Kaisha | Thin film transistor and display device |
| JP2012203148A (ja) * | 2011-03-24 | 2012-10-22 | Toppan Printing Co Ltd | 薄膜トランジスタおよび反射型カラー表示装置 |
| US8922464B2 (en) * | 2011-05-11 | 2014-12-30 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix display device and driving method thereof |
| US9466618B2 (en) * | 2011-05-13 | 2016-10-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including two thin film transistors and method of manufacturing the same |
| KR101425064B1 (ko) | 2011-06-09 | 2014-08-01 | 엘지디스플레이 주식회사 | 산화물 박막 트랜지스터 및 그 제조방법 |
| KR102062243B1 (ko) * | 2011-09-27 | 2020-02-11 | 도판 인사츠 가부시키가이샤 | 박막 트랜지스터, 및 화상 표시 장치 |
| JP6076038B2 (ja) * | 2011-11-11 | 2017-02-08 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| JP2013130802A (ja) | 2011-12-22 | 2013-07-04 | Semiconductor Energy Lab Co Ltd | 半導体装置、画像表示装置、記憶装置、及び電子機器 |
| US9419146B2 (en) * | 2012-01-26 | 2016-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP2013222124A (ja) * | 2012-04-18 | 2013-10-28 | Sony Corp | 信号伝達装置、表示装置および電子機器 |
| KR101324240B1 (ko) * | 2012-05-04 | 2013-11-01 | 엘지디스플레이 주식회사 | 어레이 기판 및 이의 제조방법 |
| JP2014199899A (ja) * | 2012-08-10 | 2014-10-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| TWI467301B (zh) * | 2012-10-24 | 2015-01-01 | Au Optronics Corp | 顯示面板 |
| CN102938394B (zh) * | 2012-11-16 | 2015-01-07 | 京东方科技集团股份有限公司 | 显示装置、透反式薄膜晶体管阵列基板及其制作方法 |
| US9265458B2 (en) | 2012-12-04 | 2016-02-23 | Sync-Think, Inc. | Application of smooth pursuit cognitive testing paradigms to clinical drug development |
| AU2013360053B2 (en) * | 2012-12-10 | 2016-04-14 | Daktronics, Inc. | Encapsulation of light-emitting elements on a display module |
| WO2014091959A1 (ja) * | 2012-12-10 | 2014-06-19 | シャープ株式会社 | 半導体装置およびその製造方法 |
| TWI498797B (zh) * | 2012-12-13 | 2015-09-01 | Au Optronics Corp | 觸控面板及觸控顯示面板 |
| US9380976B2 (en) | 2013-03-11 | 2016-07-05 | Sync-Think, Inc. | Optical neuroinformatics |
| KR102179972B1 (ko) * | 2013-05-10 | 2020-11-18 | 삼성디스플레이 주식회사 | 배선 및 박막 트랜지스터 기판의 제조 방법 및 유기 발광 표시 장치 |
| KR102081107B1 (ko) * | 2013-05-30 | 2020-02-25 | 엘지디스플레이 주식회사 | 박막트랜지스터 어레이 기판 및 그의 제조방법 |
| JP6490914B2 (ja) * | 2013-06-28 | 2019-03-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2015179247A (ja) * | 2013-10-22 | 2015-10-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
| TWI518430B (zh) * | 2013-12-02 | 2016-01-21 | 群創光電股份有限公司 | 顯示面板及應用其之顯示裝置 |
| US9728567B2 (en) * | 2013-12-02 | 2017-08-08 | United Microelectronics Corp. | Semiconductor sensor device |
| JP6506545B2 (ja) | 2013-12-27 | 2019-04-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| DE112014006046T5 (de) | 2013-12-27 | 2016-09-15 | Semiconductor Energy Laboratory Co., Ltd. | Licht emittierende Vorrichtung |
| TWI686899B (zh) * | 2014-05-02 | 2020-03-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置、觸控感測器、顯示裝置 |
| CN105826393B (zh) * | 2015-01-06 | 2019-03-26 | 昆山国显光电有限公司 | 薄膜晶体管及其制作方法 |
| JP6662665B2 (ja) * | 2015-03-19 | 2020-03-11 | 株式会社半導体エネルギー研究所 | 液晶表示装置及び該液晶表示装置を用いた電子機器 |
| WO2016203340A1 (ja) * | 2015-06-19 | 2016-12-22 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法、表示装置、電子機器、プロジェクター、及びヘッドマウントディスプレイ |
| CN105097943A (zh) * | 2015-06-24 | 2015-11-25 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制备方法、阵列基板、显示装置 |
| JP6176583B1 (ja) * | 2015-11-12 | 2017-08-09 | パナソニックIpマネジメント株式会社 | 光検出装置 |
| TWI560486B (en) * | 2016-01-05 | 2016-12-01 | Innolux Corp | Display panel |
| CN107018289B (zh) * | 2016-01-22 | 2021-01-19 | 松下知识产权经营株式会社 | 摄像装置 |
| CN105573555B (zh) * | 2016-01-28 | 2018-06-29 | 京东方科技集团股份有限公司 | 一种压力触控结构、触控显示面板、显示装置 |
| TWI621997B (zh) * | 2016-02-04 | 2018-04-21 | 速博思股份有限公司 | 高效能指紋辨識裝置 |
| JP6724548B2 (ja) * | 2016-05-25 | 2020-07-15 | 凸版印刷株式会社 | 薄膜トランジスタアレイ基板のパターン形成方法 |
| KR102549444B1 (ko) * | 2016-06-16 | 2023-06-29 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| KR102492134B1 (ko) * | 2016-07-29 | 2023-01-27 | 트리나미엑스 게엠베하 | 광학 센서 및 광학적 검출용 검출기 |
| JP7050460B2 (ja) * | 2016-11-22 | 2022-04-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
| WO2018221294A1 (ja) * | 2017-05-31 | 2018-12-06 | シャープ株式会社 | アクティブマトリクス基板およびその製造方法 |
| CN109545795B (zh) * | 2017-09-22 | 2020-10-30 | 群创光电股份有限公司 | 显示装置 |
| CN108154852A (zh) * | 2017-12-29 | 2018-06-12 | 深圳Tcl新技术有限公司 | 背光组件、背光模组、显示装置及其控制方法 |
| WO2019187139A1 (ja) * | 2018-03-30 | 2019-10-03 | シャープ株式会社 | 表示デバイス |
| WO2019226958A1 (en) | 2018-05-24 | 2019-11-28 | The Research Foundation For The State University Of New York | Capacitive sensor |
| JP7190729B2 (ja) | 2018-08-31 | 2022-12-16 | 三国電子有限会社 | キャリア注入量制御電極を有する有機エレクトロルミネセンス素子 |
| JP7246681B2 (ja) | 2018-09-26 | 2023-03-28 | 三国電子有限会社 | トランジスタ及びトランジスタの製造方法、並びにトランジスタを含む表示装置 |
| KR102631177B1 (ko) * | 2018-12-28 | 2024-01-29 | 엘지디스플레이 주식회사 | 전계 발광 조명장치 |
| KR102827322B1 (ko) * | 2019-06-21 | 2025-07-02 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
| CN112582398B (zh) * | 2019-09-30 | 2024-07-26 | 台湾积体电路制造股份有限公司 | 半导体器件及其形成方法 |
| CN110783204B (zh) * | 2019-10-29 | 2022-04-12 | 南京京东方显示技术有限公司 | 一种双沟道立体tft器件、显示面板及其制造方法 |
| CN110931511A (zh) * | 2019-11-26 | 2020-03-27 | 深圳市华星光电半导体显示技术有限公司 | 一种显示面板及其制备方法 |
| JP7444436B2 (ja) | 2020-02-05 | 2024-03-06 | 三国電子有限会社 | 液晶表示装置 |
| TWI721776B (zh) * | 2020-02-06 | 2021-03-11 | 友達光電股份有限公司 | 主動元件基板及其製造方法 |
| CN111312077A (zh) * | 2020-03-03 | 2020-06-19 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制备方法 |
| CN112234092B (zh) * | 2020-10-30 | 2023-03-24 | 云谷(固安)科技有限公司 | 显示面板及显示装置 |
| JP7552377B2 (ja) * | 2021-01-20 | 2024-09-18 | セイコーエプソン株式会社 | センサーモジュール |
| CN115188768A (zh) * | 2021-03-22 | 2022-10-14 | 合肥京东方显示技术有限公司 | 阵列基板及其制作方法、显示面板和显示装置 |
| CN113467145B (zh) * | 2021-07-07 | 2023-07-25 | 昆山龙腾光电股份有限公司 | 阵列基板及制作方法、显示面板 |
| US11864452B1 (en) | 2021-08-24 | 2024-01-02 | Apple Inc. | Black masking layer in displays having transparent openings |
| JP7780273B2 (ja) * | 2021-08-26 | 2025-12-04 | キヤノン株式会社 | 表示装置、光電変換装置、電子機器、照明装置、移動体、および、ウェアラブルデバイス |
| CN114130674B (zh) * | 2021-11-26 | 2023-06-09 | 山东至辰信息科技股份有限公司 | 一种智慧图书馆书籍智能分拣机器人 |
| CN114203730B (zh) * | 2021-12-09 | 2023-05-30 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制作方法 |
| CN114325288A (zh) * | 2022-01-06 | 2022-04-12 | 北一半导体科技(广东)有限公司 | 一种评估半导体模块功率循环能力的方法和半导体模块 |
| TW202332072A (zh) * | 2022-01-19 | 2023-08-01 | 友達光電股份有限公司 | 感測裝置 |
| US12175907B2 (en) | 2022-12-09 | 2024-12-24 | Apple Inc. | Display with a transmitter under an active area |
| TWI892278B (zh) * | 2023-10-27 | 2025-08-01 | 佳世達科技股份有限公司 | 畫素電路以及顯示裝置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006242987A (ja) * | 2005-02-28 | 2006-09-14 | Casio Comput Co Ltd | 薄膜トランジスタパネル |
| US20060205125A1 (en) * | 2005-03-09 | 2006-09-14 | Yang-Ho Bae | TFT substrate and display device having the same |
Family Cites Families (152)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151188A (ja) * | 1984-08-21 | 1986-03-13 | セイコーインスツルメンツ株式会社 | アクテイブ・マトリクス表示装置用基板 |
| JPH0282221A (ja) | 1988-09-20 | 1990-03-22 | Seiko Epson Corp | 電気光学素子の配線方法 |
| JPH02260460A (ja) * | 1989-03-31 | 1990-10-23 | Casio Comput Co Ltd | 薄膜トランジスタ |
| JPH07113728B2 (ja) | 1989-05-26 | 1995-12-06 | シャープ株式会社 | アクティブマトリクス基板 |
| EP0445535B1 (en) * | 1990-02-06 | 1995-02-01 | Sel Semiconductor Energy Laboratory Co., Ltd. | Method of forming an oxide film |
| JP2851495B2 (ja) * | 1992-08-28 | 1999-01-27 | シャープ株式会社 | アクティブマトリクス基板の製造方法 |
| JPH06317809A (ja) * | 1993-05-07 | 1994-11-15 | Fujitsu Ltd | 薄膜トランジスタマトリクスの製造方法 |
| JP3423380B2 (ja) * | 1993-11-18 | 2003-07-07 | キヤノン株式会社 | 液晶表示装置 |
| US5644327A (en) * | 1995-06-07 | 1997-07-01 | David Sarnoff Research Center, Inc. | Tessellated electroluminescent display having a multilayer ceramic substrate |
| KR100394896B1 (ko) * | 1995-08-03 | 2003-11-28 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 투명스위칭소자를포함하는반도체장치 |
| JP2933879B2 (ja) * | 1995-08-11 | 1999-08-16 | シャープ株式会社 | 透過型液晶表示装置およびその製造方法 |
| JP3541026B2 (ja) * | 1995-08-11 | 2004-07-07 | シャープ株式会社 | 液晶表示装置、およびアクティブマトリクス基板 |
| KR970011972A (ko) * | 1995-08-11 | 1997-03-29 | 쯔지 하루오 | 투과형 액정 표시 장치 및 그 제조 방법 |
| US5808691A (en) * | 1995-12-12 | 1998-09-15 | Cirrus Logic, Inc. | Digital carrier synthesis synchronized to a reference signal that is asynchronous with respect to a digital sampling clock |
| JP3625598B2 (ja) * | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
| JP3325793B2 (ja) * | 1996-03-22 | 2002-09-17 | 三洋電機株式会社 | 非晶質半導体及びその製造方法並びに光起電力装置 |
| JPH10189992A (ja) * | 1996-12-27 | 1998-07-21 | Sony Corp | 半導体装置及びその製造方法 |
| KR100229613B1 (ko) * | 1996-12-30 | 1999-11-15 | 구자홍 | 액정 표시 장치 및 제조 방법 |
| JP3436487B2 (ja) * | 1998-05-18 | 2003-08-11 | シャープ株式会社 | アクティブマトリクス基板の製造方法 |
| JP3592535B2 (ja) * | 1998-07-16 | 2004-11-24 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2000150861A (ja) * | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
| JP3276930B2 (ja) * | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
| US6524876B1 (en) * | 1999-04-08 | 2003-02-25 | Samsung Electronics Co., Ltd. | Thin film transistor array panels for a liquid crystal display and a method for manufacturing the same |
| US6362507B1 (en) * | 1999-04-20 | 2002-03-26 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical devices in which pixel section and the driver circuit are disposed over the same substrate |
| JP4403329B2 (ja) * | 1999-08-30 | 2010-01-27 | ソニー株式会社 | 液晶表示装置の製造方法 |
| WO2001061760A1 (en) * | 2000-02-15 | 2001-08-23 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing thin-film transistor, and liquid-crystal display |
| KR20020038482A (ko) * | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
| JP4801262B2 (ja) * | 2001-01-30 | 2011-10-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3997731B2 (ja) * | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
| JP4090716B2 (ja) * | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
| JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
| EP1443130B1 (en) * | 2001-11-05 | 2011-09-28 | Japan Science and Technology Agency | Natural superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
| KR100825102B1 (ko) * | 2002-01-08 | 2008-04-25 | 삼성전자주식회사 | 박막 트랜지스터 기판 및 그 제조 방법 |
| JP4083486B2 (ja) * | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
| CN1445821A (zh) * | 2002-03-15 | 2003-10-01 | 三洋电机株式会社 | ZnO膜和ZnO半导体层的形成方法、半导体元件及其制造方法 |
| KR100991305B1 (ko) | 2002-04-19 | 2010-11-01 | 마크스 가부시기가이샤 | 전동스테이플러 |
| JP2004022625A (ja) * | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
| US7105868B2 (en) * | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
| JP2004077718A (ja) * | 2002-08-15 | 2004-03-11 | Hitachi Displays Ltd | 液晶表示装置 |
| US7067843B2 (en) * | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
| TW588462B (en) * | 2003-03-31 | 2004-05-21 | Quanta Display Inc | Method of fabricating a thin film transistor array panel |
| US7262463B2 (en) * | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| JP2005062802A (ja) * | 2003-07-28 | 2005-03-10 | Advanced Display Inc | 薄膜トランジスタアレイ基板の製法 |
| JP4712352B2 (ja) * | 2003-11-14 | 2011-06-29 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
| JP4737971B2 (ja) * | 2003-11-14 | 2011-08-03 | 株式会社半導体エネルギー研究所 | 液晶表示装置および液晶表示装置の作製方法 |
| JP4667051B2 (ja) * | 2004-01-29 | 2011-04-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7282782B2 (en) * | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
| US20070194379A1 (en) * | 2004-03-12 | 2007-08-23 | Japan Science And Technology Agency | Amorphous Oxide And Thin Film Transistor |
| US7145174B2 (en) * | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
| US7211825B2 (en) * | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
| KR100968339B1 (ko) * | 2004-06-30 | 2010-07-08 | 엘지디스플레이 주식회사 | 액정 표시 장치 및 그 제조 방법 |
| JP2006100760A (ja) * | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| US7285501B2 (en) * | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
| JP4633434B2 (ja) * | 2004-10-18 | 2011-02-16 | シャープ株式会社 | 半導体装置およびその製造方法 |
| US7298084B2 (en) * | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
| KR101171175B1 (ko) * | 2004-11-03 | 2012-08-06 | 삼성전자주식회사 | 도전체용 식각액 및 이를 이용한 박막 트랜지스터표시판의 제조 방법 |
| US7829444B2 (en) * | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
| EP2453480A2 (en) * | 2004-11-10 | 2012-05-16 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
| AU2005302963B2 (en) * | 2004-11-10 | 2009-07-02 | Cannon Kabushiki Kaisha | Light-emitting device |
| EP1815530B1 (en) * | 2004-11-10 | 2021-02-17 | Canon Kabushiki Kaisha | Field effect transistor employing an amorphous oxide |
| US7863611B2 (en) * | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
| US7791072B2 (en) * | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
| US7453065B2 (en) * | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
| KR101054344B1 (ko) * | 2004-11-17 | 2011-08-04 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| KR101282397B1 (ko) * | 2004-12-07 | 2013-07-04 | 삼성디스플레이 주식회사 | 표시 장치용 배선, 상기 배선을 포함하는 박막 트랜지스터표시판 및 그 제조 방법 |
| US7579224B2 (en) * | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
| JP4777078B2 (ja) * | 2005-01-28 | 2011-09-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TWI481024B (zh) * | 2005-01-28 | 2015-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| TWI412138B (zh) * | 2005-01-28 | 2013-10-11 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| US7858451B2 (en) * | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
| US7948171B2 (en) * | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| JP2006236683A (ja) * | 2005-02-23 | 2006-09-07 | Sanyo Electric Co Ltd | 有機エレクトロルミネッセンス装置およびその製造方法 |
| US20060197092A1 (en) * | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
| US8681077B2 (en) * | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
| FI119894B (fi) * | 2005-03-30 | 2009-04-30 | Labmaster Oy | Elektrokemiluminesenssiin perustuva analyysimenetelmä ja siinä käytettävä laite |
| JP4687259B2 (ja) * | 2005-06-10 | 2011-05-25 | カシオ計算機株式会社 | 液晶表示装置 |
| US7381586B2 (en) * | 2005-06-16 | 2008-06-03 | Industrial Technology Research Institute | Methods for manufacturing thin film transistors that include selectively forming an active channel layer from a solution |
| US7402506B2 (en) * | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| KR100711890B1 (ko) * | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
| JP2007059128A (ja) * | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
| JP4280736B2 (ja) * | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
| JP2007073705A (ja) * | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
| JP5116225B2 (ja) * | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
| JP4850457B2 (ja) * | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
| KR100729043B1 (ko) | 2005-09-14 | 2007-06-14 | 삼성에스디아이 주식회사 | 투명 박막 트랜지스터 및 그의 제조방법 |
| JP5078246B2 (ja) * | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| JP5064747B2 (ja) * | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
| EP3614442A3 (en) * | 2005-09-29 | 2020-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having oxide semiconductor layer and manufactoring method thereof |
| CN101283388B (zh) * | 2005-10-05 | 2011-04-13 | 出光兴产株式会社 | Tft基板及tft基板的制造方法 |
| JP2007109918A (ja) | 2005-10-14 | 2007-04-26 | Toppan Printing Co Ltd | トランジスタおよびその製造方法 |
| CN101278403B (zh) * | 2005-10-14 | 2010-12-01 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| JP5427340B2 (ja) * | 2005-10-14 | 2014-02-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8149346B2 (en) * | 2005-10-14 | 2012-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
| JP2007115807A (ja) | 2005-10-19 | 2007-05-10 | Toppan Printing Co Ltd | トランジスタ |
| JP5037808B2 (ja) * | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
| CN101667544B (zh) * | 2005-11-15 | 2012-09-05 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| US7821613B2 (en) * | 2005-12-28 | 2010-10-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
| TWI292281B (en) * | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
| US7867636B2 (en) * | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
| JP4977478B2 (ja) * | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
| TWI332589B (en) * | 2006-01-27 | 2010-11-01 | Au Optronics Corp | Pixel structure and mehtod for fabricating the same and detecting and repair defect of the same |
| US7576394B2 (en) * | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
| KR100791290B1 (ko) | 2006-02-10 | 2008-01-04 | 삼성전자주식회사 | 디바이스 간에 악성 어플리케이션의 행위 정보를 사용하는장치 및 방법 |
| US7977169B2 (en) * | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
| JP5016831B2 (ja) * | 2006-03-17 | 2012-09-05 | キヤノン株式会社 | 酸化物半導体薄膜トランジスタを用いた発光素子及びこれを用いた画像表示装置 |
| JP5110803B2 (ja) * | 2006-03-17 | 2012-12-26 | キヤノン株式会社 | 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法 |
| JP2007286150A (ja) * | 2006-04-13 | 2007-11-01 | Idemitsu Kosan Co Ltd | 電気光学装置、並びに、電流制御用tft基板及びその製造方法 |
| JP2007292976A (ja) * | 2006-04-25 | 2007-11-08 | Hitachi Displays Ltd | 液晶表示装置及びその製造方法 |
| JP5312728B2 (ja) * | 2006-04-28 | 2013-10-09 | 凸版印刷株式会社 | 表示装置およびその製造方法 |
| JP5060738B2 (ja) * | 2006-04-28 | 2012-10-31 | 株式会社ジャパンディスプレイイースト | 画像表示装置 |
| JP5250944B2 (ja) * | 2006-04-28 | 2013-07-31 | 凸版印刷株式会社 | 構造体、透過型液晶表示装置、半導体回路の製造方法および透過型液晶表示装置の製造方法 |
| JP5105044B2 (ja) * | 2006-05-09 | 2012-12-19 | 株式会社ブリヂストン | 酸化物トランジスタ及びその製造方法 |
| JP5056142B2 (ja) | 2006-05-11 | 2012-10-24 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子の製造方法及び窒化物半導体レーザ素子 |
| JP2007310334A (ja) * | 2006-05-19 | 2007-11-29 | Mikuni Denshi Kk | ハーフトーン露光法を用いた液晶表示装置の製造法 |
| JP2006293385A (ja) * | 2006-05-24 | 2006-10-26 | Semiconductor Energy Lab Co Ltd | 表示装置 |
| US8106865B2 (en) * | 2006-06-02 | 2012-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and driving method thereof |
| EP1863079B1 (en) | 2006-06-02 | 2011-08-10 | Rohm and Haas Electronic Materials, L.L.C. | Apparatus with filet radius joints |
| JP4999400B2 (ja) * | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4609797B2 (ja) * | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
| US8400599B2 (en) * | 2006-08-16 | 2013-03-19 | Samsung Display Co., Ltd. | Liquid crystal display panel having a light blocking electrode |
| JP4332545B2 (ja) * | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP5145676B2 (ja) * | 2006-09-15 | 2013-02-20 | 凸版印刷株式会社 | 薄膜トランジスタおよびその製造方法 |
| JP4274219B2 (ja) * | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
| JP5164357B2 (ja) * | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
| KR101293573B1 (ko) * | 2006-10-02 | 2013-08-06 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| KR20080030798A (ko) * | 2006-10-02 | 2008-04-07 | 삼성전자주식회사 | 박막 트랜지스터 표시판의 제조 방법 |
| US7622371B2 (en) * | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
| US20080105872A1 (en) * | 2006-10-13 | 2008-05-08 | Chunghwa Picture Tubes, Ltd. | Pixel structure |
| JP4497328B2 (ja) * | 2006-10-25 | 2010-07-07 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
| US7772021B2 (en) * | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
| JP2008140684A (ja) * | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
| JP5105842B2 (ja) * | 2006-12-05 | 2012-12-26 | キヤノン株式会社 | 酸化物半導体を用いた表示装置及びその製造方法 |
| KR101303578B1 (ko) * | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
| KR100787464B1 (ko) * | 2007-01-08 | 2007-12-26 | 삼성에스디아이 주식회사 | 박막 트랜지스터, 및 그 제조방법 |
| US8207063B2 (en) * | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| KR101377456B1 (ko) * | 2007-02-07 | 2014-03-25 | 삼성디스플레이 주식회사 | 표시 기판, 이의 제조 방법 및 이를 갖는 표시 장치 |
| JP5196870B2 (ja) * | 2007-05-23 | 2013-05-15 | キヤノン株式会社 | 酸化物半導体を用いた電子素子及びその製造方法 |
| KR100858088B1 (ko) * | 2007-02-28 | 2008-09-10 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법 |
| JP5244331B2 (ja) | 2007-03-26 | 2013-07-24 | 出光興産株式会社 | 非晶質酸化物半導体薄膜、その製造方法、薄膜トランジスタの製造方法、電界効果型トランジスタ、発光装置、表示装置及びスパッタリングターゲット |
| KR101380225B1 (ko) * | 2007-04-13 | 2014-04-01 | 엘지디스플레이 주식회사 | 액정표시장치용 어레이 기판 |
| US8513678B2 (en) * | 2007-05-18 | 2013-08-20 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device |
| KR100873081B1 (ko) * | 2007-05-29 | 2008-12-09 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
| TWI354377B (en) * | 2007-05-30 | 2011-12-11 | Au Optronics Corp | Pixel structure of lcd and fabrication method ther |
| KR101376073B1 (ko) * | 2007-06-14 | 2014-03-21 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 이를 포함하는 어레이 기판 및 이의 제조방법 |
| KR101415561B1 (ko) * | 2007-06-14 | 2014-08-07 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그의 제조 방법 |
| US7807520B2 (en) * | 2007-06-29 | 2010-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US8202365B2 (en) * | 2007-12-17 | 2012-06-19 | Fujifilm Corporation | Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film |
| JP5540517B2 (ja) * | 2008-02-22 | 2014-07-02 | 凸版印刷株式会社 | 画像表示装置 |
| TWI469354B (zh) * | 2008-07-31 | 2015-01-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
| JP2008282050A (ja) * | 2008-08-11 | 2008-11-20 | Seiko Epson Corp | 電気光学装置 |
| JP5451280B2 (ja) * | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
| JP5491833B2 (ja) * | 2008-12-05 | 2014-05-14 | 株式会社半導体エネルギー研究所 | 半導体装置 |
-
2010
- 2010-02-24 US US12/711,661 patent/US20100224880A1/en not_active Abandoned
- 2010-03-01 TW TW099105833A patent/TWI512976B/zh not_active IP Right Cessation
- 2010-03-04 CN CN201010134313.8A patent/CN101826520B/zh not_active Expired - Fee Related
- 2010-03-04 KR KR1020100019448A patent/KR101999526B1/ko active Active
- 2010-03-05 JP JP2010048615A patent/JP5651350B2/ja active Active
-
2014
- 2014-09-03 JP JP2014178902A patent/JP5917633B2/ja active Active
-
2016
- 2016-03-17 JP JP2016054137A patent/JP6122985B2/ja active Active
-
2017
- 2017-03-23 KR KR1020170036805A patent/KR101781794B1/ko active Active
- 2017-04-03 JP JP2017073423A patent/JP6392924B2/ja active Active
- 2017-09-18 KR KR1020170119580A patent/KR101838471B1/ko active Active
- 2017-12-26 US US15/854,388 patent/US20180138283A1/en not_active Abandoned
-
2018
- 2018-02-26 KR KR1020180022894A patent/KR101881734B1/ko active Active
- 2018-07-09 KR KR1020180079189A patent/KR101991233B1/ko active Active
- 2018-07-12 JP JP2018132447A patent/JP6532989B2/ja active Active
-
2019
- 2019-05-22 JP JP2019095952A patent/JP6580806B1/ja active Active
- 2019-06-12 KR KR1020190069030A patent/KR102025531B1/ko active Active
- 2019-08-28 JP JP2019155572A patent/JP2020038965A/ja not_active Withdrawn
- 2019-09-19 KR KR1020190115143A patent/KR102258875B1/ko active Active
-
2021
- 2021-03-24 US US17/210,712 patent/US20210210612A1/en not_active Abandoned
- 2021-05-25 KR KR1020210066646A patent/KR102329918B1/ko active Active
- 2021-11-10 KR KR1020210153498A patent/KR102398135B1/ko active Active
- 2021-12-10 JP JP2021200586A patent/JP2022050404A/ja not_active Withdrawn
-
2022
- 2022-05-06 KR KR1020220055956A patent/KR20220066015A/ko not_active Ceased
-
2023
- 2023-06-02 US US18/204,993 patent/US20230317813A1/en not_active Abandoned
-
2024
- 2024-05-17 JP JP2024080710A patent/JP7663744B2/ja active Active
-
2025
- 2025-04-04 JP JP2025062220A patent/JP2025106400A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006242987A (ja) * | 2005-02-28 | 2006-09-14 | Casio Comput Co Ltd | 薄膜トランジスタパネル |
| US20060205125A1 (en) * | 2005-03-09 | 2006-09-14 | Yang-Ho Bae | TFT substrate and display device having the same |
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101991233B1 (ko) | 반도체 장치 | |
| US12336303B2 (en) | Semiconductor device and method for manufacturing the same | |
| KR101948708B1 (ko) | 반도체 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20100304 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| AMND | Amendment | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20150304 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20100304 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20160316 Patent event code: PE09021S01D |
|
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20161027 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20160316 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| AMND | Amendment | ||
| PX0901 | Re-examination |
Patent event code: PX09011S01I Patent event date: 20161027 Comment text: Decision to Refuse Application Patent event code: PX09012R01I Patent event date: 20160616 Comment text: Amendment to Specification, etc. Patent event code: PX09012R01I Patent event date: 20150304 Comment text: Amendment to Specification, etc. |
|
| PX0601 | Decision of rejection after re-examination |
Comment text: Decision to Refuse Application Patent event code: PX06014S01D Patent event date: 20170222 Comment text: Amendment to Specification, etc. Patent event code: PX06012R01I Patent event date: 20170125 Comment text: Decision to Refuse Application Patent event code: PX06011S01I Patent event date: 20161027 Comment text: Amendment to Specification, etc. Patent event code: PX06012R01I Patent event date: 20160616 Comment text: Notification of reason for refusal Patent event code: PX06013S01I Patent event date: 20160316 Comment text: Amendment to Specification, etc. Patent event code: PX06012R01I Patent event date: 20150304 |
|
| A107 | Divisional application of patent | ||
| PA0107 | Divisional application |
Comment text: Divisional Application of Patent Patent event date: 20170323 Patent event code: PA01071R01D |
|
| J201 | Request for trial against refusal decision | ||
| PJ0201 | Trial against decision of rejection |
Patent event date: 20170324 Comment text: Request for Trial against Decision on Refusal Patent event code: PJ02012R01D Patent event date: 20170222 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Patent event date: 20161027 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Appeal kind category: Appeal against decision to decline refusal Appeal identifier: 2017101001435 Request date: 20170324 |
|
| J301 | Trial decision |
Free format text: TRIAL NUMBER: 2017101001435; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20170324 Effective date: 20190329 |
|
| PJ1301 | Trial decision |
Patent event code: PJ13011S01D Patent event date: 20190329 Comment text: Trial Decision on Objection to Decision on Refusal Appeal kind category: Appeal against decision to decline refusal Request date: 20170324 Decision date: 20190329 Appeal identifier: 2017101001435 |
|
| PS0901 | Examination by remand of revocation | ||
| S901 | Examination by remand of revocation | ||
| GRNO | Decision to grant (after opposition) | ||
| PS0701 | Decision of registration after remand of revocation |
Patent event date: 20190412 Patent event code: PS07012S01D Comment text: Decision to Grant Registration Patent event date: 20190329 Patent event code: PS07011S01I Comment text: Notice of Trial Decision (Remand of Revocation) |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20190708 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20190709 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20220615 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20230615 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20240617 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20250616 Start annual number: 7 End annual number: 7 |