KR100968496B1 - 표시장치 및 그 제조방법 - Google Patents

표시장치 및 그 제조방법 Download PDF

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Publication number
KR100968496B1
KR100968496B1 KR1020030023370A KR20030023370A KR100968496B1 KR 100968496 B1 KR100968496 B1 KR 100968496B1 KR 1020030023370 A KR1020030023370 A KR 1020030023370A KR 20030023370 A KR20030023370 A KR 20030023370A KR 100968496 B1 KR100968496 B1 KR 100968496B1
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South Korea
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film
insulating film
opening
nitride insulating
nitride
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Expired - Fee Related
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Korean (ko)
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KR20030082413A (ko
Inventor
하야카와마사히코
무라카미사토시
야마자키순페이
아키모토켄고
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
    • H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020030023370A 2002-04-15 2003-04-14 표시장치 및 그 제조방법 Expired - Fee Related KR100968496B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002111745 2002-04-15
JPJP-P-2002-00111745 2002-04-15

Publications (2)

Publication Number Publication Date
KR20030082413A KR20030082413A (ko) 2003-10-22
KR100968496B1 true KR100968496B1 (ko) 2010-07-07

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Country Link
US (3) US7411215B2 (enExample)
JP (1) JP4463493B2 (enExample)
KR (1) KR100968496B1 (enExample)
CN (1) CN100357992C (enExample)
TW (1) TWI270919B (enExample)

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US6822629B2 (en) * 2000-08-18 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US7038239B2 (en) 2002-04-09 2006-05-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
JP3989761B2 (ja) 2002-04-09 2007-10-10 株式会社半導体エネルギー研究所 半導体表示装置
JP3989763B2 (ja) * 2002-04-15 2007-10-10 株式会社半導体エネルギー研究所 半導体表示装置
US7411215B2 (en) 2002-04-15 2008-08-12 Semiconductor Energy Laboratory Co., Ltd. Display device and method of fabricating the same
US7242021B2 (en) * 2002-04-23 2007-07-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display element using semiconductor device
TWI269248B (en) * 2002-05-13 2006-12-21 Semiconductor Energy Lab Display device
TWI263339B (en) * 2002-05-15 2006-10-01 Semiconductor Energy Lab Light emitting device and method for manufacturing the same
US7256421B2 (en) 2002-05-17 2007-08-14 Semiconductor Energy Laboratory, Co., Ltd. Display device having a structure for preventing the deterioration of a light emitting device
US7452257B2 (en) * 2002-12-27 2008-11-18 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a display device
KR100552975B1 (ko) * 2003-11-22 2006-02-15 삼성에스디아이 주식회사 능동 매트릭스 유기전계발광표시장치 및 그의 제조방법
JP4574158B2 (ja) * 2003-10-28 2010-11-04 株式会社半導体エネルギー研究所 半導体表示装置及びその作製方法
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JP5170985B2 (ja) 2006-06-09 2013-03-27 株式会社ジャパンディスプレイイースト 液晶表示装置
JP5512930B2 (ja) * 2007-03-26 2014-06-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP5512931B2 (ja) * 2007-03-26 2014-06-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP5142831B2 (ja) * 2007-06-14 2013-02-13 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
JP2011501361A (ja) * 2007-10-15 2011-01-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 溶液処理された電子デバイス用のバックプレーン構造
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JP2011003522A (ja) 2008-10-16 2011-01-06 Semiconductor Energy Lab Co Ltd フレキシブル発光装置、電子機器及びフレキシブル発光装置の作製方法
KR20210048590A (ko) 2009-09-16 2021-05-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20120129592A (ko) 2011-05-20 2012-11-28 삼성디스플레이 주식회사 평판 표시 장치용 백플레인, 이를 포함하는 평판 표시 장치, 및 그 제조 방법
US8716708B2 (en) * 2011-09-29 2014-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP5862204B2 (ja) * 2011-10-31 2016-02-16 セイコーエプソン株式会社 電気光学装置および電子機器
KR20130136063A (ko) * 2012-06-04 2013-12-12 삼성디스플레이 주식회사 박막 트랜지스터, 이를 포함하는 박막 트랜지스터 표시판 및 그 제조 방법
JP6186697B2 (ja) * 2012-10-29 2017-08-30 セイコーエプソン株式会社 有機ｅｌ装置の製造方法、有機ｅｌ装置、電子機器
KR102138280B1 (ko) * 2013-04-30 2020-07-28 삼성디스플레이 주식회사 표시 패널 및 이를 구비하는 표시 장치
JP2017191183A (ja) * 2016-04-12 2017-10-19 株式会社ジャパンディスプレイ 表示装置及びその製造方法
KR102723296B1 (ko) * 2016-12-29 2024-10-28 엘지디스플레이 주식회사 전계발광 표시장치
KR102349279B1 (ko) * 2017-09-08 2022-01-11 삼성디스플레이 주식회사 디스플레이 장치
TWI702457B (zh) * 2019-04-23 2020-08-21 元太科技工業股份有限公司 反射式主動元件陣列基板及其製作方法與反射式顯示裝置及其製作方法
CN111856832B (zh) * 2019-04-23 2024-09-10 元太科技工业股份有限公司 反射式主动元件阵列基板及其制作方法与反射式显示设备
CN111863857B (zh) * 2020-06-30 2024-01-23 京东方科技集团股份有限公司 Led显示基板及其制备方法显示面板
CN114497315A (zh) * 2022-02-15 2022-05-13 中国科学院半导体研究所 Led芯片结构及其制备方法

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KR20030082413A (ko) 2003-10-22
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US8709847B2 (en) 2014-04-29
US20130157398A1 (en) 2013-06-20
JP2004004757A (ja) 2004-01-08
US20030193054A1 (en) 2003-10-16
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CN100357992C (zh) 2007-12-26
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US8368072B2 (en) 2013-02-05
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