JP6931328B2 - 半導体デバイスの転写方法 - Google Patents

半導体デバイスの転写方法 Download PDF

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JP6931328B2
JP6931328B2 JP2017549243A JP2017549243A JP6931328B2 JP 6931328 B2 JP6931328 B2 JP 6931328B2 JP 2017549243 A JP2017549243 A JP 2017549243A JP 2017549243 A JP2017549243 A JP 2017549243A JP 6931328 B2 JP6931328 B2 JP 6931328B2
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transfer
die
substrate
wafer tape
product substrate
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JP2018513554A5 (enExample
JP2018513554A (ja
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ハスカ アンドリュー
ハスカ アンドリュー
ピーターソン コディ
ピーターソン コディ
アダムス クリントン
アダムス クリントン
クプカウ シーン
クプカウ シーン
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ロヒンニ リミテッド ライアビリティ カンパニー
ロヒンニ リミテッド ライアビリティ カンパニー
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Publication of JP2018513554A publication Critical patent/JP2018513554A/ja
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Priority to JP2019238704A priority Critical patent/JP6977020B2/ja
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Priority to JP2021183364A priority patent/JP7664149B2/ja
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    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
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    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
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    • H10P72/7428—
    • H10P72/7432—
    • H10P72/744—
    • H10W46/106—
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