JP4693805B2 - 半導体装置の製造装置及び製造方法 - Google Patents
半導体装置の製造装置及び製造方法 Download PDFInfo
- Publication number
- JP4693805B2 JP4693805B2 JP2007067974A JP2007067974A JP4693805B2 JP 4693805 B2 JP4693805 B2 JP 4693805B2 JP 2007067974 A JP2007067974 A JP 2007067974A JP 2007067974 A JP2007067974 A JP 2007067974A JP 4693805 B2 JP4693805 B2 JP 4693805B2
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- Prior art keywords
- push
- semiconductor chip
- adhesive sheet
- semiconductor device
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
- Y10T156/1184—Piercing layer during delaminating [e.g., cutting, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
- Y10T156/1983—Poking delaminating means
Description
Claims (5)
- 一方の面に複数の半導体チップが貼付けられた粘着シートを保持する保持部と、
前記半導体チップを、前記粘着シートの他方の面側から突き上げる複数個の突き上げ突部と、
前記突き上げ突部の間隔を変える方向へ少なくとも一つの前記突き上げ突部をスライドさせるスライド機構と、
を備え、
前記スライド機構は、前記複数個の突き上げ突部と直交する向きに配置されたスライド軸と、前記スライド軸を長手方向にスライドする移動機構とを具備し、
前記スライド軸は前記長手方向に沿って、前記複数個の突き上げ突部を挿通する複数の挿通穴を有し、
少なくとも一つの前記突き上げ突部を挿通する前記挿通穴は前記長手方向の長さが大きい長穴形状に形成され、
前記移動機構により、前記スライド軸を前記長手方向にスライドすることによって、少なくとも一つの前記突き上げ突部を前記複数個の突き上げ突部の間隔を変える方向にスライドすることを特徴とする半導体装置の製造装置。 - 前記移動機構は前記スライド軸に固定されたネジ部と、前記ネジ部に螺合されたボールネジと、前記ボールネジに連結されたモータからなり、前記モータを駆動することにより、前記スライド軸を前記長手方向にスライドすることを特徴とする請求項1記載の半導体装置の製造装置。
- 前記複数個の突き上げ突部の間隔は前記半導体チップのサイズに対応し、前記複数個の突き上げ突部が前記半導体チップの両側の縁部を突き上げるように設定されることを特徴とする請求項1記載の半導体装置の製造装置。
- 個々の前記突き上げ突部の突き上げタイミングを異ならせる手段を備えることを特徴とする請求項1記載の半導体装置の製造装置。
- 請求項1〜4のいずれか1項記載の半導体装置の製造装置を用いて、粘着シートの一方の面に貼付けられた半導体チップを前記粘着シートの他方の面側から突き上げることにより前記粘着シートから剥がす工程を有することを特徴とする半導体装置の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007067974A JP4693805B2 (ja) | 2007-03-16 | 2007-03-16 | 半導体装置の製造装置及び製造方法 |
CN2008100836624A CN101266920B (zh) | 2007-03-16 | 2008-03-14 | 半导体器件的制造装置及制造方法 |
US12/048,371 US8142611B2 (en) | 2007-03-16 | 2008-03-14 | Semiconductor-chip exfoliating device and semiconductor-device manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007067974A JP4693805B2 (ja) | 2007-03-16 | 2007-03-16 | 半導体装置の製造装置及び製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008235297A JP2008235297A (ja) | 2008-10-02 |
JP4693805B2 true JP4693805B2 (ja) | 2011-06-01 |
Family
ID=39763118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007067974A Expired - Fee Related JP4693805B2 (ja) | 2007-03-16 | 2007-03-16 | 半導体装置の製造装置及び製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8142611B2 (ja) |
JP (1) | JP4693805B2 (ja) |
CN (1) | CN101266920B (ja) |
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US8221583B2 (en) * | 2007-01-20 | 2012-07-17 | Stats Chippac Ltd. | System for peeling semiconductor chips from tape |
JP4693805B2 (ja) * | 2007-03-16 | 2011-06-01 | 株式会社東芝 | 半導体装置の製造装置及び製造方法 |
JP2012508460A (ja) * | 2008-11-12 | 2012-04-05 | エセック アーゲー | フォイルからの半導体チップの剥離及び取外し方法 |
JP2010141208A (ja) * | 2008-12-12 | 2010-06-24 | Sumitomo Electric Ind Ltd | 半導体レーザチップ又は半導体レーザバーの外観検査装置及び外観検査方法 |
TWI395281B (zh) * | 2009-07-23 | 2013-05-01 | Epistar Corp | 晶粒分類裝置 |
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US8470130B2 (en) * | 2009-10-20 | 2013-06-25 | Asm Assembly Automation Ltd | Universal die detachment apparatus |
CH706280B1 (de) * | 2012-03-30 | 2016-03-15 | Esec Ag | Verfahren zum Ablösen eines Halbleiterchips von einer Folie. |
US8907502B2 (en) * | 2012-06-29 | 2014-12-09 | Nitto Denko Corporation | Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device |
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JP2014011416A (ja) * | 2012-07-03 | 2014-01-20 | Panasonic Corp | 半導体チップのピックアップ装置およびピックアップ方法 |
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CN104217984B (zh) * | 2013-06-05 | 2018-02-06 | 上海华虹宏力半导体制造有限公司 | 防止芯片裂纹的顶针方法 |
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US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
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-
2007
- 2007-03-16 JP JP2007067974A patent/JP4693805B2/ja not_active Expired - Fee Related
-
2008
- 2008-03-14 US US12/048,371 patent/US8142611B2/en active Active
- 2008-03-14 CN CN2008100836624A patent/CN101266920B/zh not_active Expired - Fee Related
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JPH02184046A (ja) * | 1989-01-10 | 1990-07-18 | Nec Corp | 半導体ペレットのピックアップ方法 |
Also Published As
Publication number | Publication date |
---|---|
US20080227239A1 (en) | 2008-09-18 |
JP2008235297A (ja) | 2008-10-02 |
CN101266920B (zh) | 2010-06-02 |
US8142611B2 (en) | 2012-03-27 |
CN101266920A (zh) | 2008-09-17 |
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